CN109427829A - 感测器封装结构 - Google Patents

感测器封装结构 Download PDF

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CN109427829A
CN109427829A CN201711104373.3A CN201711104373A CN109427829A CN 109427829 A CN109427829 A CN 109427829A CN 201711104373 A CN201711104373 A CN 201711104373A CN 109427829 A CN109427829 A CN 109427829A
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support frame
encapsulating structure
sensor
substrate
chip
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CN109427829B (zh
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庄俊华
黃文忠
辛宗宪
彭镇滨
洪立群
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Tong Hsing Electronic Industries Ltd
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Victory International Ltd By Share Ltd
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Priority to JP2018039382A priority patent/JP6563546B2/ja
Priority to KR1020180028050A priority patent/KR102066785B1/ko
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Abstract

一种感测器封装结构，包含基板、感测芯片、多条金属线、支撑架、透光盖板、及模制封装体。基板包含有芯片固定区及位于芯片固定区外侧的多个第一接垫。感测芯片配置于芯片固定区上且包含有感测区及位于感测区外侧的多个第二接垫。多条金属线一端分别连接多个所述第一接垫，且另一端分别连接多个所述第二接垫。支撑架设置于基板及/或感测芯片的上方，支撑架的内侧边缘形成有定位部。透光盖板置于支撑架上并借由定位部固定于感测芯片上方，以与感测芯片维持一垂直距离。模制封装体填充于基板与支撑架之间，并覆盖于支撑架的部分上表面。

Description

感测器封装结构
技术领域
本发明涉及一种封装结构，尤其涉及一种感测器封装结构。
背景技术
现有的感测器封装结构为了缩小尺寸，现有感测器封装结构大都采用模压底脚型影像封装(image sensor molded on leadless chip carrier，iMLCC)的封装结构，而上述模压底脚型影像封装结构在透光盖板与感测芯片之间设置有框体，借以维持透光盖板与感测芯片之间的垂直距离。然而，对于维持透光盖板与感测芯片之间的垂直距离来说，现有感测器封装结构还有能够改善的空间存在。
于是，本发明人认为上述缺陷可改善，潜心研究并配合科学原理的运用，终于提出一种设计合理且有效改善上述缺陷的本发明。
发明内容
本发明实施例在于提供一种感测器封装结构，其能有效地改善现有感测器封装结构所可能产生的缺陷。
