TWI697990B - 感測器封裝結構及其感測模組 - Google Patents

感測器封裝結構及其感測模組 Download PDF

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TWI697990B
TWI697990B TW108124186A TW108124186A TWI697990B TW I697990 B TWI697990 B TW I697990B TW 108124186 A TW108124186 A TW 108124186A TW 108124186 A TW108124186 A TW 108124186A TW I697990 B TWI697990 B TW I697990B
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sensing
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outer edge
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洪立群
李建成
陳建儒
彭鎮濱
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勝麗國際股份有限公司
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Abstract

本發明公開一種感測器封裝結構及其感測模組，所述感測器封裝結構包含基板、設置於基板上的感測晶片、設置於感測晶片上的光固化層、通過光固化層而設置於感測晶片上方的透光層、及設置於透光層表面上的遮蔽層。光固化層包含有分別位於相反兩側的內側緣與外側緣，並且內側緣與外側緣相隔有一第一距離。於平行該感測晶片的頂面的一橫向方向上，該光固化層的外側緣與該遮蔽層的外邊緣之間相隔有一第二距離，並且該第二距離介於該第一距離的1/2～1/3。據此，該感測器封裝結構能通過在特定位置形成遮蔽層，以降低眩光現象並有效地固化光固化層。

Description

感測器封裝結構及其感測模組
本發明涉及一種封裝結構，尤其涉及一種感測器封裝結構及其感測模組。
現有的感測器封裝結構是將玻璃板通過膠層而設置於感測晶片上，並且該膠層是圍繞在該感測晶片的感測區外圍。然而，由於穿過該玻璃板的光線有可能部分會被該膠層所反射，因而對該感測晶片的該感測區會造成影響（如：眩光現象）。
於是，本發明人認為上述缺陷可改善，乃特潛心研究並配合科學原理的運用，終於提出一種設計合理且有效改善上述缺陷的本發明。
本發明實施例在於提供一種感測器封裝結構及其感測模組，其能有效地改善現有的感測器封裝結構之眩光問題。
本發明實施例公開一種感測器封裝結構，包括：一基板；一感測晶片，設置於該基板上，並且該感測晶片的一頂面包含有一感測區及圍繞於該感測區的一承載區；一光固化層，呈環形且設置於該承載區上，並且該光固化層包含有分別位於相反兩側的一內側緣與一外側緣，該內側緣與該外側緣相隔有一第一距離；一透光層，通過該光固化層而設置於該感測晶片的上方，以使該透光層、光固化層、及該感測晶片共同包圍形成有一封閉空間；其中，該感測區面向該透光層；以及一遮蔽層，設置於該透光層的表面上，並且該遮蔽層具有一外邊緣；其中，於平行該感測晶片的該頂面的一橫向方向上，該光固化層的該外側緣與該遮蔽層的該外邊緣之間相隔有一第二距離，並且該第二距離介於該第一距離的1/2～1/3。
本發明實施例也公開一種感測器封裝結構的感測模組，包括：一感測晶片，其頂面包含有一感測區及圍繞於該感測區的一承載區；一光固化層，呈環形且設置於該承載區上，並且該光固化層包含有分別位於相反兩側的一內側緣與一外側緣，該內側緣與該外側緣相隔有一第一距離；一透光層，通過該光固化層而設置於該感測晶片的上方，以使該透光層、光固化層、及該感測晶片共同包圍形成有一封閉空間；其中，該感測區面向該透光層；以及一遮蔽層，設置於該透光層的表面上，並且該遮蔽層具有一外邊緣；其中，於平行該感測晶片的該頂面的一橫向方向上，該光固化層的該內側緣與該遮蔽層的該外邊緣之間相隔有一重疊距離，並且該重疊距離介於該第一距離的1/2～1/3。
