JP2020029504A - 硬化性組成物 - Google Patents
硬化性組成物 Download PDFInfo
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- JP2020029504A JP2020029504A JP2018155547A JP2018155547A JP2020029504A JP 2020029504 A JP2020029504 A JP 2020029504A JP 2018155547 A JP2018155547 A JP 2018155547A JP 2018155547 A JP2018155547 A JP 2018155547A JP 2020029504 A JP2020029504 A JP 2020029504A
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- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- CBEVWPCAHIAUOD-UHFFFAOYSA-N 4-[(4-amino-3-ethylphenyl)methyl]-2-ethylaniline Chemical compound C1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=CC=2)=C1 CBEVWPCAHIAUOD-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- DHXQMZGNBBWBRE-UHFFFAOYSA-N C=CCCC(C1)(C2C(N3Cc4cccc(CN(C(C5C6C7(CCC=C)C=CC5C7)=O)C6=O)c4)=O)C=CC1C2C3=O Chemical compound C=CCCC(C1)(C2C(N3Cc4cccc(CN(C(C5C6C7(CCC=C)C=CC5C7)=O)C6=O)c4)=O)C=CC1C2C3=O DHXQMZGNBBWBRE-UHFFFAOYSA-N 0.000 description 1
- UWWXABHNYGIIRZ-UHFFFAOYSA-N C=CCCC(C1)(C2C(N3c4ccc(Cc(cc5)ccc5N(C(C5C6C7(CCC=C)C=CC5C7)=O)C6=O)cc4)=O)C=CC1C2C3=O Chemical compound C=CCCC(C1)(C2C(N3c4ccc(Cc(cc5)ccc5N(C(C5C6C7(CCC=C)C=CC5C7)=O)C6=O)cc4)=O)C=CC1C2C3=O UWWXABHNYGIIRZ-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N CN(C(C=C1)=O)C1=O Chemical compound CN(C(C=C1)=O)C1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 150000007945 N-acyl ureas Chemical group 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 235000018936 Vitellaria paradoxa Nutrition 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- CWRYPZZKDGJXCA-UHFFFAOYSA-N acenaphthene Chemical group C1=CC(CC2)=C3C2=CC=CC3=C1 CWRYPZZKDGJXCA-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000008064 anhydrides Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- VUKHQPGJNTXTPY-UHFFFAOYSA-N but-2-enylbenzene Chemical group CC=CCC1=CC=CC=C1 VUKHQPGJNTXTPY-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- LNEUSAPFBRDCPM-UHFFFAOYSA-N carbamimidoylazanium;sulfamate Chemical compound NC(N)=N.NS(O)(=O)=O LNEUSAPFBRDCPM-UHFFFAOYSA-N 0.000 description 1
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000006081 fluorescent whitening agent Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000005254 oxyacyl group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002627 poly(phosphazenes) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000003107 substituted aryl group Chemical group 0.000 description 1
