TW201642315A - 壓印設備及物品製造方法 - Google Patents

壓印設備及物品製造方法 Download PDF

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Publication number
TW201642315A
TW201642315A TW105109722A TW105109722A TW201642315A TW 201642315 A TW201642315 A TW 201642315A TW 105109722 A TW105109722 A TW 105109722A TW 105109722 A TW105109722 A TW 105109722A TW 201642315 A TW201642315 A TW 201642315A
Authority
TW
Taiwan
Prior art keywords
mark
pair
mold
substrate
marks
Prior art date
Application number
TW105109722A
Other languages
English (en)
Chinese (zh)
Inventor
古卷貴光
薄井義行
林望
Original Assignee
佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佳能股份有限公司 filed Critical 佳能股份有限公司
Publication of TW201642315A publication Critical patent/TW201642315A/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H10P72/57—
    • H10P74/203—
    • H10P76/2041—

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Multimedia (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW105109722A 2015-04-08 2016-03-28 壓印設備及物品製造方法 TW201642315A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015079472A JP6138189B2 (ja) 2015-04-08 2015-04-08 インプリント装置および物品の製造方法

Publications (1)

Publication Number Publication Date
TW201642315A true TW201642315A (zh) 2016-12-01

Family

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Family Applications (2)

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TW105109722A TW201642315A (zh) 2015-04-08 2016-03-28 壓印設備及物品製造方法
TW106101714A TWI634589B (zh) 2015-04-08 2016-03-28 壓印設備及物品製造方法

Family Applications After (1)

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Country Status (6)

Country Link
US (1) US10732522B2 (enExample)
JP (1) JP6138189B2 (enExample)
KR (1) KR102028235B1 (enExample)
CN (1) CN106054517B (enExample)
SG (1) SG10201602475TA (enExample)
TW (2) TW201642315A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641027B (zh) * 2016-12-09 2018-11-11 Canon Kabushiki Kaisha 壓印系統及物品製造方法
TWI651762B (zh) * 2016-12-16 2019-02-21 Canon Kabushiki Kaisha 對位裝置，對位方法，光蝕刻裝置，及物品製造方法
US12491666B2 (en) 2022-05-30 2025-12-09 Canon Kabushiki Kaisha Forming apparatus, forming method, and article manufacturing method

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JP6120678B2 (ja) * 2013-05-27 2017-04-26 キヤノン株式会社 インプリント方法、インプリント装置及びデバイス製造方法
JP6401501B2 (ja) * 2014-06-02 2018-10-10 キヤノン株式会社 インプリント装置、および物品の製造方法
US10998190B2 (en) 2017-04-17 2021-05-04 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
JP6937203B2 (ja) * 2017-09-14 2021-09-22 キオクシア株式会社 インプリント装置、インプリント方法および半導体装置の製造方法
JP7057094B2 (ja) * 2017-10-13 2022-04-19 キヤノン株式会社 位置検出装置、インプリント装置および、物品製造方法
JP6688273B2 (ja) * 2017-11-13 2020-04-28 キヤノン株式会社 リソグラフィ装置、リソグラフィ方法、決定方法及び物品の製造方法
CN109839799B (zh) * 2017-11-28 2022-07-19 上海仪电显示材料有限公司 掩膜组件及其曝光方法
JP2019102537A (ja) 2017-11-29 2019-06-24 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP7060961B2 (ja) * 2018-01-05 2022-04-27 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP7256684B2 (ja) * 2019-05-14 2023-04-12 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
US11966157B2 (en) * 2021-05-20 2024-04-23 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and article manufacturing method
JP7701883B2 (ja) * 2021-05-20 2025-07-02 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
CN113314451B (zh) * 2021-06-10 2022-08-02 哈尔滨工业大学 一种基于莫尔条纹的晶圆键合对准系统及方法
KR102697201B1 (ko) * 2021-09-03 2024-08-21 주식회사 에스디에이 디지털 노광장치
JP2023177409A (ja) 2022-06-02 2023-12-14 キヤノン株式会社 インプリント装置、インプリント方法、物品の製造方法、及びコンピュータプログラム
JP2024150284A (ja) * 2023-04-10 2024-10-23 キヤノン株式会社 インプリント装置、インプリント方法、及び物品の製造方法
JP2024162750A (ja) * 2023-05-11 2024-11-21 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法。

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JP6071221B2 (ja) * 2012-03-14 2017-02-01 キヤノン株式会社 インプリント装置、モールド、インプリント方法及び物品の製造方法
JP6188382B2 (ja) * 2013-04-03 2017-08-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP6120678B2 (ja) 2013-05-27 2017-04-26 キヤノン株式会社 インプリント方法、インプリント装置及びデバイス製造方法
JP6271875B2 (ja) * 2013-06-18 2018-01-31 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP6401501B2 (ja) * 2014-06-02 2018-10-10 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6549834B2 (ja) * 2014-11-14 2019-07-24 キヤノン株式会社 インプリント装置及び物品の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641027B (zh) * 2016-12-09 2018-11-11 Canon Kabushiki Kaisha 壓印系統及物品製造方法
US11235495B2 (en) 2016-12-09 2022-02-01 Canon Kabushiki Kaisha Imprint system and article manufacturing meihod
TWI651762B (zh) * 2016-12-16 2019-02-21 Canon Kabushiki Kaisha 對位裝置，對位方法，光蝕刻裝置，及物品製造方法
US11188001B2 (en) 2016-12-16 2021-11-30 Canon Kabushiki Kaisha Alignment apparatus, alignment method, lithography apparatus, and method of manufacturing article
US12491666B2 (en) 2022-05-30 2025-12-09 Canon Kabushiki Kaisha Forming apparatus, forming method, and article manufacturing method

Also Published As

Publication number Publication date
JP6138189B2 (ja) 2017-05-31
TWI634589B (zh) 2018-09-01
US10732522B2 (en) 2020-08-04
TW201719726A (zh) 2017-06-01
CN106054517B (zh) 2020-11-06
SG10201602475TA (en) 2016-11-29
JP2016201423A (ja) 2016-12-01
KR102028235B1 (ko) 2019-10-02
CN106054517A (zh) 2016-10-26
KR20160120676A (ko) 2016-10-18
US20160299444A1 (en) 2016-10-13

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