本發明實施例另公開一種感測器封裝結構的感測模組，包括：一感測晶片，其頂面包含有一感測區及圍繞於該感測區的一承載區；一光固化層，呈環形且設置於該承載區上，並且該光固化層包含有分別位於相反兩側的一內側緣與一外側緣，該內側緣與該外側緣相隔有一第一距離；一透光層，通過該光固化層而設置於該感測晶片的上方，以使該透光層、光固化層、及該感測晶片共同包圍形成有一封閉空間；其中，該透光層包含有一第一表面、位於該第一表面相反側的一第二表面、及相連於該第一表面與該第二表面的一外側面，該第二表面是面向該感測區；以及一遮蔽層，設置於該透光層，並且該遮蔽層具有一外邊緣；其中，於平行該感測晶片的一橫向方向上，該透光層的該外側面與該遮蔽層的該外邊緣之間相隔有一第二距離，並且該第二距離介於該第一距離的1/2～1/3。
綜上所述，本發明實施例所公開的感測器封裝結構及其感測模組，通過在特定位置（如：第二距離或重疊距離）形成遮蔽層，據以能夠有效地降低因為該光固化層反光而產生的眩光現象，並且同時使該遮蔽層下方的光固化層部位能照射到足夠的固化光線（如：紫外光線），進而能夠使光固化層被完全固化。
為能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與附圖，但是此等說明與附圖僅用來說明本發明，而非對本發明的保護範圍作任何的限制。
請參閱圖1至圖4，其為本發明的實施例，需先說明的是，本實施例對應附圖所提及的相關數量與外型，僅用來具體地說明本發明的實施方式，以便於了解本發明的內容，而非用來侷限本發明的保護範圍。
[實施例一]
請參閱圖1至圖3所示，其為本發明的實施例一。本實施例公開一種感測器封裝結構100；也就是說，內部非為封裝感測器的任何封裝結構，其結構設計基礎不同於本實施例所指的感測器封裝結構100，所以兩者之間並不適於進行對比。
如圖1和圖2所示，該感測器封裝結構100包含有一基板1、設置於該基板1上的一感測晶片2、電性耦接該感測晶片2與該基板1的多條金屬線3、設置於該感測晶片2上的一光固化層4、通過該光固化層4而設置於該感測晶片2上方的一透光層5、設置於該透光層5表面上的一遮蔽層6、及形成於該基板1上的一封裝體7。
其中，該感測器封裝結構100於本實施例中雖是以包含上述元件來做說明，但該感測器封裝結構100也可以依據設計需求而加以調整變化。舉例來說，在本發明未繪示的其他實施例中，該感測器封裝結構100可以省略該些金屬線3，並且該感測晶片2通過覆晶方式固定於該基板1上。再者，於本實施例中，該感測晶片2、該光固化層4、該透光層5、及該遮蔽層6可以合併定義為一感測模組，並且該感測模組可以獨立地應用或是搭配本實施例以外的其他元件使用。
需先闡明的是，為便於說明本實施例感測器封裝結構100，圖1是以剖視圖呈現，但可以理解的是，在圖1所未呈現的感測器封裝結構100之部位也會形成有相對應的構造。例如：圖1僅呈現兩條金屬線3，但在圖1所未呈現的感測器封裝結構100之部位還包含其他條金屬線3。以下將分別就本實施例感測器封裝結構100的各個元件構造與連接關係作一說明。
該基板1於本實施例中為呈正方形或矩形的一印刷電路板（printed circuit board，PCB），但本發明不受限於此。其中，該基板1於其上表面的大致中央處設有一晶片固定區11，並且該基板1於其上表面形成有位於該晶片固定區11（或該感測晶片2）外側的多個第一焊墊12。該些第一焊墊12於本實施例中是大致排列呈環狀，但本發明不限於此。舉例來說，在本發明未繪示的其他實施例中，該些第一焊墊12也可以是在該晶片固定區11的相反兩側分別排成兩列。
此外，該基板1也可以於其下表面設有多個焊接球（圖未標示），並且該感測器封裝結構100能通過該些焊接球而焊接固定於一電子構件上，據以使該感測器封裝結構100能電性連接該電子構件。
該感測晶片2於本實施例中是以一影像感測晶片來說明，但不以此為限。其中，該感測晶片2是固定於該基板1的晶片固定區11，也就是說，該感測晶片2是位於該些第一焊墊12的內側。再者，該感測晶片2的一頂面20包含有一感測區21、圍繞於該感測區21（且呈環形）的一承載區22、及位於該承載區22外側的多個第二焊墊23。
