TW202332067A - 感測器封裝結構 - Google Patents

感測器封裝結構 Download PDF

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TW202332067A
TW202332067A TW111103051A TW111103051A TW202332067A TW 202332067 A TW202332067 A TW 202332067A TW 111103051 A TW111103051 A TW 111103051A TW 111103051 A TW111103051 A TW 111103051A TW 202332067 A TW202332067 A TW 202332067A
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sensing
support layer
annular support
light
package structure
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TW111103051A
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TWI801107B (zh
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李建成
洪立群
張雅涵
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同欣電子工業股份有限公司
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Priority to TW111103051A priority Critical patent/TWI801107B/zh
Priority to CN202210097885.6A priority patent/CN116544249A/zh
Priority to US17/749,077 priority patent/US20230238411A1/en
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Abstract

本發明公開一種感測器封裝結構，包含一基板、設置於所述基板上的一感測晶片、設置於所述感測晶片上的一環形支撐層、及設置於所述環形支撐層上的一透光片。所述透光片具有位於相反側的一外表面與一內表面，並且所述透光片於所述內表面的邊緣處形成有一環形缺角。所述環形缺角相較於所述內表面的深度為至少10微米，所述透光片以所述環形缺角設置於所述環形支撐層上，並且所述透光片的所述內表面未接觸於所述環形支撐層，以使所述透光片的所述內表面、所述環形支撐層的內緣、及所述感測晶片共同包圍有一封閉空間。

Description

感測器封裝結構
本發明涉及一種封裝結構，尤其涉及一種感測器封裝結構。
現有的感測器封裝結構包含有一玻璃片、一感測晶片、及黏著於所述玻璃片與所述感測晶片之間的一黏著層。其中，由於所述感測晶片的結構變更較容易導致其感測結果受到影響，所以現有感測器封裝結構大都朝向所述黏著層進行改良，以提升所述黏著層與其他構件之間的連接效果。然而，上述改良方向有其侷限性存在。
於是，本發明人認為上述缺陷可改善，乃特潛心研究並配合科學原理的運用，終於提出一種設計合理且有效改善上述缺陷的本發明。
本發明實施例在於提供一種感測器封裝結構，其能有效地改善現有感測器封裝結構所可能產生的缺陷。