- 125000005346 substituted cycloalkyl group Chemical group 0.000 description 1
- 125000005420 sulfonamido group Chemical group S(=O)(=O)(N*)* 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- LTURHSAEWJPFAA-UHFFFAOYSA-N sulfuric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OS(O)(=O)=O.NC1=NC(N)=NC(N)=N1 LTURHSAEWJPFAA-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- QQOWHRYOXYEMTL-UHFFFAOYSA-N triazin-4-amine Chemical compound N=C1C=CN=NN1 QQOWHRYOXYEMTL-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Images
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
式中、R1及びR2は、それぞれ独立にアルキレン基を表し、R3及びR4は、それぞれ独立にアルキル基を表す。
式中、Z1、Z2及びZ3は、それぞれ独立に上述した2価の炭化水素基を表し、R5は式(IV)中のR5と同義であり、nは1〜10の整数を表す。nが2以上である場合、複数のZ3は、互いに同一であっても異なっていてもよい。
ポンプ:L−6200型[株式会社日立ハイテクノロジーズ製]
検出器:L−3300型RI[株式会社日立ハイテクノロジーズ製]
カラムオーブン:L−655A−52[株式会社日立ハイテクノロジーズ製]
ガードカラム及びカラム:TSK Guardcolumn HHR−L+TSKgel G4000HHR+TSKgel G2000HHR[すべて東ソー株式会社製、商品名]
カラムサイズ:6.0×40mm(ガードカラム)、7.8×300mm(カラム)
溶離液:テトラヒドロフラン
試料濃度:30mg/5mL
注入量:20μL
測定温度:40℃
式(2)中、R11及びmは、それぞれ独立に、式(1)中のR11及びmとそれぞれ同義であり、R12は、2価の有機基を表す。
ここでのイオンクロマトグラフィーの条件は以下のとおりである。
・装置:ダイオネクス製ISC−2000
・検出器:電気伝導度検出器
・カラム:AS20(4mmφ×200mm)
・カラム温度:30℃
・流速:1.0mL/分
・注入量:25μL
・グラジェント設定:KOH濃度を、0分に5mM、5分で5mM、15分で30mM、20分で55mMに設定した。
(A−1):下記式で表されるマレイミド化合物(n=1〜10の混合物、重量平均分子量:15000〜20000程度、日立化成株式会社製、商品名:SFR2300)
(A−2):下記式で表されるマレイミド化合物の混合物(大和化成工業株式会社製、商品名:BMI−TMH)
(a−1):アクリル系エラストマ(日立化成株式会社製、商品名:KH−CT−865)
(B−2):下記式(3−2)で表されるナジイミド化合物(丸善石油化学株式会社製、商品名:BANI−M)
(b−1)液状エポキシ樹脂(jER811、三菱ケミカル株式会社製)とした場合の比較例を追記いたしました。
(D):光ラジカル重合開始剤(BASF社製、商品名:Irgacure OXE02)
(E):エポキシ基を有するシランカップリング剤(信越化学工業株式会社製、商品名:X−12−984S)
上記の各成分を表1〜3に示す配合比で混合し、ワニスを作製した。作製したワニスをピーラブル銅箔上に下記の条件でスピンコートした後、乾燥、露光及び露光後ベークを行って樹脂膜を形成した。これを複数回重ねることで、30〜100μm程度の厚みを有する樹脂膜を得た。その後、220℃で2時間硬化させた。続いて、銅箔を剥離し、銅箔を過硫酸アンモニウムにて溶解除去して評価用サンプルを得た。
なお、スピンコート、乾燥、露光及び露光後ベークの条件は、それぞれ以下のとおりとした。
・スピンコート条件
Step.1:1000rpm/5秒
Step.2:2000rpm/30秒
SLOPE:5秒
・乾燥条件
90℃、3分間
・露光条件
露光量:1000mJ/cm2
ブロードバンド露光
・露光後ベーク(PEB)
100℃、1分間
SAPを用いて作製された櫛状配線上に、スピンコートにて上記のワニスを塗布し、続いて、乾燥、露光及びPEBを経て、評価用サンプルを作製した。なお、スピンコート、乾燥、露光及び露光後ベークの条件は、それぞれ上記の誘電特性の評価用サンプルの条件と同じとした。湿度85%、130℃の条件下において、作製した櫛状配線に3.3Vの電圧を印加した状態で静置した。陽極と陰極との間の抵抗値を予定の時間ごとに測定し、当該抵抗値が、300時間以上1×106Ω以上であったもの「A」(絶縁信頼性(b−HAST耐性)あり)とし、そうでなかったものを「B」(絶縁信頼性(b−HAST耐性)なし)として評価した。
誘電特性の評価用サンプルと同様にして作製した評価サンプルを、8mm×3cmの大きさに切り出した。このサンプルについて、DMA(動的粘弾性測定)装置(株式会社ユービーエム製、商品名:Rheogel−E4000)を用い、チャック間距離20mm、周波数10Hz、昇温速度10℃/分、温度範囲−30〜300℃の条件で引っ張り法にて測定した、tanδが最大値を示す温度をガラス転移温度(℃)として記録した。
