TW201913903A - 感測器封裝結構 - Google Patents

感測器封裝結構 Download PDF

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TW201913903A
TW201913903A TW106139004A TW106139004A TW201913903A TW 201913903 A TW201913903 A TW 201913903A TW 106139004 A TW106139004 A TW 106139004A TW 106139004 A TW106139004 A TW 106139004A TW 201913903 A TW201913903 A TW 201913903A
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support frame
substrate
package structure
sensor package
pads
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TWI631672B (zh
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莊俊華
黃文忠
辛宗憲
彭鎮濱
洪立群
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勝麗國際股份有限公司
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Abstract

一種感測器封裝結構，包含基板、感測晶片、多條金屬線、支撐架、透光蓋板、及模製封裝體。基板包含有晶片固定區及位於晶片固定區外側的多個第一接墊。感測晶片配置於晶片固定區上且包含有感測區及位於感測區外側的多個第二接墊。多條金屬線一端分別連接該些第一接墊，且另一端分別連接該些第二接墊。支撐架設置於基板及/或感測晶片之上方，支撐架的內側邊緣形成有定位部。透光蓋板配置於支撐架上並藉由定位部固定於感測晶片上方，以與感測晶片維持一垂直距離。模製封裝體填充於基板與支撐架之間，並覆蓋於支撐架的部分上表面。

Description

感測器封裝結構
本發明涉及一種封裝結構，尤其涉及一種感測器封裝結構。
現有的感測器封裝結構為了縮小尺寸，其大都採用模壓底腳型影像封裝(image sensor molded on leadless chip carrier，iMLCC)之封裝結構，而上述模壓底腳型影像封裝結構是在透光蓋板與感測晶片之間設置有框體，藉以維持透光蓋板與感測晶片之間的垂直距離。然而，對於維持透光蓋板與感測晶片之間的垂直距離來說，現有感測器封裝結構還有能夠改善的空間存在。
於是，本發明人認為上述缺陷可改善，乃特潛心研究並配合科學原理的運用，終於提出一種設計合理且有效改善上述缺陷的本發明。
本發明實施例在於提供一種感測器封裝結構，其能有效地改善現有感測器封裝結構所可能產生的缺陷。
本發明實施例公開一種感測器封裝結構，包括：一基板，包含有一晶片固定區及位於該晶片固定區外側的多個第一接墊；一感測晶片，配置於該晶片固定區上，且包含有一感測區及位於該感測區外側的多個第二接墊；多條金屬線，一端分別連接該些第一接墊，且另一端分別連接該些第二接墊；一支撐架，設置於該基板及/或該感測晶片之上方，該支撐架的內側邊緣形成有一定位部；一透光蓋板，配置於該支撐架上，該透光蓋板藉由該定位部 固定於該感測晶片上方，並與該感測晶片維持一垂直距離；以及一模製封裝體，填充於該基板與該支撐架之間，並覆蓋於該支撐架的部分上表面。
綜上所述，本發明實施例所公開的感測器封裝結構，其通過將支撐架大致埋置於模製封裝體內(如：模製封裝體填充於該基板與該支撐架之間、並覆蓋於該支撐架的部分上表面)，以使透光蓋板與感測晶片之間的垂直距離能夠被有效地維持。再者，該支撐架還設有能夠固定透光蓋板的定位部，藉以保持透光蓋板與感測晶片之間的相對位置。