其中，該感測晶片2的該些第二焊墊23的數量及位置於本實施例中是分別對應於該基板1的該些第一焊墊12的數量及位置。再者，該些金屬線3的一端分別連接於該些第一焊墊12，並且該些金屬線3的另一端分別連接於該些第二焊墊23，據以使該基板1能通過該些金屬線3而電性耦接於該感測晶片2。
該光固化層4呈環形且設置於該感測晶片2的該承載區22上；也就是說，該光固化層4於本實施例中是設置於該感測區21的外側、並位於該些第二焊墊23的內側，據以使該光固化層4的高度可以無需受限於該些金屬線3的高度，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，該光固化層4也可以是設置在該承載區22上、並包覆該些第二焊墊23與每條金屬線3的局部。
其中，該光固化層4意指是通過光線（如：紫外光線）照射而固化的結構，所以並非通過光線固化的任何膠層則不同於本實施例所指的光固化層4。其中，該光固化層4包含有分別位於相反兩側的一內側緣41與一外側緣42，並且該內側緣41與該外側緣42於平行該感測晶片2的該頂面20的一橫向方向D上相隔有一第一距離D1。
該透光層5於本實施例中是以呈透明狀的一平板玻璃來說明，但本發明不受限於此。該透光層5設置於該光固化層4上，也就是說，該光固化層4夾持於該透光層5與該感測晶片2之間。其中，該透光層5、該光固化層4、及該感測晶片2共同包圍形成有一封閉空間E，而該感測區21位於該封閉空間E內且面向該透光層5。
再者，該透光層5於本實施例中包含有一第一表面51、位於該第一表面51相反側的一第二表面52、及相連於該第一表面51與該第二表面52的一外側面53。其中，該第二表面52是面向該感測區21，該光固化層4的該外側緣42自該透光層5的該外側面53內縮一距離，但本發明不受限於此。舉例來說，如圖3所示，該透光層5的該外側面53也可以是切齊於該光固化層4的該外側緣42。
該遮蔽層6於本實施例中呈環形且不透光，並且該遮蔽層6設置於該透光層5的該第二表面52上，而該遮蔽層6的至少局部埋置於該光固化層4內。其中，該遮蔽層6朝向該感測晶片2的該頂面20正投影所形成的一投影區域，其位在該感測區21的外側，據以避免因為該遮蔽層6的設置而影響到該感測區21的感測精準度。
再者，該遮蔽層6具有埋置於該光固化層4內的一外邊緣61；而於平行該感測晶片2的該頂面20的該橫向方向D上，該光固化層4的該外側緣42與該遮蔽層6的該外邊緣61之間相隔有一第二距離D2，並且該第二距離D2介於該第一距離D1的1/2～1/3。
據此，該遮蔽層6的設置能夠有效地降低因為該光固化層4反光而產生的眩光現象，並且同時使該遮蔽層6下方的該光固化層4部位能照射到足夠的固化光線（如：紫外光線），進而能夠使光固化層4被完全固化。也就是說，本實施例的感測器封裝結構100能通過在特定位置形成遮蔽層6，以降低眩光現象並有效地固化光固化層4。
以上說明是以該光固化層4的該外側緣42與該遮蔽層6的該外邊緣61來共同定義該遮蔽層6所在的特定位置（也就是，該第二距離D2），但本實施例不排除以其他方式定義該遮蔽層6所在的特定位置。舉例來說，於平行該感測晶片2的該橫向方向D上，該透光層5的該外側面53與該遮蔽層6的該外邊緣61之間相隔有一第二距離D2a，並且該第二距離D2a也大致是介於該第一距離D1的1/2～1/3。
或者換個角度來看，於平行該感測晶片2的該橫向方向D上，該光固化層4的該內側緣41與該遮蔽層6的該外邊緣61之間相隔有一重疊距離Do，並且該重疊距離Do介於該第一距離D1的1/2～2/3。進一步地說，該遮蔽層6包含有埋置該光固化層4內的一內埋部62以及相連於該內埋部62且位於該封閉空間E內的一裸露部63。
其中，該遮蔽層6的該外邊緣61即為遠離該裸露部63的該內埋部62之邊緣，並且該內埋部62於該橫向方向D上具有一寬度W61（相當於該重疊距離Do），而該寬度W61為該第一距離D1的1/2～2/3。該裸露部63朝向該感測晶片2的該頂面20正投影所形成的一投影區域，其位在該感測區21與該光固化層4之間，據以在不影響到該感測區21的感測精準度的前提下，盡可能地降低眩光現象。