誘電特性の評価用サンプルと同様にして作製した評価サンプルを、4mm×3cmの大きさに切り出し、TMA(熱機械的分析)装置(セイコーインスツルメンツ株式会社製、商品名:TMA/SS6000)を用いて、荷重10mNかつ下記の温度条件で、引っ張り法にて、50℃〜70℃における線膨張率α1(10−6/K)及び200℃〜220℃における線膨張率α2(10−6/K)を測定した。
・温度条件
30℃→200℃ (昇温速度10℃/分)
200℃→30℃ (降温速度20℃/分)
30℃→260℃ (昇温速度5℃/分)
260℃→30℃ (降温速度20℃/分)
シリコンウェハ(6インチ径、厚さ400μm)上に、スピンコートにて上記のワニスを塗布し、90℃/3分加熱乾燥して、シリコンウェハ上に樹脂膜を形成した。高精度平行露光機(株式会社オーク製作所製、商品名:EXM−1172−B−∞)を用いて1000mJ/cm2で露光した。さらに、100℃/1分の条件で追加加熱を行った後、220℃/2時間更に加熱してサンプルを得た。
得られたサンプルの樹脂膜上に、50nmのチタン膜をスパッタで製膜し、次いで、150nmの銅膜をスパッタで製膜した。冷却後、サンプルを取り出し、スパッタ膜における割れ又はシワの有無を顕微鏡にて観察した。スパッタ膜に割れ又はシワが観察されたかったものを「A」(スパッタ耐性あり)、割れ又はシワが観察されたものを「B」(スパッタ耐性なし)として評価した。
ウェハ(6インチ径、厚さ400μm)にスピンコータを用いて上記のワニスを塗布し、90℃/3分乾燥させて樹脂層を形成した。1000mJ/cm2で露光して硬化させた後、220℃/2時間加熱することによって、試料を作製した。この試料を、相対湿度85%、130℃に設定された恒温恒湿槽(エスペック株式会社製、商品名:EHS−221MD)内にて、200時間静置した。そして、恒温恒湿槽内を50℃まで下げた後、試料を取り出し、シリコンウェハ上から樹脂の一部を削り取った。削り取られた樹脂の一部を示差熱熱重量同時測定装置(株式会社日立ハイテクサイエンス製、商品名:TG/DTA6300)を用いて、昇温速度:10℃/分、窒素フロー:400mL/分、温度範囲:25℃〜150℃の条件下で測定した。一方で、同様に作製した試料を、130℃で2時間乾燥させ、同様の方法でTG−DTAを測定した。これらの150℃における重量減少率の差を吸湿率として算出した。
ピーラブルコア上に上記のワニスをスピンコートし、乾燥させた。次に露光する際、長さ30mm、幅5mmのマスクを介して露光した。得られた資料を現像したのち、220℃で2時間硬化させた。以降は上記と同様に銅箔部をエッチングすることで樹脂フィルムを得た。得られたサンプルを、小型卓上試験機(株式会社島津製作所製、商品名:EZ−S)にて送り速度5mm/分にて測定したときの破断伸びを測定した。この方法で作製した樹脂フィルムは、端部がなめらかであるため、カッターなどの刃物を用いて切り出したサンプルと比較して、より高い伸び率が得られた。
シリコンウェハ(6インチ径、厚さ400μm)上に、スピンコートにてワニスを塗布し、90℃/3分加熱乾燥して、シリコンウェハ上に樹脂膜を形成した。その際、乾燥後の樹脂の膜厚は5μmとなるようにスピンコート条件を調整した。次に、Line/Space(L/S(μm/μm))が200/200、100/100、80/80、60/60、50/50、40/40、30/30、20/20、10/10、7/7、5/5、4/4、3/3で、ビア径が50、40、30、20、10、7、5、4、3μmとなるネガ型用パターンマスクを載せ、高精度平行露光機(オーク製作所製、商品名:EXM−1172−B−∞)を用いて1000mJ/cm2で露光した。さらに、100℃/1分の条件で追加加熱を行い、サンプルを得た。得られたサンプルをシクロペンタノンに室温(25℃)で60秒、揺動しながら浸漬、次いでシクロペンタノンでリンスしてからイソプロピルアルコールに室温(25℃)で5秒間浸漬した。その後、圧空を吹きかけるなどしてイソプロピルアルコールを揮発させた。
微細配線形成性は、樹脂膜のウェハ上から剥離、樹脂膜のひび割れ、パターン端部の荒れの有無、及び、樹脂を現像したパターン底部の残渣の有無を金属顕微鏡で確認した。これらの不具合が確認できなかった最小のL/S及びビア径を微細加工性とした。
Claims (6)
- 前記2価の有機基が芳香族炭化水素基を有する、請求項2又は3に記載の硬化性組成物。
- 前記2価の有機基が2価の炭化水素基である、請求項2〜4のいずれか一項に記載の硬化性組成物。
- 半導体パッケージの配線層間絶縁層の形成に用いられる、請求項1〜5のいずれか一項に記載の硬化性組成物。
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WO2021172198A1 (en) | 2020-02-25 | 2021-09-02 | Ricoh Company, Ltd. | Reflecting mirror, vertical cavity surface emitting laser, vertical cavity surface emitting laser array, projector, head up display, movable body, head mount display, optometry apparatus, and lighting apparatus |
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