TW202239815A - 絕緣膜形成用感放射線性組成物、具有圖案的樹脂膜及其製造方法、及半導體電路基板 - Google Patents
絕緣膜形成用感放射線性組成物、具有圖案的樹脂膜及其製造方法、及半導體電路基板 Download PDFInfo
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- 238000009864 tensile test Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
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Classifications
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- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
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- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H—ELECTRICITY
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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| CN115298616B (zh) * | 2020-03-18 | 2026-01-13 | 日产化学株式会社 | 感光性绝缘膜形成用组合物 |
| JP2024160416A (ja) * | 2021-09-21 | 2024-11-14 | 日産化学株式会社 | 非感光性絶縁膜形成組成物 |
| US20250188202A1 (en) | 2022-03-14 | 2025-06-12 | Mitsubishi Gas Chemical Company, Inc. | Hydroxy resin, styrene resin, method for producing hydroxy resin, method for producing styrene resin, and applications thereof |
| JP7459394B2 (ja) | 2022-03-14 | 2024-04-01 | 三菱瓦斯化学株式会社 | 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
| US20250257214A1 (en) | 2022-03-14 | 2025-08-14 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device |
| CN118922466A (zh) | 2022-03-14 | 2024-11-08 | 三菱瓦斯化学株式会社 | 树脂、树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板、以及半导体装置 |
| WO2024090408A1 (ja) | 2022-10-26 | 2024-05-02 | 三菱瓦斯化学株式会社 | 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板 |
| KR20250097842A (ko) | 2022-10-27 | 2025-06-30 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판 |
| JPWO2024095884A1 (https=) * | 2022-10-31 | 2024-05-10 | ||
| CN118047913A (zh) | 2022-11-16 | 2024-05-17 | Agc多材料美国有限公司 | 可固化组合物 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI871055B (zh) * | 2023-10-19 | 2025-01-21 | 台燿科技股份有限公司 | 樹脂組成物及其應用 |
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| JPWO2022210096A1 (https=) | 2022-10-06 |
| JP7827200B2 (ja) | 2026-03-10 |
| KR20230165903A (ko) | 2023-12-05 |
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| JP7738056B2 (ja) | 2025-09-11 |
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| WO2022210096A1 (ja) | 2022-10-06 |
| US20240026069A1 (en) | 2024-01-25 |
| EP4316814A1 (en) | 2024-02-07 |
| EP4316814A4 (en) | 2025-04-09 |
| WO2022210095A1 (ja) | 2022-10-06 |
| US20240389227A1 (en) | 2024-11-21 |
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