KR101429593B1 - 교류구동 정전 척 - Google Patents

교류구동 정전 척 Download PDF

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Publication number
KR101429593B1
KR101429593B1 KR1020147006021A KR20147006021A KR101429593B1 KR 101429593 B1 KR101429593 B1 KR 101429593B1 KR 1020147006021 A KR1020147006021 A KR 1020147006021A KR 20147006021 A KR20147006021 A KR 20147006021A KR 101429593 B1 KR101429593 B1 KR 101429593B1
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KR
South Korea
Prior art keywords
main surface
electrode
electrode elements
electrostatic chuck
dielectric substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020147006021A
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English (en)
Korean (ko)
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KR20140050709A (ko
Inventor
카즈키 아나다
카즈코 이시카와
유이치 요시이
준지 요네자와
Original Assignee
토토 가부시키가이샤
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Publication of KR20140050709A publication Critical patent/KR20140050709A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
KR1020147006021A 2011-09-30 2012-09-27 교류구동 정전 척 Expired - Fee Related KR101429593B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2011-217622 2011-09-30
JP2011217622 2011-09-30
JPJP-P-2012-207606 2012-09-20
JP2012207606A JP5505667B2 (ja) 2011-09-30 2012-09-20 交流駆動静電チャック
PCT/JP2012/074866 WO2013047647A1 (ja) 2011-09-30 2012-09-27 交流駆動静電チャック

Publications (2)

Publication Number Publication Date
KR20140050709A KR20140050709A (ko) 2014-04-29
KR101429593B1 true KR101429593B1 (ko) 2014-08-12

Family

ID=47995675

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147006021A Expired - Fee Related KR101429593B1 (ko) 2011-09-30 2012-09-27 교류구동 정전 척

Country Status (6)

Country Link
US (1) US9093488B2 (enExample)
JP (1) JP5505667B2 (enExample)
KR (1) KR101429593B1 (enExample)
CN (1) CN103890927A (enExample)
TW (1) TW201316448A (enExample)
WO (1) WO2013047647A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6224428B2 (ja) 2013-11-19 2017-11-01 東京エレクトロン株式会社 載置台にフォーカスリングを吸着する方法
US9633885B2 (en) * 2014-02-12 2017-04-25 Axcelis Technologies, Inc. Variable electrode pattern for versatile electrostatic clamp operation
JP6469985B2 (ja) * 2014-07-28 2019-02-13 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6168162B2 (ja) * 2014-09-30 2017-07-26 住友大阪セメント株式会社 静電チャック装置
JP6312926B2 (ja) * 2015-04-02 2018-04-18 株式会社アルバック 吸着方法及び真空処理方法
WO2016195945A1 (en) * 2015-06-04 2016-12-08 Applied Materials, Inc. Transparent electrostatic carrier
CN108780773B (zh) * 2016-02-10 2022-10-21 恩特格里斯公司 具有改善粒子性能的晶片接触表面突部轮廓
CN105575872B (zh) * 2016-02-26 2019-05-03 上海华力微电子有限公司 改善静电吸附盘树脂保护环损伤的结构及方法
US11289355B2 (en) 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
CN110861113A (zh) * 2018-08-28 2020-03-06 吸力奇迹（北京）科技有限公司 静电吸附装置及其制备方法
KR102048162B1 (ko) * 2018-12-17 2019-12-02 엄홍국 정전척
KR102048161B1 (ko) * 2018-12-17 2019-11-22 엄홍국 정전척용 플레이트 및 이의 제조방법
US11145532B2 (en) * 2018-12-21 2021-10-12 Toto Ltd. Electrostatic chuck
KR102497965B1 (ko) * 2019-03-18 2023-02-08 엔지케이 인슐레이터 엘티디 정전 척
KR102705400B1 (ko) 2019-08-07 2024-09-12 주식회사 엘지에너지솔루션 자동차용 언더 바디
JP7712269B2 (ja) 2019-10-29 2025-07-23 エーエスエムエル ホールディング エヌ．ブイ． リソグラフィ装置および静電クランプの設計
JP7610345B2 (ja) * 2019-10-30 2025-01-08 日本碍子株式会社 複合焼結体および複合焼結体の製造方法
KR20210089375A (ko) * 2020-01-08 2021-07-16 주식회사 미코세라믹스 정전척
JP2022048089A (ja) * 2020-09-14 2022-03-25 東京エレクトロン株式会社 載置台、基板処理装置及び吸着方法
US20220084800A1 (en) * 2020-09-14 2022-03-17 Tokyo Electron Limited Stage, substrate processing apparatus and substrate attraction method
USD1067394S1 (en) * 2020-09-30 2025-03-18 Toto Ltd. Toilet seat
CN112234015B (zh) * 2020-10-12 2022-05-13 烟台睿瓷新材料技术有限公司 一种同心圆结构的静电吸盘电极图形结构
US11417557B2 (en) * 2020-12-15 2022-08-16 Entegris, Inc. Spiraling polyphase electrodes for electrostatic chuck
JP2023130043A (ja) * 2022-03-07 2023-09-20 東京エレクトロン株式会社 載置台及び基板処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01313954A (ja) * 1988-06-14 1989-12-19 Fujitsu Ltd 静電チャック
JPH03292753A (ja) * 1990-04-10 1991-12-24 Toto Ltd 静電チャック
JPH11504760A (ja) * 1994-10-17 1999-04-27 バリアン・アソシエイツ・インコーポレイテッド 真空中における被処理体の温度制御のための装置及び方法
JP2003332412A (ja) * 2002-03-04 2003-11-21 Hitachi High-Technologies Corp 静電チャック装置及びその装置を用いた基板の処理方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233600A (ja) * 1997-12-08 1999-08-27 Ulvac Corp 静電吸着装置、及びその静電吸着装置を用いた真空処理装置
US6538873B1 (en) * 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
JP4328003B2 (ja) 2000-10-19 2009-09-09 日本碍子株式会社 セラミックヒーター
US6760213B2 (en) 2002-03-04 2004-07-06 Hitachi High-Technologies Corporation Electrostatic chuck and method of treating substrate using electrostatic chuck
JP4061131B2 (ja) * 2002-06-18 2008-03-12 キヤノンアネルバ株式会社 静電吸着装置
KR100511854B1 (ko) 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
US7357115B2 (en) * 2003-03-31 2008-04-15 Lam Research Corporation Wafer clamping apparatus and method for operating the same
US7151658B2 (en) * 2003-04-22 2006-12-19 Axcelis Technologies, Inc. High-performance electrostatic clamp comprising a resistive layer, micro-grooves, and dielectric layer
JP4409373B2 (ja) 2004-06-29 2010-02-03 日本碍子株式会社 基板載置装置及び基板温度調整方法
US7352554B2 (en) * 2004-06-30 2008-04-01 Axcelis Technologies, Inc. Method for fabricating a Johnsen-Rahbek electrostatic wafer clamp
US7126091B1 (en) * 2005-03-23 2006-10-24 Eclipse Energy Systems, Inc. Workpiece holder for vacuum processing
JP4929150B2 (ja) * 2007-12-27 2012-05-09 新光電気工業株式会社 静電チャック及び基板温調固定装置
EP2306505A4 (en) * 2008-07-08 2011-09-14 Creative Tech Corp BIPOLAR ELECTROSTATIC CHUCK
TWI467691B (zh) 2008-10-15 2015-01-01 Creative Tech Corp Electrostatic chuck and its manufacturing method
US8004817B2 (en) * 2009-06-18 2011-08-23 Varian Semiconductor Equipment Associates, Inc. Method of platen fabrication to allow electrode pattern and gas cooling optimization

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01313954A (ja) * 1988-06-14 1989-12-19 Fujitsu Ltd 静電チャック
JPH03292753A (ja) * 1990-04-10 1991-12-24 Toto Ltd 静電チャック
JPH11504760A (ja) * 1994-10-17 1999-04-27 バリアン・アソシエイツ・インコーポレイテッド 真空中における被処理体の温度制御のための装置及び方法
JP2003332412A (ja) * 2002-03-04 2003-11-21 Hitachi High-Technologies Corp 静電チャック装置及びその装置を用いた基板の処理方法

Also Published As

Publication number Publication date
CN103890927A (zh) 2014-06-25
KR20140050709A (ko) 2014-04-29
US9093488B2 (en) 2015-07-28
WO2013047647A1 (ja) 2013-04-04
JP5505667B2 (ja) 2014-05-28
TW201316448A (zh) 2013-04-16
US20140340813A1 (en) 2014-11-20
JP2013084935A (ja) 2013-05-09

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