該封裝體7設置於該基板1上並包覆該感測晶片2的外側緣、該光固化層4的該外側緣42、及該透光層5的外側面53，而該透光層5的局部外表面裸露於該封裝體7之外；也就是說，該感測模組埋置於該封裝體7內，並且該透光層5的該第一表面51裸露於該封裝體7之外。再者，該些第一焊墊12、該些第二焊墊23、及該些金屬線3皆完全埋置於該封裝體7內，但本發明不受限於此。
進一步地說，該封裝體7於本實施例中是以一液態封膠（liquid compound）來說明，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，該封裝體7的液態封膠之頂面上進一步形成有一模制封膠（molding compound）；或者，該封裝體7也可以僅為一模制封膠。
[實施例二]
請參閱圖4和圖5所示，其為本發明的實施例二，由於本實施例類似於上述的實施例一，所以兩個實施例的相同處則不再加以贅述（如：基板1、感測晶片2、金屬線3、光固化層4、透光層5、及封裝體7），而本實施例相較於實施例一的差異大致說明如下：
於本實施例中， 該遮蔽層6a未埋置於該光固化層4內，並且該遮蔽層6a是設置於該透光層5的該第一表面51上。其中，該遮蔽層6a朝向該感測晶片2的該頂面20正投影所形成的一投影區域，其較佳是位在該感測區21的外側。
再者，該遮蔽層6a具有鄰近該透光層5外側面53的一外邊緣61；而於平行該感測晶片2的該頂面20的一橫向方向D上，該光固化層4的該外側緣42與該遮蔽層6a的該外邊緣61之間相隔有一第二距離D2，並且該第二距離D2介於該第一距離D1的1/2～1/3。
據此，該遮蔽層6a的設置能夠有效地降低因為該光固化層4而反光產生的眩光現象，並且同時使遮蔽層6a於方向H（如：高度方向）而遮蔽的該光固化層4部位能照射到足夠的固化光線（如：紫外光線），進而能夠使光固化層4被完全固化。
以上說明是以該光固化層4的該外側緣42與該遮蔽層6a的該外邊緣61來共同定義該遮蔽層6a的特定位置（也就是，該第二距離D2），但本實施例不排除以其他方式定義該遮蔽層6a所在的特定位置。舉例來說，於平行該感測晶片2的該橫向方向D上，該透光層5的該外側面53與該遮蔽層6a的該外邊緣61之間相隔有一第二距離D2a，並且該第二距離D2a也大致是介於該第一距離D1的1/2～1/3。
[本發明實施例的技術效果]
綜上所述，本發明實施例所公開的感測器封裝結構及其感測模組，通過在特定位置（如：第二距離或重疊距離）形成遮蔽層，據以能夠有效地降低因為該光固化層反光而產生的眩光現象，並且同時使該遮蔽層下方的該光固化層部位能照射到足夠的的固化光線（如：紫外光線），進而能夠使光固化層被完全固化。
此外，本發明實施例所公開的感測器封裝結構及其感測模組，還能通過其他結構上的限制，據以進一步地降低因為該光固化層而產生的眩光現象。例如：該裸露部朝向該感測晶片的該頂面正投影所形成的一投影區域，其位在該感測區與該光固化層之間。
以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的專利範圍內。
100:感測器封裝結構 1:基板 11:晶片固定區 12:第一焊墊 2:感測晶片 20:頂面 21:感測區 22:承載區 23:第二焊墊 3:金屬線 4:光固化層 41:內側緣 42:外側緣 5:透光層 51:第一表面 52:第二表面 53:外側面 6、6a:遮蔽層 61:外邊緣 62:內埋部 63:裸露部 7:封裝體 E:封閉空間 D:橫向方向 D1:第一距離 D2、D2a:第二距離 Do:重疊距離 W61:寬度 H:方向
圖1為本發明實施例一的感測器封裝結構的剖視示意圖。
圖2為圖1的部位II的局部放大示意圖。
圖3為圖2的變化態樣示意圖。
圖4為本發明實施例二的感測器封裝結構的剖視示意圖。
圖5為圖4的部位V的局部放大示意圖。
100:感測器封裝結構
1:基板
11:晶片固定區
12:第一焊墊
2:感測晶片
20:頂面
21:感測區
22:承載區
23:第二焊墊
3:金屬線
4:光固化層
41:內側緣
42:外側緣
5:透光層
51:第一表面
52:第二表面
53:外側面
6:遮蔽層
