TW201317596A - 用於掃描鏈之動態時脈域旁路 - Google Patents

用於掃描鏈之動態時脈域旁路 Download PDF

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Publication number
TW201317596A
TW201317596A TW101118239A TW101118239A TW201317596A TW 201317596 A TW201317596 A TW 201317596A TW 101118239 A TW101118239 A TW 101118239A TW 101118239 A TW101118239 A TW 101118239A TW 201317596 A TW201317596 A TW 201317596A
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TW
Taiwan
Prior art keywords
scan
bypass
chains
sub
test
Prior art date
Application number
TW101118239A
Other languages
English (en)
Chinese (zh)
Inventor
Ramesh C Tekumalla
Priyesh Kumar
Original Assignee
Lsi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lsi Corp filed Critical Lsi Corp
Publication of TW201317596A publication Critical patent/TW201317596A/zh

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/3185Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318558Addressing or selecting of subparts of the device under test
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/3185Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318594Timing aspects

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW101118239A 2011-10-25 2012-05-22 用於掃描鏈之動態時脈域旁路 TW201317596A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/280,797 US8812921B2 (en) 2011-10-25 2011-10-25 Dynamic clock domain bypass for scan chains

Publications (1)

Publication Number Publication Date
TW201317596A true TW201317596A (zh) 2013-05-01

Family

ID=47263057

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101118239A TW201317596A (zh) 2011-10-25 2012-05-22 用於掃描鏈之動態時脈域旁路

Country Status (6)

Country Link
US (1) US8812921B2 (enExample)
EP (1) EP2587273A1 (enExample)
JP (1) JP2013092517A (enExample)
KR (1) KR20130045158A (enExample)
CN (1) CN103076558B (enExample)
TW (1) TW201317596A (enExample)

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TWI646845B (zh) * 2016-05-19 2019-01-01 晨星半導體股份有限公司 條件式存取晶片、其內建自我測試電路及測試方法
TWI689738B (zh) * 2019-02-21 2020-04-01 瑞昱半導體股份有限公司 測試系統

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US10436837B2 (en) * 2015-10-19 2019-10-08 Globalfoundries Inc. Auto test grouping/clock sequencing for at-speed test
US10048315B2 (en) * 2016-07-06 2018-08-14 Stmicroelectronics International N.V. Stuck-at fault detection on the clock tree buffers of a clock source
US10317464B2 (en) * 2017-05-08 2019-06-11 Xilinx, Inc. Dynamic scan chain reconfiguration in an integrated circuit
CN110514981B (zh) * 2018-05-22 2022-04-12 龙芯中科技术股份有限公司 集成电路的时钟控制方法、装置及集成电路
CN113383242B (zh) * 2019-01-30 2024-08-20 西门子工业软件有限公司 基于慢时钟信号的多重捕获全速扫描测试电路
CN109857024B (zh) * 2019-02-01 2021-11-12 京微齐力(北京)科技有限公司 人工智能模块的单元性能测试方法和系统芯片
IT202000001636A1 (it) * 2020-01-28 2021-07-28 Stmicroelectronics Shenzhen R&D Co Ltd Circuito elettronico e corrispondente procedimento per testare circuiti elettronici
JP7305583B2 (ja) * 2020-03-05 2023-07-10 株式会社東芝 半導体集積回路
US11342914B2 (en) * 2020-06-19 2022-05-24 Juniper Networks, Inc. Integrated circuit having state machine-driven flops in wrapper chains for device testing
CN112183005B (zh) * 2020-09-29 2022-11-11 飞腾信息技术有限公司 集成电路测试模式下的dft电路构建方法及应用
CN112526328B (zh) * 2020-10-28 2022-11-01 深圳市紫光同创电子有限公司 边界扫描测试方法
US11454671B1 (en) * 2021-06-30 2022-09-27 Apple Inc. Data gating using scan enable pin
US11680982B2 (en) * 2021-10-26 2023-06-20 Stmicroelectronics International N.V. Automatic test pattern generation circuitry in multi power domain system on a chip
CN114091393B (zh) * 2021-11-26 2025-09-26 芯盟科技有限公司 一种执行工程变更指令的方法、装置、设备和存储介质
KR102670130B1 (ko) * 2021-12-29 2024-05-27 연세대학교 산학협력단 스캔 체인의 다중 고장 진단장치 및 방법
JP2024063970A (ja) * 2022-10-27 2024-05-14 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置のスキャンテスト方法
US12306246B2 (en) 2023-08-21 2025-05-20 Stmicroelectronics International N.V. Partial chain reconfiguration for test time reduction
US12493076B2 (en) * 2023-09-20 2025-12-09 Apple Inc. Scan data transfer circuits for multi-die chip testing
CN118332979B (zh) * 2024-06-11 2024-08-20 奇捷科技(深圳)有限公司 一种在ECO中使用Scan DEF文件的方法
CN120104412B (zh) * 2025-05-07 2025-07-11 上海韬润半导体有限公司 一种用于集成电路调试的系统

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646845B (zh) * 2016-05-19 2019-01-01 晨星半導體股份有限公司 條件式存取晶片、其內建自我測試電路及測試方法
TWI689738B (zh) * 2019-02-21 2020-04-01 瑞昱半導體股份有限公司 測試系統

Also Published As

Publication number Publication date
US20130103994A1 (en) 2013-04-25
CN103076558A (zh) 2013-05-01
CN103076558B (zh) 2017-04-12
EP2587273A1 (en) 2013-05-01
JP2013092517A (ja) 2013-05-16
KR20130045158A (ko) 2013-05-03
US8812921B2 (en) 2014-08-19

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