CN109156095B - 柔性电磁波屏蔽片及具有其的电子设备 - Google Patents

柔性电磁波屏蔽片及具有其的电子设备 Download PDF

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CN109156095B
CN109156095B CN201780031504.1A CN201780031504A CN109156095B CN 109156095 B CN109156095 B CN 109156095B CN 201780031504 A CN201780031504 A CN 201780031504A CN 109156095 B CN109156095 B CN 109156095B
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electromagnetic wave
fiber
shielding sheet
fibers
conductive adhesive
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CN109156095A (zh
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徐寅踊
丁义荣
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Amogreentech Co Ltd
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Amogreentech Co Ltd
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Abstract

本发明涉及一种柔性电磁波屏蔽片及具有其的电子设备，柔性电磁波屏蔽片包括：压敏性粘结带，在一面具有导电性粘结层；纤维网，粘结于上述导电性粘结层，由纤维聚集而成；金属层，形成于上述纤维网的至少一面，用于屏蔽电磁波；以及绝缘膜，粘接于形成上述金属层的纤维网。并且，上述压敏性粘结带包括：纤维聚集型基材，由多个纤维聚集而成，具有多个气孔；以及导电性粘结层，形成于上述纤维聚集型基材的两面，由填充于上述多个气孔的导电性粘结物质所形成，通过所施加的压力被电连接。

Description

柔性电磁波屏蔽片及具有其的电子设备
技术领域
本发明涉及电磁波屏蔽片，更详细地，涉及一种可挠性优秀并可提高电磁波屏蔽效率的柔性电磁波屏蔽片及具有其的电子设备。
背景技术
近年来，随着包括移动电话、平板电脑、笔记本电脑和数码相机等的电子设备变得高性能化及高功能化，各种部件也正在被配置。
并且，随着对高轻量化及柔性电子设备需求的增加，柔性部件的开发也正在积极实施。
当内置在这种电子设备的部件以高性能及多功能执行时，产生热量和电磁波，在电磁波流入到部件或流出到外部的情况下，电磁波会引起多种多样的电磁波干扰直到其他电子设备发生故障和对人体产生负面影响为止。
因此，电子设备中必须使用电磁波屏蔽片，以防止电磁波引起的对部件的影响。
电磁波屏蔽技术可以分为两种方法，即通过屏蔽电磁波产生源附近来保护外部设备的方法和在屏蔽材料内部保管设备来从电磁波产生源保护的方法。
目前，正在不断开发用于增强电磁波屏蔽的各种技术，并且需要开发一种用于粘结或粘接于电磁波产生源而与接地相连接的电磁波屏蔽片的技术。
韩国公开专利公报第2013-0136386号(专利文献1)中揭示了一种电磁波屏蔽片，即，包括基材，通过纺纱方法将高分子物质纺纱为纤维束而成纳米网形态；导电性金属层，形成于上述基材的一面来屏蔽电磁波；以及粘结层，形成于上述基材的另一面。
专利文献1的电磁波屏蔽片具有如下缺点，即，电磁波屏蔽片的粘结层是通过纺纱粘结物质而获得的多个纤维束聚集而成，因此，仅具有用于将电磁波屏蔽片粘结到对象物的粘结功能，不可能执行粘结到对象物时由通电引起的电磁波屏蔽功能。
发明内容
要解决的问题
本发明用于解决如上所述的问题而提出，其目的在于，提供一种可挠性优异而能够包围并封装电磁波产生部来可提高电磁波屏蔽效率的柔性电磁波屏蔽片及具有其的电子设备。
本发明的再一目的在于，提供一种由于通电性能的增大而可提高电磁波屏蔽效率的柔性电磁波屏蔽片及具有其的电子设备。
本发明的另一目的在于，提供一种当用电磁波屏蔽片将电磁波产生部包围并封装时，由于施加的压力而压敏性粘结带的导电性粘结层可通电的柔性电磁波屏蔽片及具有其的电子设备。
解决问题的方案
为了实现上述目的，本发明一实施例的柔性电磁波屏蔽片的特征在于，包括：压敏性粘结带，在一面具有导电性粘结层；纤维网，粘结于上述导电性粘结层，由纤维聚集而成；金属层，形成于上述纤维网的至少一面，用于屏蔽电磁波；以及绝缘膜，粘接于形成有上述金属层的纤维网，上述压敏性粘结带包括：纤维聚集型基材，由多个纤维聚集而成，具有多个气孔；以及导电性粘结层，形成于上述纤维聚集型基材的两面，由填充于上述多个气孔的导电性粘结物质形成，通过所施加的压力被电连接。
上述纤维网可具有无气孔结构或微细气孔结构。
并且，上述金属层可形成于上述无气孔结构的纤维网的一面或两面。
并且，上述金属层以超薄膜形态形成于上述微细气孔结构的纤维网的一面或两面，或者，在上述微细气孔结构的纤维网的微细气孔的内侧壁(即，纤维的外周面)涂敷金属，可在纤维网的一面或两面形成超薄膜的金属层。
并且，上述绝缘膜可为由可挠性绝缘膜或纳米纤维聚集而成的纳米纤维网片。
并且，上述压敏性粘结带的导电性粘结层及上述金属层可与接地相连接。
而且，上述压敏性粘结带能够以包围安装在印刷电路板的电磁波产生部的方式被封装。
并且，上述纤维聚集型基材可为由纤维直径小于1μm的纤维所形成的纳米纤维网，或为由纤维直径大于1μm的纤维所形成的无纺布网。
并且，上述纤维聚集型基材可呈在由纤维直径大于1μm的纤维所形成的无纺布网的一面或两面结合有由纤维直径小于1μm的纤维所形成的纳米纤维网的结构，上述纳米纤维网由通过电纺丝得到的高分子物质的纤维在上述无纺布网的一面或两面聚集而成，或者，在上述无纺布网的一面或两面接合单独制造的纳米纤维网而成。
而且，上述纤维的纤维直径可为100nm～5μm。
另一方面，形成上述纤维聚集型基材的多个纤维可包括：镍(Ni)质第一金属涂敷层，涂敷于上述纤维的外周面；以及铜(Cu)质第二金属涂敷层，涂敷于上述镍质第一金属涂敷层的外周面。
并且，上述导电性粘结层可由分散有导电性填料的粘结物质形成。
并且，形成有上述金属涂敷层的纤维聚集型基材的厚度和上述导电性粘结层的厚度之和，即，压敏性粘结带的厚度可小于30μm。
本发明一实施例的电子设备可通过由上述的柔性电磁波屏蔽片的压敏性粘结带包围电磁波产生部而构成。
本发明一实施例的电子设备的特征在于，包括：印刷电路板；电磁波产生部，安装在上述印刷电路板；以及柔性电磁波屏蔽片，包围上述电磁波产生部，与上述印刷电路板相结合或相粘接，来切断从上述电磁波产生部产生的电磁波及从外部向上述电磁波产生部流入的电磁波，上述柔性电磁波屏蔽片的特征在于，包括：压敏性粘结带，包括纤维聚集型基材以及导电性粘结层，上述纤维聚集型基材由多个纤维聚集而成，具有多个气孔，上述导电性粘结层形成于上述纤维聚集型基材的两面，由填充于上述多个气孔的导电性粘结物质形成，通过所施加的压力被电连接；金属层，粘结于上述压敏性粘结带一面的导电性粘结层，用于屏蔽电磁波；以及绝缘层，形成于上述金属层。
上述压敏性粘结带的导电性粘结层及上述金属层可与接地相连接。
发明的效果
