JP2015065343A - シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法 - Google Patents

シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法 Download PDF

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Publication number
JP2015065343A
JP2015065343A JP2013198888A JP2013198888A JP2015065343A JP 2015065343 A JP2015065343 A JP 2015065343A JP 2013198888 A JP2013198888 A JP 2013198888A JP 2013198888 A JP2013198888 A JP 2013198888A JP 2015065343 A JP2015065343 A JP 2015065343A
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JP
Japan
Prior art keywords
shield
electronic circuit
shield container
circuit board
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013198888A
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English (en)
Japanese (ja)
Inventor
光司郎 生駒
Hikarishiro Ikoma
光司郎 生駒
裕貴 堀尾
Yuki Horio
裕貴 堀尾
眞次 芳野
Shinji Yoshino
眞次 芳野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP2013198888A priority Critical patent/JP2015065343A/ja
Priority to PCT/JP2014/074868 priority patent/WO2015046063A1/ja
Priority to CN201480061426.6A priority patent/CN105684566A/zh
Priority to KR1020167007880A priority patent/KR20160060651A/ko
Priority to TW103133080A priority patent/TW201526780A/zh
Publication of JP2015065343A publication Critical patent/JP2015065343A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2013198888A 2013-09-25 2013-09-25 シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法 Pending JP2015065343A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013198888A JP2015065343A (ja) 2013-09-25 2013-09-25 シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法
PCT/JP2014/074868 WO2015046063A1 (ja) 2013-09-25 2014-09-19 シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法
CN201480061426.6A CN105684566A (zh) 2013-09-25 2014-09-19 屏蔽壳体、印刷线路板、电子设备及屏蔽壳体的制作方法
KR1020167007880A KR20160060651A (ko) 2013-09-25 2014-09-19 차폐 수용체, 프린트 회로판, 전자 기기, 및 차폐 수용체의 제조 방법
TW103133080A TW201526780A (zh) 2013-09-25 2014-09-24 屏蔽容納體、印刷電路板、電子設備及屏蔽容納體之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013198888A JP2015065343A (ja) 2013-09-25 2013-09-25 シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法

Publications (1)

Publication Number Publication Date
JP2015065343A true JP2015065343A (ja) 2015-04-09

Family

ID=52743200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013198888A Pending JP2015065343A (ja) 2013-09-25 2013-09-25 シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法

Country Status (5)

Country Link
JP (1) JP2015065343A (ko)
KR (1) KR20160060651A (ko)
CN (1) CN105684566A (ko)
TW (1) TW201526780A (ko)
WO (1) WO2015046063A1 (ko)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104837327A (zh) * 2015-05-21 2015-08-12 小米科技有限责任公司 电路保护结构及电子装置
JP6098692B1 (ja) * 2015-10-19 2017-03-22 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP2017059708A (ja) * 2015-09-17 2017-03-23 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
KR101746289B1 (ko) * 2015-10-15 2017-06-13 주식회사 포콘스 내외부절연필름이 구비된 쉴드캔 및 그 제조방법
WO2017164415A1 (ja) * 2016-03-25 2017-09-28 タツタ電線株式会社 導電性補強部材、フレキシブルプリント配線板、及び、フレキシブルプリント配線板の製造方法
US20170325365A1 (en) 2016-05-04 2017-11-09 Samsung Electronics Co., Ltd. Hollow shielding structure for different types of circuit elements and manufacturing method thereof
WO2017209427A1 (ko) * 2016-05-30 2017-12-07 주식회사 아모그린텍 플렉시블 전자파 차폐시트 및 그를 구비한 전자기기
JP2018530904A (ja) * 2015-07-29 2018-10-18 ビューラー モーター ゲゼルシャフト ミット ベシュレンクテル ハフツング プリント回路基板配置、この種のプリント回路基板配置を有するオイルポンプ、プリント回路基板配置の使用及び形成方法
US10201072B2 (en) 2016-12-12 2019-02-05 Samsung Electronics Co., Ltd. EMI shielding structure and manufacturing method thereof
KR102015896B1 (ko) * 2019-05-21 2019-10-21 주식회사 유경하이테크 쉴드방열캔
US10477687B2 (en) 2016-08-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method for EMI shielding structure
US10531599B2 (en) 2017-09-08 2020-01-07 Samsung Electronics Co., Ltd. Electromagnetic interference shielding structure
US10566293B2 (en) 2015-03-06 2020-02-18 Samsung Electronics Co., Ltd. Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
US10594020B2 (en) 2017-07-19 2020-03-17 Samsung Electronics Co., Ltd. Electronic device having antenna element and method for manufacturing the same
US11013155B2 (en) 2018-01-30 2021-05-18 Samsung Electronics Co., Ltd. Electromagnetic wave shielding structure and manufacturing method therefor

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KR20170136063A (ko) * 2016-05-30 2017-12-11 주식회사 아모그린텍 초박형 전자파 차폐시트 및 그를 구비한 전자기기
FR3062982B1 (fr) * 2017-02-13 2019-04-19 Commissariat A L'energie Atomique Et Aux Energies Alternatives Structure de blindage electromagnetique pour cartes electroniques
FR3062981A1 (fr) * 2017-02-13 2018-08-17 Commissariat Energie Atomique Structure de blindage electromagnetique pour cartes electroniques
CN108541205B (zh) * 2017-03-01 2020-05-22 庆鼎精密电子（淮安）有限公司 电磁屏蔽罩及其制作方法
CN207070595U (zh) * 2017-08-16 2018-03-02 苏州城邦达力材料科技有限公司 电磁屏蔽膜的导电层及电磁屏蔽膜
CN107325747A (zh) * 2017-08-29 2017-11-07 德阳力久云智知识产权运营有限公司 一种电磁屏蔽胶带
CN108495491A (zh) * 2018-03-06 2018-09-04 广州金升阳科技有限公司 一种电源外壳
KR102567412B1 (ko) 2018-10-31 2023-08-16 삼성전자주식회사 복수의 레이어를 포함하는 차폐 필름 및 그것을 사용하는 전자 장치
TWI768213B (zh) * 2018-11-08 2022-06-21 日商拓自達電線股份有限公司 電磁波屏蔽膜、電磁波屏蔽膜之製造方法及屏蔽印刷配線板之製造方法

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JPS61276399A (ja) * 1985-05-31 1986-12-06 藤倉ゴム工業株式会社 電磁波遮蔽用可撓性転写フイルムの製造方法
JP2004511107A (ja) * 2000-10-06 2004-04-08 ストルク・プリンツ・ベー・ベー 干渉放射線に対して遮蔽された印刷回路基板の製造方法
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JP2005064266A (ja) * 2003-08-13 2005-03-10 Murata Mfg Co Ltd 電磁波シールドシートおよび電子機器
JP2006032845A (ja) * 2004-07-21 2006-02-02 Tdk Corp 透明シールドケース及びその製造方法並びに遊技機
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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10566293B2 (en) 2015-03-06 2020-02-18 Samsung Electronics Co., Ltd. Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
CN104837327A (zh) * 2015-05-21 2015-08-12 小米科技有限责任公司 电路保护结构及电子装置
JP2018530904A (ja) * 2015-07-29 2018-10-18 ビューラー モーター ゲゼルシャフト ミット ベシュレンクテル ハフツング プリント回路基板配置、この種のプリント回路基板配置を有するオイルポンプ、プリント回路基板配置の使用及び形成方法
JP2017059708A (ja) * 2015-09-17 2017-03-23 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
KR101746289B1 (ko) * 2015-10-15 2017-06-13 주식회사 포콘스 내외부절연필름이 구비된 쉴드캔 및 그 제조방법
JP6098692B1 (ja) * 2015-10-19 2017-03-22 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP2017079218A (ja) * 2015-10-19 2017-04-27 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
WO2017164415A1 (ja) * 2016-03-25 2017-09-28 タツタ電線株式会社 導電性補強部材、フレキシブルプリント配線板、及び、フレキシブルプリント配線板の製造方法
JP2020205442A (ja) * 2016-03-25 2020-12-24 タツタ電線株式会社 導電性補強部材、フレキシブルプリント配線板、及び、フレキシブルプリント配線板の製造方法
JPWO2017164415A1 (ja) * 2016-03-25 2019-01-31 タツタ電線株式会社 導電性補強部材、フレキシブルプリント配線板、及び、フレキシブルプリント配線板の製造方法
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