TW201337839A - 用於晶圓檢測之分段處理 - Google Patents
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Abstract
本發明提供用於晶圓檢測之像素分段處理之方法及系統。一方法包含:基於藉由一檢測系統針對一晶圓獲取之一影像中之個別像素之一特性而判定該等個別像素之一統計量。該方法亦包含基於該統計量指派該等個別像素至第一段。此外,該方法包含:在該等第一段之一影像中偵測該等第一段之間之一或多個邊緣;及藉由跨對應於該晶圓之該影像之一區域投影該一或多個邊緣而產生一邊緣映像。該方法進一步包含藉由將該等第一段及該邊緣映像施加至該晶圓之該影像而指派該等個別像素至第二段,藉此對該影像分段處理。基於該等個別像素經指派至之該等第二段而執行缺陷偵測。
Description
本發明大體上係關於對一晶圓之一影像中之像素分段處理以進行缺陷偵測。
以下描述及實例並非由於包含於此章節中而被認為係先前技術。
晶圓檢測(使用光學或電子束技術)係用於在半導體工業中調試半導體製造程序、監測程序變動及改善生產良率之一重要技術。隨著現代積體電路(IC)之規模不斷降低以及製造程序之複雜性日益增加,檢測變得愈加困難。
在對一半導體晶圓執行之每一處理步驟中,將相同電路圖案印刷在晶圓上之各晶粒內。大多數晶圓檢測系統利用此事實且使用一相對簡單晶粒對晶粒比較以偵測晶圓上之缺陷。然而,各晶粒內之印刷電路可包含在x或y方向上重複之圖案化特徵之許多區域,諸如DRAM、SRAM或FLASH之區域。此類型之區域通常稱作為陣列區域(其餘區域稱作隨機區域或邏輯區域)。為達成更佳靈敏度,先進檢測系統採用不同策略以檢測陣列區域及隨機區域或邏輯區域。
強度可用作為分段處理之一特徵以將類似強度像素集合在一起。接著,將相同組缺陷偵測參數施加至在相同組(基於強度)中之全部像素。然而,此方法具有若干缺點。舉例而言,當一幾何特徵均勻
分散時可使用基於強度分段處理演算法。然而,此常常並不足夠。舉例而言,在基於強度或基於強度總和之分段處理中,可將一晶圓影像分段處理成一安靜陣列段、一雜訊分頁段及一雜訊交叉段。然而,若將一安靜段誤分類為一雜訊段,則可遺漏安靜段中之所關注之缺陷(DOI)。當段之間之相同切割線在訓練及運行時間中導致不同分段處理時可誤分類段。段之此誤分類對影像之任何預處理(諸如,移除分頁區域中之週期性圖案)亦可係不利的。因而,在運行時間期間,純粹基於強度或強度總和之分段處理易於遭受與強度隨工件變動相關之不穩定性。因此,需要基於其他性質之分段處理。
用於對暗視場(DF)檢測系統之輸出分段處理之另一種方法係基於投影之分段處理(PBS)。PBS提供一相對簡單方式以基於x或y方向上之相對投影強度分離區域中之分段處理。大部分時間,PBS方法運作良好。然而,因PBS係用於DF晶圓檢測演算法之預處理部分中,所以存在PBS分段處理結果沿著下伏實體結構圖案波動之情形,此使得基於投影分段處理不穩定。直接結果係將一些安靜段誤分段處理為雜訊段且反之亦然。影響係引起缺陷偵測對局部雜訊具有更小適應性。
一種用於對暗視場檢測系統之輸出分段處理之額外方法係基於中值強度之分段處理(MBS)。因為大部分時間陣列區域與分頁區域之間之中值強度差係大的,所以MBS比PBS更穩定,此提供陣列與分頁之間之更易分離。然而,來自MBS之段邊界可係不規則的,其可能無法與下伏實體結構圖案極佳地相關聯。
相應地,開發不具有上述缺點之一或多者之對一晶圓之一影像中之像素分段處理以進行缺陷偵測之方法及系統將係有利的。
對各種實施例之以下描述絕不應理解為限制隨附申請專利範圍之標的。
一實施例係關於一種對一晶圓之一影像中之像素分段處理以進行缺陷偵測之電腦實施方法。該方法包含基於藉由一檢測系統針對一晶圓而獲取之一影像中之個別像素之一特性而判定該等個別像素之一統計量。該方法亦包含:基於統計量將個別像素指派至第一段;及在第一段之一影像中偵測該等第一段之間之一或多個邊緣。此外,該方法包含藉由跨對應於該晶圓之影像之一區域投影一或多個邊緣而產生一邊緣映像。該方法進一步包含藉由施加該等第一段及該邊緣映像至該晶圓之影像而將該等個別像素指派至第二段,藉此對影像分段處理。缺陷偵測係基於個別像素經指派至之第二段而執行。該方法之步驟係藉由一電腦系統執行。