本发明具有如下优点，即，用以纤维聚集型基材为基础的压敏性粘结带、纤维网、超薄型金属层及绝缘膜来可制造弯曲特性优异的带形态的电磁波屏蔽片。
即，本发明具有如下优点，用可挠性优异的柔性电磁波屏蔽片包围并可封装电磁波产生部，不仅能够提高电磁波屏蔽效率，而且还可以在由于多个障碍物难以安装电磁波屏蔽片的弯曲位置及需要弯曲的位置也能设置屏蔽片。
本发明具有如下优点，即，在具有优异导电性的纤维聚集型基材内部的气孔及表面形成有导电性粘结层的压敏性粘结带包括在柔性电磁波屏蔽片。结果，当用电磁波屏蔽片包围电磁波产生部来封装时，随着施加的压力而实现导电性粘结层的通电，因此可由通电性能的增加来提高电磁波屏蔽效率。
附图说明
图1为本发明一实施例的柔性电磁波屏蔽片的剖视图。
图2为具有本发明一实施例的柔性电磁波屏蔽片的电子设备的简要剖视图。
图3为本发明的压敏性粘结带的剖视图。
图4a及图4b为用于说明本发明的压敏性粘结带的导电性粘结层在被施加压力前后的状态的示意图。
图5a及图5b为用于说明在本发明的压敏性粘结带的纤维聚集型基材的纤维形成有金属涂敷层的状态的示意剖视图。
图6a至图6c为示出本发明的压敏性粘结带的纤维聚集型基材的变形例的剖视图。
图7为本发明的压敏性粘结带的制造方法的流程图。
图8a至图8c为用于说明在本发明的压敏性粘结带的纤维聚集型基材形成导电性粘结层的方法的示意剖视图。
具体实施方式
以下，参照附图对用于实施本发明的具体内容进行说明。
参照图1及图3，本发明的柔性电磁波屏蔽片300包括：压敏性粘结带100，包括纤维聚集型基材110以及导电性粘结层131、132，上述纤维聚集型基材110由多个纤维111聚集而成，具有多个气孔，上述导电性粘结层131、132形成于上述纤维聚集型基材110的两面，由填充于上述多个气孔的导电性粘结物质形成，通过所施加的压力被电连接；纤维网200，粘结于上述压敏性粘结带100一面的导电性粘结层131，由纤维聚集而成；金属层205，形成于上述纤维网200，用于屏蔽电磁波；以及绝缘膜210，粘接于形成有上述金属层205的纤维网200。
其中，纤维网200可形成无气孔结构或微细气孔结构。
金属层205可形成于无气孔结构的纤维网200的一面或两面。在此情况下，金属层205以超薄膜形态形成于微细气孔结构的纤维网200的一面或两面，或者在纤维网200的微细气孔的内侧壁(即，纤维的外周面)涂敷有金属并在纤维网200的一面或两面形成有超薄膜的金属层来实现。
这种金属层205通过喷射工艺或化学镀工艺来形成。
绝缘膜210可以用作如PET膜的可挠性绝缘膜或者纳米纤维聚集而成的纳米纤维网片。
因此，本发明可通过使用包括纤维聚集型基材110的压敏性粘结带100、涂敷有金属层205的纤维网200及绝缘膜210来制造带形态的具有优异可挠性的电磁波屏蔽片300。
参照图2，本发明的柔性电磁波屏蔽片300具有如下优点，即，由于具有优异的弯曲特性(即，可挠性)，因此可将电子设备的电磁波产生部360完全包围并封装，从而可提高电磁波屏蔽效率。
即，在电子设备包括印刷电路板350以及安装在上述印刷电路板350的如AP(Application Processor)的电磁波产生部360的情况下，将电磁波产生部360用本发明的柔性电磁波屏蔽片300来包围并与印刷电路板350相结合(或粘接)封装。
其中，在柔性电磁波屏蔽片300的金属层205及压敏性粘结带100的导电性粘结层131、132与接地(GND)相连接的情况下，流入于压敏性粘结带100的电磁波流出到接地(GND)，传递到金属层205的电磁波也流出到接地(GND)。
如上所述，柔性电磁波屏蔽片的压敏性粘结带100可屏蔽由电磁波产生部360产生的电磁波，或者可屏蔽从外部流入到电磁波产生部360的电磁波。