為能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與附圖，但是此等說明與附圖僅用來說明本發明，而非對本發明的保護範圍作任何的限制。
100、100’、200、200’、300、300’、400、500‧‧‧感測器封裝結構
1‧‧‧基板
11‧‧‧晶片固定區
12‧‧‧第一接墊
2‧‧‧感測晶片
21‧‧‧感測區
22‧‧‧第二接墊
3‧‧‧金屬線
4‧‧‧支撐架
41‧‧‧支撐腳
42‧‧‧定位部(如：環形槽)
421‧‧‧缺口
43‧‧‧內環部
44‧‧‧外環部
441‧‧‧裸露段
45‧‧‧內凹槽
46‧‧‧外凹槽
47‧‧‧裁切面
5‧‧‧密封膠
6‧‧‧透光蓋板
7‧‧‧擋牆
8‧‧‧電子元件
9‧‧‧模製封裝體
D‧‧‧垂直距離
C‧‧‧氣流通道
S‧‧‧裁切路徑
圖1為本發明實施例一的感測器封裝結構未裁切的俯視示意圖。
圖2為圖1沿剖線Ⅱ-Ⅱ的剖視示意圖。
圖3為圖1沿剖線Ⅲ-Ⅲ的剖視示意圖。
圖4為本發明實施例一的感測器封裝結構的支撐架立體示意圖。
圖5為本發明實施例一的感測器封裝結構裁切後的剖視示意圖。
圖6為本發明實施例二的感測器封裝結構未裁切的俯視示意圖。
圖7為圖6沿剖線VⅡ-VⅡ的剖視示意圖。
圖8為圖6沿剖線VⅢ-VⅢ的剖視示意圖。
圖9為本發明實施例二的感測器封裝結構裁切後的剖視示意圖。
圖10為本發明實施例三的感測器封裝結構未裁切的俯視示意圖。
圖11為圖10沿剖線XI-XI的剖視示意圖。
圖12為圖10沿剖線XⅡ-XⅡ的剖視示意圖。
圖13為本發明實施例三的感測器封裝結構裁切後的剖視示意圖。
圖14A為本發明實施例四的感測器封裝結構示意圖(一)。
圖14B為本發明實施例四的感測器封裝結構示意圖(二)。
請參閱圖1至圖14B，為本發明的實施例，需先說明的是，本實施例對應附圖所提及的相關數量與外形，僅用來具體地說明本發明的實施方式，以便於了解本發明的內容，而非用來侷限本發明的保護範圍。
需先說明的是，本發明公開一種感測器封裝結構，並且該感測器封裝結構可依據設計者的需求而選擇性地被裁切。也就是說，本發明的感測器封裝結構可以是未裁切的類型或是裁切後的類型，而為便於理解本發明，以下各個實施例將先說明未裁切的感測器封裝結構，而後再說明未裁切的感測器封裝結構經裁切後所產生的差異。
[實施例一]
請參閱圖1至圖5所示，其為本發明的實施例一。如圖1至圖3所示，該感測器封裝結構100包含有一基板1、配置於該基板1上的一感測晶片2、電性連接該基板1與該感測晶片2的多條金屬線3、設置於該基板1及/或該感測晶片2之上方的一支撐架4、黏接在該感測晶片2與該支撐架4之間的一密封膠5、配置於該支撐架4上的一透光蓋板6、配置於該透光蓋板6頂面的一擋牆7、填充於該基板1與該支撐架4之間並覆蓋於該支撐架4部分上表面的一模製封裝體9(molding compound)、及配置於該基板1上且埋置在該模製封裝體9內的至少一個電子元件8。以下將分別就本實施例之感測器封裝結構100的各個元件構造與連接關係作一說明。
該基板1於本實施例中呈方形或矩形且其至少一邊緣長度小 於或等於7.5毫米(mm)，而該基板1較佳是其任一邊緣長度小於或等於7.5毫米。其中，該基板1的頂面設有一晶片固定區11及位於該晶片固定區11外側的多個第一接墊12。該晶片固定區11的形狀對應於該感測晶片2，並且該晶片固定區11於本實施例中為矩形，其包含有相對的兩個短邊緣及相對的兩個長邊緣(如圖1)，而該些第一接墊12分別設置於該晶片固定區11的兩個短邊緣與其中一個長邊緣的外側。
該感測晶片2於本實施例中為影像感測晶片，並且該感測晶片2的頂面設有一感測區21及位於該感測區21外側的多個第二接墊22。其中，該感測區21於本實施例中為矩形，其包含有相對的兩個短邊緣及相對的兩個長邊緣(如：圖1)，而該些第二接墊22分別設置於該感測區21的兩個短邊緣與其中一個長邊緣的外側。
