TW201526780A - 屏蔽容納體、印刷電路板、電子設備及屏蔽容納體之製造方法 - Google Patents
屏蔽容納體、印刷電路板、電子設備及屏蔽容納體之製造方法 Download PDFInfo
- Publication number
- TW201526780A TW201526780A TW103133080A TW103133080A TW201526780A TW 201526780 A TW201526780 A TW 201526780A TW 103133080 A TW103133080 A TW 103133080A TW 103133080 A TW103133080 A TW 103133080A TW 201526780 A TW201526780 A TW 201526780A
- Authority
- TW
- Taiwan
- Prior art keywords
- shield
- electronic circuit
- film
- layer
- conductive
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 92
- 239000012790 adhesive layer Substances 0.000 claims abstract description 42
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 8
- 230000004308 accommodation Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000010292 electrical insulation Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 description 62
- 230000000694 effects Effects 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 230000005684 electric field Effects 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- -1 etc. Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- LVRNBDXQURQYED-UHFFFAOYSA-N [Sb].N1=C(N)N=C(N)N=C1N Chemical compound [Sb].N1=C(N)N=C(N)N=C1N LVRNBDXQURQYED-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000417 polynaphthalene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/105—Metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013198888A JP2015065343A (ja) | 2013-09-25 | 2013-09-25 | シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201526780A true TW201526780A (zh) | 2015-07-01 |
Family
ID=52743200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103133080A TW201526780A (zh) | 2013-09-25 | 2014-09-24 | 屏蔽容納體、印刷電路板、電子設備及屏蔽容納體之製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2015065343A (ko) |
| KR (1) | KR20160060651A (ko) |
| CN (1) | CN105684566A (ko) |
| TW (1) | TW201526780A (ko) |
| WO (1) | WO2015046063A1 (ko) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109156095A (zh) * | 2016-05-30 | 2019-01-04 | 阿莫绿色技术有限公司 | 柔性电磁波屏蔽片及具有其的电子设备 |
| CN109315084A (zh) * | 2016-05-30 | 2019-02-05 | 阿莫绿色技术有限公司 | 超薄型电磁波屏蔽片及具有其的电子设备 |
| TWI728082B (zh) * | 2016-03-25 | 2021-05-21 | 日商拓自達電線股份有限公司 | 導電性補強構件、可撓式印刷配線板、以及可撓式印刷配線板的製造方法 |
| TWI837383B (zh) * | 2019-06-18 | 2024-04-01 | 日商東洋油墨Ｓｃ控股股份有限公司 | 電磁波屏蔽片及電磁波屏蔽性配線電路基板 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6098688B1 (ja) * | 2015-09-17 | 2017-03-22 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
| JP6098692B1 (ja) * | 2015-10-19 | 2017-03-22 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
| WO2016144039A1 (en) | 2015-03-06 | 2016-09-15 | Samsung Electronics Co., Ltd. | Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof |
| CN104837327A (zh) * | 2015-05-21 | 2015-08-12 | 小米科技有限责任公司 | 电路保护结构及电子装置 |
