TW201316448A - 交流驅動靜電吸盤 - Google Patents

交流驅動靜電吸盤 Download PDF

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Publication number
TW201316448A
TW201316448A TW101135221A TW101135221A TW201316448A TW 201316448 A TW201316448 A TW 201316448A TW 101135221 A TW101135221 A TW 101135221A TW 101135221 A TW101135221 A TW 101135221A TW 201316448 A TW201316448 A TW 201316448A
Authority
TW
Taiwan
Prior art keywords
main surface
electrode
disposed
electrostatic chuck
protrusion
Prior art date
Application number
TW101135221A
Other languages
English (en)
Chinese (zh)
Inventor
穴田和輝
石川佳津子
吉井雄一
米澤順治
Original Assignee
Ｔｏｔｏ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｔｏ股份有限公司 filed Critical Ｔｏｔｏ股份有限公司
Publication of TW201316448A publication Critical patent/TW201316448A/zh

Links

Classifications

    • H10P72/722—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H10P72/7614—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
TW101135221A 2011-09-30 2012-09-26 交流驅動靜電吸盤 TW201316448A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011217622 2011-09-30
JP2012207606A JP5505667B2 (ja) 2011-09-30 2012-09-20 交流駆動静電チャック

Publications (1)

Publication Number Publication Date
TW201316448A true TW201316448A (zh) 2013-04-16

Family

ID=47995675

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101135221A TW201316448A (zh) 2011-09-30 2012-09-26 交流驅動靜電吸盤

Country Status (6)

Country Link
US (1) US9093488B2 (enExample)
JP (1) JP5505667B2 (enExample)
KR (1) KR101429593B1 (enExample)
CN (1) CN103890927A (enExample)
TW (1) TW201316448A (enExample)
WO (1) WO2013047647A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110861113A (zh) * 2018-08-28 2020-03-06 吸力奇迹（北京）科技有限公司 静电吸附装置及其制备方法

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JP6224428B2 (ja) * 2013-11-19 2017-11-01 東京エレクトロン株式会社 載置台にフォーカスリングを吸着する方法
US9633885B2 (en) * 2014-02-12 2017-04-25 Axcelis Technologies, Inc. Variable electrode pattern for versatile electrostatic clamp operation
JP6469985B2 (ja) * 2014-07-28 2019-02-13 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6168162B2 (ja) * 2014-09-30 2017-07-26 住友大阪セメント株式会社 静電チャック装置
KR101902806B1 (ko) * 2015-04-02 2018-10-01 울박, 인크 흡착방법 및 진공처리방법
WO2016195945A1 (en) * 2015-06-04 2016-12-08 Applied Materials, Inc. Transparent electrostatic carrier
KR102203402B1 (ko) * 2016-02-10 2021-01-15 엔테그리스, 아이엔씨. 입자 성능이 개선된 웨이퍼 접촉 표면 돌출 프로파일
CN105575872B (zh) * 2016-02-26 2019-05-03 上海华力微电子有限公司 改善静电吸附盘树脂保护环损伤的结构及方法
US11289355B2 (en) 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
KR102048162B1 (ko) * 2018-12-17 2019-12-02 엄홍국 정전척
KR102048161B1 (ko) * 2018-12-17 2019-11-22 엄홍국 정전척용 플레이트 및 이의 제조방법
US11145532B2 (en) * 2018-12-21 2021-10-12 Toto Ltd. Electrostatic chuck
KR102497965B1 (ko) * 2019-03-18 2023-02-08 엔지케이 인슐레이터 엘티디 정전 척
KR102705400B1 (ko) * 2019-08-07 2024-09-12 주식회사 엘지에너지솔루션 자동차용 언더 바디
JP7712269B2 (ja) 2019-10-29 2025-07-23 エーエスエムエル ホールディング エヌ．ブイ． リソグラフィ装置および静電クランプの設計
JP7610345B2 (ja) * 2019-10-30 2025-01-08 日本碍子株式会社 複合焼結体および複合焼結体の製造方法
KR20210089375A (ko) * 2020-01-08 2021-07-16 주식회사 미코세라믹스 정전척
JP2022048089A (ja) * 2020-09-14 2022-03-25 東京エレクトロン株式会社 載置台、基板処理装置及び吸着方法
US20220084800A1 (en) * 2020-09-14 2022-03-17 Tokyo Electron Limited Stage, substrate processing apparatus and substrate attraction method
USD1067394S1 (en) * 2020-09-30 2025-03-18 Toto Ltd. Toilet seat
CN112234015B (zh) * 2020-10-12 2022-05-13 烟台睿瓷新材料技术有限公司 一种同心圆结构的静电吸盘电极图形结构
US11417557B2 (en) * 2020-12-15 2022-08-16 Entegris, Inc. Spiraling polyphase electrodes for electrostatic chuck
JP2023130043A (ja) * 2022-03-07 2023-09-20 東京エレクトロン株式会社 載置台及び基板処理装置

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
JPH01313954A (ja) * 1988-06-14 1989-12-19 Fujitsu Ltd 静電チャック
JPH03292753A (ja) * 1990-04-10 1991-12-24 Toto Ltd 静電チャック
JP4079992B2 (ja) * 1994-10-17 2008-04-23 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド 導電性被処理体を載置部材に締め付けるための装置及び静電クランピング方法
JPH11233600A (ja) * 1997-12-08 1999-08-27 Ulvac Corp 静電吸着装置、及びその静電吸着装置を用いた真空処理装置
US6538873B1 (en) * 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
JP4328003B2 (ja) 2000-10-19 2009-09-09 日本碍子株式会社 セラミックヒーター
US6760213B2 (en) 2002-03-04 2004-07-06 Hitachi High-Technologies Corporation Electrostatic chuck and method of treating substrate using electrostatic chuck
JP3974475B2 (ja) * 2002-03-04 2007-09-12 株式会社日立ハイテクノロジーズ 静電チャック装置及びその装置を用いた基板の処理方法
JP4061131B2 (ja) * 2002-06-18 2008-03-12 キヤノンアネルバ株式会社 静電吸着装置
KR100511854B1 (ko) 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
US7357115B2 (en) * 2003-03-31 2008-04-15 Lam Research Corporation Wafer clamping apparatus and method for operating the same
US7151658B2 (en) * 2003-04-22 2006-12-19 Axcelis Technologies, Inc. High-performance electrostatic clamp comprising a resistive layer, micro-grooves, and dielectric layer
JP4409373B2 (ja) 2004-06-29 2010-02-03 日本碍子株式会社 基板載置装置及び基板温度調整方法
US7352554B2 (en) * 2004-06-30 2008-04-01 Axcelis Technologies, Inc. Method for fabricating a Johnsen-Rahbek electrostatic wafer clamp
US7126091B1 (en) * 2005-03-23 2006-10-24 Eclipse Energy Systems, Inc. Workpiece holder for vacuum processing
JP4929150B2 (ja) * 2007-12-27 2012-05-09 新光電気工業株式会社 静電チャック及び基板温調固定装置
KR20110027785A (ko) * 2008-07-08 2011-03-16 가부시키가이샤 크리에이티브 테크놀러지 쌍극형 정전 척
TWI467691B (zh) 2008-10-15 2015-01-01 創意科技股份有限公司 Electrostatic chuck and its manufacturing method
US8004817B2 (en) * 2009-06-18 2011-08-23 Varian Semiconductor Equipment Associates, Inc. Method of platen fabrication to allow electrode pattern and gas cooling optimization

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110861113A (zh) * 2018-08-28 2020-03-06 吸力奇迹（北京）科技有限公司 静电吸附装置及其制备方法

Also Published As

Publication number Publication date
KR20140050709A (ko) 2014-04-29
US20140340813A1 (en) 2014-11-20
US9093488B2 (en) 2015-07-28
JP5505667B2 (ja) 2014-05-28
WO2013047647A1 (ja) 2013-04-04
KR101429593B1 (ko) 2014-08-12
CN103890927A (zh) 2014-06-25
JP2013084935A (ja) 2013-05-09

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