TW202232677A - 感測器封裝結構 - Google Patents

感測器封裝結構 Download PDF

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TW202232677A
TW202232677A TW110104619A TW110104619A TW202232677A TW 202232677 A TW202232677 A TW 202232677A TW 110104619 A TW110104619 A TW 110104619A TW 110104619 A TW110104619 A TW 110104619A TW 202232677 A TW202232677 A TW 202232677A
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solder
wire
electrical connection
adhesive layer
sensing
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TW110104619A
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TWI800793B (zh
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李建成
彭鎮濱
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勝麗國際股份有限公司
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Priority to US17/205,463 priority patent/US11735562B2/en
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Abstract

本發明公開一種感測器封裝結構，包含一基板、設置於該基板的一感測晶片、分別連接該基板的多個焊接墊與該感測晶片的多個連接墊的多個電連接元件、形成於該感測晶片的一支撐膠層、及設置於該支撐膠層上的一透光片。任一個該電連接元件包含一頭端焊料、一導線、及一尾端焊料。該頭端焊料設置於一個該連接墊上，該導線的第一端自該頭端焊料延伸，以使其第二端連接至一個該焊接墊，該尾端焊料固定於該第二端及相對應該焊接墊上。任一個該電連接元件的該頭端焊料及其鄰近的該導線的第一折彎部皆埋置於該支撐膠層內。

Description

感測器封裝結構
本發明涉及一種感測器封裝結構，尤其涉及一種打線形式的感測器封裝結構。
現有感測器封裝結構的打線形式包含有正打（normal bond）與反打（reverse bond），上述正打的打線形式將使得現有感測器封裝結構僅能形成有較大的厚度，而上述反打的打線形式則是容易降低現有感測器封裝結構的可靠度。
於是，本發明人認為上述缺陷可改善，乃特潛心研究並配合科學原理的運用，終於提出一種設計合理且有效改善上述缺陷的本發明。
本發明實施例在於提供一種感測器封裝結構，其能有效地改善現有感測器封裝結構所可能產生的缺陷。
本發明實施例公開一種感測器封裝結構，其包括：一基板，包含有一晶片固定區及位於該晶片固定區外側的多個焊接墊；一感測晶片，設置於該晶片固定區上，並且該感測晶片的頂面具有一感測區域及位於該感測區域外側的多個連接墊；多個電連接元件，分別電性連接於該些連接墊及該些焊接墊之間，並且任一個該電連接元件包含：一頭端焊料，設置於相對應的該連接墊上；一導線，其第一端自該頭端焊料延伸，以使該導線的第二端連接至相對應的該焊接墊，並且該導線形成有鄰近於該頭端焊料的一第一折彎部；及一尾端焊料，固定於該導線的該第二端及相對應的該焊接墊上；一支撐膠層，形成於該感測晶片的該頂面並圍繞於該感測區域的外側，並且任一個該電連接元件的該頭端焊料及該導線的該第一折彎部皆埋置於該支撐膠層內；以及一透光片，設置於該支撐膠層上，以使該透光片、該支撐膠層、及該感測晶片的該頂面共同包圍形成有一封閉空間。