| DE102015112337A1 (de) * | 2015-07-29 | 2017-02-02 | Bühler Motor GmbH | Leiterplattenanordnung, Ölpumpe mit einer solchen Leiterplattenanordnung, Verwendung der Leiterplattenanordnung und Herstellungsverfahren |
| KR101746289B1 (ko) * | 2015-10-15 | 2017-06-13 | 주식회사 포콘스 | 내외부절연필름이 구비된 쉴드캔 및 그 제조방법 |
| US10477737B2 (en) | 2016-05-04 | 2019-11-12 | Samsung Electronics Co., Ltd. | Manufacturing method of a hollow shielding structure for circuit elements |
| US10477687B2 (en) | 2016-08-04 | 2019-11-12 | Samsung Electronics Co., Ltd. | Manufacturing method for EMI shielding structure |
| KR102551657B1 (ko) | 2016-12-12 | 2023-07-06 | 삼성전자주식회사 | 전자파 차폐구조 및 그 제조방법 |
| FR3062982B1 (fr) * | 2017-02-13 | 2019-04-19 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Structure de blindage electromagnetique pour cartes electroniques |
| FR3062981A1 (fr) * | 2017-02-13 | 2018-08-17 | Commissariat Energie Atomique | Structure de blindage electromagnetique pour cartes electroniques |
| CN108541205B (zh) * | 2017-03-01 | 2020-05-22 | 庆鼎精密电子（淮安）有限公司 | 电磁屏蔽罩及其制作方法 |
| US10594020B2 (en) | 2017-07-19 | 2020-03-17 | Samsung Electronics Co., Ltd. | Electronic device having antenna element and method for manufacturing the same |
| CN207070595U (zh) * | 2017-08-16 | 2018-03-02 | 苏州城邦达力材料科技有限公司 | 电磁屏蔽膜的导电层及电磁屏蔽膜 |
| CN107325747A (zh) * | 2017-08-29 | 2017-11-07 | 德阳力久云智知识产权运营有限公司 | 一种电磁屏蔽胶带 |
| KR102373931B1 (ko) | 2017-09-08 | 2022-03-14 | 삼성전자주식회사 | 전자파 차폐구조 |
| KR102488875B1 (ko) | 2018-01-30 | 2023-01-17 | 삼성전자주식회사 | 전자파 차폐구조 및 그 제조방법 |
| CN108495491A (zh) * | 2018-03-06 | 2018-09-04 | 广州金升阳科技有限公司 | 一种电源外壳 |
| KR102567412B1 (ko) | 2018-10-31 | 2023-08-16 | 삼성전자주식회사 | 복수의 레이어를 포함하는 차폐 필름 및 그것을 사용하는 전자 장치 |
| TWI768213B (zh) * | 2018-11-08 | 2022-06-21 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜、電磁波屏蔽膜之製造方法及屏蔽印刷配線板之製造方法 |
| KR102015896B1 (ko) * | 2019-05-21 | 2019-10-21 | 주식회사 유경하이테크 | 쉴드방열캔 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61276399A (ja) * | 1985-05-31 | 1986-12-06 | 藤倉ゴム工業株式会社 | 電磁波遮蔽用可撓性転写フイルムの製造方法 |
| NL1016549C2 (nl) * | 2000-10-06 | 2002-04-10 | Stork Screens Bv | Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. |
| JP2003069284A (ja) * | 2001-08-24 | 2003-03-07 | Komatsu Seiren Co Ltd | 電磁波シールド材及びその製造方法 |
| JP2005064266A (ja) * | 2003-08-13 | 2005-03-10 | Murata Mfg Co Ltd | 電磁波シールドシートおよび電子機器 |
| JP4484042B2 (ja) * | 2004-07-21 | 2010-06-16 | Ｔｄｋ株式会社 | 透明シールドケース及びその製造方法並びに遊技機 |
| JP2009081400A (ja) * | 2007-09-27 | 2009-04-16 | Mitsubishi Electric Corp | 電子機器端末のシールド構造 |
| JP4911321B2 (ja) * | 2008-02-05 | 2012-04-04 | 株式会社村田製作所 | 電磁遮蔽シート及び電磁遮蔽方法 |
| JP2012033704A (ja) * | 2010-07-30 | 2012-02-16 | Hitachi Chem Co Ltd | 電子部品用電磁波シールドフィルムを用いた電子部品の電磁波シールド方法 |
