TWI800876B - 熱感測封裝 - Google Patents

熱感測封裝 Download PDF

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Publication number
TWI800876B
TWI800876B TW110127066A TW110127066A TWI800876B TW I800876 B TWI800876 B TW I800876B TW 110127066 A TW110127066 A TW 110127066A TW 110127066 A TW110127066 A TW 110127066A TW I800876 B TWI800876 B TW I800876B
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TW
Taiwan
Prior art keywords
thermal sensor
sensor package
package
thermal
sensor
Prior art date
Application number
TW110127066A
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English (en)
Other versions
TW202306057A (zh
Inventor
劉育賢
蘇瑞巴舒 尼加古納
龐茜
簡伊辰
Original Assignee
新加坡商光寶科技新加坡私人有限公司
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Application filed by 新加坡商光寶科技新加坡私人有限公司 filed Critical 新加坡商光寶科技新加坡私人有限公司
Priority to TW110127066A priority Critical patent/TWI800876B/zh
Publication of TW202306057A publication Critical patent/TW202306057A/zh
Application granted granted Critical
Publication of TWI800876B publication Critical patent/TWI800876B/zh

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TW110127066A 2021-07-23 2021-07-23 熱感測封裝 TWI800876B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110127066A TWI800876B (zh) 2021-07-23 2021-07-23 熱感測封裝

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110127066A TWI800876B (zh) 2021-07-23 2021-07-23 熱感測封裝

Publications (2)

Publication Number Publication Date
TW202306057A TW202306057A (zh) 2023-02-01
TWI800876B true TWI800876B (zh) 2023-05-01

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ID=86661436

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110127066A TWI800876B (zh) 2021-07-23 2021-07-23 熱感測封裝

Country Status (1)

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TW (1) TWI800876B (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200824062A (en) * 2006-11-22 2008-06-01 Lu Wei Hua Anti-warpage structure of semiconductor device
TWI671872B (zh) * 2018-10-11 2019-09-11 勝麗國際股份有限公司 感測器封裝結構
TW202034474A (zh) * 2019-03-14 2020-09-16 力成科技股份有限公司 半導體封裝結構及其製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200824062A (en) * 2006-11-22 2008-06-01 Lu Wei Hua Anti-warpage structure of semiconductor device
TWI671872B (zh) * 2018-10-11 2019-09-11 勝麗國際股份有限公司 感測器封裝結構
TW202034474A (zh) * 2019-03-14 2020-09-16 力成科技股份有限公司 半導體封裝結構及其製造方法

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Publication number Publication date
TW202306057A (zh) 2023-02-01

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