TW201012876A - Thermally conductive silicone composition and semiconductor device - Google Patents

Thermally conductive silicone composition and semiconductor device Download PDF

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Publication number
TW201012876A
TW201012876A TW098127155A TW98127155A TW201012876A TW 201012876 A TW201012876 A TW 201012876A TW 098127155 A TW098127155 A TW 098127155A TW 98127155 A TW98127155 A TW 98127155A TW 201012876 A TW201012876 A TW 201012876A
Authority
TW
Taiwan
Prior art keywords
group
component
mass
composition
thermally conductive
Prior art date
Application number
TW098127155A
Other languages
English (en)
Chinese (zh)
Inventor
Tomoko Kato
Kazumi Nakayoshi
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of TW201012876A publication Critical patent/TW201012876A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW098127155A 2008-09-01 2009-08-12 Thermally conductive silicone composition and semiconductor device TW201012876A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008223588A JP6014299B2 (ja) 2008-09-01 2008-09-01 熱伝導性シリコーン組成物及び半導体装置

Publications (1)

Publication Number Publication Date
TW201012876A true TW201012876A (en) 2010-04-01

Family

ID=41225975

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098127155A TW201012876A (en) 2008-09-01 2009-08-12 Thermally conductive silicone composition and semiconductor device

Country Status (7)

Country Link
US (1) US20110163460A1 (enExample)
EP (1) EP2331637A1 (enExample)
JP (1) JP6014299B2 (enExample)
KR (1) KR20110053441A (enExample)
CN (1) CN102124057B (enExample)
TW (1) TW201012876A (enExample)
WO (1) WO2010024305A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102725355A (zh) * 2010-01-28 2012-10-10 道康宁东丽株式会社 导热硅橡胶组合物
TWI683860B (zh) * 2015-04-30 2020-02-01 日商信越化學工業股份有限公司 熱傳導性聚矽氧滑脂組成物
TWI851537B (zh) * 2017-07-24 2024-08-11 日商陶氏東麗股份有限公司 導熱性聚矽氧凝膠組合物、導熱性構件及散熱結構體

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JP2012069783A (ja) * 2010-09-24 2012-04-05 Yokohama Rubber Co Ltd:The 熱伝導性シリコーン組成物およびこれを用いる実装基板
JP2014080522A (ja) * 2012-10-17 2014-05-08 Shin Etsu Chem Co Ltd 熱伝導性樹脂組成物
KR101911690B1 (ko) * 2012-12-07 2018-10-25 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물 및 광반도체 디바이스
KR101413065B1 (ko) 2013-03-04 2014-07-04 주식회사 에이치알에스 열전도성 액상 실리콘 점착제 조성물 및 이의 제조 방법
JP5898139B2 (ja) 2013-05-24 2016-04-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP5947267B2 (ja) * 2013-09-20 2016-07-06 信越化学工業株式会社 シリコーン組成物及び熱伝導性シリコーン組成物の製造方法
WO2015155948A1 (ja) * 2014-04-09 2015-10-15 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電気・電子機器
JP2016098319A (ja) * 2014-11-21 2016-05-30 信越化学工業株式会社 低摩擦性シリコーンコート剤組成物及び低摩擦性シリコーンゴムコーティング被膜の形成方法
EP3398996B1 (en) * 2015-12-28 2021-01-27 Sumitomo Chemical Company, Limited Composition
JP6675543B2 (ja) * 2016-02-05 2020-04-01 北川工業株式会社 熱伝導部材、熱伝導部材の製造方法及びシリコーン混合物
WO2017152353A1 (en) * 2016-03-08 2017-09-14 Honeywell International Inc. Phase change material
JP6895364B2 (ja) * 2017-10-20 2021-06-30 本田技研工業株式会社 放熱性塗料組成物、放熱性被膜及び被膜形成方法
JP2019077843A (ja) * 2017-10-27 2019-05-23 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物およびその硬化物
JP7495434B2 (ja) 2019-06-21 2024-06-04 ダウ シリコーンズ コーポレーション 熱伝導性シリコーン組成物
US11845869B2 (en) 2019-06-21 2023-12-19 Dow Silicones Corporation Method for producing thixotropic curable silicone composition
CN110591635B (zh) * 2019-07-05 2021-10-29 惠州瑞德新材料科技股份有限公司 一种密封胶及制备方法
EP4114892B1 (en) 2020-03-05 2024-01-10 Dow Global Technologies LLC Shear thinning thermally conductive silicone compositions
US20230167301A1 (en) * 2020-05-22 2023-06-01 Shin-Etsu Chemical Co., Ltd. High thermal conductive silicone composition
JP2023044473A (ja) 2021-09-17 2023-03-30 デュポン・東レ・スペシャルティ・マテリアル株式会社 熱伝導性シリコーン組成物
KR20240103046A (ko) * 2022-01-28 2024-07-03 와커 헤미 아게 경금속 합금-함유 열 전도 페이스트
EP4469519B1 (de) * 2022-01-28 2025-08-27 Wacker Chemie AG Aluminiumhaltige wärmeleitpasten
CN116102890B (zh) * 2023-02-09 2024-08-13 广州回天新材料有限公司 一种有机硅橡胶组合物及其制备方法

