1364069 九、發明說明： C 明戶斤屬系餘々頁 發明領域 本發明係有關-種基板之處理裝£，該處理裳置係以 5預定角度傾斜搬送基板時併同進行處理者。 C 前^^标】 發明背景 • 液晶顯示裝置所用的玻璃製之基板上，形成有電路圖 案。為在基板上形成電路圖案，可採用微影製程技術。眾 !〇所周知，微影製程係在前述基板上塗佈抗钱劑並透過已 形成有電路圖案之遮罩而對該抗蝕劑照射光。 接著，去除抗钮劑中未照射到光之部分，或照射到光 之。P刀ϋ對基板中已去除掉抗餘劑之部分進行姓刻，飯 刻後再去除抗_等，藉由反覆進行前述一連串動作而在 15 前述基板上形成電路圖案。1364069 IX. INSTRUCTIONS OF THE INVENTION: C. The present invention relates to a processing apparatus for a substrate which is disposed at the same angle as a predetermined angle and transported to the substrate. C. Before the background of the invention Background of the invention: A circuit pattern is formed on a glass substrate used for a liquid crystal display device. In order to form a circuit pattern on a substrate, a lithography process technique can be employed. As is well known, the lithography process applies an anti-money agent to the substrate and transmits the light to the resist through a mask having a circuit pattern formed thereon. Next, the portion of the anti-buckling agent that is not irradiated with light or the light is irradiated. The P blade slaps the portion of the substrate from which the anti-surplus agent has been removed, and removes the anti-metal after the meal, and forms a circuit pattern on the substrate 15 by repeating the above-described series of operations.
此種微影製程中，有如下之程序，即，在前述基板上 塗佈顯像液、姓刻液，或姓刻後藉由用以去除抗姓劑之剝 離液等而對基板進行處理之程序，進而，還有以洗淨液進 行洗淨之程序’洗淨後必須去除附著殘留在基板上的洗淨 2〇 液之乾燥程序。 歷來，對基板進行前述—連串處理時，該基板係藉由 讓軸線成水㈣加魏置之料雜，在水倾態下而依 次搬送至各處理室，並於Μ理室㈣行前述各種處理。 然而，近年來，液 晶顯示裝置所用的玻璃製之基板有 5 自喜匕且薄型化之傾向1此，若水平搬送基板因基板 各的重量，搬送滾輪間之基板的偏斜情形將加劇，使得 "處理i内之處理變得無法均等地在基板的整個板 面上進 旦再者，基板大型化時，供給而滯留在基板上的處理液 里將増大，隨著滞留在基板上的處理液量，施加於前述搬 送軸之負荷變大，因此也使得搬送軸偏斜情形加重。故， 基板會跟搬送軸一同偏斜，導致無法進行均等處理。 因此，近來為減少基板之偏斜，以預定角度傾斜搬送 基板時併同進行處理此一方式已漸為實用化。若傾斜搬送 基板’不僅可去除搬送滾輪間之因基板自身的重量而產生 的偏斜’亦可防止水平地進行搬送時，處理液滯留在基板 上，並因基板自身的重量而使得基板偏斜等狀況。 傾斜搬送前述基板時，係以支撐滾輪支撐基板之傾斜 方向的下面，並以驅動滾輪支撐基板下端。又’藉由旋轉 驅動該驅動滾輪’而將前述基板朝驅動滾輪之旋轉方向搬 送。 别述支樓滾輪係沿基板之搬送方向而以預定間隔，再 者’讓其軸線與呈傾斜狀之基板的板面平行地而加以設 置’即’該支標滾輪在軸方向上，係隔有預定間隔而可旋 轉地，設在與基板之傾斜角度為相同角度而傾斜配置之多 數安裝軸上。 【韻^明内容】 發明欲解決之課題 惟，如前述，利用下述構造，即，藉由設在安裝軸上 之支撐滾輪支樓傾斜基板’並驅動卡合於基板下端之驅動 滾輪而搬送基板時’由於基板大型化，前述安裝軸無法避 免長尺寸化。即’女裝轴必須較呈傾斜狀之基板的上下方 向尺寸（高度尺寸）更長，再者，近來伴隨著基板大型化，必 須讓安裝轴為2m以上的長度尺寸。 安裝轴長尺寸化’特別是2m以上的長度，由於該安裝 軸係以預定肖度顺設置’以及隔著切滾輪而增加基板 的重量等情形’钱軸以生偏斜。若安裝軸產生偏斜， 以預定間_在該安裝軸上的多數支樓滾輪，即無法以均 等的強度碰觸基板板面。 即’會產生幾乎無法碰觸到基板的支撐滚輪 ，以及太 過強力地碰觸基板之支撐滚輪 因此，變得無法順暢地搬 送基板，且有因強力地碰觸之切滾輪而損傷基板之虞。 本發明係提供-種基板之處理袭置，該處理裝置在以 預疋角度傾斜搬送基板時，可讓多數支撐滾輪均等地碰觸 基板而加以搬送。 用以解決課題之手段 本發明係一種基板之處理裝置，係以預定角度傾斜搬 送基板，且於雜送過財_基板騎肢處理者，包 含有：多數處理室’係崎前述基板之寬度尺寸更小的寬 度尺寸形成且並舰置’心料述絲進行各個預定處 理，多數安裝構件，係長度尺寸設定為較前述基板之高度 尺寸更短，且在各處理室内於上下方向以預定間隔地且與 前述基板之搬送方向平行地設置；支撐滾輪，係可旋轉地 設於各安裝構件上’用以支樓於前述處理室内以預定角度 傾斜搬入之前述基板的傾斜方向下側之面；及驅動滾輪， 係可旋轉驅動地設於各處理室内，且藉由支撐並旋轉驅動 前述基板之下端，而將該基板朝預定方向搬送，該基板係 藉由前述支撐滾輪支撐傾斜方向下側之面者。 本發明係一種基板之處理裝置，係以預定角度傾斜搬 送基板，且於該搬送過程中對該基板進行預定處理者，包 含有：多數處理室，係以較前述基板之寬度尺寸更小的寬 度尺寸形成且並列設置，用以對前述基板進行各個預定處 理；支撐滾輪，係用以支撐以預定角度傾斜送入前述處理 室内之前述基板的傾斜方向下側之面；及驅動滾輪，係可 旋轉驅動地設於各處理室内，且藉由支撐並旋轉驅動前述 基板之下端’而將該基板朝預定方向搬送’該基板係藉由 前述支撐滾輪支撐傾斜方向下側之面者。 發明之功效 依本發明，係讓處理室之寬度尺寸小於基板的寬度尺 寸，並讓設有支撐滾輪的安裝構件之長度尺寸短於基板的 高度尺寸’又’沿處理室的寬度方向設置該安裝構件。因 此，可讓安裝構件的長度尺寸短於基板的寬度尺寸及高度 尺寸許多，故’安裝構件不易產生偏斜’並可藉由設於該 安裝構件上之支撐滾輪而確實地支撐住基板。 圖式簡單説明 第1圖係例示本發明一實施態樣之處理裝置在寬度方 丄 *364069 向上的縱剖面圖。 第2圖相同地，係處理裝置中第2處理部分之縱剖面圖。 第3圖相同地，係處理裝置的橫刮面圖。 第4圖係例示支揮滾輪的安裝構造之剖面圖。 5 【實施方式】 較佳實施例之詳細說明 第1圖係概略地例示本發明之處理裝置的構造圖，該處 理裝置具有框體1。在本實施態樣中，該框體1内，係藉由 於長向方向上以預定間隔而加以設置之多數間隔壁2，而間 1〇隔出第1乃至第3等三個處理室3〜5。即，框體1在橫方向上 並列形成有第1乃至第3處理室3〜5。 第3圖係該框體丨的橫剖面圖，框體丨的長向方向一端之 側壁la上，細長狀之搬入口 6在上下方向上，係以預定角 度，譬如75度之角度傾斜而形成，長向方向另一端的側壁 lb上，同樣地以相同角度傾斜形成有細長狀之搬出口 7 ^將 框體1内間隔為三個處理室3〜5之二個間隔壁2上，形成有 以同於前述搬入口 6及搬出口 7之角度而傾斜的細長狀連通 σ 8。 第1乃至第3處理室3〜5内，具預定厚度之帶板狀的多 2〇數安裝構件，本實施態樣中為四個安裝構件η，在上下方 向上，係以預定間隔而水平地，且如第2圖所示，錯開地設 在i後方向上，俾偏離以相同角度傾斜的搬入口 6、搬出 口 7及連通口8(第2圖中僅例示連通口 8)。 如第3圖所示，前述框體丨之長向方向兩端的側壁丨&、 9 1364069 lb之内面，及一對間隔壁2之兩側面上，L字形的承接具12 係單邊固定住地而加以設置。前述安裝構件11之長向方向 兩端面上，對應前述承接具12之L字形的安裝具13，係單邊 固定住地而加以設置。 5 再者，前述承接具12之另一邊上，藉由以螺絲穿過固 定住前述安裝具13之另一邊，前述安裝構件11係如前述 地，在上下方向上以預定間隔而水平地，且錯開前後二者 地設在各處理室3〜5内。 各安裝構件11的上面上，四個支撐滾輪15係分別與軸 10 線垂直而可旋轉地加以設置。第4圖例示前述支撐滚輪15之 安裝構造。即，安裝構件11上，在前後方向的前端側上， 沿前後方向而形成有細長之安裝孔16。 前述支撐滾輪15上設有軸承17，該軸承17之内輪上插 通有安裝螺栓18。安裝螺栓18突出於前述安裝孔16之端部 15 上，隔著墊片19而螺合有螺帽20。藉此，前述支撐滾輪15 係可調整前後方向之安裝位置地而安裝於前述安裝構件11 上。 如第1圖及第2圖所示，各處理室3〜5之下端部處，多 數驅動滾輪22係沿處理室3〜5的寬度方向且以預定間隔而 20 加以配置。各驅動滾輪22係藉由驅動馬達23而可旋轉驅動。 由形成在前述第1處理室3之側壁la上的搬入口 6,以75 度之角度傾斜供給液晶面板所用的玻璃製之基板W。供給 至第1處理室3之基板W，其下端係以驅動滾輪22而加以支 撐，且傾斜方向之下側面係以支撐滾輪15而加以支撐。因 10 此，若前述驅動滾輪22藉由驅動馬達23而旋轉驅動，前述 基板W會朝驅動滾輪22之旋轉方向，即第2處理室4的方向 而加以搬送。 前述基板W為2m角形以上之大小，譬如具有高度尺寸 為2200mm，寬度尺寸為2600mm之大小。第1乃至第3處理 室3〜5的寬度尺寸係設定為短於前述基板w的寬度尺寸許 多。譬如，設定為基板W的寬度尺寸的二分之--三分之 二的程度。譬如，設定為基板W的高度尺寸的二分之一〜 三分之二的程度。藉此，安裝構件11可做成不易因自身重 量而產生偏斜之長度尺寸，譬如可做成比2m短很多的尺寸。 縱或讓前述安裝構件11的長度尺寸為不易因自身重量 而產生偏斜的長度尺寸，但由於各處理室3〜5的寬度尺寸 亦設定為短於基板W的寬度尺寸，因此，安裝構件u的長 度尺寸相較於處理室3〜5的寬度尺寸，並不會短太多。 藉此’設於安裝構件11上之支撐滾輪15，可沿寬度方 向而確實地支撐住基板W位在各處理室3〜5内之部分。 即，縱或讓安裝構件11較短，但對應該態樣而讓各處理室3 〜5之寬度尺寸亦較短，因此基板w位在各處理室3〜5内之 部分在寬度方向上’可確實地被支撐滾輪15支撐住。 前述基板W在第1處理室3中，係藉由未予圖式之洗淨 刷而加以洗淨。於第1處理室3中洗淨的基板w，於第2處理 室4内進行沖洗處理。即，第2處理室4内，經由流量調節閥 而連接於沖洗液供給源（均未予圖式）之給液管25,係以預定 間隔而分離地配設在上下方向。 1364069 各給液管25上’以預定間隔設有多數噴頭26，由該等 噴頭26而對在第2處理室3内進行搬送之基板W的傾斜方向 上側之面，噴射沖洗液。 藉由將設有用以對基板W喷射沖洗液之喷頭26的給液 5 管25，以預定間隔而配置在基板W的高度方向上，於該基 板W的高度方向，可藉由設在各給液管25上的流量調節閥 (未予圖式），調整由各給液管25之喷頭26而喷射供給至基板 W上的沖洗液量。即’供給至基板w之板面上的沖洗液， 係由基板W的高度方向上方而朝下方流動》因此，為對各 10 給液管25提供相同量之沖洗液，相較於基板w的高度方向 上方’下方由沖洗液所接收到的沖洗作用變大，因而變得 無法均等地對基板W的整個板面進行沖洗處理。 然而’由於多數給液管25係以預定間隔而分離地配設 在基板W的高度方向上，故藉由調整供給至各給液管25的 15沖洗液量，就可調節供給到基板W板面在高度方向之上部 及下部的沖洗液量。 因此，若讓供給到基板W上部的沖洗液量多於供給到 下部之沖洗液量’供給到上部之沖洗液將流至下部，藉此’ 可讓下部所承受的沖洗作用大致與上部相同。舉其一例， 20即，若設定來自各供給管25之沖洗液量，俾讓在呈傾斜狀 之基板W板面上流動的沖洗液之流速與流量的總和，不論 在基板W的高度方向上任一位置都相等，就可大致均等地 對基板W的整個板面進行處理。 本實施態樣中，係以沖洗液對基板…進行處理之例， 12 但縱或是沖洗液以外的處理液，譬如藉由#刻液及剝離液 等處理液而對基板W進行處理之場合，藉由如前述之方式 來調整處理液之供給量，就可均等地對基板w的整個板面 進行處理。 5 將第2處理室4内經沖洗處理之基板W，送至第3處理室 5。該第3處理室5中，未予圖式之氣刀（air_knife)係沿著與基 板W之搬送方向相交又之上下方向而加以配置，並進行乾 燥處理’即’藉由氣壓去除進經行沖洗處理而附著在基板 W板面上的沖洗液。再者，於第3處理室5内經乾燥處理的 10基板w ’係由搬出口 7搬出而送至次一程序。 藉由如此構成的處理裝置，可藉由設在沿各處理室3 〜5之寬度方向而水平配置之安裝構件^上的支撐滾輪 15，支撐住以預定角度傾斜搬送的基板w之傾斜方向下側 之面。 15 各處理室3〜5之寬度尺寸係設定為較基板w的寬度尺 寸小二分之--三分之二程度，且安裝構件11的長度尺寸 係設定為較基板W的高度尺寸小二分之一〜三分之二程 度。 若如前述般，將安裝構件11的長度尺寸設定為較短尺 20寸’可防止該安裝構件η因自身重量而產生偏斜問題。因 此，設於各安裝構件11上之多數支撐滾輪15，可不產生水 平方向之鬲度差地進行定位。又，設於各安裝構件η上的 支撐滾輪15，可藉由設在安裝構件u上的安裝孔16而調整 前後方向的安裝位置。 13 1364069 因此，可讓設在各安裝構件讥上的支撐滾輪15，強力 地碰觸基板w之傾斜方向的下面’故，驅動驅動滾輪22時， 可藉由前述支撐滾輪15而順暢地導引並搬送前述基板霤。 即，不會對基板W造成損傷而可確實地進行搬送。 5 相較於處理室3〜5的寬度尺寸，若安裝構件U之長度 尺寸過短，於各處理室3〜5中，在基板貿的寬度方向上， 支樓滾輪15未予支樓的部分將變多，而該部分有產生偏斜 之虞。 然而，本實施態樣中，不僅是將安裝構件1丨設定為不 10易因自身重量而產生偏斜之長度，且由於讓處理室3〜5的 寬度尺寸縮小，故安裝構件11的長度尺寸相對於各處理室3 〜5的寬度尺寸，並未大幅短少。藉此，基板w位在各處理 室3〜5内之部分，可藉由設在前述安裝構件u上的多數支 撐滾輪15，而確實地讓寬度方向予以支撐住。 15 即，若僅僅是將安裝構件11設定為較短尺寸，俾不易 因自身重量而產生偏斜，則相對各處理室3〜5之寬度尺 寸’安裝構件11的長度尺寸就顯得過短，而產生如丁之情 況’即’基板W位在各處理室3〜5内的部分中之寬度方向， 無法以支撐滾輪15而確實地加以支撐，將有基板w變形且 20無法順暢地進行搬送之虞。 然而，安裝構件11並不僅僅只是設定得較短，由於處 理室3〜5的寬度尺寸亦縮小，故相對於基板W在各處理室3 〜5中的寬度尺寸，安裝構件11並不會變得過短。因此，可 藉由設在安裝構件11上之支撐滾輪15 ’而確實地支稽住基 14 °^4〇69 板W位在各處理室3〜5内的部分。 用以進行基板W之沖洗處理的第2處理室4中，水平地 配置有多數設有用以喷射沖洗液之噴頭26的給液管25。供 給至各給液管25之沖洗液量，可#由未予圖式之流量控制 5 閱而加以調整。 因此，藉由讓供給至位在傾斜搬送之基板W的高度方 向上方的給液管25之沖洗液量，多於供給至位在下方之給 液管25的沖冼液量，可以大致相同的狀態在基板w的上下 方向進行沖洗處理。即，可大致均等地對整個基板W的板 10 面進行處理。 藉由讓處理室3〜5的寬度尺寸小於基板w的寬度尺 寸’基板W即如第1圖中虛線所示般，在多數處理室3〜5 内’以橫跨相鄰之多數處理室狀態而加以搬送。藉此，基 板W中’譬如搬送方向之前端部在第2處理室4内進行沖洗 15 處理時’後端部是在第1處理室3内進行刷洗。同樣地，前 端部在第3處理室5内進行乾燥處理時，後端部在第2處理室 4内進行沖洗處理。 如此’邊搬送基板W ’邊以多數處理室3〜5對該基板 W連續地進行處理時，由於可同時進行相鄰之處理室内的 2〇不同處理，故可效率良好地進行基板W的處理。 本發明並不限於前述一實施態樣，可做各種變形。譬 如’雖以並列設置有三個處理室之例作為處理裝置之態 樣’但處理室之數目並不限於此，再者，以各處理室對基 板進订處理的種類當然亦未有限定。 15 1364069 ί：圖式簡單說明3 第1圖係例示本發明一實施態樣之處理裝置在寬度方 向上的縱剖面圖。 第2圖相同地，係處理裝置中第2處理部分之縱剖面圖。 5 第3圖相同地，係處理裝置的橫剖面圖。 第4圖係例示支撐滾輪的安裝構造之剖面圖。In the lithography process, there is a procedure of applying a developing solution, a surname to the substrate on the substrate, or processing the substrate by removing the stripping solution or the like against the surname. The program, in addition, has a procedure of washing with a washing liquid. After washing, it is necessary to remove the drying procedure of the washing liquid remaining on the substrate. Conventionally, when