本發明實施例公開一種感測器封裝結構，其包括：一基板，具有位於相反側的一第一板面與一第二板面；一感測晶片，設置於所述基板的所述第一板面上，並且所述感測晶片電性耦接於所述基板；其中，所述感測晶片的頂面具有一感測區域及位於所述感測區域外側的一承載區域；一環形支撐層，設置於所述感測晶片的所述承載區域上並圍繞所述感測區域；以及一透光片，具有位於相反側的一外表面與一內表面，並且所述透光片於所述內表面的邊緣處形成有一環形缺角；其中，所述環形缺角相較於所述內表面的深度為至少10微米，所述透光片以所述環形缺角設置於所述環形支撐層上，並且所述透光片的所述內表面未接觸於所述環形支撐層，以使所述透光片的所述內表面、所述環形支撐層的內緣、及所述感測晶片的所述頂面共同包圍有一封閉空間。
綜上所述，本發明實施例所公開的感測器封裝結構，其通過所述透光片僅以所述環形缺角搭配於所述環形支撐層，據以能夠有效地降低所述透光片以及所述環形支撐層之間產生分層缺失的機率，並還能夠進一步改善所述感測器封裝結構於製造過程中所可能產生的製程缺失，如：所述環形支撐層於固化過程中所產生的溢膠、或是所述透光片產生傾斜或是碎裂。
為能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與附圖，但是此等說明與附圖僅用來說明本發明，而非對本發明的保護範圍作任何的限制。
以下是通過特定的具體實施例來說明本發明所公開有關“感測器封裝結構”的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。
應當可以理解的是，雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號，但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件，或者一信號與另一信號。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。
[實施例一]
請參閱圖1至圖4所示，其為本發明的實施例一。如圖1和圖2所示，本實施例公開一種感測器封裝結構100；也就是說，內部非為封裝感測器的任何結構，其結構設計基礎不同於本實施例所指的所述感測器封裝結構100，所以兩者之間並不適於進行對比。
如圖2至圖4所示，所述感測器封裝結構100於本實施例中包含一基板1、設置於所述基板1上且彼此電性耦接的一感測晶片2、電性耦接所述感測晶片2與所述基板1的多條金屬線3、設置於所述感測晶片2上的一環形支撐層4、設置於所述環形支撐層4上的一透光片5、及形成於所述基板1上的一封裝體6。
其中，所述感測器封裝結構100於本實施例中雖是以包含上述元件來做說明，但所述感測器封裝結構100也可以依據設計需求而加以調整變化。舉例來說，在本發明未繪示的其他實施例中，所述感測器封裝結構100可以省略多個所述金屬線3，並且所述感測晶片2通過覆晶方式固定且電性耦接於所述基板1上；或者，所述感測器封裝結構100也可以省略或以其他構造替代所述封裝體6。以下將分別就本實施例中的所述感測器封裝結構100的各個元件構造與連接關係作一說明。
所述基板1於本實施例中為呈正方形或矩形，但本發明不受限於此。其中，所述基板1具有位於相反側的一第一板面11與一第二板面12，所述基板1於所述第一板面11的大致中央處設有一固晶區111，並且所述基板1形成有位於所述固晶區111（或所述感測晶片2）外側的多個焊接墊112。多個所述焊接墊112於本實施例中是大致排列成環狀，但本發明不限於此。舉例來說，在本發明未繪示的其他實施例中，多個所述焊接墊112也可以是在所述固晶區111的相反兩側分別排成兩列。
此外，所述基板1也可以於所述第二板面12設有多個焊接球7，並且所述感測器封裝結構100能通過多個所述焊接球7而焊接固定於一電子構件（圖中未示出）上，據以使所述感測器封裝結構100能夠電性耦接所述電子構件。
所述感測晶片2於本實施例中是以一影像感測晶片來說明，但不以此為限。其中，所述感測晶片2（的底面22）是固定於所述基板1的所述第一板面11（如：所述固晶區111），並且所述感測晶片2是位於多個所述焊接墊112的內側。需額外說明的是，所述感測器封裝結構100於本實施例中是包含有設置於所述固晶區111上的一膠材M（如：導熱膠），並且所述感測晶片2通過所述膠材M而固定於所述固晶區111上（如：所述感測晶片2的所述底面22與所述固晶區111通過所述膠材M而彼此黏接固定），但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，所述膠材M也可以被省略或是以其他元件取代。
