TW200818380A - Substrate processing method and substrate processing apparatus - Google Patents
Substrate processing method and substrate processing apparatus Download PDFInfo
- Publication number
- TW200818380A TW200818380A TW096123286A TW96123286A TW200818380A TW 200818380 A TW200818380 A TW 200818380A TW 096123286 A TW096123286 A TW 096123286A TW 96123286 A TW96123286 A TW 96123286A TW 200818380 A TW200818380 A TW 200818380A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- posture
- processing
- tilt
- cleaning
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 371
- 238000012545 processing Methods 0.000 title claims abstract description 233
- 238000003672 processing method Methods 0.000 title claims description 24
- 239000007788 liquid Substances 0.000 claims description 122
- 230000007246 mechanism Effects 0.000 claims description 74
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 230000008859 change Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 230000009466 transformation Effects 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 abstract description 118
- 238000011161 development Methods 0.000 abstract description 44
- 239000012530 fluid Substances 0.000 abstract 1
- 230000036544 posture Effects 0.000 description 200
- 238000002360 preparation method Methods 0.000 description 48
- 230000032258 transport Effects 0.000 description 46
- 238000000034 method Methods 0.000 description 33
- 230000008569 process Effects 0.000 description 24
- 238000001035 drying Methods 0.000 description 17
- 238000012546 transfer Methods 0.000 description 17
- 238000005406 washing Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 6
- 239000003480 eluent Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000003708 ampul Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- 239000001653 FEMA 3120 Substances 0.000 description 1
- 208000003251 Pruritus Diseases 0.000 description 1
- 244000295923 Yucca aloifolia Species 0.000 description 1
- 235000004552 Yucca aloifolia Nutrition 0.000 description 1
- 235000012044 Yucca brevifolia Nutrition 0.000 description 1
- 235000017049 Yucca glauca Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000007803 itching Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006201040A JP2008028247A (ja) | 2006-07-24 | 2006-07-24 | 基板処理方法および基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200818380A true TW200818380A (en) | 2008-04-16 |
| TWI343088B TWI343088B (enrdf_load_stackoverflow) | 2011-06-01 |
Family
ID=39022826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096123286A TW200818380A (en) | 2006-07-24 | 2007-06-27 | Substrate processing method and substrate processing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2008028247A (enrdf_load_stackoverflow) |
| KR (1) | KR100866001B1 (enrdf_load_stackoverflow) |
| CN (1) | CN101114578B (enrdf_load_stackoverflow) |
| TW (1) | TW200818380A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI407270B (zh) * | 2009-12-30 | 2013-09-01 | Au Optronics Corp | 顯影設備 |
| TWI415210B (zh) * | 2008-06-12 | 2013-11-11 | Semes Co Ltd | Substrate transfer apparatus and method, and a substrate manufacturing apparatus having the same |
| TWI874634B (zh) * | 2020-04-06 | 2025-03-01 | 日商日本電氣硝子股份有限公司 | 玻璃板的製造方法及其製造裝置 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103324038A (zh) * | 2013-06-25 | 2013-09-25 | 京东方科技集团股份有限公司 | 一种显影装置及显影方法 |
| CN104347352B (zh) * | 2013-07-31 | 2018-05-29 | 细美事有限公司 | 一种基板处理装置及基板处理方法 |
| JP6887616B2 (ja) * | 2017-05-09 | 2021-06-16 | 日本電気硝子株式会社 | ガラス板の搬送装置及びガラス板の製造方法 |
| CN108325900B (zh) * | 2017-09-19 | 2021-02-02 | 福建晟哲自动化科技有限公司 | 一种液晶面板清洗设备 |
| CN108000368B (zh) * | 2017-12-01 | 2020-03-31 | 福建和达玻璃技术有限公司 | 曲边玻璃盖板防眩表面处理设备与处理方法 |
| CN107962501B (zh) * | 2017-12-01 | 2019-09-20 | 福建和达玻璃技术有限公司 | 带倾角的异形玻璃盖板防眩表面处理设备 |
| CN108380564A (zh) * | 2018-02-05 | 2018-08-10 | 武汉华星光电技术有限公司 | 具有自动清洗功能的显影腔室及其清洗组件、清洗方法 |
| JP7642005B2 (ja) | 2023-03-10 | 2025-03-07 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板姿勢変更装置および基板処理装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3704064B2 (ja) | 2001-07-05 | 2005-10-05 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
| JP4076755B2 (ja) | 2001-11-02 | 2008-04-16 | アルプス電気株式会社 | ウエット処理装置およびウエット処理方法 |
| JP4309782B2 (ja) | 2004-02-27 | 2009-08-05 | シャープ株式会社 | 液処理装置および液処理方法 |
| KR100602410B1 (ko) * | 2006-01-27 | 2006-07-20 | 주식회사 디엠에스 | 평판 처리 장치 |
-
2006
- 2006-07-24 JP JP2006201040A patent/JP2008028247A/ja not_active Abandoned
-
2007
- 2007-06-27 TW TW096123286A patent/TW200818380A/zh not_active IP Right Cessation
- 2007-07-20 CN CN2007101373080A patent/CN101114578B/zh not_active Expired - Fee Related
- 2007-07-24 KR KR1020070073891A patent/KR100866001B1/ko not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI415210B (zh) * | 2008-06-12 | 2013-11-11 | Semes Co Ltd | Substrate transfer apparatus and method, and a substrate manufacturing apparatus having the same |
| TWI407270B (zh) * | 2009-12-30 | 2013-09-01 | Au Optronics Corp | 顯影設備 |
| TWI874634B (zh) * | 2020-04-06 | 2025-03-01 | 日商日本電氣硝子股份有限公司 | 玻璃板的製造方法及其製造裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100866001B1 (ko) | 2008-10-29 |
| CN101114578B (zh) | 2011-08-10 |
| TWI343088B (enrdf_load_stackoverflow) | 2011-06-01 |
| KR20080009661A (ko) | 2008-01-29 |
| CN101114578A (zh) | 2008-01-30 |
| JP2008028247A (ja) | 2008-02-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |