CN102124057B - 热传导性硅氧烷组合物和半导体器件 - Google Patents

热传导性硅氧烷组合物和半导体器件 Download PDF

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Publication number
CN102124057B
CN102124057B CN2009801312949A CN200980131294A CN102124057B CN 102124057 B CN102124057 B CN 102124057B CN 2009801312949 A CN2009801312949 A CN 2009801312949A CN 200980131294 A CN200980131294 A CN 200980131294A CN 102124057 B CN102124057 B CN 102124057B
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China
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component
mass
sio
parts
thermally conductive
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Expired - Fee Related
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CN2009801312949A
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Chinese (zh)
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CN102124057A (zh
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加藤智子
中吉和己
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN2009801312949A 2008-09-01 2009-08-20 热传导性硅氧烷组合物和半导体器件 Expired - Fee Related CN102124057B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008223588A JP6014299B2 (ja) 2008-09-01 2008-09-01 熱伝導性シリコーン組成物及び半導体装置
JP2008-223588 2008-09-01
PCT/JP2009/064901 WO2010024305A1 (en) 2008-09-01 2009-08-20 Thermally conductive silicone composition and semiconductor device

Publications (2)

Publication Number Publication Date
CN102124057A CN102124057A (zh) 2011-07-13
CN102124057B true CN102124057B (zh) 2013-01-02

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CN2009801312949A Expired - Fee Related CN102124057B (zh) 2008-09-01 2009-08-20 热传导性硅氧烷组合物和半导体器件

Country Status (7)

Country Link
US (1) US20110163460A1 (enExample)
EP (1) EP2331637A1 (enExample)
JP (1) JP6014299B2 (enExample)
KR (1) KR20110053441A (enExample)
CN (1) CN102124057B (enExample)
TW (1) TW201012876A (enExample)
WO (1) WO2010024305A1 (enExample)

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JP5534837B2 (ja) * 2010-01-28 2014-07-02 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP2012069783A (ja) * 2010-09-24 2012-04-05 Yokohama Rubber Co Ltd:The 熱伝導性シリコーン組成物およびこれを用いる実装基板
JP2014080522A (ja) * 2012-10-17 2014-05-08 Shin Etsu Chem Co Ltd 熱伝導性樹脂組成物
KR101911690B1 (ko) * 2012-12-07 2018-10-25 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물 및 광반도체 디바이스
KR101413065B1 (ko) 2013-03-04 2014-07-04 주식회사 에이치알에스 열전도성 액상 실리콘 점착제 조성물 및 이의 제조 방법
JP5898139B2 (ja) 2013-05-24 2016-04-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP5947267B2 (ja) * 2013-09-20 2016-07-06 信越化学工業株式会社 シリコーン組成物及び熱伝導性シリコーン組成物の製造方法
WO2015155948A1 (ja) * 2014-04-09 2015-10-15 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電気・電子機器
JP2016098319A (ja) * 2014-11-21 2016-05-30 信越化学工業株式会社 低摩擦性シリコーンコート剤組成物及び低摩擦性シリコーンゴムコーティング被膜の形成方法
KR102570177B1 (ko) * 2015-04-30 2023-08-24 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 그리스 조성물
EP3398996B1 (en) * 2015-12-28 2021-01-27 Sumitomo Chemical Company, Limited Composition
JP6675543B2 (ja) * 2016-02-05 2020-04-01 北川工業株式会社 熱伝導部材、熱伝導部材の製造方法及びシリコーン混合物
WO2017152353A1 (en) * 2016-03-08 2017-09-14 Honeywell International Inc. Phase change material
KR20200033274A (ko) * 2017-07-24 2020-03-27 다우 도레이 캄파니 리미티드 열전도성 실리콘 겔 조성물 열전도성 부재 및 방열 구조체
JP6895364B2 (ja) * 2017-10-20 2021-06-30 本田技研工業株式会社 放熱性塗料組成物、放熱性被膜及び被膜形成方法
JP2019077843A (ja) * 2017-10-27 2019-05-23 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物およびその硬化物
JP7495434B2 (ja) 2019-06-21 2024-06-04 ダウ シリコーンズ コーポレーション 熱伝導性シリコーン組成物
US11845869B2 (en) 2019-06-21 2023-12-19 Dow Silicones Corporation Method for producing thixotropic curable silicone composition
CN110591635B (zh) * 2019-07-05 2021-10-29 惠州瑞德新材料科技股份有限公司 一种密封胶及制备方法
EP4114892B1 (en) 2020-03-05 2024-01-10 Dow Global Technologies LLC Shear thinning thermally conductive silicone compositions
US20230167301A1 (en) * 2020-05-22 2023-06-01 Shin-Etsu Chemical Co., Ltd. High thermal conductive silicone composition
JP2023044473A (ja) 2021-09-17 2023-03-30 デュポン・東レ・スペシャルティ・マテリアル株式会社 熱伝導性シリコーン組成物
KR20240103046A (ko) * 2022-01-28 2024-07-03 와커 헤미 아게 경금속 합금-함유 열 전도 페이스트
EP4469519B1 (de) * 2022-01-28 2025-08-27 Wacker Chemie AG Aluminiumhaltige wärmeleitpasten
CN116102890B (zh) * 2023-02-09 2024-08-13 广州回天新材料有限公司 一种有机硅橡胶组合物及其制备方法

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CN101151326A (zh) * 2005-03-30 2008-03-26 陶氏康宁东丽株式会社 导热性硅橡胶组合物

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JP3580366B2 (ja) * 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
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Also Published As

Publication number Publication date
CN102124057A (zh) 2011-07-13
WO2010024305A1 (en) 2010-03-04
TW201012876A (en) 2010-04-01
EP2331637A1 (en) 2011-06-15
JP6014299B2 (ja) 2016-10-25
KR20110053441A (ko) 2011-05-23
US20110163460A1 (en) 2011-07-07
JP2010059237A (ja) 2010-03-18

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