本發明實施例也公開一種感測器封裝結構，其包括：一基板，包含有一晶片固定區及位於該晶片固定區外側的多個焊接墊；一感測晶片，設置於該晶片固定區上，並且該感測晶片的頂面具有一感測區域及位於該感測區域外側的多個連接墊；多個電連接元件，分別電性連接於該些連接墊及該些焊接墊之間，並且任一個該電連接元件包含：一頭端焊料，設置於相對應的該連接墊上；一導線，其第一端自該頭端焊料延伸，以使該導線的第二端連接至相對應的該焊接墊；及一尾端焊料，固定於該導線的該第二端及相對應的該焊接墊上；一支撐膠層，形成於該感測晶片的該頂面並圍繞於該感測區域的外側，並且任一個該電連接元件的該頭端焊料及該導線的局部皆埋置於該支撐膠層內；其中，埋置於該支撐膠層的該局部具有一最高點，其與該基板之間形成有一最大距離；以及一透光片，設置於該支撐膠層上，以使該透光片、該支撐膠層、及該感測晶片的該頂面共同包圍形成有一封閉空間。
本發明實施例另公開一種感測器封裝結構，其包括：一基板，包含有一晶片固定區及位於該晶片固定區外側的多個焊接墊；一感測晶片，設置於該晶片固定區上，並且該感測晶片的頂面具有一感測區域及位於該感測區域外側的多個連接墊；多個電連接元件，分別電性連接於該些連接墊及該些焊接墊之間，並且任一個該電連接元件包含：一頭端焊料，設置於相對應的該連接墊上；一導線，其第一端自該頭端焊料延伸，以使該導線的第二端連接至相對應的該焊接墊，並且該導線形成有鄰近於該頭端焊料的一第一折彎部及位於該第一折彎部與該第二端之間的一第二折彎部；及一尾端焊料，固定於該導線的該第二端及相對應的該焊接墊上；一支撐膠層，形成於該感測晶片的該頂面並圍繞於該感測區域的外側，並且任一個該電連接元件的該頭端焊料及該導線的局部皆埋置於該支撐膠層內；以及一透光片，設置於該支撐膠層上，以使該透光片、該支撐膠層、及該感測晶片的該頂面共同包圍形成有一封閉空間。
綜上所述，本發明實施例所公開的感測器封裝結構，其通過任一個該電連接元件的結構設計（如：任一個該電連接元件的該頭端焊料及該導線的該第一折彎部皆埋置於該支撐膠層內；或者，埋置於該支撐膠層的任一個該導線的該局部具有與該基板之間形成該最大距離的最高點；又或者，任一個該導線形成有鄰近於該頭端焊料的該第一折彎部及位於該第一折彎部與該第二端之間的該第二折彎部），據以使該感測器封裝結構不但能形成較薄厚度、還能具備有較佳的可靠度。
為能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與附圖，但是此等說明與附圖僅用來說明本發明，而非對本發明的保護範圍作任何的限制。
以下是通過特定的具體實施例來說明本發明所公開有關“感測器封裝結構”的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。
應當可以理解的是，雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號，但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件，或者一信號與另一信號。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。
請參閱圖1至圖4，其為本發明的一實施例。本實施例公開一種感測器封裝結構100，其包含有一基板1、設置於該基板1上的一感測晶片2、電性連接該基板1與該感測晶片2的多個電連接元件3、形成於該感測晶片2上的一支撐膠層4、設置於該支撐膠層4上的一透光片5、及形成於該基板1上的一封裝體6。
其中，該感測器封裝結構100於本實施例中雖是以包含有上述元件來做一說明，但該感測器封裝結構100也可以依據設計需求而加以調整變化。舉例來說，在本發明未繪示的其他實施例中，該感測器封裝結構100也可以省略該封裝體6。
該基板1於本實施例中呈矩形，但本發明不受限於此。其中，該基板1具有位於相反側的一第一板面11與一第二板面12，該基板1包含有一晶片固定區111及位於該晶片固定區111外側的多個焊接墊112。於本實施例中，該晶片固定區111大致位於該第一板面11的中央處，而該些焊接墊112位於該第一板面11且呈環狀排列，但本發明不受限於此。
此外，該基板1也可以於該第二板面12設置有多個焊接球（圖中未示出），並且該感測器封裝結構100能通過該些焊接球而焊接固定於一電子構件（圖中未示出）上，據以使該感測器封裝結構100能被安裝且電性連接於該電子構件。
該感測晶片2於本實施例中是以一影像感測晶片來說明，但不以此為限。其中，該感測晶片2是設置於該基板1的該晶片固定區111上。再者，該感測晶片2的一頂面21包含有一感測區域22及位於該感測區域22外側的多個連接墊23，並且該些連接墊23的位置較佳是分別對應於該些焊接墊112的位置。於本實施例中，該些連接墊23是大致呈環狀排列以圍繞該感測區域22，但本發明不以此為限。
舉例來說，在本發明未繪示的其他實施例中，該些連接墊23可以是排成兩列且分佈於該感測區域22的相反兩側，該些焊接墊112也可以是排成兩列且分佈於該晶片固定區111的相反兩側，並且該些連接墊23的位置分別對應於該些焊接墊112的位置。
多個電連接元件3分別電性連接於該感測晶片2的該些連接墊23及該基板1的該些焊接墊112之間；也就是說，一個該電連接元件3對應地連接於一個該連接墊23與一個該焊接墊112之間。而由於該些電連接元件3於本實施例中的構造大致相同，所以為便於說明本實施例，以下僅介紹單個該電連接元件3的構造，但本發明不以此為限。舉例來說，在本發明未繪示的其他實施例中，該些電連接元件3的構造可以略有差異。
於本實施例中，該電連接元件3包含一頭端焊料31、一導線32、及一尾端焊料33。其中，該頭端焊料31設置於相對應的該連接墊23上。該導線32具有位於相反兩個末端的一第一端321與一第二端322，並且該第一端321自該頭端焊料31延伸，以使該第二端322連接至相對應的該焊接墊112。該尾端焊料33固定於該導線32的該第二端322及相對應的該焊接墊112上。
更詳細地說，該導線32於本實施例中形成有鄰近於該頭端焊料31的一第一折彎部323、及位於該第一折彎部323與該第二端322之間的一第二折彎部324。其中，該導線32在該第一折彎部323之位置（如：該第一折彎部323的頂點）與該基板1（的該第一板面11）間形成有一最大距離Dmax；也就是說，該導線32的其他位置與該基板1（的該第一板面11）間的距離皆小於該最大距離Dmax。需額外說明的是，該感測晶片2的厚度可以依據設計需求而調整變化，但該第一折彎部323（的頂點）與該感測晶片2的該頂面21較佳是相隔有介於50微米（μm）～100微米的一距離D321。
此外，該導線32可以進一步形成有位於該第二折彎部324與該第二端322之間的一第三折彎部325，但本發明不以此為限。舉例來說，在本發明未繪示的其他實施例中，該導線32還可以形成有位在該第三折彎部325與該第二端322之間的至少一個第四折彎部。
換個角度來看，該導線32包含有位於該第一端321與該第一折彎部323之間的一牽引段326、位於該第一折彎部323與該第二折彎部324之間的一橫移段327、及位於該第二折彎部324與該第二端322之間的一下拉段328。其中，通過該第一折彎部323與該第二折彎部324而形成的該橫移段327，其與該感測晶片2的該頂面21相夾有不大於15度的夾角α，據以有效地縮小該最大距離Dmax，進而降低該導線32觸碰到該透光片5的可能性。
需額外說明的是，該電連接元件3於本實施例中是以具備有上述構造與條件來說明，但該電連接元件3的具體構造與條件也可以依據設計需求而加以調整變化，不受限於本實施例所載。舉例來說，在本發明未繪示的其他實施例中，該最大距離Dmax可以是介於該導線32在該第二折彎部324之位置與該基板1（的該第一板面11）間；或者，該導線32可以不具有該第三折彎部325；又或者，該導線32也可以不具有該第二折彎部324、該第三折彎部325、與該橫移段327。
此外，該電連接元件3的該第二折彎部324於本實施例的圖式中雖是以鄰近於該頭端焊料31，但該第二折彎部324的具體位置可依據設計需求而加以調整變化，並不受限於此。舉例來說，在本發明未繪示的其他實施例中，該導線32可以不具有該第三折彎部325，並且該第二折彎部324則是位於該導線32的大致中央處，以使該下拉段328自該第二折彎部324朝向相對應的該焊接墊112延伸，並有效地拉長該橫移段327的長度。
該支撐膠層4形成於該感測晶片2的該頂面21並圍繞於該感測區域22的外側，並且該支撐膠層4於本實施例中呈環狀且其外側緣未突伸出該感測晶片2的該頂面21。任一個該電連接元件3的該頭端焊料31及該導線32的局部皆埋置於該支撐膠層4內，並且埋置於該支撐膠層4的任一個該導線32的該局部具有與該基板1之間形成該最大距離Dmax的一最高點。也就是說，該最高點與該感測晶片2的該頂面21相隔有介於50微米～100微米的距離。
