JP5830928B2 - 検査領域設定方法およびｘ線検査システム - Google Patents

検査領域設定方法およびｘ線検査システム Download PDF

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Publication number
JP5830928B2
JP5830928B2 JP2011108608A JP2011108608A JP5830928B2 JP 5830928 B2 JP5830928 B2 JP 5830928B2 JP 2011108608 A JP2011108608 A JP 2011108608A JP 2011108608 A JP2011108608 A JP 2011108608A JP 5830928 B2 JP5830928 B2 JP 5830928B2
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image
ray
inspection
substrate
visible
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Japanese (ja)
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JP2012237729A (ja
JP2012237729A5 (enExample
Inventor
清 村上
清 村上
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Omron Corp
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Omron Corp
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Priority to JP2011108608A priority Critical patent/JP5830928B2/ja
Priority to PCT/JP2012/061741 priority patent/WO2012157467A1/ja
Priority to TW101116754A priority patent/TW201300768A/zh
Publication of JP2012237729A publication Critical patent/JP2012237729A/ja
Publication of JP2012237729A5 publication Critical patent/JP2012237729A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/419—Imaging computed tomograph

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  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pulmonology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2011108608A 2011-05-13 2011-05-13 検査領域設定方法およびｘ線検査システム Active JP5830928B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011108608A JP5830928B2 (ja) 2011-05-13 2011-05-13 検査領域設定方法およびｘ線検査システム
PCT/JP2012/061741 WO2012157467A1 (ja) 2011-05-13 2012-05-08 検査領域設定方法およびｘ線検査システム
TW101116754A TW201300768A (zh) 2011-05-13 2012-05-11 檢查區域設定方法及ｘ光檢查系統

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011108608A JP5830928B2 (ja) 2011-05-13 2011-05-13 検査領域設定方法およびｘ線検査システム

Publications (3)

Publication Number Publication Date
JP2012237729A JP2012237729A (ja) 2012-12-06
JP2012237729A5 JP2012237729A5 (enExample) 2014-06-26
JP5830928B2 true JP5830928B2 (ja) 2015-12-09

Family

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JP2011108608A Active JP5830928B2 (ja) 2011-05-13 2011-05-13 検査領域設定方法およびｘ線検査システム

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JP (1) JP5830928B2 (enExample)
TW (1) TW201300768A (enExample)
WO (1) WO2012157467A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6025768B2 (ja) * 2014-02-27 2016-11-16 三菱電機株式会社 貴金属量算出装置および貴金属量算出方法
WO2016063381A1 (ja) * 2014-10-22 2016-04-28 株式会社システムスクエア 電磁波検知部と光学検知部を使用した検査装置
WO2016063380A1 (ja) * 2014-10-22 2016-04-28 株式会社システムスクエア 包装体の検査装置
US11652243B2 (en) * 2017-09-19 2023-05-16 Konica Minolta, Inc Non-destructive inspection method
JP7466362B2 (ja) * 2020-04-13 2024-04-12 東芝Ｉｔコントロールシステム株式会社 非破壊検査装置
JP6976613B1 (ja) * 2020-09-24 2021-12-08 昭立電気工業株式会社 はんだ付け作業プログラム作成システム、はんだ付け作業プログラム作成装置及びはんだ付ロボット
JP7753638B2 (ja) * 2021-01-20 2025-10-15 オムロン株式会社 計測システム、検査システム、計測装置、計測方法、検査方法、及びプログラム
JP2023067031A (ja) * 2021-10-29 2023-05-16 オムロン株式会社 Ｘ線検査装置、ｘ線検査システム、画像管理方法及びプログラム
JPWO2024117099A1 (enExample) * 2022-12-01 2024-06-06
WO2025177416A1 (ja) * 2024-02-20 2025-08-28 三菱電機株式会社 半導体装置の製造方法および半導体検査装置
US20250305971A1 (en) * 2024-03-28 2025-10-02 Tokyo Electron Limited X-ray methods and systems for semiconductor substrate alignment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0252246A (ja) * 1988-08-15 1990-02-21 Tokyo Electron Ltd Ｘ線検査装置
JP3203766B2 (ja) * 1992-05-15 2001-08-27 ソニー株式会社 Ｘ線位置合わせ確認方法、ｘ線位置合わせ確認・位置合わせ方法、及びｘ線検査装置
JP3883153B2 (ja) * 1998-04-10 2007-02-21 松下電器産業株式会社 Ｘ線基板検査装置
JP2002310954A (ja) * 2001-04-18 2002-10-23 Shimadzu Corp 試料解析装置
JP4124339B2 (ja) * 2003-01-31 2008-07-23 株式会社堀場製作所 計測結果表示方法、ｘ線装置、及びコンピュータプログラム
JP4665696B2 (ja) * 2005-10-05 2011-04-06 株式会社島津製作所 Ｘ線検査装置
JP5043589B2 (ja) * 2007-10-15 2012-10-10 ソニー株式会社 断面試料作成システム及び断面試料作成方法
JP5493360B2 (ja) * 2009-01-08 2014-05-14 オムロン株式会社 Ｘ線検査方法、ｘ線検査装置およびｘ線検査プログラム

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Publication number Publication date
JP2012237729A (ja) 2012-12-06
WO2012157467A1 (ja) 2012-11-22
TW201300768A (zh) 2013-01-01

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