再者，所述感測晶片2的一頂面21包含有一感測區域211及圍繞於所述感測區域211（且呈環形）的一承載區域212。需額外說明的是，所述感測器封裝結構100於本實施例中可以通過整體結構配合而能夠用來封裝尺寸較小的所述感測晶片2，如：所述感測區域211與所述感測晶片2的側表面23之間的一橫向距離Dh小於1釐米（mm），但本發明不受限於此。
更詳細地說，所述感測晶片2於本實施例中包含有位於所述承載區域212的多個連接墊213，並且所述感測晶片2的多個所述連接墊213的數量及位置於本實施例中是分別對應於所述基板1的多個所述焊接墊112的數量及位置；也就是說，多個所述連接墊213大致排列成環狀且其數量等同於多個所述焊接墊112的數量。
多個所述金屬線3的一端分別連接於多個所述焊接墊112，並且多個所述金屬線3的另一端分別連接於多個所述連接墊213，據以使所述基板1能通過多個所述金屬線3而電性耦接於所述感測晶片2。其中，任一個所述金屬線3可以依據設計需求而採用正打（normal bond）形式或反打（reverse bond）形式，本發明在此不加以限制。
所述環形支撐層4於本實施例中限定為一不透光層，並且所述環形支撐層4設置於所述感測晶片2的所述承載區域212上並圍繞所述感測區域211。也就是說，多個所述連接墊213埋置於所述環形支撐層4內，並且分別連接於多個所述連接墊213的多條所述金屬線3的所述另一端也被埋置於所述環形支撐層4內。
所述透光片5於本實施例中是以呈透明狀的一平板玻璃來說明，但本發明不受限於此。其中，所述透光片5於本實施例中包含有一外表面51、位於所述外表面51相反側的一內表面52、相連於所述外表面51的一環側面53、及形成於所述內表面52邊緣（與所述環側面53底緣）的一環形缺角54。
所述環形缺角54相較於所述內表面52的深度D為至少10微米（μm），但所述深度D較佳是不超過所述透光片5厚度的50%。於本實施例中，所述環形缺角54具有相連於所述內表面52的一梯面541、及相連於所述梯面541與所述環側面53的一階面542，並且所述階面542平行於所述內表面52且彼此相隔有一距離，其等同於所述深度D。
所述透光片5通過所述環形支撐層4而設置於所述感測晶片2的上方；也就是說，所述環形支撐層4於本實施例中是夾持於所述透光片5（的所述階面542）與所述感測晶片2（的所述承載區域212）之間。再者，所述透光片5的所述內表面52、所述環形支撐層4的內緣、及所述感測晶片2的所述頂面21共同包圍形成有一封閉空間E，而所述感測區域211位於所述封閉空間E內且面向所述透光片5的所述內表面52。
更進一步地說，所述透光片5於本實施例中是限定僅以其所述環形缺角54設置於所述環形支撐層4上，並且所述透光片5的所述內表面52未接觸於所述環形支撐層4，據以能夠有效地降低所述透光片5以及所述環形支撐層4之間產生分層（delamination）缺失的機率，並還能夠進一步改善所述感測器封裝結構100於製造過程中所可能產生的製程缺失，如：所述環形支撐層4於固化過程中所產生的溢膠（bleeding）、或是所述透光片5產生傾斜（tilt）或是碎裂（squash）。
再者，所述透光片5通過所述環形缺角54與所述環形支撐層4的結構搭配，據以能夠精準地控制所述感測晶片2的所述頂面21與所述透光片5的所述內表面52之間的一縱向距離Dv，以使所述縱向距離Dv介於75微米～200微米，但本發明不受限於此。
此外，所述透光片5較佳是與其他構件之間符合下述結構特徵，以利於實現尺寸較小的所述感測晶片2的封裝。其中，多個所述連接墊213位於所述透光片5的所述階面542的正下方，以使得至少一條所述金屬線3的局部可以位於所述環形缺角54之內且未接觸於所述環形缺角54，並且所述透光片5的所述環側面53較佳是切齊於（或共平面於）所述環形支撐層4的外緣與所述感測晶片2的所述側表面23，但本發明不以此為限。