進一步地說，於本實施例的任一個該導線32中，該最高點位於該第一折彎部323（如：該第一折彎部323的頂點），且其埋置於該支撐膠層4內，而該第二折彎部324則是位於該支撐膠層4之外（也就是，埋置於該支撐膠層4內的任一個該導線32的該局部包含有該第一端321、該牽引段326、該第一折彎部323、及至少部分該橫移段327），但本發明不限於此。舉例來說，在本發明未繪示的其他實施例中，任一個該導線32的該第二折彎部324也可以埋置於該支撐膠層4內且形成該最高點。
據此，該感測器封裝結構100於本實施例中可以通過任一個該電連接元件3的結構設計（如：任一個該電連接元件3的該頭端焊料31及該導線32的該第一折彎部323皆埋置於該支撐膠層4內；或者，埋置於該支撐膠層4的任一個該導線32的該局部具有與該基板1之間形成該最大距離Dmax的最高點；又或者，任一個該導線32形成有鄰近於該頭端焊料31的該第一折彎部323及位於該第一折彎部323與該第二端322之間的該第二折彎部324），據以使該感測器封裝結構100不但能形成較薄厚度、還能具備有較佳的可靠度。
該透光片5於本實施例中是以呈透明狀的一平板玻璃來說明，但本發明不受限於此。其中，該透光片5、該支撐膠層4、及該感測晶片2的該頂面21共同包圍形成有一封閉空間S；也就是說，該支撐膠層4是夾持於該透光片5與該感測晶片2的該頂面21之間，而該感測區域22位於該封閉空間S內且面向該透光片5。
該封裝體6設置於該基板1的該第一板面11上，並且該感測晶片2、任一個該電連接元件3的該尾端焊料33與位於該支撐膠層4之外的該導線32部位（如：部分該橫移段327、該第二折彎部324、該下拉段328、該第二端322）、該支撐膠層4、及部分該透光片5皆埋置於該封裝體6內。
進一步地說，該封裝體6於本實施例中是以一液態封膠（liquid compound）來說明，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，該封裝體6的頂部能進一步形成有一模制封膠（molding compound）；或者，該封裝體6也可以是一模制封膠。
[本發明實施例的技術效果]
綜上所述，本發明實施例所公開的感測器封裝結構，其通過任一個該電連接元件的結構設計（如：任一個該電連接元件的該頭端焊料及該導線的該第一折彎部皆埋置於該支撐膠層內；或者，埋置於該支撐膠層的任一個該導線的該局部具有與該基板之間形成該最大距離的最高點；又或者，任一個該導線形成有鄰近於該頭端焊料的該第一折彎部及位於該第一折彎部與該第二端之間的該第二折彎部），據以使該感測器封裝結構不但能形成較薄厚度之結構、還能具備有較佳的可靠度。
再者，本發明實施例所公開的感測器封裝結構，其通過位於該第一折彎部與該第二折彎部的該橫移段來與該感測晶片的該頂面相夾有不大於15度的夾角，據以有效地縮小該最大距離，進而降低該導線觸碰到該透光片的可能性，進而提升該感測器封裝結構的可靠度。
以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的專利範圍內。
100:感測器封裝結構 1:基板 11:第一板面 111:晶片固定區 112:焊接墊 12:第二板面 2:感測晶片 21:頂面 22:感測區域 23:連接墊 3:電連接元件 31:頭端焊料 32:導線 321:第一端 322:第二端 323:第一折彎部 324:第二折彎部 325:第三折彎部 326:牽引段 327:橫移段 328:下拉段 33:尾端焊料 4:支撐膠層 5:透光片 6:封裝體 Dmax:最大距離 D321:距離 α:夾角 S:封閉空間
圖1為本發明實施例的感測器封裝結構的俯視示意圖。
圖2為圖1沿剖線II-II的剖視示意圖。
圖3為圖2中的部位III的放大示意圖。
圖4為圖2中的部位IV的放大示意圖。
100:感測器封裝結構
1:基板
11:第一板面
111:晶片固定區
112:焊接墊
12:第二板面
2:感測晶片
21:頂面
22:感測區域
23:連接墊
3:電連接元件
31:頭端焊料
32:導線
321:第一端
33:尾端焊料
4:支撐膠層
5:透光片
6:封裝體
Dmax:最大距離
D321:距離
S:封閉空間

Claims (10)

  1. 一種感測器封裝結構，其包括： 一基板，包含有一晶片固定區及位於該晶片固定區外側的多個焊接墊； 一感測晶片，設置於該晶片固定區上，並且該感測晶片的頂面具有一感測區域及位於該感測區域外側的多個連接墊； 多個電連接元件，分別電性連接於該些連接墊及該些焊接墊之間，並且任一個該電連接元件包含： 一頭端焊料，設置於相對應的該連接墊上； 一導線，其第一端自該頭端焊料延伸，以使該導線的第二端連接至相對應的該焊接墊，並且該導線形成有鄰近於該頭端焊料的一第一折彎部；及 一尾端焊料，固定於該導線的該第二端及相對應的該焊接墊上； 一支撐膠層，形成於該感測晶片的該頂面並圍繞於該感測區域的外側，並且任一個該電連接元件的該頭端焊料及該導線的該第一折彎部皆埋置於該支撐膠層內；以及 一透光片，設置於該支撐膠層上，以使該透光片、該支撐膠層、及該感測晶片的該頂面共同包圍形成有一封閉空間。
  2. 如請求項1所述的感測器封裝結構，其中，於任一個該電連接元件中，該導線在該第一折彎部之位置與該基板間形成有一最大距離。
  3. 如請求項1所述的感測器封裝結構，其中，任一個該電連接元件的該第一折彎部與該感測晶片的該頂面相隔有介於50微米（μm）～100微米的一距離。
  4. 如請求項1所述的感測器封裝結構，其中，於任一個該電連接元件中，該導線包含有一第二折彎部，並且該第二折彎部位於該第一折彎部與該第二端之間。
  5. 如請求項4所述的感測器封裝結構，其中，於任一個該電連接元件中，該導線具有位於該第一折彎部與該第二折彎部之間的一橫移段，並且該橫移段與該感測晶片的該頂面相夾有不大於15度的夾角。
  6. 如請求項1所述的感測器封裝結構，其中，該感測器封裝結構進一步包括形成於該基板上的一封裝體，並且該感測晶片、任一個該電連接元件的該尾端焊料與位於該支撐膠層之外的該導線部位、該支撐膠層、及部分該透光片皆埋置於該封裝體內。
  7. 一種感測器封裝結構，其包括： 一基板，包含有一晶片固定區及位於該晶片固定區外側的多個焊接墊； 一感測晶片，設置於該晶片固定區上，並且該感測晶片的頂面具有一感測區域及位於該感測區域外側的多個連接墊； 多個電連接元件，分別電性連接於該些連接墊及該些焊接墊之間，並且任一個該電連接元件包含： 一頭端焊料，設置於相對應的該連接墊上； 一導線，其第一端自該頭端焊料延伸，以使該導線的第二端連接至相對應的該焊接墊；及 一尾端焊料，固定於該導線的該第二端及相對應的該焊接墊上； 一支撐膠層，形成於該感測晶片的該頂面並圍繞於該感測區域的外側，並且任一個該電連接元件的該頭端焊料及該導線的局部皆埋置於該支撐膠層內；其中，埋置於該支撐膠層的任一個該導線的該局部具有一最高點，其與該基板之間形成有一最大距離；以及 一透光片，設置於該支撐膠層上，以使該透光片、該支撐膠層、及該感測晶片的該頂面共同包圍形成有一封閉空間。
  8. 如請求項7所述的感測器封裝結構，其中，任一個該電連接元件的該最高點與該感測晶片的該頂面相隔有介於50微米（μm）～100微米的一距離。
  9. 一種感測器封裝結構，其包括： 一基板，包含有一晶片固定區及位於該晶片固定區外側的多個焊接墊； 一感測晶片，設置於該晶片固定區上，並且該感測晶片的頂面具有一感測區域及位於該感測區域外側的多個連接墊； 多個電連接元件，分別電性連接於該些連接墊及該些焊接墊之間，並且任一個該電連接元件包含： 一頭端焊料，設置於相對應的該連接墊上； 一導線，其第一端自該頭端焊料延伸，以使該導線的第二端連接至相對應的該焊接墊，並且該導線形成有鄰近於該頭端焊料的一第一折彎部及位於該第一折彎部與該第二端之間的一第二折彎部；及 一尾端焊料，固定於該導線的該第二端及相對應的該焊接墊上； 一支撐膠層，形成於該感測晶片的該頂面並圍繞於該感測區域的外側，並且任一個該電連接元件的該頭端焊料及該導線的局部皆埋置於該支撐膠層內；以及 一透光片，設置於該支撐膠層上，以使該透光片、該支撐膠層、及該感測晶片的該頂面共同包圍形成有一封閉空間。
  10. 如請求項9所述的感測器封裝結構，其中，於任一個該電連接元件中，該導線具有位於該第一折彎部與該第二折彎部之間的一橫移段，並且該橫移段與該感測晶片的該頂面相夾有不大於15度的夾角。
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