再者，該感測晶片2配置於該基板1的晶片固定區11上，並且該些第二接墊22的位置分別對應於該些第一接墊12的位置。換個角度來說，該基板1的該晶片固定區11其中一個長邊緣外側未設有任何第一接墊12；該感測晶片2的感測區21其中一個長邊緣外側未設有任何第二接墊22、並且其鄰近於上述外側未設有任何第一接墊12的該晶片固定區11之該長邊緣。
該些金屬線3的一端分別連接該些第一接墊12、並且另一端分別連接該些第二接墊22，藉以使該基板1與該感測晶片2能通過該些金屬線3而達成電性連接。其中，每條金屬線3較佳是以反打的方式形成，藉以降低其高度。
該支撐架4於本實施例中呈環狀，並且該支撐架4在其外側部位形成有多個支撐腳41(如：圖1或圖4)，而該支撐架4的 內側邊緣形成有一定位部42。其中，該定位部42於本實施例中為一環形槽，且該環形槽形成在該支撐架4的內側邊緣之頂部。
再者，該支撐架4的該些支撐腳41設置在該基板1上，而接觸於該些支撐腳41的該基板1位置是分別位於該晶片固定區11的外側、且分別對應於該晶片固定區11的兩個短邊緣及上述外側未設有任何第一接墊12的該長邊緣。該支撐架4的內側部位底緣利用該密封膠5黏著於該感測晶片2上，且該密封膠5的局部介於該感測區21與該些第二接墊22之間(在其他實施例中，密封膠5也可覆蓋住該些第二接墊22)，藉以使該支撐架4與該感測晶片2之間形成大致無縫隙地連接。
該透光蓋板6於本實施例中為透明的平板狀構造，並且該透光蓋板6的外形對應於(如：等同或略小於)該定位部42的外形，而該透光蓋板6的厚度較佳是大於該定位部42(即該環形槽)的深度。換個角度來說，該透光蓋板6的尺寸於本實施例中是大於該感測晶片2(或該晶片固定區11)的尺寸。
再者，該透光蓋板6的底部配置於該支撐架4的定位部42內，也就是說，本實施例的透光蓋板6頂部突伸出定位部42。並且該透光蓋板6藉由該定位部42固定於該感測晶片2上方，藉以與該感測晶片2維持一垂直距離D。也就是說，本實施例的感測器封裝結構100能通過改變該定位部42，而精準地控制該透光蓋板6與該感測晶片2之間的垂直距離D。其中，本實施例的垂直距離D較佳是至少200微米(μm)。在另一較佳的實施例中，垂直距離D較佳是300微米(μm)。
需額外說明的是，如圖3和圖4所示，該支撐架4在定位部42(或環形槽)上形成有一缺口421，該缺口421的側壁與該透光蓋板6之間形成有一氣流通道C，該氣流通道C連通至該感測區21與該透光蓋板6之間形成的空間。藉此，在本實施例感測器封 裝結構100的製造過程中，該氣流通道C能有效地避免該感測區21與透光蓋板6之間的空氣膨脹而造成透光蓋板6位移。
再者，該缺口421的局部是對應於該晶片固定區11其中一個短邊緣的該支撐腳41，並且該氣流通道C的出口是落在該支撐腳41的上方。
該擋牆7設置於鄰近該透光蓋板6邊緣的頂面部位、且覆蓋至少一部分該透光蓋板6的頂面。其中，該擋牆7於本實施例中呈環狀並且較佳是與該透光蓋板6的邊緣留有距離。進一步地說，該擋牆7朝向該感測晶片2頂面正投影所形成的一投影區域，其較佳是圍繞在該感測區21的外側。
該至少一個電子元件8的數量於本實施例中以多個來說明，而每個電子元件8的類型可依據設計者需求而變化，本發明在此不加以限制。其中，該些電子元件8配置於該基板1上並且分別位於該晶片固定區11的兩個長邊緣外側，而該些電子元件8的其中部分電子元件8是對應於(或鄰近於)上述外側未設有任何第一接墊12的該長邊緣、並且位於該支撐架4的下方。
該模製封裝體9大部分位在該基板1晶片固定區11以外的區域上，也就是說，該模製封裝體9朝向該基板1頂面正投影所形成的一投影區域，其較佳是大部分位於該晶片固定區11的外側。其中，該模製封裝體9的側表面大致切齊於該基板1的側緣，該模製封裝體9的頂面大致切齊於該擋牆7的頂緣。
更詳細地說，該模製封裝體9覆蓋該些第一接墊12、該些第二接墊22、該些金屬線3、及該些電子元件8。該模製封裝體9覆蓋在該支撐架4的上表面、鄰接於該擋牆7外側，並且該模製封裝體9覆蓋在位於該支撐架4上表面與該擋牆7之間的該透光蓋板6部位之頂緣與外側緣。其中，該模製封裝體9的頂面與該 基板1間之距離大於該透光蓋板6的頂面與該基板1間之距離。
以上為本實施例未裁切的感測器封裝結構100說明，而上述未裁切的感測器封裝結構100在沿著圖3(或圖1)中的兩條裁切路徑S進行裁切後，即可形成本實施例裁切後的感測器封裝結構100’(如：圖5)，藉以達到縮小尺寸的效果。以下接著說明本實施例裁切後的感測器封裝結構100’的差異處。
具體來說，如圖5所示，該支撐架4之部分側面為裁切面47，並且該支撐架4的之該部分側面與該模製封裝體9之側表面對齊。其中，對應該晶片固定區11之兩個短邊緣的該兩個支撐腳41被切除，以使該支撐架4的相對應部位形成有兩個裁切面47，並且該氣流通道C的出口則被改變至其中一個裁切面47上。
[實施例二]
請參閱圖6至圖9所示，其為本發明的實施例二，由於本實施例感測器封裝結構200的部分元件類似於上述實施例一所載，所以相同處則不再加以贅述。
具體來說，如圖6至圖8所示，該感測器封裝結構200包含有一基板1、配置於該基板1上的一感測晶片2、電性連接該基板1與該感測晶片2的多條金屬線3、設置於該感測晶片2且未接觸該基板1的一支撐架4、黏接在該感測晶片2與該支撐架4之間的一密封膠5、配置於該支撐架4上的一透光蓋板6、配置於該透光蓋板6頂面的一擋牆7、填充於該基板1與該支撐架4之間並覆蓋於該支撐架4部分上表面的一模製封裝體9、及配置於該基板1上且埋置在該模製封裝體9內的至少一個電子元件8。以下將分別就本實施例之感測器封裝結構200的各個元件構造與連接關係作一說明。
該支撐架4於本實施例中呈環狀且未設有支撐腳41，該支撐架4的內側邊緣形成有一定位部42，而本實施例的定位部42構造大致如同實施例一所載，在此不加以贅述。其中，該支撐架4包含有一內環部43與一外環部44，該外環部44連接於該內環部43之外側，而該定位部42形成在該內環部43的上方。
再者，該支撐架4的內環部43設置在該感測晶片2上(即位於該感測晶片2之邊緣上方)，而接觸於該內環部43的該感測晶片2之位置是位於該晶片固定區11的外側。進一步地說，支撐架4未接觸於該基板1，且兩者相隔有一距離；而該支撐架4的內環部43底緣利用該密封膠5黏著於該感測晶片2上，且該密封膠5的局部介於該感測區21與該些第二接墊22之間(在其他實施例中，密封膠5也可覆蓋住該些第二接墊22)，藉以使該支撐架4與該感測晶片2之間形成大致無縫隙地連接。進一步地說，對應於(或鄰近於)該感測區21兩個短邊緣的外環部44於本實施例中從該基板1突伸出、並於各邊定義一裸露段441。
另，該支撐架4與該透光蓋板6形成有一氣流通道C，其類似於實施例一所載，但本實施例支撐架4的缺口421局部是對應於該外環部44的其中一個裸露段441，並且該氣流通道C的出口是落在該裸露段441的上表面。
該至少一個電子元件8的數量於本實施例中以多個來說明，而每個電子元件8的類型可依據設計者需求而變化，本發明在此不加以限制。其中，該些電子元件8配置於該基板1上、且對應於(或鄰近於)上述外側未設有任何第一接墊12的該長邊緣、並位於該支撐架4的外環部44下方。
該模製封裝體9覆蓋該些第一接墊12、該些第二接墊22、該些金屬線3、及該些電子元件8。該模製封裝體9覆蓋在該支撐架 4的部分上表面、鄰接於該擋牆7外側，並且該模製封裝體9覆蓋在位於該支撐架4上表面與該擋牆7之間的該透光蓋板6部位之頂緣與外側緣。而該支撐架4的兩個裸露段441從該模製封裝體9突伸出。
以上為本實施例未裁切的感測器封裝結構200說明，而上述未裁切的感測器封裝結構200在沿著圖8(或圖6)中的兩條裁切路徑S進行裁切後，即可形成本實施例裁切後的感測器封裝結構200’(如：圖9)，藉以達到縮小尺寸的效果。以下接著說明本實施例裁切後的感測器封裝結構200’的差異處。
具體來說，如圖9所示，該支撐架4之部分側面為裁切面47，並且該支撐架4的之該部分側面與該模製封裝體9之側表面對齊。其中，該支撐架的兩個裸露段441被切除，以使該支撐架4的相對應部位形成有兩個裁切面47，並且該氣流通道C的出口則被改變至其中一個裁切面47上。
[實施例三]
請參閱圖10至圖13所示，其為本發明的實施例三，由於本實施例感測器封裝結構300的部分元件類似於上述實施例一所載，所以相同處則不再加以贅述。
具體來說，如圖10至圖12所示，該感測器封裝結構300包含有一基板1、配置於該基板1上的一感測晶片2、電性連接該基板1與該感測晶片2的多條金屬線3、設置於該基板1上的一支撐架4、配置於該支撐架4上的一透光蓋板6、配置於該透光蓋板6頂面的一擋牆7、填充於該基板1與該支撐架4之間並覆蓋於該支撐架4部分上表面的一模製封裝體9、及配置於該基板1上且埋置在該模製封裝體9內的多個電子元件8。以下將分別就本實施例之感測器封裝結構300的各個元件構造與連接關係作一說明。
該基板1上的該些第一接墊12分別設置於該晶片固定區11的兩個短邊緣的外側。該感測晶片2的該些第二接墊22分別設置於該感測區21的兩個短邊緣的外側、並且其位置分別對應於該些第一接墊12的位置。換個角度來說，該基板1的該晶片固定區11兩個長邊緣外側未設有任何第一接墊12，該感測晶片2的感測區21兩個長邊緣外側未設有任何第二接墊22。
該支撐架4於本實施例中呈環狀，並且該支撐架4在其外側部位形成有呈長形的至少兩個支撐腳41，而該支撐架4的內側邊緣形成有一定位部42，而本實施例的定位部42構造大致如同實施例一所載，在此不加以贅述。其中，該支撐架4於相對的各內側具有一內凹槽45，該支撐架4於相對的各外側底部具有一外凹槽46。
再者，該支撐架4的該些支撐腳41設置在該基板1上，而接觸於該些支撐腳41的該基板1位置是分別位於該晶片固定區11的外側、且分別對應於該晶片固定區11的兩個短邊緣。其中，該支撐架4的內凹槽45分別對應於該晶片固定區11的兩個短邊緣，而該支撐架4的外凹槽46分別對應於該晶片固定區11的兩個長邊緣，並且該些金屬線3分別容置於該些內凹槽45中，而該些電子元件8設置於基板1上且分別位於該些外凹槽46中。
另，該支撐架4與該透光蓋板6形成有一氣流通道C，其類似於實施例一所載，並且本實施例支撐架4的缺口421局部是對應於該支撐架4的其中一個支撐腳41，而該氣流通道C的出口是落在該支撐腳41的上方。
該模製封裝體9位在該支撐架4的外側及上側，也就是說，該模製封裝體9充填於該支撐架4的該些外凹槽46、但未充填於 該些內凹槽45，以使該模製封裝體9覆蓋該些電子元件8、但未覆蓋該些第一接墊12、該些第二接墊22、及該些金屬線3。其中，該模製封裝體9的側表面大致切齊於該基板1的側緣，該模製封裝體9的頂面大致切齊於該擋牆7的頂緣。
以上為本實施例未裁切的感測器封裝結構300說明，而上述未裁切的感測器封裝結構300在沿著圖12(或圖10)中的兩條裁切路徑S進行裁切後，即可形成本實施例裁切後的感測器封裝結構300’(如：圖13)，藉以達到縮小尺寸的效果。以下接著說明本實施例裁切後的感測器封裝結構300’的差異處。
具體來說，如圖13所示，該支撐架4之部分側面為裁切面47，並且該支撐架4的之該部分側面與該模製封裝體9之側表面對齊。其中，該支撐架4的兩個支撐腳41被切除，以使該支撐架4的相對應部位形成有兩個裁切面47，並且該氣流通道C的出口則被改變至其中一個裁切面47上。
[實施例四]
請參閱圖14A與圖14B，其為本發明的實施例四，由於本實施例感測器封裝結構400、500的部分元件類似於上述實施例一所載，所以相同處則不再加以贅述。
具體來說，本實施例中感測器封裝結構400、500的透光蓋板6之頂面與支撐架4的頂面切齊。而在圖14B的感測器封裝結構500中，擋牆7覆蓋透光蓋板6之頂面的外緣以及支撐架4之頂面的內緣。
[本發明實施例的技術功效]
