TW358231B - Semiconductor device and the manufacturing method, circuit substrate and the film carrying tape - Google Patents

Semiconductor device and the manufacturing method, circuit substrate and the film carrying tape

Info

Publication number
TW358231B
TW358231B TW086114535A TW86114535A TW358231B TW 358231 B TW358231 B TW 358231B TW 086114535 A TW086114535 A TW 086114535A TW 86114535 A TW86114535 A TW 86114535A TW 358231 B TW358231 B TW 358231B
Authority
TW
Taiwan
Prior art keywords
connection
semiconductor chip
manufacturing
semiconductor device
circuit substrate
Prior art date
Application number
TW086114535A
Other languages
English (en)
Inventor
Nobuaki Hashimoto
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of TW358231B publication Critical patent/TW358231B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW086114535A 1996-10-17 1997-10-04 Semiconductor device and the manufacturing method, circuit substrate and the film carrying tape TW358231B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29753196 1996-10-17

Publications (1)

Publication Number Publication Date
TW358231B true TW358231B (en) 1999-05-11

Family

ID=17847745

Family Applications (2)

Application Number Title Priority Date Filing Date
TW086114535A TW358231B (en) 1996-10-17 1997-10-04 Semiconductor device and the manufacturing method, circuit substrate and the film carrying tape
TW086115153A TW365694B (en) 1996-10-17 1997-10-15 Film carrier tape and semiconductor device, the manufacture method and the circuit substrate

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW086115153A TW365694B (en) 1996-10-17 1997-10-15 Film carrier tape and semiconductor device, the manufacture method and the circuit substrate

Country Status (7)

Country Link
US (4) US6274405B1 (zh)
JP (2) JP3608205B2 (zh)
KR (2) KR100459968B1 (zh)
CN (3) CN1124644C (zh)
AU (2) AU4321997A (zh)
TW (2) TW358231B (zh)
WO (2) WO1998018161A1 (zh)

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JP3558921B2 (ja) * 1999-05-14 2004-08-25 シャープ株式会社 テープキャリア並びにテープキャリア型半導体装置の製造方法
JP3360723B2 (ja) * 1999-06-08 2002-12-24 日本電気株式会社 半導体素子のチップサイズパッケージ
JP3998878B2 (ja) * 1999-11-25 2007-10-31 シャープ株式会社 半導体装置、半導体装置の製造方法、およびパッケージの製造方法
US6576496B1 (en) 2000-08-21 2003-06-10 Micron Technology, Inc. Method and apparatus for encapsulating a multi-chip substrate array
JP3645511B2 (ja) * 2001-10-09 2005-05-11 株式会社ルネサステクノロジ 半導体装置の製造方法
US6674174B2 (en) * 2001-11-13 2004-01-06 Skyworks Solutions, Inc. Controlled impedance transmission lines in a redistribution layer
JP3726961B2 (ja) * 2002-06-26 2005-12-14 三井金属鉱業株式会社 Ｃｏｆフィルムキャリアテープ及びその製造方法
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DE102005063272A1 (de) * 2005-12-30 2007-07-05 Robert Bosch Gmbh Flexible Leiterplatte und Kontaktierverfahren
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CN101373748B (zh) * 2007-08-20 2011-06-15 宏茂微电子(上海)有限公司 晶圆级封装结构及其制作方法
JP4344766B2 (ja) * 2007-11-30 2009-10-14 シャープ株式会社 ソースドライバ、ソースドライバの製造方法、および液晶モジュール
US7989266B2 (en) * 2009-06-18 2011-08-02 Aptina Imaging Corporation Methods for separating individual semiconductor devices from a carrier
EP2757583A1 (en) * 2013-01-17 2014-07-23 Funai Electric Co., Ltd. Chip on film, and method of manufacture thereof
KR102413224B1 (ko) * 2015-10-01 2022-06-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자, 발광 소자 제조방법 및 발광 모듈
JP7341942B2 (ja) * 2019-06-21 2023-09-11 旭化成株式会社 包装体及びその製造方法
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Also Published As

Publication number Publication date
US20020110943A1 (en) 2002-08-15
KR19990072172A (ko) 1999-09-27
TW365694B (en) 1999-08-01
WO1998018161A1 (en) 1998-04-30
WO1998018162A1 (en) 1998-04-30
KR100496762B1 (ko) 2005-09-30
CN1126163C (zh) 2003-10-29
CN1516250A (zh) 2004-07-28
KR19990072170A (ko) 1999-09-27
US6867068B2 (en) 2005-03-15
US6274405B1 (en) 2001-08-14
CN1206496A (zh) 1999-01-27
CN1272837C (zh) 2006-08-30
US6452257B2 (en) 2002-09-17
CN1206494A (zh) 1999-01-27
AU4471397A (en) 1998-05-15
KR100459968B1 (ko) 2005-04-28
US6262473B1 (en) 2001-07-17
CN1124644C (zh) 2003-10-15
JP3584469B2 (ja) 2004-11-04
JP3608205B2 (ja) 2005-01-05
US20010029062A1 (en) 2001-10-11
AU4321997A (en) 1998-05-15

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