并且，本发明具有如下优点，即，由于柔性电磁波屏蔽片300包括具有优异导电性的纤维聚集型基材110内部的气孔及表面形成有导电性粘结层131、132的压敏性粘结带100，因此可以以优异的通电性能来提高电磁波屏蔽效率。
因此，从电磁波产生部360发射的电磁波被柔性电磁波屏蔽片300屏蔽而不会泄漏到外部，并且，从外部流入的电磁波也被柔性电磁波屏蔽片300屏蔽，使得电磁波屏蔽性能增大。
因此，本发明具有如下优点，即，不仅用电磁波屏蔽片300包围电磁波产生部360来提高屏蔽效率，而且还可以在由于多个障碍物难以安装电磁波屏蔽片300的弯曲位置及需要弯曲的位置也能设置屏蔽片。
以下，将对应用于本发明的柔性电磁波屏蔽片的压敏性粘结带的技术特征进行说明。
参照图3，本发明的压敏性粘结带100包括：纤维聚集型基材110，由多个纤维111聚集而成，在上述多个纤维111之间形成有多个气孔；金属涂敷层(未图示)，涂敷在上述纤维聚集型基材110的多个纤维111外周面，使上述多个气孔的大小变小；以及导电性粘结层131、132，形成于形成有上述金属涂敷层的上述纤维聚集型基材110的一面或两面，由填充于因上述金属涂敷层而使大小变小的多个气孔的导电性粘结物质形成，通过所施加的压力被电连接。
纤维聚集型基材110为使纤维111聚集而成的纤维网片，其纤维网片通常包括由具有小于1μm的相对小的纤维直径的纤维形成的纳米纤维网或者由具有大于1μm的相对大的纤维直径的纤维所形成的无纺布网。
而且，纤维聚集型基材110由利用高分子物质进行电纺丝而得到的纤维111聚集而成。在此情况下，通过电纺丝而得到的纤维下落并聚集，则在纤维之间形成多个气孔。
金属涂敷层作为具有优异导电性的金属材质的涂敷层，可以使用镍、铜等。金属涂敷层可用化学镀工艺来形成。
导电性粘结层131、132由分散有导电性填料136(参照图4a)的粘结物质所形成，导电性填料136使用具有优异导电性的镍、铜、银(Ag)等的金属粉末、炭黑(carbon black)粉末、碳纳米管粉末及石墨烯(Graphene)粉末中的至少一种。
本发明具有如下优点，即，在纤维聚集型基材110的多个纤维111的外周面形成金属涂敷层，可将纤维聚集型基材110实现为具有优异导电性并可提高可挠性的基材。
而且，本发明的压敏性粘结带100由于在具有优异导电性的纤维聚集型基材110内部的气孔及表面形成导电性粘结层131、132，因此当对压敏性粘结带100施加压力后粘结于对象物时，随着通过施加的压力而实现导电性粘结层131、132的通电，从而可增加通电性能来提高电磁波屏蔽性能。
并且，优选地，在本发明中，形成有上述金属涂敷层的纤维聚集型基材110的厚度及上述导电性粘结层131、132的厚度之和T应小于30μm。即，本发明具有如下优点，由于压敏性粘结带100可以为具有小于30μm的厚度的超薄型结构，因此满足包括最新便携式终端的电子设备的规格，从而可有效屏蔽从电子设备的电磁波产生部360产生的电磁波。
根据本发明的压敏性粘结带100，由于金属涂敷层涂敷在纤维聚集型基材110的多个纤维111的外周面，在使纤维聚集型基材110具有导电性的状态下，导电性粘结层131、132形成在纤维聚集型基材110的一面或两面，使得在纤维聚集型基材110的多个气孔填充导电性粘结层131、132，从而具有通过施加压力而可进行通电的电磁波屏蔽功能。
图4a及图4b为用于说明本发明的压敏性粘结带的导电性粘结层在被施加压力前后的状态的示意图。如图4a所示，在对压敏性粘结带100施加压力之前，包括在压敏性粘结带100的导电性粘结层130的粘结物质层135内分散的多个导电性填料136以规定间隔d隔开。在对压敏性粘结带100施加压力后粘结于对象区域的情况下，如图4b所示，在导电性粘结层130的粘结物质层135内分散的多个导电性填料136通过压力施加而相互接触并电连接。
其中，与对象区域电连接，将压敏性粘结带100与接地(GND)相连接时，吸收由电磁波产生部360产生的电磁波并通过接地(GND)发射而屏蔽电磁波。
