TW201218883A - Circuit connection structure - Google Patents

Circuit connection structure Download PDF

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Publication number
TW201218883A
TW201218883A TW100133431A TW100133431A TW201218883A TW 201218883 A TW201218883 A TW 201218883A TW 100133431 A TW100133431 A TW 100133431A TW 100133431 A TW100133431 A TW 100133431A TW 201218883 A TW201218883 A TW 201218883A
Authority
TW
Taiwan
Prior art keywords
circuit
conductive particles
connection
electrode
connecting material
Prior art date
Application number
TW100133431A
Other languages
English (en)
Chinese (zh)
Other versions
TWI373993B (https=
Inventor
Kazuyoshi Kojima
Kouji Kobayashi
Motohiro Arifuku
Nichiomi Mochizuki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201218883A publication Critical patent/TW201218883A/zh
Application granted granted Critical
Publication of TWI373993B publication Critical patent/TWI373993B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
TW100133431A 2006-10-31 2007-10-31 Circuit connection structure TW201218883A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006295789 2006-10-31
JP2007280782A JP4737177B2 (ja) 2006-10-31 2007-10-29 回路接続構造体

Publications (2)

Publication Number Publication Date
TW201218883A true TW201218883A (en) 2012-05-01
TWI373993B TWI373993B (https=) 2012-10-01

Family

ID=39344214

Family Applications (2)

Application Number Title Priority Date Filing Date
TW100133431A TW201218883A (en) 2006-10-31 2007-10-31 Circuit connection structure
TW096141010A TW200843577A (en) 2006-10-31 2007-10-31 Circuit connection structure

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW096141010A TW200843577A (en) 2006-10-31 2007-10-31 Circuit connection structure

Country Status (7)

Country Link
US (1) US20100025097A1 (https=)
EP (1) EP2081222A4 (https=)
JP (1) JP4737177B2 (https=)
KR (2) KR20090075749A (https=)
CN (2) CN103198878A (https=)
TW (2) TW201218883A (https=)
WO (1) WO2008053873A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI602201B (zh) * 2012-07-03 2017-10-11 日本化學工業股份有限公司 導電性粒子、導電性材料及導電性粒子的製造方法

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JP4743322B2 (ja) * 2007-05-15 2011-08-10 日立化成工業株式会社 回路接続材料及び回路部材の接続構造
WO2010001900A1 (ja) * 2008-07-01 2010-01-07 日立化成工業株式会社 回路接続材料及び回路接続構造体
JP5375374B2 (ja) * 2009-07-02 2013-12-25 日立化成株式会社 回路接続材料及び回路接続構造体
JP2011055033A (ja) * 2009-08-31 2011-03-17 Kyocera Kinseki Corp 圧電発振器
JP5886582B2 (ja) * 2010-09-28 2016-03-16 積水化学工業株式会社 異方性導電材料、ｂステージ状硬化物、ｂステージ状硬化物の製造方法及び接続構造体
JP5184612B2 (ja) * 2010-11-22 2013-04-17 日本化学工業株式会社 導電性粉体、それを含む導電性材料及びその製造方法
JP2014149918A (ja) * 2011-06-06 2014-08-21 Hitachi Chemical Co Ltd フィルム状回路接続材料及び回路接続構造体
CN102354629B (zh) * 2011-07-12 2014-02-05 南通万德科技有限公司 麻面金属与橡胶复合导电粒
WO2013035204A1 (ja) 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電子装置用組成物
KR101151366B1 (ko) * 2011-11-24 2012-06-08 한화케미칼 주식회사 도전성 입자 및 이의 제조방법
KR101941721B1 (ko) * 2011-12-21 2019-01-23 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
EP3047973A3 (en) * 2015-01-23 2016-09-07 Konica Minolta, Inc. Inkjet head, method of producing inkjet head, and inkjet recording device
KR102540372B1 (ko) * 2015-05-28 2023-06-05 엘지디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102429906B1 (ko) * 2015-10-13 2022-08-05 삼성전자주식회사 스토리지 장치, 상기 스토리지 장치와 통신하는 호스트 및 상기 스토리지 장치를 포함하는 전자 장치
WO2017159694A1 (ja) * 2016-03-15 2017-09-21 積水化学工業株式会社 金属含有粒子、接続材料、接続構造体及び接続構造体の製造方法
US10509459B2 (en) 2016-05-19 2019-12-17 Scenera, Inc. Scene-based sensor networks
WO2017222010A1 (ja) * 2016-06-22 2017-12-28 積水化学工業株式会社 接続構造体、金属原子含有粒子及び接合用組成物
JP7011141B2 (ja) * 2016-06-24 2022-02-10 天馬微電子有限公司 触覚提示用パネル、触覚提示装置および電子機器
US10588214B2 (en) * 2017-05-09 2020-03-10 Unimicron Technology Corp. Stacked structure and method for manufacturing the same
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
US11224131B2 (en) * 2018-04-04 2022-01-11 Lenovo (Singapore) Pte. Ltd. Systems and methods for surface mounting cable connections
CN113365412B (zh) * 2020-03-05 2022-06-24 宏启胜精密电子(秦皇岛)有限公司 复合电路板及其制作方法

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JP5247968B2 (ja) * 2003-12-02 2013-07-24 日立化成株式会社 回路接続材料、及びこれを用いた回路部材の接続構造
JP4243279B2 (ja) * 2004-01-30 2009-03-25 積水化学工業株式会社 導電性微粒子及び異方性導電材料
JP4674096B2 (ja) * 2005-02-15 2011-04-20 積水化学工業株式会社 導電性微粒子及び異方性導電材料
JP4743322B2 (ja) * 2007-05-15 2011-08-10 日立化成工業株式会社 回路接続材料及び回路部材の接続構造
JP5316410B2 (ja) * 2007-08-02 2013-10-16 日立化成株式会社 回路部材の接続構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI602201B (zh) * 2012-07-03 2017-10-11 日本化學工業股份有限公司 導電性粒子、導電性材料及導電性粒子的製造方法

Also Published As

Publication number Publication date
EP2081222A4 (en) 2011-11-30
EP2081222A1 (en) 2009-07-22
JP2008135734A (ja) 2008-06-12
TWI360377B (https=) 2012-03-11
WO2008053873A1 (fr) 2008-05-08
CN103198878A (zh) 2013-07-10
US20100025097A1 (en) 2010-02-04
KR20090075749A (ko) 2009-07-08
JP4737177B2 (ja) 2011-07-27
KR20110057253A (ko) 2011-05-31
TWI373993B (https=) 2012-10-01
TW200843577A (en) 2008-11-01
CN102063949A (zh) 2011-05-18

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