DE3686990T2 - Verfahren zum herstellen einer halbleiteranordnung wobei ein filmtraegerband angewendet wird. - Google Patents

Verfahren zum herstellen einer halbleiteranordnung wobei ein filmtraegerband angewendet wird.

Info

Publication number
DE3686990T2
DE3686990T2 DE8686111650T DE3686990T DE3686990T2 DE 3686990 T2 DE3686990 T2 DE 3686990T2 DE 8686111650 T DE8686111650 T DE 8686111650T DE 3686990 T DE3686990 T DE 3686990T DE 3686990 T2 DE3686990 T2 DE 3686990T2
Authority
DE
Germany
Prior art keywords
producing
carrier tape
film carrier
semiconductor arrangement
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686111650T
Other languages
English (en)
Other versions
DE3686990D1 (de
Inventor
Kouichi Takekawa
Manabu Bonkohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60186061A external-priority patent/JPH0740576B2/ja
Priority claimed from JP60288786A external-priority patent/JPH0740580B2/ja
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE3686990D1 publication Critical patent/DE3686990D1/de
Publication of DE3686990T2 publication Critical patent/DE3686990T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
DE8686111650T 1985-08-23 1986-08-22 Verfahren zum herstellen einer halbleiteranordnung wobei ein filmtraegerband angewendet wird. Expired - Fee Related DE3686990T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60186061A JPH0740576B2 (ja) 1985-08-23 1985-08-23 フィルムキャリヤ半導体装置の電気試験方法
JP60288786A JPH0740580B2 (ja) 1985-12-20 1985-12-20 半導体素子の選別用基板および半導体素子の選別方法

Publications (2)

Publication Number Publication Date
DE3686990D1 DE3686990D1 (de) 1992-11-26
DE3686990T2 true DE3686990T2 (de) 1993-04-22

Family

ID=26503511

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686111650T Expired - Fee Related DE3686990T2 (de) 1985-08-23 1986-08-22 Verfahren zum herstellen einer halbleiteranordnung wobei ein filmtraegerband angewendet wird.

Country Status (3)

Country Link
US (1) US4763409A (de)
EP (1) EP0213575B1 (de)
DE (1) DE3686990T2 (de)