而且，图4a及图4b为用于说明本发明的包括在压敏性粘结带100的导电性粘结层130的特性的示意图，施加压力后的导电性粘结层130的厚度t2为施加压力之前的导电性粘结层130的厚度t1细微减小而成。
参照图5a及图5b，形成图3所示的纤维聚集型基材110的纤维111的外周面形成有金属涂敷层112、113、114。
其中，纤维聚集型基材110是由高分子物质的纤维聚集而成，具有电绝缘特性，但是在纤维111的外周面形成有金属涂敷层112、113、114的纤维聚积型基材110具有导电性。
而且，如图5a所示，可在纤维111的外周面形成有单层的金属涂敷层112，或者如图5b所示，可在纤维111的外周面形成有2层金属涂敷层，即，第一金属涂敷层113和第二金属涂敷层114。
参照图5b，2层的第一金属涂敷层113和第二金属涂敷层114用于在纤维111增加涂敷性及导电性，首先，将例如种子(seed)的镍质第一金属涂敷层113涂敷在纤维111的外周面，可在镍质第一金属涂敷层113的外周面涂敷具有优异导电性的铜质第二金属涂敷层114。
在此情况下，优选地，镍质第一金属涂敷层113的厚度t4小于铜质第二金属涂敷层114的厚度t5，单层的金属涂敷层112的厚度t3及2层的第一金属涂敷层113和第二金属涂敷层114的厚度t4+t5应在200～100nm的范围。
而且，在本发明中，金属涂敷层可形成多层结构，即，可包括：镍质第一金属涂敷层113，涂敷在纤维111的外周面；以及铜质第二金属涂敷层114，涂敷在上述镍质第一金属涂敷层113的外周面。
优选地，在上述纤维111的外周面形成单层的金属涂敷层112，或者通过化学镀工艺将镍质第一金属涂敷层113涂敷在纤维111的外周面，通过电解电镀法在镍质第一金属涂敷层113的外周面涂敷具有优异导电性的铜质第二金属涂敷层114。
优选地，这种纤维聚集型基材的纤维111的纤维直径d为100nm～5μm。
参照图6a至图6c，纤维聚集型基材110(参照图3)可单独使用由具有小于1μm的相对小的纤维直径的纤维所形成的纳米纤维网或者由具有大于1μm的相对大的纤维直径的纤维所形成的无纺布网115(参照图6a)。
并且，为了提高纤维聚集型基材110的强度并降低制造成本，使得在由具有大于1μm的相对大的纤维直径的纤维所形成的无纺布网115的一面(图6b)或两面(图6c)使通过电纺丝得到的高分子物质的纤维聚集而成的第一纳米纤维网116及第二纳米纤维网117相结合，或者可使用在无纺布网115的一面(图6b)或两面(图6c)接合单独制造的第一纳米纤维网116及第二纳米纤维网117的叠层结构。
参照图3及图7，对本发明的压敏性粘结带的制造方法进行说明，首先，通过使多个纤维111聚集来形成在上述多个纤维之间形成有多个气孔的纤维聚集型基材110(步骤S100)。
之后，通过在纤维聚集型基材110的多个纤维111的外周面涂敷金属来形成减小上述多个气孔的大小的金属涂敷层(步骤S110)。
接着，将导电性粘结物质填充到形成有上述金属涂敷层的纤维聚集型基材110的多个气孔中，形成于纤维聚集型基材110的一面或两面并可通过所施加的压力来电连接的导电性粘结层131、132(步骤S120)。
这种导电性粘结层可以通过浸涂(dip coating)、接合及电纺丝或电喷射方法来形成。
即，如图8a所示，通过在形成有金属涂敷层的纤维聚集型基材110浸涂导电性粘结物质来形成导电性粘结层130。
而且，通过接合方法来使得形成有金属涂敷层的纤维聚集型基材110和单独制造的导电粘结片130a与形成有金属涂敷层的纤维聚集型基材110接合(图8b)。
并且，如图8c所示，使用导电性粘结物质、混合有溶剂的纺丝溶液或喷射溶液并通过喷嘴11、12进行电纺丝或电喷射来使导电性粘结物质的纤维11a或液滴12a在形成有金属涂敷层的纤维聚集型基材110聚集，从而形成导电性粘结层130b。