the substrate is subjected to the above-described series of processes, the substrate is sequentially transferred to the processing chambers in the water tilt state by allowing the axis to be water (4) plus the material, and the row is processed in the processing chamber (4). Various treatments. However, in recent years, the glass substrate used in the liquid crystal display device has a tendency to be self-satisfied and thinner. When the substrate is horizontally transferred, the skew of the substrate between the transfer rollers is intensified due to the weight of each substrate. " The processing in the processing i cannot be uniformly performed on the entire surface of the substrate. When the substrate is enlarged, the processing liquid that is supplied and retained on the substrate will be large, and the processing will remain on the substrate. Since the amount of liquid applied to the transport shaft is increased, the deflection of the transport shaft is also increased. Therefore, the substrate is skewed together with the transport shaft, resulting in inability to perform equal processing. Therefore, in order to reduce the skew of the substrate, it has been put into practical use in the same manner as when the substrate is tilted at a predetermined angle and processed. When the inclined transfer substrate 'not only removes the skew caused by the weight of the substrate itself between the transfer rollers, but also prevents horizontal transfer, the treatment liquid stays on the substrate, and the substrate is deflected due to the weight of the substrate itself. And so on. When the substrate is tilted and conveyed, the support roller supports the lower surface of the substrate in the oblique direction, and the lower end of the substrate is supported by the drive roller. Further, the substrate is conveyed in the rotation direction of the driving roller by rotationally driving the driving roller. The roller of the support tower is arranged at a predetermined interval along the conveying direction of the substrate, and then the axis is arranged in parallel with the plate surface of the inclined substrate. That is, the roller is spaced in the axial direction. It is rotatably provided at a predetermined interval, and is provided on a plurality of mounting shafts which are disposed at an angle equal to the inclination angle of the substrate. [Rhyme] Contents to be Solved by the Invention However, as described above, the structure is carried out by tilting the substrate 'on the supporting roller base provided on the mounting shaft and driving the driving roller that is engaged with the lower end of the substrate. In the case of a substrate, the mounting shaft cannot be lengthened due to an increase in size of the substrate. In other words, the 'women's shaft must have a longer dimension (height size) than the upper and lower sides of the substrate which is inclined, and further, the size of the mounting shaft is required to be 2 m or more in order to increase the size of the substrate. The length of the mounting shaft is 'specifically, the length is 2 m or more, and the mounting shaft is arranged at a predetermined degree of shading', and the weight of the substrate is increased by the cutting roller. If the mounting shaft is deflected, it is impossible to touch the board surface with equal strength with a predetermined number of roller rollers on the mounting shaft. That is, 'the support roller that hardly touches the substrate and the support roller that touches the substrate too strongly, so that the substrate cannot be smoothly conveyed, and the substrate is damaged by the strong touch of the roller. . The present invention provides a substrate for processing. When the substrate is tilted at a pre-turn angle, the processing device allows a plurality of support rollers to uniformly touch the substrate and transport them. Means for Solving the Problems The present invention relates to a substrate processing apparatus which is configured to obliquely transport a substrate at a predetermined angle, and to pass the miscellaneous material to the substrate, and includes: a plurality of processing chambers; A smaller width dimension is formed and the ship is placed in a 'hearted wire' for each predetermined process, and a plurality of mounting members are set to have a length dimension shorter than a height dimension of the substrate, and are spaced apart at a predetermined interval in each of the processing chambers in the up and down direction. And being provided in parallel with the transport direction of the substrate; the support roller is rotatably provided on each of the mounting members; a surface for tilting the lower side of the substrate into which the support is tilted at a predetermined angle in the processing chamber; and The driving roller is rotatably driven in each processing chamber, and the substrate is conveyed in a predetermined direction by supporting and rotating the lower end of the substrate, and the substrate supports the lower side of the oblique direction by the supporting roller By. The present invention relates to a substrate processing apparatus which is configured to obliquely transport a substrate at a predetermined angle, and to perform predetermined processing on the substrate during the transporting process, including: a plurality of processing chambers having a width smaller than a width dimension of the substrate Forming and juxtaposed for performing predetermined processing on the substrate; supporting rollers for supporting a surface inclined to a lower side of the substrate in the processing chamber at a predetermined angle; and driving the roller to be rotatable The substrate is driven in each of the processing chambers, and the substrate is transported in a predetermined direction by supporting and rotating the lower end of the substrate. The substrate is supported by the support roller to support the lower side in the oblique direction. According to the present invention, the width of the processing chamber is smaller than the width dimension of the substrate, and the length of the mounting member provided with the supporting roller is shorter than the height dimension of the substrate 'and' is disposed along the width direction of the processing chamber. member. Therefore, the length of the mounting member can be made shorter than the width dimension and the height of the substrate, so that the mounting member is less likely to be deflected, and the substrate can be reliably supported by the supporting roller provided on the mounting member. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a longitudinal sectional view showing a processing apparatus according to an embodiment of the present invention in a width direction of *364069. Similarly, Fig. 2 is a longitudinal sectional view showing a second processing portion in the processing apparatus. Similarly, Fig. 3 is a cross-sectional view of the processing apparatus. Fig. 4 is a cross-sectional view showing an attachment structure of the support roller. [Embodiment] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Fig. 1 is a view schematically showing a configuration of a processing apparatus according to the present invention, which has a housing 1. In the present embodiment, the plurality of partition walls 2 are provided in the frame body 1 at predetermined intervals in the longitudinal direction, and the first to third processing chambers 3 to 3 are separated. 