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JPS63142894A (ja) * 1986-12-06 1988-06-15 株式会社東芝 フラツトパツケ−ジ集積回路の配線基板
FR2614134B1 (fr) * 1987-04-17 1990-01-26 Cimsa Sintra Procede de connexion d'un composant electronique pour son test et son montage, et dispositif de mise en oeuvre de ce procede
JPH0526746Y2 (de) * 1987-07-14 1993-07-07
JPH0783036B2 (ja) * 1987-12-11 1995-09-06 三菱電機株式会社 キヤリアテープ
FR2625067A1 (fr) * 1987-12-22 1989-06-23 Sgs Thomson Microelectronics Procede pour fixer sur un support un composant electronique et ses contacts
DE3809005A1 (de) * 1988-03-17 1989-09-28 Hitachi Semiconductor Europ Gm Chipmodul und seine herstellung und verwendung
US4980219A (en) * 1988-04-06 1990-12-25 Casio Computer Co., Ltd. Carrier tape for bonding IC devices and method of using the same
US4862827A (en) * 1988-06-28 1989-09-05 Wacker-Chemie Gmbh Apparatus for coating semiconductor components on a dielectric film
US5121053A (en) * 1988-10-11 1992-06-09 Hewlett-Packard Company Tab frame and process of testing same
JPH03505146A (ja) * 1988-12-07 1991-11-07 トリボテック テープ自動接着導線パッケージ及び該パッケージに使用する再使用可能な送りテープ
US5184207A (en) * 1988-12-07 1993-02-02 Tribotech Semiconductor die packages having lead support frame
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
USRE35385E (en) * 1988-12-12 1996-12-03 Sgs-Thomson Microelectronics, Sa. Method for fixing an electronic component and its contacts to a support
US4956605A (en) * 1989-07-18 1990-09-11 International Business Machines Corporation Tab mounted chip burn-in apparatus
US5156983A (en) * 1989-10-26 1992-10-20 Digtial Equipment Corporation Method of manufacturing tape automated bonding semiconductor package
US5008615A (en) * 1989-11-03 1991-04-16 Motorola, Inc. Means and method for testing integrated circuits attached to a leadframe
US5076485A (en) * 1990-04-24 1991-12-31 Microelectronics And Computer Technology Corporation Bonding electrical leads to pads with particles
US4995551A (en) * 1990-04-24 1991-02-26 Microelectronics And Computer Technology Corporation Bonding electrical leads to pads on electrical components
US5029386A (en) * 1990-09-17 1991-07-09 Hewlett-Packard Company Hierarchical tape automated bonding method
US5148003A (en) * 1990-11-28 1992-09-15 International Business Machines Corporation Modular test oven
US5678301A (en) * 1991-06-04 1997-10-21 Micron Technology, Inc. Method for forming an interconnect for testing unpackaged semiconductor dice
US5133118A (en) * 1991-08-06 1992-07-28 Sheldahl, Inc. Surface mounted components on flex circuits
US5330919A (en) * 1993-02-08 1994-07-19 Motorola, Inc. Method for electrically testing a semiconductor die using a test apparatus having an independent conductive plane
JPH06331678A (ja) * 1993-05-13 1994-12-02 Internatl Business Mach Corp <Ibm> 電子部品のリード接続を検査する方法および装置
JP2500785B2 (ja) * 1993-09-20 1996-05-29 日本電気株式会社 半導体パッケ―ジ用フィルムキャリアテ−プ及びこれを用いた半導体装置
US5367763A (en) * 1993-09-30 1994-11-29 Atmel Corporation TAB testing of area array interconnected chips
US5766983A (en) * 1994-04-29 1998-06-16 Hewlett-Packard Company Tape automated bonding circuit with interior sprocket holes
US5920114A (en) 1997-09-25 1999-07-06 International Business Machines Corporation Leadframe having resilient carrier positioning means
JP3608205B2 (ja) * 1996-10-17 2005-01-05 セイコーエプソン株式会社 半導体装置及びその製造方法並びに回路基板
KR100205353B1 (ko) * 1996-12-27 1999-07-01 구본준 프리-몰드 패들을 갖는 반도체 패키지 제조 공정용 리드 프레임
JP3022819B2 (ja) * 1997-08-27 2000-03-21 日本電気アイシーマイコンシステム株式会社 半導体集積回路装置
US6473702B1 (en) * 2000-06-27 2002-10-29 Advanced Micro Devices, Inc. System and method for integrated singulation and inspection of semiconductor devices
JP3675364B2 (ja) * 2001-05-30 2005-07-27 ソニー株式会社 半導体装置用基板その製造方法および半導体装置
US6783316B2 (en) * 2001-06-26 2004-08-31 Asm Assembly Automation Limited Apparatus and method for testing semiconductor devices
DE10213296B9 (de) * 2002-03-25 2007-04-19 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Nutzens
US7271047B1 (en) * 2006-01-06 2007-09-18 Advanced Micro Devices, Inc. Test structure and method for measuring the resistance of line-end vias
US20110012240A1 (en) * 2009-07-15 2011-01-20 Chenglin Liu Multi-Connect Lead
CN107770956A (zh) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 电路板结构
US11908705B2 (en) * 2021-10-18 2024-02-20 Texas Instruments Incorporated Interconnect singulation

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US2795043A (en) * 1954-08-16 1957-06-11 Fleischer Ruth Device for administering medicine to be attached to a spoon handle
DE1909480C2 (de) * 1968-03-01 1984-10-11 General Electric Co., Schenectady, N.Y. Trägeranordnung und Verfahren zur elektrischen Kontaktierung von Halbleiterchips
US3678385A (en) * 1969-09-26 1972-07-18 Amp Inc Assembly and test device for microelectronic circuit members
JPS517096B1 (de) * 1971-03-10 1976-03-04
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process
US4026008A (en) * 1972-10-02 1977-05-31 Signetics Corporation Semiconductor lead structure and assembly and method for fabricating same
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
CA1052912A (en) * 1975-07-07 1979-04-17 National Semiconductor Corporation Gang bonding interconnect tape for semiconductive devices and method of making same
US4138691A (en) * 1977-06-07 1979-02-06 Nippon Electric Co., Ltd. Framed lead assembly for a semiconductor device comprising insulator reinforcing strips supported by a frame and made integral with lead strips
JPS5826828B2 (ja) * 1978-04-26 1983-06-06 新光電気工業株式会社 テ−プキヤリアの製造方法
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Also Published As

Publication number Publication date
EP0213575A3 (en) 1987-11-25
US4763409A (en) 1988-08-16
EP0213575A2 (de) 1987-03-11
EP0213575B1 (de) 1992-10-21
DE3686990D1 (de) 1992-11-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee