JP6743299B2 - 試料保持具 - Google Patents
試料保持具 Download PDFInfo
- Publication number
- JP6743299B2 JP6743299B2 JP2019522209A JP2019522209A JP6743299B2 JP 6743299 B2 JP6743299 B2 JP 6743299B2 JP 2019522209 A JP2019522209 A JP 2019522209A JP 2019522209 A JP2019522209 A JP 2019522209A JP 6743299 B2 JP6743299 B2 JP 6743299B2
- Authority
- JP
- Japan
- Prior art keywords
- heating resistor
- ceramic body
- sample holder
- main surface
- grid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Resistance Heating (AREA)
Description
11:試料保持面
2:発熱抵抗体
21:方形渦巻状部
22:接続部分
3:格子状の溝
31:幅広部分
4:接合層
5:金属プレート
10:試料保持具
Claims (5)
- 一方の主面に試料保持面を有するセラミック体と、
該セラミック体の他方の主面に設けられた発熱抵抗体とを備えており、
該発熱抵抗体の表面には格子状に複数の溝が設けられているとともに、該複数の溝の伸びる方向が前記発熱抵抗体の部位ごとに異なり、
平面視したときに、前記発熱抵抗体は、前記複数の溝に囲まれた部分の角部がR形状である試料保持具。 - 前記発熱抵抗体が帯状であるとともに、前記発熱抵抗体を長さ方向に対して垂直な断面で見たときに、前記発熱抵抗体のうち中央よりも両端が薄い請求項1に記載の試料保持具。
- 前記発熱抵抗体の配線パターンは、前記セラミック体の中心部に中心を有する円の円周上に複数並んだ、中央で折り返した二重の方形渦巻状部が電気的に接続された配線郡を有しており、前記複数の溝の伸びる方向が前記方形渦巻状部ごとに異なる請求項1または請求項2に記載の試料保持具。
- 前記発熱抵抗体は、複数の前記方形渦巻状部を接続する接続部分を有し、
該接続部分は、前記方形渦巻状部よりも厚い請求項3に記載の試料保持具。 - 前記他方の主面に、前記他方の主面を前記発熱抵抗体ごと覆う接合層を介して、金属プレートが接合されている請求項1乃至請求項4のいずれかに記載の試料保持具。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017105734 | 2017-05-29 | ||
JP2017105734 | 2017-05-29 | ||
PCT/JP2018/020286 WO2018221436A1 (ja) | 2017-05-29 | 2018-05-28 | 試料保持具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018221436A1 JPWO2018221436A1 (ja) | 2020-03-19 |
JP6743299B2 true JP6743299B2 (ja) | 2020-08-19 |
Family
ID=64454731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019522209A Active JP6743299B2 (ja) | 2017-05-29 | 2018-05-28 | 試料保持具 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11295967B2 (ja) |
JP (1) | JP6743299B2 (ja) |
WO (1) | WO2018221436A1 (ja) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5221829A (en) * | 1990-10-15 | 1993-06-22 | Shimon Yahav | Domestic cooking apparatus |
JP2766433B2 (ja) * | 1992-07-23 | 1998-06-18 | 株式会社東芝 | 半導体気相成長装置 |
JP3477062B2 (ja) * | 1997-12-26 | 2003-12-10 | 京セラ株式会社 | ウエハ加熱装置 |
JP2002190373A (ja) * | 2000-12-19 | 2002-07-05 | Ibiden Co Ltd | セラミックヒータの製造方法 |
JP2002246155A (ja) * | 2001-02-16 | 2002-08-30 | Ibiden Co Ltd | セラミックヒータ |
JP4562460B2 (ja) * | 2004-08-27 | 2010-10-13 | 京セラ株式会社 | ヒータとそれを用いたウェハ加熱装置 |
KR101098798B1 (ko) * | 2004-05-26 | 2011-12-26 | 쿄세라 코포레이션 | 히터와 웨이퍼 가열장치 및 히터의 제조방법 |
JP4359927B2 (ja) * | 2004-06-28 | 2009-11-11 | 京セラ株式会社 | ウエハ加熱装置及びその製造方法 |
JP2006332410A (ja) * | 2005-05-27 | 2006-12-07 | Kyocera Corp | ウェハ加熱装置およびそれを用いた半導体製造装置 |
JP2007258585A (ja) * | 2006-03-24 | 2007-10-04 | Tokyo Electron Ltd | 基板載置機構および基板処理装置 |
JP6525763B2 (ja) * | 2015-06-25 | 2019-06-05 | 京セラ株式会社 | 試料保持具 |
-
2018
- 2018-05-28 WO PCT/JP2018/020286 patent/WO2018221436A1/ja active Application Filing
- 2018-05-28 US US16/611,436 patent/US11295967B2/en active Active
- 2018-05-28 JP JP2019522209A patent/JP6743299B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2018221436A1 (ja) | 2020-03-19 |
WO2018221436A1 (ja) | 2018-12-06 |
US11295967B2 (en) | 2022-04-05 |
US20200211869A1 (en) | 2020-07-02 |
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