綜上所述，本發明實施例所公開的感測器封裝結構，其通過將支撐架大致埋置於模製封裝體內(如：模製封裝體填充於該基 板與該支撐架之間、並覆蓋於該支撐架的部分上表面)，以使透光蓋板與感測晶片之間的垂直距離能夠被有效地維持。再者，該支撐架還設有能夠固定透光蓋板的定位部，藉以保持透光蓋板與感測晶片之間的相對位置。
另，本發明實施例所公開的感測器封裝結構，其能通過改變該支撐架上的定位部位置，而精準地控制該透光蓋板與感測晶片之間的垂直距離，例如：該垂直距離能被控制在200微米或300微米。再者，該感測器封裝結構能夠在支撐架大致埋置於模製封裝體內之後被裁切，藉以縮小尺寸。
又，本發明實施例一、實施例二、及實施例四所公開的感測器封裝結構，其通過將支撐架大致埋置於模製封裝體內，以達到晶片塑模(molding on chip，MOC)之技術門檻，進而有效地縮小感測器封裝結構的尺寸。
以上所述僅為本發明的優選可行實施例，並非用來侷限本發明的保護範圍，凡依本發明申請專利範圍所做的均等變化與修飾，皆應屬本發明的權利要求書的保護範圍。

Claims (13)

  1. 一種感測器封裝結構，包括：一基板，包含有一晶片固定區及位於該晶片固定區外側的多個第一接墊；一感測晶片，配置於該晶片固定區上，且包含有一感測區及位於該感測區外側的多個第二接墊；多條金屬線，一端分別連接該些第一接墊，且另一端分別連接該些第二接墊；一支撐架，設置於該基板及/或該感測晶片之上方，該支撐架的內側邊緣形成有一定位部；一透光蓋板，配置於該支撐架上，該透光蓋板藉由該定位部固定於該感測晶片上方，並與該感測晶片維持一垂直距離；以及一模製封裝體(molding compound)，填充於該基板與該支撐架之間，並覆蓋於該支撐架的部分上表面。
  2. 如請求項1所述的感測器封裝結構，其中該垂直距離至少為200微米(μm)。
  3. 如請求項1所述的感測器封裝結構，其中該基板呈方形或矩形，且該基板的至少一邊緣長度小於或等於7.5毫米(mm)。
  4. 如請求項1所述的感測器封裝結構，其中該支撐架未與該基板接觸，且兩者之間相隔一距離。
  5. 如請求項4所述的感測器封裝結構，其中該支撐架之部分側面為裁切面，該支撐架的之該部分側面與該模製封裝體之側表面對齊。
  6. 如請求項1所述的感測器封裝結構，其中該支撐架接觸該基板。
  7. 如請求項6所述的感測器封裝結構，其中該支撐架之部分側面為裁切面，該支撐架的之該部分側面與該模製封裝體之側表面對齊。
  8. 如請求項1所述的感測器封裝結構，更包括一密封膠，該支撐架係利用該密封膠黏著於該感測晶片上，且該密封膠的至少局部介於該感測區與該些第二接墊之間或覆蓋到該些第二接墊。
  9. 如請求項1所述的感測器封裝結構，其中該模製封裝體覆蓋該些第一接墊、該些第二接墊以及該些金屬線。
  10. 如請求項1所述的感測器封裝結構，更包括至少一電子元件，該至少一電子元件配置於該基板上且埋置於該模製封裝體中，該支撐架還包含有一內環部與一外環部，該內環部設置於該感測晶片之邊緣上方，該外環部連接於該內環部之外側，該至少一電子元件位於該外環部的下方。
  11. 如請求項1所述的感測器封裝結構，其中該支撐架於相對的各內側具有一內凹槽，該些金屬線分別容置於該些內凹槽中，該支撐架於相對的各外側底部具有一外凹槽，該感測器封裝結構包括有安裝在該基板且埋置於該模製封裝體的多個電子元件，該些電子元件分別位於該些外凹槽中。
  12. 如請求項1至11中任一項所述的感測器封裝結構，更包括一擋牆，其設置於鄰近該透光蓋板邊緣的頂面部位且覆蓋至少一部分該透光蓋板的頂面，該模製封裝體鄰接於該擋牆的外側，該模製封裝體的頂面與該基板間之距離大於該透光蓋板的頂面與該基板間之距離。
  13. 如請求項1至11中任一項所述的感測器封裝結構，其中該定位部為一環形槽，該環形槽上有一缺口，該缺口的側壁與該透光蓋板之間形成有一氣流通道，該氣流通道連通至該感測區與該透光蓋板之間形成的空間。
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