TW201300768A - 檢查區域設定方法及ｘ光檢查系統 - Google Patents
檢查區域設定方法及ｘ光檢查系統 Download PDFInfo
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- TW201300768A TW201300768A TW101116754A TW101116754A TW201300768A TW 201300768 A TW201300768 A TW 201300768A TW 101116754 A TW101116754 A TW 101116754A TW 101116754 A TW101116754 A TW 101116754A TW 201300768 A TW201300768 A TW 201300768A
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- Prior art keywords
- inspection
- ray
- image
- visible light
- substrate
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Links
- 238000007689 inspection Methods 0.000 title claims abstract description 255
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000012790 confirmation Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 129
- 230000003287 optical effect Effects 0.000 claims description 31
- 238000003384 imaging method Methods 0.000 claims description 11
- 238000012360 testing method Methods 0.000 claims description 3
- 238000004364 calculation method Methods 0.000 description 21
- 238000012545 processing Methods 0.000 description 21
- 238000003466 welding Methods 0.000 description 19
- 238000002591 computed tomography Methods 0.000 description 13
- 238000011960 computer-aided design Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 9
- 238000003860 storage Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 4
- 238000013170 computed tomography imaging Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000002372 labelling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
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- 238000012423 maintenance Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
- G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/419—Imaging computed tomograph
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pulmonology (AREA)
- Radiology & Medical Imaging (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011108608A JP5830928B2 (ja) | 2011-05-13 | 2011-05-13 | 検査領域設定方法およびｘ線検査システム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201300768A true TW201300768A (zh) | 2013-01-01 |
Family
ID=47176800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101116754A TW201300768A (zh) | 2011-05-13 | 2012-05-11 | 檢查區域設定方法及ｘ光檢查系統 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5830928B2 (enExample) |
| TW (1) | TW201300768A (enExample) |
| WO (1) | WO2012157467A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6025768B2 (ja) * | 2014-02-27 | 2016-11-16 | 三菱電機株式会社 | 貴金属量算出装置および貴金属量算出方法 |
| WO2016063381A1 (ja) * | 2014-10-22 | 2016-04-28 | 株式会社システムスクエア | 電磁波検知部と光学検知部を使用した検査装置 |
| WO2016063380A1 (ja) * | 2014-10-22 | 2016-04-28 | 株式会社システムスクエア | 包装体の検査装置 |
| WO2019059012A1 (ja) * | 2017-09-19 | 2019-03-28 | コニカミノルタ株式会社 | 非破壊検査方法 |
| JP7466362B2 (ja) * | 2020-04-13 | 2024-04-12 | 東芝Ｉｔコントロールシステム株式会社 | 非破壊検査装置 |
| JP6976613B1 (ja) * | 2020-09-24 | 2021-12-08 | 昭立電気工業株式会社 | はんだ付け作業プログラム作成システム、はんだ付け作業プログラム作成装置及びはんだ付ロボット |
| JP7753638B2 (ja) * | 2021-01-20 | 2025-10-15 | オムロン株式会社 | 計測システム、検査システム、計測装置、計測方法、検査方法、及びプログラム |
| JP2023067031A (ja) | 2021-10-29 | 2023-05-16 | オムロン株式会社 | Ｘ線検査装置、ｘ線検査システム、画像管理方法及びプログラム |
| JPWO2024117099A1 (enExample) * | 2022-12-01 | 2024-06-06 | ||
| WO2025177416A1 (ja) * | 2024-02-20 | 2025-08-28 | 三菱電機株式会社 | 半導体装置の製造方法および半導体検査装置 |
| US20250305971A1 (en) * | 2024-03-28 | 2025-10-02 | Tokyo Electron Limited | X-ray methods and systems for semiconductor substrate alignment |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0252246A (ja) * | 1988-08-15 | 1990-02-21 | Tokyo Electron Ltd | Ｘ線検査装置 |
| JP3203766B2 (ja) * | 1992-05-15 | 2001-08-27 | ソニー株式会社 | Ｘ線位置合わせ確認方法、ｘ線位置合わせ確認・位置合わせ方法、及びｘ線検査装置 |
| JP3883153B2 (ja) * | 1998-04-10 | 2007-02-21 | 松下電器産業株式会社 | Ｘ線基板検査装置 |
| JP2002310954A (ja) * | 2001-04-18 | 2002-10-23 | Shimadzu Corp | 試料解析装置 |
| JP4124339B2 (ja) * | 2003-01-31 | 2008-07-23 | 株式会社堀場製作所 | 計測結果表示方法、ｘ線装置、及びコンピュータプログラム |
| JP4665696B2 (ja) * | 2005-10-05 | 2011-04-06 | 株式会社島津製作所 | Ｘ線検査装置 |
| JP5043589B2 (ja) * | 2007-10-15 | 2012-10-10 | ソニー株式会社 | 断面試料作成システム及び断面試料作成方法 |
| JP5493360B2 (ja) * | 2009-01-08 | 2014-05-14 | オムロン株式会社 | Ｘ線検査方法、ｘ線検査装置およびｘ線検査プログラム |
-
2011
- 2011-05-13 JP JP2011108608A patent/JP5830928B2/ja active Active
-
2012
- 2012-05-08 WO PCT/JP2012/061741 patent/WO2012157467A1/ja not_active Ceased
- 2012-05-11 TW TW101116754A patent/TW201300768A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP5830928B2 (ja) | 2015-12-09 |
| JP2012237729A (ja) | 2012-12-06 |
| WO2012157467A1 (ja) | 2012-11-22 |
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