7:封裝體
E:封閉空間
D:橫向方向
H:方向

Claims (8)

  1. 一種感測器封裝結構，包括：一基板；一感測晶片，設置於該基板上，並且該感測晶片的一頂面包含有一感測區及圍繞於該感測區的一承載區；一光固化層，呈環形且設置於該承載區上，並且該光固化層包含有分別位於相反兩側的一內側緣與一外側緣，該內側緣與該外側緣相隔有一第一距離；一透光層，通過該光固化層而設置於該感測晶片的上方，以使該透光層、該光固化層、及該感測晶片共同包圍形成有一封閉空間；其中，該感測區面向該透光層；以及一遮蔽層，設置於該透光層的表面上，並且該遮蔽層具有一外邊緣；其中，於平行該感測晶片的該頂面的一橫向方向上，該光固化層的該外側緣與該遮蔽層的該外邊緣之間相隔有一第二距離，並且該第二距離介於該第一距離的1/2~1/3；其中，該透光層包含有分別位於相反兩側的一第一表面與一第二表面，並且該第二表面是面向該感測區；該遮蔽層設置於該第二表面並且至少局部埋置於該光固化層內。
  2. 如請求項1所述的感測器封裝結構，其中，該遮蔽層包含有：一內埋部，埋置該光固化層內，並且該內埋部於該橫向方向上具有一寬度，而該寬度為該第一距離的1/2~2/3；及一裸露部，位於該封閉空間內，並且該裸露部朝向該感測晶片的該頂面正投影所形成的一投影區域，其位在該感測區與該光固化層之間。
  3. 如請求項1所述的感測器封裝結構，其中，該遮蔽層朝向該感 測晶片的該頂面正投影所形成的一投影區域，其位在該感測區的外側。
  4. 如請求項1所述的感測器封裝結構，其中，該透光層包含有相連於該第一表面與該第二表面的一外側面，該外側面切齊於該光固化層的該外側緣。
  5. 如請求項1所述的感測器封裝結構，其中，該透光層包含相連於該第一表面與該第二表面的一外側面，該光固化層的該外側緣自該外側面內縮一距離。
  6. 如請求項1所述的感測器封裝結構，其中，該基板包含有位於該感測晶片外側的多個第一焊墊，該感測晶片的該頂面包含有位於該承載區外側的多個第二焊墊；該感測器封裝結構進一步包括：多條金屬線，其一端分別連接於該些第一焊墊，而另一端連接於該些第二焊墊；及一封裝體，位於該基板上；其中，該感測晶片、該光固化層、該透光層、及該些金屬線埋置於該封裝體內，並且該透光層的局部外表面裸露於該封裝體之外。
  7. 一種感測器封裝結構的感測模組，包括：一感測晶片，其頂面包含有一感測區及圍繞於該感測區的一承載區；一光固化層，呈環形且設置於該承載區上，並且該光固化層包含有分別位於相反兩側的一內側緣與一外側緣，該內側緣與該外側緣相隔有一第一距離； 一透光層，通過該光固化層而設置於該感測晶片的上方，以使該透光層、該光固化層、及該感測晶片共同包圍形成有一封閉空間；其中，該感測區面向該透光層；以及一遮蔽層，設置於該透光層的表面上，並且該遮蔽層具有一外邊緣；其中，於平行該感測晶片的該頂面的一橫向方向上，該光固化層的該內側緣與該遮蔽層的該外邊緣之間相隔有一重疊距離，並且該重疊距離介於該第一距離的1/2~2/3；其中，該透光層包含有分別位於相反兩側的一第一表面與一第二表面，並且該第二表面是面向該感測區；該遮蔽層設置於該第二表面並且至少局部埋置於該光固化層內。
  8. 一種感測器封裝結構的感測模組，包括：一感測晶片，其頂面包含有一感測區及圍繞於該感測區的一承載區；一光固化層，呈環形且設置於該承載區上，並且該光固化層包含有分別位於相反兩側的一內側緣與一外側緣，該內側緣與該外側緣相隔有一第一距離；一透光層，通過該光固化層而設置於該感測晶片的上方，以使該透光層、該光固化層、及該感測晶片共同包圍形成有一封閉空間；其中，該透光層包含有一第一表面、位於該第一表面相反側的一第二表面、及相連於該第一表面與該第二表面的一外側面，該第二表面是面向該感測區；以及一遮蔽層，設置於該透光層，並且該遮蔽層具有一外邊緣；其中，於平行該感測晶片的一橫向方向上，該透光層的該外側面與該遮蔽層的該外邊緣之間相隔有一第二距離，並且該第二距離介於該第一距離的1/2~1/3；其中，該遮蔽層設置於該第二表面並且至少局部埋置於該光固化層內。
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