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JP4015722B2 (ja) * 1997-06-20 2007-11-28 東レ・ダウコーニング株式会社 熱伝導性ポリマー組成物
JP3948642B2 (ja) * 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP3543663B2 (ja) * 1999-03-11 2004-07-14 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
JP4646357B2 (ja) * 2000-06-08 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP3580358B2 (ja) * 2000-06-23 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP3580366B2 (ja) * 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP4255287B2 (ja) * 2001-05-14 2009-04-15 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP3922367B2 (ja) * 2002-12-27 2007-05-30 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4460433B2 (ja) * 2004-12-15 2010-05-12 信越化学工業株式会社 放熱性シリコーングリース組成物の製造方法
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
TWI285675B (en) * 2005-12-16 2007-08-21 Foxconn Tech Co Ltd Heat conductive grease and semiconductor device
JP4933094B2 (ja) * 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP2007277387A (ja) * 2006-04-06 2007-10-25 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
JP4495749B2 (ja) * 2006-06-16 2010-07-07 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP2008038137A (ja) * 2006-07-12 2008-02-21 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物およびその硬化物
JP4514058B2 (ja) * 2006-08-30 2010-07-28 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5372388B2 (ja) * 2008-01-30 2013-12-18 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
JP5507059B2 (ja) * 2008-05-27 2014-05-28 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電子装置
JP2010013521A (ja) * 2008-07-02 2010-01-21 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物
WO2010107516A1 (en) * 2009-03-16 2010-09-23 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102725355A (zh) * 2010-01-28 2012-10-10 道康宁东丽株式会社 导热硅橡胶组合物
CN102725355B (zh) * 2010-01-28 2014-10-08 道康宁东丽株式会社 导热硅橡胶组合物
TWI683860B (zh) * 2015-04-30 2020-02-01 日商信越化學工業股份有限公司 熱傳導性聚矽氧滑脂組成物
US10704008B2 (en) 2015-04-30 2020-07-07 Shin-Etsu Chemical Co., Ltd. Heat-conductive silicone grease composition
TWI851537B (zh) * 2017-07-24 2024-08-11 日商陶氏東麗股份有限公司 導熱性聚矽氧凝膠組合物、導熱性構件及散熱結構體

Also Published As

Publication number Publication date
CN102124057B (zh) 2013-01-02
CN102124057A (zh) 2011-07-13
WO2010024305A1 (en) 2010-03-04
EP2331637A1 (en) 2011-06-15
JP6014299B2 (ja) 2016-10-25
KR20110053441A (ko) 2011-05-23
US20110163460A1 (en) 2011-07-07
JP2010059237A (ja) 2010-03-18

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