本发明实施例公开一种感测器封装结构，包括：一基板，包含有一芯片固定区及位于所述芯片固定区外侧的多个第一接垫；一感测芯片，配置于所述芯片固定区上，且包含有一感测区及位于所述感测区外侧的多个第二接垫；多条金属线，一端分别连接多个所述第一接垫，且另一端分别连接多个所述第二接垫；一支撑架，设置于所述基板及/或所述感测芯片的上方，所述支撑架的内侧边缘形成有一定位部；一透光盖板，置于所述支撑架上，所述透光盖板借由所述定位部固定于所述感测芯片上方，并与所述感测芯片维持一垂直距离；以及一模制封装体，填充于所述基板与所述支撑架之间，并覆盖于所述支撑架的部分上表面。
优选地，所述垂直距离至少为200微米。
优选地，所述基板呈方形或矩形，且所述基板的至少一边缘长度小于或等于7.5毫米。
优选地，所述支撑架未与所述基板接触，且所述支撑架与所述基板之间相隔一距离。
优选地，所述支撑架的部分侧面为裁切面，所述支撑架的所述部分侧面与所述模制封装体的侧表面对齐。
优选地，所述支撑架接触所述基板。
优选地，所述支撑架的部分侧面为裁切面，所述支撑架的所述部分侧面与所述模制封装体的侧表面对齐。
优选地，所述感测器封装结构包括一密封胶，所述支撑架利用所述密封胶黏着于所述感测芯片上，且所述密封胶的至少局部介于所述感测区与多个所述第二接垫之间或覆盖到多个所述第二接垫。
优选地，所述模制封装体覆盖多个所述第一接垫、多个所述第二接垫以及多个所述金属线。
优选地，所述感测器封装结构包括至少一电子组件，至少一所述电子组件配置于所述基板上且埋置于所述模制封装体中，所述支撑架还包含有一内环部与一外环部，所述内环部设置于所述感测芯片的边缘上方，所述外环部连接于所述内环部的外侧，至少一所述电子组件位于所述外环部的下方。
优选地，所述支撑架于相对的内侧各具有一内凹槽，多个所述金属线分别置于多个所述内凹槽中，所述支撑架于相对的外侧底部各具有一外凹槽，所述感测器封装结构包括有安装在所述基板且埋置于所述模制封装体的多个电子组件，多个所述电子组件分别位于多个所述外凹槽中。
优选地，所述感测器封装结构包括一挡墙，所述挡墙设置于邻近所述透光盖板边缘的顶面部位且覆盖至少一部分所述透光盖板的顶面，所述模制封装体邻接于所述挡墙的外侧，所述模制封装体的顶面与所述基板间的距离大于所述透光盖板的顶面与所述基板间的距离。
优选地，所述定位部为一环形槽，所述环形槽上有一缺口，所述缺口的侧壁与所述透光盖板之间形成有一气流通道，所述气流通道连通至所述感测区与所述透光盖板之间形成的空间。
综上所述，本发明实施例所公开的感测器封装结构，其通过将支撑架大致埋置于模制封装体内(如：模制封装体填充于所述基板与所述支撑架之间、并覆盖于所述支撑架的部分上表面)，以使透光盖板与感测芯片之间的垂直距离能够被有效地维持。再者，所述支撑架还设有能够固定透光盖板的定位部，借以保持透光盖板与感测芯片之间的相对位置。
为能更进一步了解本发明的特征及技术内容，请参阅以下有关本发明的详细说明与附图，但是此等说明与附图仅用来说明本发明，而非对本发明的保护范围作任何的限制。
附图说明
图1为本发明实施例一的感测器封装结构未裁切的俯视示意图。
图2为图1沿剖线Ⅱ-Ⅱ的剖视示意图。
图3为图1沿剖线Ⅲ-Ⅲ的剖视示意图。
图4为本发明实施例一的感测器封装结构的支撑架立体示意图。
图5为本发明实施例一的感测器封装结构裁切后的剖视示意图。
图6为本发明实施例二的感测器封装结构未裁切的俯视示意图。
图7为图6沿剖线VⅡ-VⅡ的剖视示意图。
图8为图6沿剖线VⅢ-VⅢ的剖视示意图。
图9为本发明实施例二的感测器封装结构裁切后的剖视示意图。
图10为本发明实施例三的感测器封装结构未裁切的俯视示意图。
图11为图10沿剖线XI-XI的剖视示意图。
图12为图10沿剖线XⅡ-XⅡ的剖视示意图。
图13为本发明实施例三的感测器封装结构裁切后的剖视示意图。
图14A为本发明实施例四的感测器封装结构示意图(一)。
图14B为本发明实施例四的感测器封装结构示意图(二)。
具体实施方式
请参阅图1至图14B，为本发明的实施例，需先说明的是，本实施例对应附图所提及的相关数量与外形，仅用来具体地说明本发明的实施方式，以便于了解本发明的内容，而非用来局限本发明的保护范围。
需先说明的是，本发明公开一种感测器封装结构，并且所述感测器封装结构可依据设计者的需求选择性地被裁切。也就是说，本发明的感测器封装结构可以是未裁切的类型或是裁切后的类型，为便于理解本发明，以下各个实施例将先说明未裁切的感测器封装结构，而后再说明未裁切的感测器封装结构经裁切后所产生的差异。
实施例一
请参阅图1至图5所示，其为本发明的实施例一。如图1至图3所示，所述感测器封装结构100包含有一基板1、配置于所述基板1上的一感测芯片2、电性连接所述基板1与所述感测芯片2的多条金属线3、设置于所述基板1及/或所述感测芯片2的上方的一支撑架4、黏接在所述感测芯片2与所述支撑架4之间的一密封胶5、配置于所述支撑架4上的一透光盖板6、配置于所述透光盖板6顶面的一挡墙7、填充于所述基板1与所述支撑架4之间并覆盖于所述支撑架4部分上表面的一模制封装体9(molding compound)、及置于所述基板1上且埋置在所述模制封装体9内的至少一个电子组件8。以下将分别就本实施例的感测器封装结构100的各个组件构造与连接关系作一说明。
所述基板1于本实施例中呈方形或矩形且其至少一边缘长度小于或等于7.5毫米(mm)，而所述基板1较佳是其任一边缘长度小于或等于7.5毫米。其中，所述基板1的顶面设有一芯片固定区11及位于所述芯片固定区11外侧的多个第一接垫12。所述芯片固定区11的形状对应于所述感测芯片2，并且所述芯片固定区11于本实施例中为矩形，其包含有相对的两个短边缘及相对的两个长边缘(如图1)，而多个所述第一接垫12分别设置于所述芯片固定区11的两个短边缘与其中一个长边缘的外侧。
所述感测芯片2于本实施例中为影像感测芯片，并且所述感测芯片2的顶面设有一感测区21及位于所述感测区21外侧的多个第二接垫22。其中，所述感测区21于本实施例中为矩形，其包含有相对的两个短边缘及相对的两个长边缘(如：图1)，而多个所述第二接垫22分别设置于所述感测区21的两个短边缘与其中一个长边缘的外侧。
再者，所述感测芯片2配置于所述基板1的芯片固定区11上，并且多个所述第二接垫22的位置分别对应于多个所述第一接垫12的位置。换个角度来说，所述基板1的所述芯片固定区11其中一个长边缘外侧未设有任何第一接垫12；所述感测芯片2的感测区21其中一个长边缘外侧未设有任何第二接垫22、并且其邻近于上述外侧未设有任何第一接垫12的所述芯片固定区11的所述长边缘。
多个所述金属线3的一端分别连接多个所述第一接垫12、并且另一端分别连接多个所述第二接垫22，借以使所述基板1与所述感测芯片2能通过多个所述金属线3而达成电性连接。其中，每条金属线3较佳是以反打的方式形成，借以降低其高度。
所述支撑架4于本实施例中呈环状，并且所述支撑架4在其外侧部位形成有多个支撑脚41(如：图1或图4)，而所述支撑架4的内侧边缘形成有一定位部42。其中，所述定位部42于本实施例中为一环形槽，且所述环形槽形成在所述支撑架4的内侧边缘的顶部。
再者，所述支撑架4的多个所述支撑脚41设置在所述基板1上，而接触于多个所述支撑脚41的所述基板1位置是分别位于所述芯片固定区11的外侧、且分别对应于所述芯片固定区11的两个短边缘及上述外侧未设有任何第一接垫12的所述长边缘。所述支撑架4的内侧部位底缘利用所述密封胶5黏着于所述感测芯片2上，且所述密封胶5的局部介于所述感测区21与多个所述第二接垫22之间(在其他实施例中，密封胶5也可覆盖住多个所述第二接垫22)，借以使所述支撑架4与所述感测芯片2之间形成大致无缝隙地连接。
所述透光盖板6于本实施例中为透明的平板状构造，并且所述透光盖板6的外形对应于(如：等同或略小于)所述定位部42的外形，而所述透光盖板6的厚度较佳是大于所述定位部42(也就是所述环形槽)的深度。换个角度来说，所述透光盖板6的尺寸于本实施例中是大于所述感测芯片2(或所述芯片固定区11)的尺寸。
再者，所述透光盖板6的底部配置于所述支撑架4的定位部42内，也就是说，本实施例的透光盖板6顶部突伸出定位部42。并且所述透光盖板6借由所述定位部42固定于所述感测芯片2上方，借以与所述感测芯片2维持一垂直距离D。也就是说，本实施例的感测器封装结构100能通过改变所述定位部42，而精准地控制所述透光盖板6与所述感测芯片2之间的垂直距离D。其中，本实施例的垂直距离D较佳是至少200微米(μm)。在另一较佳的实施例中，垂直距离D较佳是300微米(μm)。
需额外说明的是，如图3和图4所示，所述支撑架4在定位部42(或环形槽)上形成有一缺口421，所述缺口421的侧壁与所述透光盖板6之间形成有一气流通道C，所述气流通道C连通至所述感测区21与所述透光盖板6之间形成的空间。借此，在本实施例感测器封装结构100的制造过程中，所述气流通道C能有效地避免所述感测区21与透光盖板6之间的空气膨胀而造成透光盖板6位移。
再者，所述缺口421的局部对应于所述芯片固定区11其中一个短边缘的所述支撑脚41，并且所述气流通道C的出口是落在所述支撑脚41的上方。
所述挡墙7设置于邻近所述透光盖板6边缘的顶面部位、且覆盖至少一部分所述透光盖板6的顶面。其中，所述挡墙7于本实施例中呈环状并且较佳是与所述透光盖板6的边缘留有距离。进一步地说，所述挡墙7朝向所述感测芯片2顶面正投影所形成的一投影区域，其较佳是围绕在所述感测区21的外侧。
至少一所述电子组件8的数量于本实施例中以多个来说明，而每个电子组件8的类型可依据设计者需求而变化，本发明在此不加以限制。其中，多个所述电子组件8配置于所述基板1上并且分别位于所述芯片固定区11的两个长边缘外侧，而多个所述电子组件8的其中部分电子组件8是对应于(或邻近于)上述外侧未设有任何第一接垫12的所述长边缘、并且位于所述支撑架4的下方。
所述模制封装体9大部分位在所述基板1芯片固定区11以外的区域上，也就是说，所述模制封装体9朝向所述基板1顶面正投影所形成的一投影区域，其较佳是大部分位于所述芯片固定区11的外侧。其中，所述模制封装体9的侧表面大致切齐于所述基板1的侧缘，所述模制封装体9的顶面大致切齐于所述挡墙7的顶缘。
更详细地说，所述模制封装体9覆盖多个所述第一接垫12、多个所述第二接垫22、多个所述金属线3、及多个所述电子组件8。所述模制封装体9覆盖在所述支撑架4的上表面、邻接于所述挡墙7外侧，并且所述模制封装体9覆盖在位于所述支撑架4上表面与所述挡墙7之间的所述透光盖板6部位的顶缘与外侧缘。其中，所述模制封装体9的顶面与所述基板1间的距离大于所述透光盖板6的顶面与所述基板1间的距离。
以上为本实施例未裁切的感测器封装结构100说明，而上述未裁切的感测器封装结构100在沿着图3(或图1)中的两条裁切路径S进行裁切后，即可形成本实施例裁切后的感测器封装结构100’(如：图5)，借以达到缩小尺寸的效果。以下接着说明本实施例裁切后的感测器封装结构100’的差异处。
具体来说，如图5所示，所述支撑架4的部分侧面为裁切面47，并且所述支撑架4的所述部分侧面与所述模制封装体9的侧表面对齐。其中，对应所述芯片固定区11的两个短边缘的所述两个支撑脚41被切除，以使所述支撑架4的相对应部位形成有两个裁切面47，并且所述气流通道C的出口则被改变至其中一个裁切面47上。
实施例二
请参阅图6至图9所示，其为本发明的实施例二，由于本实施例感测器封装结构200的部分组件类似于上述实施例一所载，所以相同处则不再加以赘述。
具体来说，如图6至图8所示，所述感测器封装结构200包含有一基板1、配置于所述基板1上的一感测芯片2、电性连接所述基板1与所述感测芯片2的多条金属线3、设置于所述感测芯片2且未接触所述基板1的一支撑架4、黏接在所述感测芯片2与所述支撑架4之间的一密封胶5、配置于所述支撑架4上的一透光盖板6、配置于所述透光盖板6顶面的一挡墙7、填充于所述基板1与所述支撑架4之间并覆盖于所述支撑架4部分上表面的一模制封装体9、及配置于所述基板1上且埋置在所述模制封装体9内的至少一个电子组件8。以下将分别就本实施例的感测器封装结构200的各个组件构造与连接关系作一说明。
所述支撑架4于本实施例中呈环状且未设有支撑脚41，所述支撑架4的内侧边缘形成有一定位部42，而本实施例的定位部42构造大致如同实施例一所述，在此不加以赘述。其中，所述支撑架4包含有一内环部43与一外环部44，所述外环部44连接于所述内环部43的外侧，而所述定位部42形成在所述内环部43的上方。
再者，所述支撑架4的内环部43设置在所述感测芯片2上(也就是位于所述感测芯片2的边缘上方)，而接触于所述内环部43的所述感测芯片2的位置是位于所述芯片固定区11的外侧。进一步地说，支撑架4未接触于所述基板1，且两者相隔有一距离；而所述支撑架4的内环部43底缘利用所述密封胶5黏着于所述感测芯片2上，且所述密封胶5的局部介于所述感测区21与多个所述第二接垫22之间(在其他实施例中，密封胶5也可覆盖住多个所述第二接垫22)，借以使所述支撑架4与所述感测芯片2之间形成大致无缝隙地连接。进一步地说，对应于(或邻近于)所述感测区21两个短边缘的外环部44于本实施例中从所述基板1突伸出、并于各边定义一裸露段441。
另，所述支撑架4与所述透光盖板6形成有一气流通道C，其类似于实施例一所述，但本实施例支撑架4的缺口421局部是对应于所述外环部44的其中一个裸露段441，并且所述气流通道C的出口是在所述裸露段441的上表面。
至少一所述电子组件8的数量于本实施例中以多个来说明，而每个电子组件8的类型可依据设计者需求而变化，本发明在此不加以限制。其中，多个所述电子组件8配置于所述基板1上、且对应于(或邻近于)上述外侧未设有任何第一接垫12的所述长边缘、并位于所述支撑架4的外环部44下方。
所述模制封装体9覆盖多个所述第一接垫12、多个所述第二接垫22、多个所述金属线3、及多个所述电子组件8。所述模制封装体9覆盖在所述支撑架4的部分上表面、邻接于所述挡墙7外侧，并且所述模制封装体9覆盖在位于所述支撑架4上表面与所述挡墙7之间的所述透光盖板6部位的顶缘与外侧缘。而所述支撑架4的两个裸露段441从所述模制封装体9突伸出。
以上为本实施例未裁切的感测器封装结构200说明，而上述未裁切的感测器封装结构200在沿着图8(或图6)中的两条裁切路径S进行裁切后，即可形成本实施例裁切后的感测器封装结构200’(如：图9)，借以达到缩小尺寸的效果。以下接着说明本实施例裁切后的感测器封装结构200’的差异处。
具体来说，如图9所示，所述支撑架4的部分侧面为裁切面47，并且所述支撑架4的所述部分侧面与所述模制封装体9的侧表面对齐。其中，所述支撑架的两个裸露段441被切除，以使所述支撑架4的相对应部位形成有两个裁切面47，并且所述气流通道C的出口则被改变至其中一个裁切面47上。
实施例三
请参阅图10至图13所示，其为本发明的实施例三，由于本实施例感测器封装结构300的部分组件类似于上述实施例一所述，所以相同处则不再加以赘述。
具体来说，如图10至图12所示，所述感测器封装结构300包含有一基板1、置于所述基板1上的一感测芯片2、电性连接所述基板1与所述感测芯片2的多条金属线3、设置于所述基板1上的一支撑架4、置于所述支撑架4上的一透光盖板6、置于所述透光盖板6顶面的一挡墙7、填充于所述基板1与所述支撑架4之间并覆盖于所述支撑架4部分上表面的一模制封装体9、及置于所述基板1上且埋置在所述模制封装体9内的多个电子组件8。以下将分别就本实施例的感测器封装结构300的各个组件构造与连接关系作一说明。
所述基板1上的多个所述第一接垫12分别设置于所述芯片固定区11的两个短边缘的外侧。所述感测芯片2的多个所述第二接垫22分别设置于所述感测区21的两个短边缘的外侧、并且其位置分别对应于多个所述第一接垫12的位置。换个角度来说，所述基板1的所述芯片固定区11两个长边缘外侧未设有任何第一接垫12，所述感测芯片2的感测区21两个长边缘外侧未设有任何第二接垫22。
所述支撑架4于本实施例中呈环状，并且所述支撑架4在其外侧部位形成有呈长形的至少两个支撑脚41，而所述支撑架4的内侧边缘形成有一定位部42，而本实施例的定位部42构造大致如同实施例一所述，在此不加以赘述。其中，所述支撑架4于相对的内侧各具有一内凹槽45，所述支撑架4于相对的外侧底部各具有一外凹槽46。
再者，所述支撑架4的多个所述支撑脚41设置在所述基板1上，而接触于多个所述支撑脚41的所述基板1位置是分别位于所述芯片固定区11的外侧、且分别对应于所述芯片固定区11的两个短边缘。其中，所述支撑架4的内凹槽45分别对应于所述芯片固定区11的两个短边缘，而所述支撑架4的外凹槽46分别对应于所述芯片固定区11的两个长边缘，并且多个所述金属线3分别置于多个所述内凹槽45中，而多个所述电子组件8设置于基板1上且分别位于多个所述外凹槽46中。
另，所述支撑架4与所述透光盖板6形成有一气流通道C，其类似于实施例一所载，并且本实施例支撑架4的缺口421局部是对应于所述支撑架4的其中一个支撑脚41，而所述气流通道C的出口是在所述支撑脚41的上方。
所述模制封装体9位在所述支撑架4的外侧及上侧，也就是说，所述模制封装体9充填于所述支撑架4的多个所述外凹槽46、但未充填于多个所述内凹槽45，以使所述模制封装体9覆盖多个所述电子组件8、但未覆盖多个所述第一接垫12、多个所述第二接垫22、及多个所述金属线3。其中，所述模制封装体9的侧表面大致切齐于所述基板1的侧缘，所述模制封装体9的顶面大致切齐于所述挡墙7的顶缘。
以上为本实施例未裁切的感测器封装结构300说明，而上述未裁切的感测器封装结构300在沿着图12(或图10)中的两条裁切路径S进行裁切后，即可形成本实施例裁切后的感测器封装结构300’(如：图13)，借以达到缩小尺寸的效果。以下接着说明本实施例裁切后的感测器封装结构300’的差异处。
具体来说，如图13所示，所述支撑架4的部分侧面为裁切面47，并且所述支撑架4的所述部分侧面与所述模制封装体9的侧表面对齐。其中，所述支撑架4的两个支撑脚41被切除，以使所述支撑架4的相对应部位形成有两个裁切面47，并且所述气流通道C的出口则被改变至其中一个裁切面47上。
实施例四
请参阅图14A与图14B，其为本发明的实施例四，由于本实施例感测器封装结构400、500的部分组件类似于上述实施例一所述，所以相同处则不再加以赘述。
具体来说，本实施例中感测器封装结构400、500的透光盖板6的顶面与支撑架4的顶面切齐。而在图14B的感测器封装结构500中，挡墙7覆盖透光盖板6的顶面的外缘以及支撑架4顶面的内缘。
本发明实施例的技术功效:
综上所述，本发明实施例所公开的感测器封装结构，其通过将支撑架大致埋置于模制封装体内(如：模制封装体填充于所述基板与所述支撑架之间、并覆盖于所述支撑架的部分上表面)，以使透光盖板与感测芯片之间的垂直距离能够被有效地维持。再者，所述支撑架还设有能够固定透光盖板的定位部，借以保持透光盖板与感测芯片之间的相对位置。
另，本发明实施例所公开的感测器封装结构，其能通过改变所述支撑架上的定位部位置，而精准地控制所述透光盖板与感测芯片之间的垂直距离，例如：所述垂直距离能被控制在200微米或300微米。再者，所述感测器封装结构能够在支撑架大致埋置于模制封装体内后被裁切，借以缩小尺寸。
又，本发明实施例一、实施例二、及实施例四所公开的感测器封装结构，其通过将支撑架大致埋置于模制封装体内，以达到芯片塑模(molding on chip，MOC)的技术门坎，进而有效地缩小感测器封装结构的尺寸。
以上所述仅为本发明的优选可行实施例，并非用来局限本发明的保护范围，凡依本发明申请专利范围所做的均等变化与修饰，皆应属本发明的权利要求书的保护范围。

Claims (13)

1.一种感测器封装结构，其特征在于，所述感测器封装结构包括：
一基板，包含有一芯片固定区及位于所述芯片固定区外侧的多个第一接垫；
一感测芯片，置于所述芯片固定区上，且包含有一感测区及位于所述感测区外侧的多个第二接垫；
多条金属线，一端分别连接多个所述第一接垫，且另一端分别连接多个所述第二接垫；
一支撑架，设置于所述基板及/或所述感测芯片的上方，所述支撑架的内侧边缘形成有一定位部；
一透光盖板，置于所述支撑架上，所述透光盖板借由所述定位部固定于所述感测芯片上方，并与所述感测芯片维持一垂直距离；以及
一模制封装体，填充于所述基板与所述支撑架之间，并覆盖于所述支撑架的部分上表面。
2.依据权利要求1所述的感测器封装结构，其特征在于，所述垂直距离至少为200微米。
3.依据权利要求1所述的感测器封装结构，其特征在于，所述基板呈方形或矩形，且所述基板的至少一边缘长度小于或等于7.5毫米。
4.依据权利要求1所述的感测器封装结构，其特征在于，所述支撑架未与所述基板接触，且所述支撑架与所述基板之间相隔一距离。
5.依据权利要求4所述的感测器封装结构，其特征在于，所述支撑架的部分侧面为裁切面，所述支撑架的所述部分侧面与所述模制封装体的侧表面对齐。
6.依据权利要求1所述的感测器封装结构，其特征在于，所述支撑架接触所述基板。
7.依据权利要求6所述的感测器封装结构，其特征在于，所述支撑架的部分侧面为裁切面，所述支撑架的所述部分侧面与所述模制封装体的侧表面对齐。
8.依据权利要求1所述的感测器封装结构，其特征在于，所述感测器封装结构包括一密封胶，所述支撑架利用所述密封胶黏着于所述感测芯片上，且所述密封胶的至少局部介于所述感测区与多个所述第二接垫之间或覆盖到多个所述第二接垫。
9.依据权利要求1所述的感测器封装结构，其特征在于，所述模制封装体覆盖多个所述第一接垫、多个所述第二接垫以及多个所述金属线。
10.依据权利要求1所述的感测器封装结构，其特征在于，所述感测器封装结构包括至少一电子组件，至少一所述电子组件配置于所述基板上且埋置于所述模制封装体中，所述支撑架还包含有一内环部与一外环部，所述内环部设置于所述感测芯片的边缘上方，所述外环部连接于所述内环部的外侧，至少一所述电子组件位于所述外环部的下方。
11.依据权利要求1所述的感测器封装结构，其特征在于，所述支撑架于相对的内侧各具有一内凹槽，多个所述金属线分别置于多个所述内凹槽中，所述支撑架于相对的外侧底部各具有一外凹槽，所述感测器封装结构包括有安装在所述基板且埋置于所述模制封装体的多个电子组件，多个所述电子组件分别位于多个所述外凹槽中。
12.依据权利要求1至11中任一项所述的感测器封装结构，其特征在于，所述感测器封装结构包括一挡墙，所述挡墙设置于邻近所述透光盖板边缘的顶面部位且覆盖至少一部分所述透光盖板的顶面，所述模制封装体邻接于所述挡墙的外侧，所述模制封装体的顶面与所述基板间的距离大于所述透光盖板的顶面与所述基板间的距离。
13.依据权利要求1至11中任一项所述的感测器封装结构，其特征在于，所述定位部为一环形槽，所述环形槽上有一缺口，所述缺口的侧壁与所述透光盖板之间形成有一气流通道，所述气流通道连通至所述感测区与所述透光盖板之间形成的空间。
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