DE69114217T2 - Träger für filmmontierte Halbleiter-Vorrichtung. - Google Patents
Träger für filmmontierte Halbleiter-Vorrichtung.Info
- Publication number
- DE69114217T2 DE69114217T2 DE69114217T DE69114217T DE69114217T2 DE 69114217 T2 DE69114217 T2 DE 69114217T2 DE 69114217 T DE69114217 T DE 69114217T DE 69114217 T DE69114217 T DE 69114217T DE 69114217 T2 DE69114217 T2 DE 69114217T2
- Authority
- DE
- Germany
- Prior art keywords
- carrier
- film
- semiconductor device
- mounted semiconductor
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22020790 | 1990-08-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69114217D1 DE69114217D1 (de) | 1995-12-07 |
DE69114217T2 true DE69114217T2 (de) | 1996-04-11 |
Family
ID=16747567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69114217T Expired - Fee Related DE69114217T2 (de) | 1990-08-22 | 1991-08-22 | Träger für filmmontierte Halbleiter-Vorrichtung. |
Country Status (3)
Country | Link |
---|---|
US (1) | US5338973A (de) |
EP (1) | EP0472435B1 (de) |
DE (1) | DE69114217T2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5349236A (en) * | 1992-07-21 | 1994-09-20 | Mitsui Toatsu Chemicals, Incorporated | Reusable fixture for carrier tape |
JP3608205B2 (ja) | 1996-10-17 | 2005-01-05 | セイコーエプソン株式会社 | 半導体装置及びその製造方法並びに回路基板 |
JP3034814B2 (ja) * | 1997-02-27 | 2000-04-17 | 沖電気工業株式会社 | リードフレーム構造及び半導体装置の製造方法 |
US6320135B1 (en) | 1999-02-03 | 2001-11-20 | Casio Computer Co., Ltd. | Flexible wiring substrate and its manufacturing method |
CN106813888B (zh) * | 2015-11-27 | 2019-01-04 | 环维电子(上海)有限公司 | 冲击试验模块及其测试板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS575887Y2 (de) * | 1976-08-23 | 1982-02-03 | ||
US4069496A (en) * | 1976-12-30 | 1978-01-17 | Honeywell Information Systems Inc. | Reusable fixture for an integrated circuit chip |
US4435724A (en) * | 1981-09-10 | 1984-03-06 | Wells Electronics, Inc. | Single piece carrier for integrated circuit devices |
DE3207458C1 (de) * | 1982-03-02 | 1983-06-09 | Siemens AG, 1000 Berlin und 8000 München | Halterung fuer die Einzelverarbeitung von filmmotierten integrierten Schaltkreisen |
DE3234745C2 (de) * | 1982-09-20 | 1986-03-06 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Handhabung von filmmontierten integrierten Schaltkreisen und Vorrichtung zu seiner Durchführung |
JPS6190453A (ja) * | 1984-10-09 | 1986-05-08 | Nec Corp | フイルムキャリヤーテープ |
JPH02206140A (ja) * | 1989-02-06 | 1990-08-15 | Hitachi Cable Ltd | フィルムキャリア用エンボススペーサフィルム |
-
1991
- 1991-08-22 EP EP91307751A patent/EP0472435B1/de not_active Expired - Lifetime
- 1991-08-22 DE DE69114217T patent/DE69114217T2/de not_active Expired - Fee Related
-
1993
- 1993-11-01 US US08/146,806 patent/US5338973A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0472435A1 (de) | 1992-02-26 |
US5338973A (en) | 1994-08-16 |
DE69114217D1 (de) | 1995-12-07 |
EP0472435B1 (de) | 1995-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |