JP2019047103A - センサパッケージ構造 - Google Patents
センサパッケージ構造 Download PDFInfo
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- JP2019047103A JP2019047103A JP2018039382A JP2018039382A JP2019047103A JP 2019047103 A JP2019047103 A JP 2019047103A JP 2018039382 A JP2018039382 A JP 2018039382A JP 2018039382 A JP2018039382 A JP 2018039382A JP 2019047103 A JP2019047103 A JP 2019047103A
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- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 17
- 230000000903 blocking effect Effects 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 14
- 239000003566 sealing material Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 3
- 230000004888 barrier function Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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Abstract
Description
本発明の実施形態1を述べる図1ないし図5を参照する。図1ないし図3に示すように、センサパッケージ構造100は、基板1と、該基板1に配置されるセンサチップ2と、基板1とセンサチップ2とを電気的に接続する複数の金属ワイヤ3と、基板1及び/又はセンサチップ2の上方に設けられる支持枠4と、センサチップ2と支持枠4との間に接着されるシール材5と、支持枠4に配置される透光カバー6と、該透光カバー6の天面に配置される阻止壁7と、基板1と支持枠4との間に充填されると共に、支持枠4の上面の一部を覆うモールドパッケージ(molding compound)9と、基板1に配置されると共にモールドパッケージ9に埋め込まれる少なくとも一つの電子部品8とを備えている。下記において、本実施形態に係るセンサパッケージ構造100の各部材構造及び接続関係についてそれぞれ説明する。
本発明に係る実施形態2を述べる図6ないし図9を参照する。なお、本実施形態に係るセンサパッケージ構造200の一部の部材が、実施形態1の部材と類似するため、ここではその説明を省略する。
本発明に係る実施形態3を述べる図10ないし図13を参照する。なお、本実施形態に係るセンサパッケージ構造300の一部の部材が、実施形態1、2の部材と類似するため、ここではその説明を省略する。
本発明に係る実施形態4を述べる図14A、図14Bを参照する。なお、本実施形態に係るセンサパッケージ構造400、500の一部の部材が、上記の実施形態と類似するため、ここではその説明を省略する。
上記を纏めて、本発明に係る実施形態により開示されたセンサパッケージ構造は、支持枠をほぼモールドパッケージ内に埋め込む(例えば、モールドパッケージが基板と支持枠の間に充填され、支持枠の上面の一部を覆うように設けられる)ことにより、透光カバーとセンサチップとの間の垂直距離を効果的に維持することができる。また、支持枠には透光カバーを固定する位置決め部が設けられ、これにより、透光カバーとセンサチップとの相対位置を保持することができる。
1 基板
11 チップ実装エリア
12 第1のパッド
2 センサチップ
21 感知エリア
22 第2のパッド
3 金属ワイヤ
4 支持枠
41 支持足
42 位置決め部(リング溝)
421 切欠き
43 インナーリンク
44 アウターリンク
441 露出部
45 内凹部
46 外凹部
47 カット面
5 シール材
6 透光カバー
7 阻止壁
8 電子部品
9 モールドパッケージ
D 垂直距離
C 気流通路
S カット経路
Claims (13)
- チップ実装エリアと、前記チップ実装エリアの外側に配置される複数の第1のパッドとを含む基板と、
前記チップ実装エリアに配置され、感知エリアと、前記感知エリアの外側に配置される複数の第2のパッドとを含むセンサチップと、
各一端がそれぞれ前記複数の第1のパッドと接続され、各他端がそれぞれ前記複数の第2のパッドと接続される複数の金属ワイヤと、
前記基板及び/又は前記センサチップの上方に設けられると共に内側の縁に位置決め部が形成される支持枠と、
前記支持枠に設けられ、前記位置決め部により前記センサチップの上方に固定されて、前記センサチップとの間に垂直距離を維持するように構成される透光カバーと、
前記基板と前記支持枠の間に充填されると共に、前記支持枠の上面の一部を覆うモールドパッケージ(molding compound)と
を備えることを特徴とする、センサパッケージ構造。 - 前記垂直距離は、200μm以上であることを特徴とする、請求項1に記載のセンサパッケージ構造。
- 前記基板は、正方形状又は長方形状を呈し、
前記基板の少なくとも一つの側縁の長さは、7.5mm以下であることを特徴とする、請求項1に記載のセンサパッケージ構造。 - 前記支持枠は、前記基板と接触せず、前記支持枠と前記基板と間に距離が空いていることを特徴とする、請求項1に記載のセンサパッケージ構造。
- 前記支持枠の一部の側面はカット面であり、
前記支持枠の前記一部の側面は、前記モールドパッケージの側面と面一となることを特徴とする、請求項4に記載のセンサパッケージ構造。 - 前記支持枠は、基板と接触していることを特徴とする、請求項1に記載のセンサパッケージ構造。
- 前記支持枠の一部の側面はカット面であり、
前記支持枠の前記一部の側面は、前記モールドパッケージの側面と面一になることを特徴とする、請求項6に記載のセンサパッケージ構造。 - シール材をさらに備え、
前記支持枠は、前記シール材により前記センサチップと粘着され、
前記シール材の少なくとも一部は、感知エリアと第2のパッドとの間に介在するか、又は前記複数の第2のパッドを覆うことを特徴とする、請求項1に記載のセンサパッケージ構造。 - 前記モールドパッケージは、前記複数の第1のパッド、前記複数の第2のパッド、及び前記複数の金属ワイヤを覆うことを特徴とする、請求項1に記載のセンサパッケージ構造。
- 少なくとも一つの電子部品をさらに備え、
前記少なくとも一つの電子部品は、前記基板に配置されると共に前記モールドパッケージに埋め込まれ、
前記支持枠は、前記センサチップの側縁の上方に設けられるインナーリンクと、前記インナーリンクの外側に配置されるアウターリンクとをさらに備え、
前記少なくとも一つの電子部品は、前記アウターリンクの下方に配置されていることを特徴とする、請求項1に記載のセンサパッケージ構造。 - 前記支持枠における対向する各内側に内凹部が設けられ、
前記複数の金属ワイヤがそれぞれ前記内凹部に収納され、
前記支持枠における対向する各外側の底部に外凹部が設けられ、
前記基板に実装されて前記モールドパッケージに埋め込まれた複数の電子部品がそれぞれ前記複数の外凹部に配置されていることを特徴とする、請求項1に記載のセンサパッケージ構造。 - 前記透光カバーの天面における側縁と近接する部分に設けられ、その一部が前記透光カバーの天面の少なくとも一部を覆う阻止壁をさらに備え、
前記モールドパッケージは、前記阻止壁の外側と隣接され、
前記モールドパッケージの天面と前記基板との間の距離は、前記透光カバーの天面と前記基板との間の距離よりも大きいことを特徴とする、請求項1〜11のいずれか1項に記載のセンサパッケージ構造。 - 前記位置決め部は、切欠きを有するリング溝であり、
前記切欠きの側壁と前記透光カバーとの間に、前記感知エリアと前記透光カバーとの間に形成された空間と連通する気流通路が形成されていることを特徴とする、請求項1〜11のいずれか1項に記載のセンサパッケージ構造。
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