所述封裝體6於本實施例中形成於所述基板1的所述第一板面11且其邊緣切齊於所述基板1的邊緣。其中，所述感測晶片2、所述環形支撐層4、所述透光片5、及每條所述金屬線3的部分皆埋置於所述封裝體6內，並且所述透光片5的至少部分所述外表面51裸露於所述封裝體6之外。
進一步地說，所述封裝體6於本實施例中是以一液態封膠（liquid compound）來說明，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，所述封裝體6的液態封膠之頂面上可以進一步形成有一模制封膠（molding compound）；或者，所述封裝體6也可以僅為一模制封膠。
[實施例二]
請參閱圖5至圖7所示，其為本發明的實施例二。由於本實施例類似於上述實施例一，所以兩個實施例的相同處不再加以贅述，而本實施例相較於上述實施例一的差異大致說明如下：
於本實施例中，所述環形支撐層4是由一半固化樹脂（B-stage epoxy）層或一光阻層（photo resist layer）所構成，並且所述環形支撐層4的內緣形成有呈環狀配置的一散光面41。其中，所述散光面41包含有間隔排列的多個鋸齒形條紋42。其中，所述散光面41的所述些鋸齒形條紋42於本實施例中是呈等間隔地排列成環狀，但本發明不以此為限。舉例來說，在本發明未繪示的其他實施例中，所述些鋸齒形條紋42也可以依據設計需求而彼此相連或非等間隔地排列成環狀。
再者，所述散光面41與所述感測區域211相夾形成有一夾角σ，並且所述夾角σ於本實施例中是以90度來說明，但本發明不受限於此。舉例來說，所述夾角σ可以依據設計需求而調整成介於80度～100度。其中，所述散光面41的每個所述鋸齒形條紋42的長度方向較佳是垂直於所述感測晶片2的所述感測區域211。
據此，當一光線L穿過所述透光片5而以一入射角投射於所述散光面41時（如：圖6），所述散光面41（或多個所述鋸齒形條紋42）能使所述光線L以不同於所述入射角的多個角度散開成多道光線，進而有效地降低眩光（flare）現象於所述感測器封裝結構100中產生。
[本發明實施例的技術效果]
綜上所述，本發明實施例所公開的感測器封裝結構，其通過所述透光片僅以所述環形缺角搭配於所述環形支撐層，據以能夠有效地降低所述透光片以及所述環形支撐層之間產生分層缺失的機率，並還能夠進一步改善所述感測器封裝結構於製造過程中所可能產生的製程缺失，如：所述環形支撐層於固化過程中所產生的溢膠、或是所述透光片產生傾斜或是碎裂。
再者，本發明實施例所公開的感測器封裝結構，其通過在所述環形支撐層的內緣形成有所述散光面，據以使得穿過所述透光片而投射於所述散光面的光線能夠被以不同於該入射角的多個角度散開成多道光線，進而有效地減輕於所述感測器封裝結構中產生的眩光現象。
進一步地說，當本發明實施例的所述環形支撐層以所述半固化樹脂或所述光阻層來實現時，其可以通過沖壓、微影、印刷、或塗佈等方式製造而成，所以所述環形支撐層的厚度可以被有效且精準地控制，並且所述環形支撐層的外形（如：所述散光面的形狀）也可以被精確地成形。據此，所述感測器封裝結構能夠更為有效地降低眩光現象的產生。
再者，在本發明實施例所公開的感測器封裝結構中，所述環形支撐層的所述散光面還可以形成有特定的構造（如：所述散光面的每個所述鋸齒形條紋的長度方向垂直於所述透光片的所述內表面、或所述散光面的多個所述鋸齒形條紋呈等間隔地排列），據以使得該感測器封裝結構能夠進一步地降低眩光現象的產生。
以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的專利範圍內。
100:感測器封裝結構 1:基板 11:第一板面 111:固晶區 112:焊接墊 12:第二板面 2:感測晶片 21:頂面 211:感測區域 212:承載區域 213:連接墊 22:底面 23:側表面 3:金屬線 4:環形支撐層 41:散光面 42:鋸齒形條紋 5:透光片 51:外表面 52:內表面 53:環側面 54:環形缺角 541:梯面 542:階面 6:封裝體 7:焊接球 M:膠材 E:封閉空間 D:深度 Dh:橫向距離 Dv:縱向距離 σ:夾角 L:光線