以上，以特定优选实施例为例来示出并说明了本发明，但本发明不限定于上述的实施例，在不超出本发明的思想的范围内，可由本发明所属技术领域的普通技术人员实施多种变形及修改。
产业上的可利用性
本发明可应用于具有优异可挠性并可提高电磁波屏蔽效率的柔性电磁波屏蔽片。

Claims (14)

1.一种柔性电磁波屏蔽片，其特征在于，
包括：
压敏性粘结带(100)，具有导电性粘结层；
纤维网(200)，粘结于上述导电性粘结层，由纤维聚集而成；
金属层(205)，形成于上述纤维网的至少一面，用于屏蔽电磁波；以及
绝缘膜(210)，粘接于形成有上述金属层的纤维网，
上述压敏性粘结带包括：
纤维聚集型基材(110)，由多个纤维(111)聚集而成，并具有多个气孔，以完全包围上述多个纤维的外周面的方式形成有金属涂敷层；以及
上述导电性粘结层(131、132)，形成于上述纤维聚集型基材的两面，由填充于上述多个气孔的分散有导电性填料的导电性粘结物质形成，通过所施加的压力，上述导电性填料相接触来使上述导电性粘结层电连接，
上述导电性粘结物质通过浸涂形成于上述纤维聚集型基材的两面，部分填充于形成有上述金属涂敷层的上述纤维聚集型基材的多个气孔。
2.根据权利要求1所述的柔性电磁波屏蔽片，其特征在于，上述纤维网具有无气孔结构或微细气孔结构。
3.根据权利要求2所述的柔性电磁波屏蔽片，其特征在于，上述金属层形成于上述无气孔结构的纤维网的一面或两面。
4.根据权利要求2所述的柔性电磁波屏蔽片，其特征在于，上述金属层以超薄膜形态形成于上述微细气孔结构的纤维网的一面或两面，或者，在位于上述微细气孔结构的纤维网的微细气孔的内侧壁上的纤维的外周面涂敷金属，在纤维网的一面或两面形成超薄膜的金属层。
5.根据权利要求1所述的柔性电磁波屏蔽片，其特征在于，上述绝缘膜为由可挠性绝缘膜或纳米纤维聚集而成的纳米纤维网片。
6.根据权利要求1所述的柔性电磁波屏蔽片，其特征在于，上述压敏性粘结带的导电性粘结层及上述金属层接地。
7.根据权利要求6所述的柔性电磁波屏蔽片，其特征在于，上述压敏性粘结带包围电磁波产生部。
8.根据权利要求1所述的柔性电磁波屏蔽片，其特征在于，上述纤维聚集型基材为由纤维直径小于1μm的纤维所形成的纳米纤维网，或为由纤维直径大于1μm的纤维所形成的无纺布网。
9.根据权利要求1所述的柔性电磁波屏蔽片，其特征在于，
上述纤维聚集型基材呈在由纤维直径大于1μm的纤维所形成的无纺布网的一面或两面结合有由纤维直径小于1μm的纤维所形成的纳米纤维网的结构，
上述纳米纤维网由通过电纺丝得到的高分子物质的纤维在上述无纺布网的一面或两面聚集而成，或者，在上述无纺布网的一面或两面接合单独制造的纳米纤维网而成。
10.根据权利要求1所述的柔性电磁波屏蔽片，其特征在于，上述纤维的纤维直径为100nm～5μm。
11.根据权利要求1所述的柔性电磁波屏蔽片，其特征在于，形成上述纤维聚集型基材的多个纤维包括：
镍质第一金属涂敷层，涂敷于上述纤维的外周面；以及
铜质第二金属涂敷层，涂敷于上述镍质第一金属涂敷层的外周面。
12.根据权利要求1所述的柔性电磁波屏蔽片，其特征在于，上述压敏性粘结带的厚度小于30μm。
13.一种电子设备，其特征在于，包括：
印刷电路板；
电磁波产生部，安装在上述印刷电路板；以及
权利要求1所述的柔性电磁波屏蔽片，包围上述电磁波产生部，与上述印刷电路板相结合，来切断从上述电磁波产生部产生的电磁波及从外部向上述电磁波产生部流入的电磁波。
14.根据权利要求13所述的电子设备，其特征在于，上述压敏性粘结带的导电性粘结层及上述金属层接地。
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