可如本文進一步描述般執行上述電腦實施方法之每一步驟。上述電腦實施方法可包含本文描述之(若干)任何其他方法之(若干)任何其他步驟。上述電腦實施方法可使用本文描述之任何系統執行。
另一實施例係關於一種非暫時性電腦可讀媒體,其儲存可在一電腦系統上執行以執行對一晶圓之一影像中之像素分段處理以進行缺陷偵測之一方法之程式指令。該方法包含上述電腦實施方法之步驟。可如本文描述般進一步組態電腦可讀媒體。可如本文進一步描述般執行該方法之步驟。此外,程式指令可執行之方法可包含本文描述之(若干)任何其他方法之(若干)任何其他步驟。
一額外實施例係關於一種經組態以對一晶圓之一影像中之像素分段處理以進行缺陷偵測之系統。該系統包含經組態以產生一晶圓之一影像之一檢測子系統。該系統亦包含經組態用於執行上述方法之步驟之一電腦子系統。可如本文描述般進一步組態該系統。
10‧‧‧影像/中值影像
12‧‧‧第一段
14‧‧‧第一段
16‧‧‧影像
18‧‧‧黑色區域
20‧‧‧白色區域
22‧‧‧垂直邊緣
24‧‧‧垂直邊緣
26‧‧‧水平軸
28‧‧‧水平邊緣
30‧‧‧垂直軸
32‧‧‧邊緣映像
34‧‧‧影像
36‧‧‧電腦可讀媒體
38‧‧‧程式指令
40‧‧‧電腦系統
42‧‧‧系統
44‧‧‧檢測子系統
46‧‧‧電腦子系統
48‧‧‧光源
50‧‧‧偏光組件
52‧‧‧晶圓
54‧‧‧透鏡
56‧‧‧偏光組件
58‧‧‧偵測器
60‧‧‧透鏡
62‧‧‧偏光組件
64‧‧‧偵測器
圖1係圖解說明對一晶圓之一影像中之像素分段處理以進行缺陷偵測之一電腦實施方法之一實施例之一示意圖;
圖2係圖解說明一非暫時性電腦可讀媒體(其包含可在一電腦系統上執行以執行本文描述之方法實施例之一或多者之程式指令)之一實施例之一方塊圖;及圖3係圖解說明經組態以對一晶圓之一影像中之像素分段處理以進行缺陷偵測之一系統之一實施例之一側視圖之一示意圖。
在閱讀以下詳細描述及參考附圖之後,將明白本發明之其他目的及優點。
雖然本發明易於以各種修改及替代形式呈現,但其特定實施例係憑藉圖式中之實例展示且將在本文中詳細描述。然而,應瞭解,圖式及其詳細描述並不旨在將本發明限制於所揭示之特定形式,恰相反,本發明將涵蓋落於如藉由隨附申請專利範圍所界定之本發明精神及範疇中之全部修改、等效物及替代物。
現參考圖式,應注意,該等圖並未按比例繪製。特定言之,極大地放大圖中一些元件之規模以強調該等元件之特性。亦應注意,該等圖並未按相同比例繪製。已使用相同參考符號指示在一個以上圖中展示之可經類似組態之元件。
一實施例係關於一種對一晶圓之一影像中之像素分段處理以進行缺陷偵測之電腦實施方法。該電腦實施方法可包含獲取藉由一檢測系統產生之一晶圓之一影像。獲取該晶圓之影像可使用檢測系統執行。舉例而言,獲取該影像可包含使用檢測系統以掃描晶圓上方之光且在掃描期間回應於自藉由檢測系統偵測之晶圓散射及/或反射之光而產生(若干)影像。以此方式,獲取該影像可包含掃描該晶圓。然而,獲取該影像不必包含掃描該晶圓。舉例而言,獲取該影像可包含自其中已儲存影像之一電腦可讀儲存媒體獲取影像(例如,藉由檢測系統)。自儲存媒體獲取影像可以任何適當方式執行,且儲存媒體(自
其獲取影像)可包含本文描述之任何儲存媒體。儘管在本文描述之一些實施例中,針對晶圓獲取之影像可稱作或描述為一「影像圖框」,然本文描述之實施例中所使用之晶圓影像可包含可藉由任何晶圓檢測系統產生或獲取之任何影像或任何影像之部分。
該方法包含基於藉由一檢測系統針對一晶圓獲取之一影像中之個別像素之一特性而判定個別像素之一統計量。在一實施例中,特性係個別像素之影像強度。在一些實施例中,統計量係個別像素之中值影像強度。以此方式,該方法可包含在逐像素基礎上判定個別像素之各者之一統計量,即使任一像素之統計量可使用影像中之多個像素之特性判定。舉例而言,一單一像素之中值強度可基於該像素之影像強度以及周圍像素之影像強度而判定。中值影像強度可使用任何適當方法或演算法判定。此外,特性及統計量可包含以任何適當方式判定之個別像素之任何其他適當特性及統計量。
該方法亦包含基於統計量指派個別像素至第一段。若統計量係中值影像強度(如上文描述),則此步驟可類似於基於中值強度之分段處理(MBS)。然而,本文描述之額外步驟有助於在MBS中更精確界定段邊界。「段」通常可界定為個別像素之可能值之一整個範圍之不同部分。段可取決於使用該等段之缺陷偵測演算法基於個別像素之統計量之值而界定。例如,在多個晶粒自動定限(MDAT)演算法中,用以界定第一段之個別像素之統計量之值可包含中值強度值。在一此闡釋性及非限制性實例中,若中值強度值之整個範圍係從0至255,則第一段之一者可包含從0至100之中值強度值且第一段之另一者可包含從101至255之中值強度值。以此方式,第一段之一者對應於影像中之較暗像素,且第一段之另一者對應於影像中之較亮像素。用於本文描述之實施例中之第一段可以任何適當方式判定,且個別像素可使用任何適當方法及/或演算法指派至第一段。
在一實施例中,該方法包含產生展示針對個別像素判定之統計量之一影像,且基於展示統計量之影像而執行指派個別像素至第一段。舉例而言,該方法可包含基於像素強度統計量(例如,基於中值強度、範圍等)標記晶圓之影像。此外,儘管一些實施例在本文描述為基於中值強度,然應瞭解,該等實施例可首先基於任何統計量且隨後執行如本文描述之邊緣偵測。在圖1中展示之一此實例中,該方法可根據個別像素產生展示針對個別像素之各者判定之統計量之影像10。若統計量係中值影像強度(如上文描述),則圖1中展示之影像10可係檢測系統之一通道(一偵測子系統或一偵測器)之一中值影像,且可針對檢測系統之其他通道個別地產生其他影像。
該影像接著可用於第一分段處理。舉例而言,在影像10中之第一段12可經界定以包含具有一範圍中之統計量之值之像素,且第一段14可經界定以包含具有不同於前一範圍之另一範圍中之統計量之值之像素。因此,影像中之像素可基於統計量分成若干第一段。指派像素至第一段不必包含產生如上文描述之一影像且將影像用於第一分段處理可以任何其他適當方式執行。
該方法亦包含在第一段之一影像中偵測第一段之間之一或多個邊緣。在一些實施例中,該方法包含藉由基於個別像素所指派至之第一段標記個別像素而產生第一段之影像。舉例而言,如圖1中所展示,第一段之影像16可藉由基於個別像素所指派至之第一段標記影像10之個別像素而產生。接著,可將邊緣偵測應用於標記影像。以此方式,MBS可應用於中值影像10以產生展示標記第一段之影像16。特定言之,因為影像16包含在兩個不同第一段(第一段12及第一段14)中之像素,所以影像16可係一二進制影像,其中第一段之一者(第一段12)展示為影像中之黑色區域18且第一段之另一者(第一段14)展示為影像中之白色區域20。接著,可將展示標記第一段之影像用作為用於本
文描述之其他步驟之一分段處理遮罩(例如,藉由使用針對晶圓獲取之一影像覆疊該遮罩使得在不同段內之像素可基於其等在遮罩內之位置加以識別)。展示第一段之影像亦可以任何其他適當方式(例如,經由色差、灰階差、文數字差及類似物)進行標記。接著可使用該影像以偵測第一段之(該等)邊緣,如本文進一步描述。
在一實施例中,一或多個邊緣包含在x方向上延伸之至少一邊緣、在y方向上延伸之至少一邊緣或在x方向上延伸之至少一邊緣與在y方向上延伸之至少一邊緣之一組合。舉例而言,邊緣偵測可包含水平邊緣偵測及/或垂直邊緣偵測。在一此實例中,對於一影像(諸如,上文描述之標記影像)中之每一像素(i,j),若(i,j-1)、(i,j+1)屬於不同段,則邊緣偵測可將1加至位於第i位置處之水平邊緣。此外,若(i-1,j)、(i+1,j)屬於不同段,則邊緣偵測可將1加至位於第j位置處之垂直邊緣。在圖1中展示之實例中,使用影像16,可偵測在y方向上延伸之兩個垂直邊緣22及24(相對於水平軸26)且可偵測在x方向上延伸之一水平邊緣28(相對於垂直軸30)。此係一相對簡單邊緣偵測方法,其可經微調用於任何特定應用、計算考量或費用。此外,邊緣偵測可以若干其他不同方式執行。
在一些實施例中,該方法包含在產生本文進一步描述之邊緣映像之前基於一或多個偵測邊緣之空間特性修改該一或多個偵測邊緣。此步驟可包含「修剪」冗餘邊緣。舉例而言,歸因於實體結構粗糙度及檢測系統解析度限制,一影像中之段之邊緣並非始終凈切。因此,邊緣偵測步驟可偵測實質上緊靠在一實際實體邊緣周圍之多個邊緣(冗餘邊緣)。因而,可使用(例如)一擴張演算法修改該一或多個偵測邊緣以將實質上彼此接近之邊緣合併(或減少)為一邊緣。擴張演算法可包含此項技術中已知之任何適當擴張演算法。
該方法亦包含藉由跨對應於晶圓之影像之一區域投影一或多個
邊緣而產生一邊緣映像。以此方式,本文描述之方法可基於邊緣資訊執行基於投影之分段處理(PBS)。舉例而言,如圖1中所展示,邊緣映像32可自圖1中所展示之水平及垂直邊緣(邊緣22、24、28)之邊緣投影產生為一柵格。投影一或多個邊緣可包含延伸經偵測且不跨整個影像延伸之任何邊緣使得其等跨整個影像延伸。換言之,投影(該等)邊緣可包含使一邊緣沿著其長度延伸使得其橫跨整個影像區域。
相較於基於強度之投影,基於一基於統計量(例如,基於中值強度)之段映像偵測邊緣且接著在x及/或y方向上投影(該等)邊緣可大大有助於減小(該等)邊緣之模糊度。因而,可使用此方法以對下伏結構圖案之圖框影像精確地分段處理。本文描述可對一段映像執行之邊緣偵測及基於邊緣映像之投影亦有利地穩定(相對於自用以形成晶圓之影像之晶圓偵測之光之任何強度變動)。舉例言之,對於執行x及y上之邊緣偵測,MBS段映像係穩定的。此外,基於x及y邊緣之投影比基於晶圓之影像之其他特性之邊緣投影更穩定。
該方法亦包含藉由將第一段及邊緣映像施加至晶圓之影像而指派個別像素至第二段,藉此對影像分段處理。因此,本文描述之實施例可基於邊緣而對圖框影像分段處理(或標記)。該方法可基於影像強度(用以界定施加至影像之第一段)及強度改變型樣(用以界定施加至影像之邊緣映像)之一組合對像素分段處理以對下伏結構精確地分段處理。舉例而言,即使具有相對較低影像強度之相對較薄垂直區域仍可使用本文描述之方法分段處理出。此外,對於重建段映像(用於第二段),本文描述在x及y上之邊緣投影實質上係穩定的。
在一實施例中,指派個別像素至第二段包含基於第一段及邊緣映像產生第二段及將第二段施加至個別像素。舉例而言,分段處理遮罩(或展示第一段之影像16)可與柵格(或展示邊緣之邊緣映像32)結合以產生圖1中之影像34中所展示之第二段群組。以此方式,此影像展
示第二段群組且可用作為如上文描述之一第二分段處理遮罩。然而,指派個別像素至第二段可以任何其他適當方式執行。
缺陷偵測係基於個別像素所指派至之第二段而執行。舉例而言,本文描述之實施例可用作為(若干)預處理方法以將區域分成不同段,但其等本身並非一檢測或缺陷偵測演算法。本文描述之實施例可用於針對任何檢測演算法之預處理。以此方式,可使用任何適當方法及/或演算法以任何適當方式執行缺陷偵測。
該方法之步驟係藉由可如本文進一步描述般組態之一電腦系統執行。
在一實施例中,指派個別像素至第一段導致具有不同雜訊位準之個別像素指派至不同第一段。舉例而言,本文描述之方法基本上以矩形定界框之形式使低強度段與高強度段分段。因此,本文描述之方法本質上使相對較低雜訊段與相對較高雜訊段分離,且接著在缺陷偵測期間可個別處理具有不同雜訊位準之段使得可無關於雜訊位準而在該等段之各者中偵測所關注之缺陷(DOI)(例如,藉由調整施加至像素之一臨限值),此亦抑制公害、雜訊及背景信號偵測。
在另一實施例中,第一段之至少一者對應於晶圓上含有具有一第一特性之結構之一區域,且第一段之至少另一者對應於晶圓上含有具有不同於第一特性之一第二特性之結構之一區域。舉例而言,因為具有不同特性之晶圓結構將以不同方式影響來自藉由檢測系統偵測之晶圓之光且因為第一段可基於關於晶圓之影像之一統計量(例如,中值影像強度)而界定,所以可使用第一段以分離晶圓之含有不同結構之不同區域。此外,因為第一段係基於個別像素之一特性之一統計量而非基於特性本身加以界定,所以可使用第一段以用相對較高精確度分離該等區域。
在一些實施例中,第二段之至少一者對應於晶圓上含有具有一
第一特性之結構之一區域,且第二段之至少另一者對應於晶圓上含有具有不同於第一特性之一第二特性之結構之一區域。舉例而言,因為第二段至少部分基於第一段且因為不同第一段可(如上文描述般)對應於含有具有不同特性之結構之不同區域,所以第二段亦可對應於含有具有不同特性之結構之不同區域。
在一實施例中,第一段之至少一者對應於製造於晶圓上之一裝置之一分頁區域且第一段之至少另一者對應於該裝置之一陣列區域。在此項技術中,分頁通常係定義為分離實體記憶體之實質上連續區域之一晶粒之區域。實體記憶體之連續區域之各者通常可稱作為一頁框。在一暗視場陣列區域內部,不存在實質特徵差且因此不存在實質強度差,僅存在一些背景雜訊。然而,因為分頁包含顯著不同於陣列區域之結構,所以相較於陣列區域,在針對分頁之影像中將存在實質強度差。因此,實施例可使一陣列段與一分頁段分離。如本文進一步描述,中值強度可係用以指派個別像素至第一段之個別像素之特性之統計量。使用本文描述之中值強度係有利的,因為對於根據強度差區分陣列與分頁,中值強度係穩定的。
在一些實施例中,第二段之至少一者對應於製造於晶圓上之一裝置之一分頁區域,且第二段之至少另一者對應於該裝置之一陣列區域。舉例而言,因為第二段係至少部分基於第一段且因為一些第一段可(如上文描述般)對應於分頁區域而其他第一段可對應於陣列區域,所以一些第二段亦可對應於分頁區域且其他第二段可對應於陣列區域。
在一實施例中,在藉由檢測系統掃描晶圓期間執行該方法。舉例而言,因為影像圖框係在掃描期間針對一晶圓而獲取,所以該方法可針對影像圖框之各者或至少一些者執行。以此方式,可在藉由一檢測系統之一電腦子系統(可如本文進一步描述般組態該電腦子系統)檢
測期間即時執行該方法。
在另一實施例中,晶圓之影像包含在藉由檢測系統掃描晶圓期間針對晶圓上之不同區域循序獲取之多個影像圖框之一者。舉例而言,當晶圓相對於檢測系統移動時,檢測系統之一偵測器或偵測子系統可擷取多個影像圖框,或反之亦然。因此,可在晶圓上之不同位置處獲取影像圖框。可針對任何或全部該等影像圖框執行本文描述之方法。舉例而言,在一此實施例中,針對該多個影像圖框之一個影像圖框執行該方法。以此方式,可在逐圖框基礎上針對各影像圖框獨立及個別地執行該方法。
在一些實施例中,晶圓之影像包含藉由檢測系統之多個偵測子系統針對晶圓上之一區域同時獲取之多個影像圖框之一者,且該方法包含藉由將第一段及邊緣映像施加至該多個影像圖框之至少另一者而指派該多個影像圖框之該至少另一者中之個別像素至第二段。舉例而言,對於相同工件,使用任一圖框影像產生之分段處理結果可跨檢測系統之其他偵測子系統(或「通道」)施加至影像圖框。以此方式,在一些例項中,針對藉由一通道產生之影像圖框判定之分段處理可應用於藉由另一通道產生之一影像圖框。
在一些實施例中,檢測系統係一暗視場檢測系統。因此,本文描述之實施例可用於可如本文進一步描述般組態之一暗視場檢測系統上之分段處理。此外,本文描述之實施例改良藉由一暗視場掃描檢測系統產生之晶圓影像之分段處理之精確度、穩定性及易用性。然而,本文描述之實施例並不專用於一特定晶圓或層或一特定檢測系統。舉例而言,該方法可用以對任何影像分段處理,無關於使用何種檢測系統獲取影像。
該方法亦可包含將該方法之(該等)步驟之任一者之結果儲存在一電腦可讀儲存媒體中。該等結果可包含本文描述之任何結果且可以此
項技術中已知之任何方式加以儲存。儲存媒體可包含此項技術中已知之任何適當儲存媒體。在結果已經儲存之後,該等結果可在儲存媒體中存取及如本文所描述般加以使用、經格式化以對一使用者顯示、藉由另一軟體模組、方法或系統使用等。
另一實施例係關於一種非暫時性電腦可讀媒體,其儲存可在一電腦系統上執行以執行對一晶圓之一影像中之像素分段處理以進行缺陷偵測之一方法(即,一電腦實施方法)之程式指令。圖2中展示一此實施例。例如,如圖2中所展示,電腦可讀媒體36儲存可在電腦系統40上執行以執行上述方法之程式指令38。程式指令可執行之電腦實施方法可包含本文描述之(若干)任何其他方法之(若干)任何其他步驟。
實施諸如本文描述之方法之程式指令38可儲存在電腦可讀媒體36上。電腦可讀媒體可係一儲存媒體,諸如一磁碟或光碟或一磁帶或此項技術中已知之任何其他適當非暫時性電腦可讀媒體。
程式指令可以各種方式之任一種實施,包含基於程序之技術、基於組件之技術及/或物件導向之技術等。舉例而言,程式指令可如所需般使用Matlab、Visual Basic、ActiveX controls、C、C++ objects、C#、JavaBeans、微軟基礎類別(「MFC」)或其他技術或方法論實施。
電腦系統40可採取各種形式,包含一個人電腦系統、大型電腦系統、工作站、系統電腦、影像電腦、可程式化影像電腦、並行處理器或此項技術中已知之任何其他裝置。通常,術語「電腦系統」可經廣泛定義以涵蓋具有一或多個處理器(其執行來自一記憶體媒體之指令)之任何裝置。
一額外實施例係關於一種經組態以對一晶圓之一影像中之像素分段處理以進行缺陷偵測之系統。圖3中展示此一系統之一實施例。如圖3中所展示,系統42包含檢測子系統44及電腦子系統46。檢測子
系統經組態以產生一晶圓之一影像。舉例而言,如圖3中所展示,檢測子系統包含光源48(諸如雷射)。光源48經組態以將光引導至偏光組件50。此外,檢測子系統可包含一個以上偏光組件(未展示),其等之各者可獨立定位於來自光源之光之路徑中。該等偏光組件之各者可經組態以依不同方式改變來自光源之光之偏光。檢測子系統可經組態以取決於在一掃描期間針對晶圓之照明所選擇之偏光設定而依任何適當方式將偏光組件移入及移出來自光源之光之路徑。在一掃描期間用於晶圓之照明之偏光設定可包含p-偏光(P)、s-偏光(S)或圓偏光(C)。
以一傾斜入射角(其可包含任何適當傾斜入射角)將離開偏光組件50之光引導至晶圓52。檢測子系統亦可包含一或多個光學組件(未展示),該一或多個光學組件經組態以將光自光源48引導至偏光組件50或自偏光組件50引導至晶圓52。光學組件可包含此項技術中已知之任何適當光學組件,諸如(但不限於)一反射光學組件。此外,光源、偏光組件及/或一或多個光學組件可經組態以依一或多個入射角(例如,一傾斜入射角及/或一實質上法線入射角)將光引導至晶圓。檢測子系統可經組態以依任何方式藉由掃描晶圓上方之光而執行掃描。
在掃描期間可藉由檢測子系統之多個通道收集並偵測自晶圓52散射之光。舉例而言,可藉由透鏡54收集以相對接近法線之角度自晶圓52散射之光。如圖3中所展示,透鏡54可包含一折射光學元件。此外,透鏡54可包含一或多個折射光學元件及/或一或多個反射光學元件。藉由透鏡54收集之光可經引導至偏光組件56,偏光組件56可包含此項技術中已知之任何適當偏光組件。此外,檢測子系統可包含一個以上偏光組件(未展示),其等之各者可獨立定位於藉由透鏡所收集之光之路徑中。偏光組件之各者可經組態以依一不同方式改變藉由透鏡所收集之光之偏光。檢測子系統可經組態以取決於在掃描期間經選擇用於藉由透鏡54收集之光之偵測之偏光設定而依任何適當方式將偏光
組件移入及移出藉由透鏡所收集之光之路徑。在掃描期間用於藉由透鏡54收集之光之偵測之偏光設定可包含本文描述之偏光設定(例如,P、S及非偏光(N))之任一者。
將離開偏光組件56之光引導至偵測器58。偵測器58可包含此項技術中已知之任何適當偵測器,諸如一電荷耦合裝置(CCD)或另一類型之成像偵測器。偵測器58經組態以產生一影像,該影像回應於藉由透鏡54收集且藉由偏光組件56(若定位於所收集之散射光之路徑中)透射之散射光。因此,透鏡54、偏光組件56(若定位於藉由透鏡54收集之光之路徑中)及偵測器58形成檢測子系統之一通道。檢測子系統之此通道可包含此項技術中已知之任何其他適當光學組件((未展示),諸如,Fourier濾波組件。
可藉由透鏡60收集以不同角度自晶圓52散射之光。可如上文所描述般組態透鏡60。可將藉由透鏡60收集之光引導至偏光組件62,偏光組件62可包含此項技術中已知之任何適當偏光組件。此外,檢測子系統可包含一個以上偏光組件(未展示),其等之各者可獨立定位於藉由透鏡收集之光之路徑中。偏光組件之各者可經組態以依一不同方式改變藉由透鏡收集之光之偏光。檢測子系統可經組態以取決於在掃描期間經選擇用於藉由透鏡60收集之光之偵測之偏光設定而依任何適當方式將偏光組件移入及移出藉由透鏡收集之光之路徑。在掃描期間用於藉由透鏡60收集之光之偵測之偏光設定可包含P、S或N。
將離開偏光組件62之光引導至偵測器64,可如上文所描述般組態偵測器64。偵測器64亦經組態以產生一影像,該影像回應於通過偏光組件62(若定位於散射光之路徑中)之所收集之散射光。因此,透鏡60、偏光組件62(若定位於藉由透鏡60收集之光之路徑中)及偵測器64可形成檢測子系統之另一通道。此通道亦可包含上述任何其他光學組件(未展示)。在一些實施例中,透鏡60可經組態以收集以自約20度至
約70度之極角自晶圓散射之光。此外,透鏡60可組態為一反射光學組件(未展示),其經組態以收集以約360度之方位角自晶圓散射之光。
圖3中所展示之檢測子系統亦可包含一或多個其他通道(未展示)。舉例而言,檢測子系統可包含組態為一側通道之一額外通道,該額外通道可包含本文描述之任何光學組件,諸如一透鏡、一或多個偏光組件及一偵測器。可如本文描述般進一步組態該透鏡、該一或多個偏光組件及該偵測器。在一此實例中,側通道可經組態以收集及偵測自入射平面散射之光(例如,側通道可包含在實質上垂直於入射平面之一平面中居中之一透鏡及經組態以偵測藉由透鏡收集之光之一偵測器)。
電腦子系統46經組態以獲取藉由檢測子系統產生之(若干)影像。舉例而言,在掃描期間藉由偵測器產生之(若干)影像可提供至電腦子系統46。特定言之,電腦子系統可耦合至偵測器之各者(例如,藉由憑藉圖3中之虛線展示之一或多個傳輸媒體,其可包含此項技術中已知之任何適當傳輸媒體)使得電腦子系統可接收藉由偵測器產生之(若干)影像。電腦子系統可以任何適當方式耦合至偵測器之各者。在晶圓掃描期間藉由偵測器產生之(若干)影像可包含本文描述之(若干)影像之任一者。
電腦子系統經組態用於執行本文描述之方法之步驟。電腦子系統亦可經組態以執行本文描述之(若干)任何方法實施例之(若干)任何其他步驟。可如本文所描述般進一步組態電腦子系統、檢測子系統及系統。
應注意,本文提供圖3以大體上圖解說明可包含在本文描述之系統實施例中之一檢測子系統之一組態。顯然,如在設計一商業檢測系統時通常所執行般,可改變本文描述之檢測子系統組態以最佳化檢測子系統之效能。此外,本文描述之系統可使用一現有檢測系統(例
如,藉由將本文描述之功能性添加至一現有檢測系統)實施,諸如商業上可購自加利福尼亞州,米爾皮塔斯市,KLA-Tencor之Puma 90xx、91xx及93xx系列之工具。對於一些此等系統,本文描述之方法可提供為系統之選用功能性(例如,除系統之其他功能性之外)。或者,本文描述之系統可「從頭開始」設計以提供一全新系統。
鑒於此描述,熟習此項技術者將明白本發明之各種態樣之進一步修改及替代性實施例。舉例而言,提供用於對一晶圓之一影像中之像素分段處理以進行缺陷偵測之方法及系統。因此,此描述應僅理解為闡釋性且用於向熟習此項技術者教示實行本發明之一般方式之目的。應瞭解,本文展示及描述之本發明之形式應視作為當前較佳實施例。如熟習此項技術者在受益於本發明之此描述之後將明白般,元件及材料可取代本文所圖解說明及描述之該等元件及材料,可反轉部件及程序,且可獨立利用本發明之某些特徵。在不脫離如以下申請專利範圍中所描述之本發明之精神及範疇之情況下,可對本文描述之元件作出改變。
10‧‧‧影像/中值影像
12‧‧‧第一段
14‧‧‧第一段
16‧‧‧影像
18‧‧‧黑色區域
20‧‧‧白色區域
22‧‧‧垂直邊緣
24‧‧‧垂直邊緣
26‧‧‧水平軸
28‧‧‧水平邊緣
30‧‧‧垂直軸
32‧‧‧邊緣映像
34‧‧‧影像
Claims (20)
- 一種用於對一晶圓之一影像中之像素分段處理以進行缺陷偵測之電腦實施方法,其包括:基於藉由一檢測系統針對一晶圓獲取之一影像中之個別像素之一特性判定該等個別像素之一統計量;基於該統計量指派該等個別像素至第一段;在該等第一段之一影像中偵測該等第一段之間之一或多個邊緣;藉由跨對應於該晶圓之該影像之一區域投影該一或多個邊緣而產生一邊緣映像;及藉由將該等第一段及該邊緣映像施加至該晶圓之該影像而指派該等個別像素至第二段,藉此對該影像分段處理,其中基於該等個別像素經指派至之該等第二段而執行缺陷偵測,且其中藉由一電腦系統執行該方法之步驟。
- 如請求項1之方法,其中該特性係該等個別像素之影像強度。
- 如請求項1之方法,其中該統計量係該等個別像素之中值影像強度。
- 如請求項1之方法,其進一步包括產生展示針對該等個別像素判定之該統計量之一影像,其中指派該等個別像素至該等第一段係基於展示該統計量之該影像而執行。
- 如請求項1之方法,其進一步包括藉由基於該等個別像素經指派至之該等第一段標記該等個別像素而產生該等第一段之該影像。
- 如請求項1之方法,其中該一或多個邊緣包括在x方向上延伸之至少一邊緣、在y方向上延伸之至少一邊緣或在x方向上延伸之 至少一邊緣與在y方向上延伸之至少一邊緣之一組合。
- 如請求項1之方法,其進一步包括在該產生之前基於該一或多個偵測邊緣之空間特性修改該一或多個偵測邊緣。
- 如請求項1之方法,其中指派該等個別像素至該等第二段包括基於該等第一段及該邊緣映像產生該等第二段及將該等第二段施加至該等個別像素。
- 如請求項1之方法,其中指派該等個別像素至該等第一段導致具有不同雜訊位準之該等個別像素指派至不同第一段。
- 如請求項1之方法,其中該等第一段之至少一者對應於該晶圓上含有具有一第一特性之結構之一區域,且其中該等第一段之至少另一者對應於該晶圓上含有具有不同於該第一特性之一第二特性之結構之一區域。
- 如請求項1之方法,其中該等第二段之至少一者對應於該晶圓上含有具有一第一特性之結構之一區域,且其中該等第二段之至少另一者對應於該晶圓上含有具有不同於該第一特性之一第二特性之結構之一區域。
- 如請求項1之方法,其中該等第一段之至少一者對應於製造於該晶圓上之一裝置之一分頁區域,且其中該等第一段之至少另一者對應於該裝置之一陣列區域。
- 如請求項1之方法,其中該等第二段之至少一者對應於製造於該晶圓上之一裝置之一分頁區域,且其中該等第二段之至少另一者對應於該裝置之一陣列區域。
- 如請求項1之方法,其中該方法係在藉由該檢測系統掃描該晶圓期間執行。
- 如請求項1之方法,其中該晶圓之該影像包括在藉由該檢測系統掃描該晶圓期間針對該晶圓上之不同區域循序獲取之多個影像 圖框之一者。
- 如請求項1之方法,其中該晶圓之該影像包括在藉由該檢測系統掃描該晶圓期間針對該晶圓上之不同區域循序獲取之多個影像圖框之一者,且其中針對該多個影像圖框之一個以上影像圖框執行該方法。
- 如請求項1之方法,其中該晶圓之該影像包括藉由該檢測系統之多個偵測子系統針對該晶圓上之一區域同時獲取之多個影像圖框之一者,且其中該方法進一步包括藉由將該等第一段及該邊緣映像施加至該多個影像圖框之至少另一者而指派該多個影像圖框中之該至少另一者中之個別像素至該等第二段。
- 如請求項1之方法,其中該檢測系統係一暗視場檢測系統。
- 一種非暫時性電腦可讀媒體,其儲存可在一電腦系統上執行以執行對一晶圓之一影像中之像素分段處理以進行缺陷偵測之一方法之程式指令,其中該方法包括:基於藉由一檢測系統針對一晶圓獲取之一影像中之個別像素之一特性判定該等個別像素之一統計量;基於該統計量指派該等個別像素至第一段;在該等第一段之一影像中偵測該等第一段之間一或多個邊緣;藉由跨對應於該晶圓之該影像之一區域投影該一或多個邊緣產生一邊緣映像;及藉由將該等第一段及該邊緣映像施加至該晶圓之該影像而指派該等個別像素至第二段,藉此對該影像分段處理,其中基於該等個別像素經指派至之該等第二段而執行缺陷偵測。
- 一種經組態以對一晶圓之一影像中之像素分段處理以進行缺陷偵測之系統,其包括: 一檢測子系統,其經組態以產生一晶圓之一影像;及一電腦子系統,其經組態以:基於該晶圓之該影像中之個別像素之一特性判定該等個別像素之一統計量;基於該統計量指派該等個別像素至第一段;在該等第一段之一影像中偵測該等第一段之間之一或多個邊緣;藉由跨對應於該晶圓之該影像之一區域投影該一或多個邊緣而產生一邊緣映像;及藉由將該等第一段及該邊緣映像施加至該晶圓之該影像而指派該等個別像素至第二段,藉此對該影像分段處理,其中基於該等個別像素經指派至之該等第二段而執行缺陷偵測。
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- 2013-01-17 WO PCT/US2013/021940 patent/WO2013109755A1/en active Application Filing
- 2013-01-17 KR KR1020147023290A patent/KR102009494B1/ko active IP Right Grant
- 2013-01-17 DE DE112013000627.8T patent/DE112013000627T5/de active Pending
- 2013-01-17 JP JP2014553408A patent/JP2015511310A/ja active Pending
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TWI493177B (zh) * | 2013-10-15 | 2015-07-21 | Benq Materials Corp | 一種檢測具週期性結構光學薄膜的瑕疵檢測方法及其檢測裝置 |
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TWI562098B (en) | 2016-12-11 |
US20130188859A1 (en) | 2013-07-25 |
KR102009494B1 (ko) | 2019-08-12 |
KR20140116946A (ko) | 2014-10-06 |
US8831334B2 (en) | 2014-09-09 |
WO2013109755A1 (en) | 2013-07-25 |
JP2015511310A (ja) | 2015-04-16 |
DE112013000627T5 (de) | 2014-10-09 |
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