| JP5707216B2 (ja) * | 2011-04-26 | 2015-04-22 | 藤森工業株式会社 | Ｆｐｃ用電磁波シールド材 |
| US10015915B2 (en) * | 2011-11-24 | 2018-07-03 | Tatsuta Electric Wire & Cable Co., Ltd. | Shield film, shielded printed wiring board, and method for manufacturing shield film |
| JP6264731B2 (ja) * | 2012-03-06 | 2018-01-24 | 東洋インキＳｃホールディングス株式会社 | 導電性樹脂組成物、導電性シート、電磁波シールドシートおよびこれらの製造方法、並びに導電性微粒子の製造方法 |
-
2013
- 2013-09-25 JP JP2013198888A patent/JP2015065343A/ja active Pending
-
2014
- 2014-09-19 CN CN201480061426.6A patent/CN105684566A/zh active Pending
- 2014-09-19 KR KR1020167007880A patent/KR20160060651A/ko not_active Application Discontinuation
- 2014-09-19 WO PCT/JP2014/074868 patent/WO2015046063A1/ja active Application Filing
- 2014-09-24 TW TW103133080A patent/TW201526780A/zh unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI728082B (zh) * | 2016-03-25 | 2021-05-21 | 日商拓自達電線股份有限公司 | 導電性補強構件、可撓式印刷配線板、以及可撓式印刷配線板的製造方法 |
| CN109156095A (zh) * | 2016-05-30 | 2019-01-04 | 阿莫绿色技术有限公司 | 柔性电磁波屏蔽片及具有其的电子设备 |
| CN109315084A (zh) * | 2016-05-30 | 2019-02-05 | 阿莫绿色技术有限公司 | 超薄型电磁波屏蔽片及具有其的电子设备 |
| CN109156095B (zh) * | 2016-05-30 | 2020-08-14 | 阿莫绿色技术有限公司 | 柔性电磁波屏蔽片及具有其的电子设备 |
| TWI837383B (zh) * | 2019-06-18 | 2024-04-01 | 日商東洋油墨Ｓｃ控股股份有限公司 | 電磁波屏蔽片及電磁波屏蔽性配線電路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015046063A1 (ja) | 2015-04-02 |
| KR20160060651A (ko) | 2016-05-30 |
| CN105684566A (zh) | 2016-06-15 |
| JP2015065343A (ja) | 2015-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201526780A (zh) | 屏蔽容納體、印刷電路板、電子設備及屏蔽容納體之製造方法 | |
| TWI612885B (zh) | 屏蔽容納體、印刷電路板及電子設備 | |
| JP6511473B2 (ja) | 電磁波シールドフィルム | |
| TWI627256B (zh) | 導電性黏接膜、印刷電路板及電子設備 | |
| TWI629929B (zh) | 電子裝置及其製造方法 | |
| WO2013183632A1 (ja) | シールドフィルム、及び、シールドプリント配線板 | |
| CN108848609A (zh) | 电磁波屏蔽膜、柔性印刷布线板以及它们的制造方法 | |
| CN105407693B (zh) | 电磁波屏蔽膜及带有其的挠性印刷配线板的制造方法 | |
| JP2015162672A (ja) | ケース、このケースを備える電子装置並びにこのケースの製造方法 | |
| JP7334169B2 (ja) | システムインパッケージアセンブリの電磁干渉からのシールド方法 | |
| WO2014097933A1 (ja) | シールドプリント配線板の製造方法、シールドフィルム、及び、シールドプリント配線板 | |
| CN108702863B (zh) | 电磁波屏蔽膜 | |
| CN102480004A (zh) | 一种具有空间间隙的超材料及其制备方法 | |
| JP2014135389A (ja) | 金属基材フィルムを用いたフレキシブルプリント配線基板、及びそれを用いた非接触型ｉｃカード。 | |
| KR20150092625A (ko) | 임베디드 인쇄회로기판 | |
| TWI802757B (zh) | 電磁波遮蔽片以及電子零件搭載基板 | |
| JP2016029748A (ja) | シールドプリント配線板の製造方法 | |
| JP2013513156A (ja) | Ｒｆｉｄタグ内蔵型インレイ、これを含むカード、及びｒｆｉｄタグ内蔵型インレイの製造方法 | |
| TWI754611B (zh) | Ｆｐｃ用導電性黏著片材及使用此片材之ｆｐｃ | |
| KR20190001141U (ko) | 전자파 차폐막의 도전층, 전자파 차폐막 | |
| CN211509708U (zh) | 电磁波屏蔽膜及带电磁波屏蔽膜的印刷线路板 | |
| JP2018056423A (ja) | 電磁波シールドフィルムの製造方法および電磁波シールドフィルム付きプリント配線板の製造方法 | |
| JP2018056424A (ja) | 電磁波シールドフィルムの製造方法および電磁波シールドフィルム付きプリント配線板の製造方法 | |
| WO2024117012A1 (ja) | 電磁波シールド材、電子部品および電子機器 | |
| JP2017201607A (ja) | シールド付フレキシブルフラットケーブル及びシールド付フレキシブルフラットケーブルの製造方法 |