圖1為本發明實施例一的感測器封裝結構的立體示意圖。
圖2為圖1省略封裝體後的分解示意圖。
圖3為圖1的上視示意圖。
圖4為圖1沿剖線IV-IV的剖視示意圖。
圖5為本發明實施例二的感測器封裝結構的立體示意圖。
圖6為本發明實施例二的感測器封裝結構的立體剖視示意圖。
圖7為圖5沿剖線VII-VII的剖視示意圖。
100:感測器封裝結構
1:基板
11:第一板面
111:固晶區
112:焊接墊
12:第二板面
2:感測晶片
21:頂面
211:感測區域
212:承載區域
213:連接墊
22:底面
23:側表面
3:金屬線
4:環形支撐層
5:透光片
51:外表面
52:內表面
53:環側面
54:環形缺角
541:梯面
542:階面
6:封裝體
7:焊接球
M:膠材
E:封閉空間
D:深度
Dh:橫向距離
Dv:縱向距離

Claims (10)

  1. 一種感測器封裝結構，其包括： 一基板，具有位於相反側的一第一板面與一第二板面； 一感測晶片，設置於所述基板的所述第一板面上，並且所述感測晶片電性耦接於所述基板；其中，所述感測晶片的頂面具有一感測區域及位於所述感測區域外側的一承載區域； 一環形支撐層，設置於所述感測晶片的所述承載區域上並圍繞所述感測區域；以及 一透光片，具有位於相反側的一外表面與一內表面，並且所述透光片於所述內表面的邊緣處形成有一環形缺角；其中，所述環形缺角相較於所述內表面的深度為至少10微米（μm），所述透光片以所述環形缺角設置於所述環形支撐層上，並且所述透光片的所述內表面未接觸於所述環形支撐層，以使所述透光片的所述內表面、所述環形支撐層的內緣、及所述感測晶片的所述頂面共同包圍有一封閉空間。
  2. 如請求項1所述的感測器封裝結構，其中，所述透光片具有相連於所述外表面的一環側面，所述環形缺角具有相連於所述內表面的一梯面、及相連於所述梯面與所述環側面的一階面，並且所述階面平行於所述內表面且彼此相隔有一距離，其等同於所述深度。
  3. 如請求項2所述的感測器封裝結構，其中，所述基板包含有位於所述感測晶片外側的多個焊接墊，所述感測晶片包含有位於所述承載區域的多個連接墊，並且多個所述連接墊位於所述階面的正下方且埋置於所述環形支撐層內；其中，所述感測器封裝結構包含有多條金屬線，並且多條所述金屬線的一端連接於多個所述焊接墊，而多條所述金屬線的另一端連接於多個所述連接墊且埋置於所述環形支撐層內。
  4. 如請求項3所述的感測器封裝結構，其中，至少一條所述金屬線的局部位於所述環形缺角之內且未接觸於所述環形缺角。
  5. 如請求項1所述的感測器封裝結構，其中，所述感測區域與所述感測晶片的側表面之間的一橫向距離小於1釐米（mm），並且所述感測晶片的所述頂面與所述透光片的所述內表面之間的一縱向距離介於75微米～200微米。
  6. 如請求項5所述的感測器封裝結構，其中，所述環形支撐層的外緣切齊於所述感測晶片的所述側表面及所述透光片的環側面。
  7. 如請求項1所述的感測器封裝結構，其中，所述環形支撐層進一步限定為一半固化樹脂（B-stage epoxy）層、一光阻層（photo resist layer）、或一不透光層。
  8. 如請求項1所述的感測器封裝結構，其中，所述環形支撐層的所述內緣形成有呈環狀配置的一散光面；其中，當一光線穿過所述透光片而以一入射角投射於所述散光面時，所述散光面能使所述光線以不同於所述入射角的多個角度散開成多道光線。
  9. 如請求項8所述的感測器封裝結構，其中，所述散光面包含有間隔排列的多個鋸齒形條紋，並且每個所述鋸齒形條紋的長度方向垂直於所述感測區域。
  10. 如請求項1所述的感測器封裝結構，其中，所述感測器封裝結構包含有形成於所述第一板面的一封裝體，並且所述感測晶片、所述環形支撐層、及所述透光片皆埋置於所述封裝體之內，而所述透光片的至少部分所述外表面裸露於所述封裝體之外。
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