CN103890927A - 交流驱动静电吸盘 - Google Patents

交流驱动静电吸盘 Download PDF

Info

Publication number
CN103890927A
CN103890927A CN201280046775.1A CN201280046775A CN103890927A CN 103890927 A CN103890927 A CN 103890927A CN 201280046775 A CN201280046775 A CN 201280046775A CN 103890927 A CN103890927 A CN 103890927A
Authority
CN
China
Prior art keywords
main surface
electrostatic chuck
protrusions
electrode
electrode elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280046775.1A
Other languages
English (en)
Chinese (zh)
Inventor
穴田和辉
石川佳津子
吉井雄一
米泽顺治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Publication of CN103890927A publication Critical patent/CN103890927A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
CN201280046775.1A 2011-09-30 2012-09-27 交流驱动静电吸盘 Pending CN103890927A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2011217622 2011-09-30
JP2011-217622 2011-09-30
JP2012207606A JP5505667B2 (ja) 2011-09-30 2012-09-20 交流駆動静電チャック
JP2012-207606 2012-09-20
PCT/JP2012/074866 WO2013047647A1 (ja) 2011-09-30 2012-09-27 交流駆動静電チャック

Publications (1)

Publication Number Publication Date
CN103890927A true CN103890927A (zh) 2014-06-25

Family

ID=47995675

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280046775.1A Pending CN103890927A (zh) 2011-09-30 2012-09-27 交流驱动静电吸盘

Country Status (6)

Country Link
US (1) US9093488B2 (enExample)
JP (1) JP5505667B2 (enExample)
KR (1) KR101429593B1 (enExample)
CN (1) CN103890927A (enExample)
TW (1) TW201316448A (enExample)
WO (1) WO2013047647A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105575872A (zh) * 2016-02-26 2016-05-11 上海华力微电子有限公司 改善静电吸附盘树脂保护环损伤的结构及方法
CN107636820A (zh) * 2015-06-04 2018-01-26 应用材料公司 透明静电载具
CN114188260A (zh) * 2020-09-14 2022-03-15 东京毅力科创株式会社 载置台、基板处理装置及吸附方法

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6224428B2 (ja) 2013-11-19 2017-11-01 東京エレクトロン株式会社 載置台にフォーカスリングを吸着する方法
US9633885B2 (en) * 2014-02-12 2017-04-25 Axcelis Technologies, Inc. Variable electrode pattern for versatile electrostatic clamp operation
JP6469985B2 (ja) * 2014-07-28 2019-02-13 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6168162B2 (ja) * 2014-09-30 2017-07-26 住友大阪セメント株式会社 静電チャック装置
WO2016159342A1 (ja) * 2015-04-02 2016-10-06 株式会社アルバック 吸着装置、吸着装置の製造方法、及び真空処理装置
TWI734739B (zh) * 2016-02-10 2021-08-01 美商恩特葛瑞斯股份有限公司 具有改善粒子效能的晶圓接觸表面突出輪廓
US11289355B2 (en) 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
CN110861113A (zh) * 2018-08-28 2020-03-06 吸力奇迹（北京）科技有限公司 静电吸附装置及其制备方法
KR102048161B1 (ko) * 2018-12-17 2019-11-22 엄홍국 정전척용 플레이트 및 이의 제조방법
KR102048162B1 (ko) * 2018-12-17 2019-12-02 엄홍국 정전척
US11145532B2 (en) * 2018-12-21 2021-10-12 Toto Ltd. Electrostatic chuck
KR102497965B1 (ko) * 2019-03-18 2023-02-08 엔지케이 인슐레이터 엘티디 정전 척
KR102705400B1 (ko) * 2019-08-07 2024-09-12 주식회사 엘지에너지솔루션 자동차용 언더 바디
US12174552B2 (en) 2019-10-29 2024-12-24 Asml Holding N.V. Lithographic apparatus and electrostatic clamp designs
JP7610345B2 (ja) * 2019-10-30 2025-01-08 日本碍子株式会社 複合焼結体および複合焼結体の製造方法
KR20210089375A (ko) * 2020-01-08 2021-07-16 주식회사 미코세라믹스 정전척
JP2022048089A (ja) * 2020-09-14 2022-03-25 東京エレクトロン株式会社 載置台、基板処理装置及び吸着方法
USD1067394S1 (en) * 2020-09-30 2025-03-18 Toto Ltd. Toilet seat
CN112234015B (zh) 2020-10-12 2022-05-13 烟台睿瓷新材料技术有限公司 一种同心圆结构的静电吸盘电极图形结构
US11417557B2 (en) * 2020-12-15 2022-08-16 Entegris, Inc. Spiraling polyphase electrodes for electrostatic chuck
JP2023130043A (ja) * 2022-03-07 2023-09-20 東京エレクトロン株式会社 載置台及び基板処理装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01313954A (ja) * 1988-06-14 1989-12-19 Fujitsu Ltd 静電チャック
JPH03292753A (ja) * 1990-04-10 1991-12-24 Toto Ltd 静電チャック
DE69530801T2 (de) 1994-10-17 2004-03-11 Varian Semiconductor Equipment Associates Inc., Gloucester Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes
JPH11233600A (ja) * 1997-12-08 1999-08-27 Ulvac Corp 静電吸着装置、及びその静電吸着装置を用いた真空処理装置
US6538873B1 (en) * 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
JP4328003B2 (ja) * 2000-10-19 2009-09-09 日本碍子株式会社 セラミックヒーター
JP3974475B2 (ja) * 2002-03-04 2007-09-12 株式会社日立ハイテクノロジーズ 静電チャック装置及びその装置を用いた基板の処理方法
US6760213B2 (en) 2002-03-04 2004-07-06 Hitachi High-Technologies Corporation Electrostatic chuck and method of treating substrate using electrostatic chuck
KR100511854B1 (ko) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
JP4061131B2 (ja) * 2002-06-18 2008-03-12 キヤノンアネルバ株式会社 静電吸着装置
US7357115B2 (en) * 2003-03-31 2008-04-15 Lam Research Corporation Wafer clamping apparatus and method for operating the same
US7151658B2 (en) * 2003-04-22 2006-12-19 Axcelis Technologies, Inc. High-performance electrostatic clamp comprising a resistive layer, micro-grooves, and dielectric layer
JP4409373B2 (ja) 2004-06-29 2010-02-03 日本碍子株式会社 基板載置装置及び基板温度調整方法
US7352554B2 (en) * 2004-06-30 2008-04-01 Axcelis Technologies, Inc. Method for fabricating a Johnsen-Rahbek electrostatic wafer clamp
US7126091B1 (en) * 2005-03-23 2006-10-24 Eclipse Energy Systems, Inc. Workpiece holder for vacuum processing
JP4929150B2 (ja) * 2007-12-27 2012-05-09 新光電気工業株式会社 静電チャック及び基板温調固定装置
US8730644B2 (en) * 2008-07-08 2014-05-20 Creative Technology Corporation Bipolar electrostatic chuck
TWI467691B (zh) 2008-10-15 2015-01-01 Creative Tech Corp Electrostatic chuck and its manufacturing method
US8004817B2 (en) * 2009-06-18 2011-08-23 Varian Semiconductor Equipment Associates, Inc. Method of platen fabrication to allow electrode pattern and gas cooling optimization

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107636820A (zh) * 2015-06-04 2018-01-26 应用材料公司 透明静电载具
CN107636820B (zh) * 2015-06-04 2022-01-07 应用材料公司 透明静电载具
CN105575872A (zh) * 2016-02-26 2016-05-11 上海华力微电子有限公司 改善静电吸附盘树脂保护环损伤的结构及方法
CN114188260A (zh) * 2020-09-14 2022-03-15 东京毅力科创株式会社 载置台、基板处理装置及吸附方法

Also Published As

Publication number Publication date
KR101429593B1 (ko) 2014-08-12
US20140340813A1 (en) 2014-11-20
TW201316448A (zh) 2013-04-16
US9093488B2 (en) 2015-07-28
WO2013047647A1 (ja) 2013-04-04
KR20140050709A (ko) 2014-04-29
JP5505667B2 (ja) 2014-05-28
JP2013084935A (ja) 2013-05-09

Similar Documents

Publication Publication Date Title
CN103890927A (zh) 交流驱动静电吸盘
JP7296869B2 (ja) 静電チャック、基板固定装置
CN104952779B (zh) 静电吸盘
TWI644393B (zh) Electrostatic chuck
JP7278035B2 (ja) 静電チャック、基板固定装置
CN111108589A (zh) 静电卡盘装置
WO2000072376A1 (en) Electrostatic chuck and treating device
JP6489195B1 (ja) 静電チャック装置
CN111512428A (zh) 静电卡盘装置
CN111108590A (zh) 静电卡盘装置
JP2001284442A (ja) 静電チャック及びその製造方法
CN105917457A (zh) 等离子体处理装置以及晶片搬送用托盘
KR102761340B1 (ko) 세라믹 구조체, 정전 척 및 기판 고정 장치
KR102891255B1 (ko) 정전 척 및 기판 고정 장치
KR20100137679A (ko) 글라스 정전척 및 그 제조방법
JP2017168649A (ja) 半導体製造用部品
JP4879771B2 (ja) 静電チャック
JPH11251419A (ja) 基板保持用静電チャック及び基板保持方法
JP7252378B2 (ja) 試料保持具
JP7655410B1 (ja) 静電チャック
JP2025066092A (ja) 静電チャック
JPH118291A (ja) 静電吸着装置
JP6743299B2 (ja) 試料保持具
JP2010177698A (ja) 静電チャックの製造方法
JP2025025801A (ja) 保持部材

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140625