KR20230165904A - 절연막 형성용 감방사선성 조성물, 패턴을 갖는 수지막 및 반도체 회로 기판 - Google Patents
절연막 형성용 감방사선성 조성물, 패턴을 갖는 수지막 및 반도체 회로 기판 Download PDFInfo
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- KR20230165904A KR20230165904A KR1020237031975A KR20237031975A KR20230165904A KR 20230165904 A KR20230165904 A KR 20230165904A KR 1020237031975 A KR1020237031975 A KR 1020237031975A KR 20237031975 A KR20237031975 A KR 20237031975A KR 20230165904 A KR20230165904 A KR 20230165904A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
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- C—CHEMISTRY; METALLURGY
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- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
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- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4006—(I) or (II) containing elements other than carbon, oxygen, hydrogen or halogen as leaving group (X)
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
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- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
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- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021063607 | 2021-04-02 | ||
| JPJP-P-2021-063606 | 2021-04-02 | ||
| JP2021063606 | 2021-04-02 | ||
| JPJP-P-2021-063607 | 2021-04-02 | ||
| PCT/JP2022/013159 WO2022210096A1 (ja) | 2021-04-02 | 2022-03-22 | 絶縁膜形成用感放射線性組成物、パターンを有する樹脂膜および半導体回路基板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230165904A true KR20230165904A (ko) | 2023-12-05 |
Family
ID=83455279
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237031975A Pending KR20230165904A (ko) | 2021-04-02 | 2022-03-22 | 절연막 형성용 감방사선성 조성물, 패턴을 갖는 수지막 및 반도체 회로 기판 |
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| CN115298616B (zh) * | 2020-03-18 | 2026-01-13 | 日产化学株式会社 | 感光性绝缘膜形成用组合物 |
| JP2024160416A (ja) * | 2021-09-21 | 2024-11-14 | 日産化学株式会社 | 非感光性絶縁膜形成組成物 |
| US20250188202A1 (en) | 2022-03-14 | 2025-06-12 | Mitsubishi Gas Chemical Company, Inc. | Hydroxy resin, styrene resin, method for producing hydroxy resin, method for producing styrene resin, and applications thereof |
| JP7459394B2 (ja) | 2022-03-14 | 2024-04-01 | 三菱瓦斯化学株式会社 | 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
| US20250257214A1 (en) | 2022-03-14 | 2025-08-14 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device |
| CN118922466A (zh) | 2022-03-14 | 2024-11-08 | 三菱瓦斯化学株式会社 | 树脂、树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板、以及半导体装置 |
| WO2024090408A1 (ja) | 2022-10-26 | 2024-05-02 | 三菱瓦斯化学株式会社 | 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板 |
| KR20250097842A (ko) | 2022-10-27 | 2025-06-30 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판 |
| JPWO2024095884A1 (https=) * | 2022-10-31 | 2024-05-10 | ||
| CN118047913A (zh) | 2022-11-16 | 2024-05-17 | Agc多材料美国有限公司 | 可固化组合物 |
| WO2024257781A1 (ja) * | 2023-06-16 | 2024-12-19 | Jsr株式会社 | 配線基板形成用熱硬化性樹脂組成物、硬化物、プリプレグおよび層間絶縁フィルム |
| TW202536020A (zh) * | 2023-10-16 | 2025-09-16 | 日商Agc股份有限公司 | 組合物、預浸體、及金屬箔積層板 |
| TWI871055B (zh) * | 2023-10-19 | 2025-01-21 | 台燿科技股份有限公司 | 樹脂組成物及其應用 |
| WO2025115606A1 (ja) * | 2023-11-30 | 2025-06-05 | Jsr株式会社 | 樹脂組成物、硬化物、および電子部品 |
| JP2025104831A (ja) | 2023-12-28 | 2025-07-10 | 味の素株式会社 | 樹脂組成物 |
| WO2025206187A1 (ja) * | 2024-03-28 | 2025-10-02 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| CN121628365A (zh) | 2024-09-10 | 2026-03-10 | 味之素株式会社 | 树脂组合物 |
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| KR20230165903A (ko) | 2023-12-05 |
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| US20240026069A1 (en) | 2024-01-25 |
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| US20240389227A1 (en) | 2024-11-21 |
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