TWI800793B - 感測器封裝結構 - Google Patents

感測器封裝結構 Download PDF

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Publication number
TWI800793B
TWI800793B TW110104619A TW110104619A TWI800793B TW I800793 B TWI800793 B TW I800793B TW 110104619 A TW110104619 A TW 110104619A TW 110104619 A TW110104619 A TW 110104619A TW I800793 B TWI800793 B TW I800793B
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TW
Taiwan
Prior art keywords
package structure
sensor package
sensor
package
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TW110104619A
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English (en)
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TW202232677A (zh
Inventor
李建成
彭鎮濱
Original Assignee
同欣電子工業股份有限公司
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Application filed by 同欣電子工業股份有限公司 filed Critical 同欣電子工業股份有限公司
Priority to TW110104619A priority Critical patent/TWI800793B/zh
Priority to US17/205,463 priority patent/US11735562B2/en
Publication of TW202232677A publication Critical patent/TW202232677A/zh
Application granted granted Critical
Publication of TWI800793B publication Critical patent/TWI800793B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
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    • H01L2224/061—Disposition
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
    • H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/48997—Reinforcing structures
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
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    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Light Receiving Elements (AREA)
  • Pressure Sensors (AREA)
TW110104619A 2021-02-08 2021-02-08 感測器封裝結構 TWI800793B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW110104619A TWI800793B (zh) 2021-02-08 2021-02-08 感測器封裝結構
US17/205,463 US11735562B2 (en) 2021-02-08 2021-03-18 Sensor package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110104619A TWI800793B (zh) 2021-02-08 2021-02-08 感測器封裝結構

Publications (2)

Publication Number Publication Date
TW202232677A TW202232677A (zh) 2022-08-16
TWI800793B true TWI800793B (zh) 2023-05-01

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Citations (6)

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Publication number Priority date Publication date Assignee Title
US20040080037A1 (en) * 2002-10-25 2004-04-29 Foong Chee Seng Image sensor device
US20080191335A1 (en) * 2007-02-08 2008-08-14 Advanced Chip Engineering Technology Inc. Cmos image sensor chip scale package with die receiving opening and method of the same
US20090267170A1 (en) * 2008-04-29 2009-10-29 Omnivision Technologies, Inc. Apparatus and Method For Using Spacer Paste to Package an Image Sensor
TW201407703A (zh) * 2012-08-08 2014-02-16 Taiwan Semiconductor Mfg 元件、封裝、與內連線的形成方法
US20140070235A1 (en) * 2012-09-07 2014-03-13 Peter Scott Andrews Wire bonds and light emitter devices and related methods
TWI631675B (zh) * 2016-07-06 2018-08-01 勝麗國際股份有限公司 感測器封裝結構

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US5205463A (en) 1992-06-05 1993-04-27 Kulicke And Soffa Investments, Inc. Method of making constant clearance flat link fine wire interconnections
TW465064B (en) 2000-12-22 2001-11-21 Advanced Semiconductor Eng Bonding process and the structure thereof
US7475802B2 (en) 2004-04-28 2009-01-13 Texas Instruments Incorporated Method for low loop wire bonding
US20070063135A1 (en) * 2005-09-21 2007-03-22 Po-Hung Chen Image sensing device package structure
US20080265385A1 (en) 2007-04-11 2008-10-30 Siliconware Precision Industries Co., Ltd. Semiconductor package using copper wires and wire bonding method for the same
JP6092084B2 (ja) * 2013-11-29 2017-03-08 アオイ電子株式会社 半導体装置および半導体装置の製造方法
EP3267485B1 (en) 2016-07-06 2020-11-18 Kingpak Technology Inc. Sensor package structure
CN109427829B (zh) * 2017-09-01 2020-09-15 胜丽国际股份有限公司 感测器封装结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040080037A1 (en) * 2002-10-25 2004-04-29 Foong Chee Seng Image sensor device
US20080191335A1 (en) * 2007-02-08 2008-08-14 Advanced Chip Engineering Technology Inc. Cmos image sensor chip scale package with die receiving opening and method of the same
US20090267170A1 (en) * 2008-04-29 2009-10-29 Omnivision Technologies, Inc. Apparatus and Method For Using Spacer Paste to Package an Image Sensor
TW201407703A (zh) * 2012-08-08 2014-02-16 Taiwan Semiconductor Mfg 元件、封裝、與內連線的形成方法
US20140070235A1 (en) * 2012-09-07 2014-03-13 Peter Scott Andrews Wire bonds and light emitter devices and related methods
TWI631675B (zh) * 2016-07-06 2018-08-01 勝麗國際股份有限公司 感測器封裝結構

Non-Patent Citations (2)

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Title
網路文獻 BSOB模式與BBOS模式 2019-05-15 https://www.weizhuannet.com/p-7355453.html;網路文獻 集成电路封装设计的可靠性提高方法研究 电子工程世界 2011-11-01 news.eeworld.com.cn/Test_and_measurement/2011/1101/article_3833.html *
網路文獻 集成电路封装设计的可靠性提高方法研究 电子工程世界 2011-11-01 news.eeworld.com.cn/Test_and_measurement/2011/1101/article_3833.html

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US11735562B2 (en) 2023-08-22
TW202232677A (zh) 2022-08-16

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