5. In other words, the first and third processing chambers 3 to 5 are formed in parallel in the lateral direction of the casing 1. Fig. 3 is a cross-sectional view of the frame body, the side wall la of one end of the frame body in the longitudinal direction, and the elongated inlet 6 is formed at an angle of, for example, 75 degrees in the up and down direction. In the side wall lb of the other end in the longitudinal direction, the elongated outlet 7 is formed obliquely at the same angle. The partition 1 is partitioned into two partition walls 2 of the three processing chambers 3 to 5, and is formed with The elongated connection σ 8 is inclined at the same angle as the inlet 6 and the outlet 7 . In the first to third processing chambers 3 to 5, a plurality of two-numbered mounting members having a predetermined thickness and a plate shape are four mounting members η in the present embodiment, and are horizontally arranged at predetermined intervals in the vertical direction. As shown in Fig. 2, in the rear direction of i, the yoke is offset from the carry-in port 6, the carry-out port 7, and the communication port 8 which are inclined at the same angle (only the communication port 8 is exemplified in Fig. 2). As shown in Fig. 3, the inner side of the side wall 丨&, 9 1364069 lb in the longitudinal direction of the frame body, and the two sides of the pair of partition walls 2, the L-shaped socket 12 is unilaterally fixed. And set it up. The L-shaped mounting members 13 corresponding to the receiving members 12 are provided on both end faces of the mounting member 11 in the longitudinal direction, and are fixed by a single side. Further, on the other side of the receiving member 12, the mounting member 11 is horizontally spaced at a predetermined interval in the up-and-down direction as described above by fixing the other side of the mounting member 13 with a screw. Both of them are disposed in the respective processing chambers 3 to 5 before and after the shift. On the upper surface of each of the mounting members 11, four support rollers 15 are rotatably disposed perpendicular to the axis of the shaft 10. Fig. 4 illustrates the mounting structure of the aforementioned support roller 15. In other words, in the attachment member 11, an elongated attachment hole 16 is formed in the front-rear direction on the distal end side in the front-rear direction. A bearing 17 is disposed on the support roller 15, and a mounting bolt 18 is inserted into the inner wheel of the bearing 17. The mounting bolt 18 protrudes from the end portion 15 of the mounting hole 16, and the nut 20 is screwed through the spacer 19. Thereby, the support roller 15 is attached to the mounting member 11 by adjusting the mounting position in the front-rear direction. As shown in Figs. 1 and 2, at the lower end portions of the respective processing chambers 3 to 5, most of the driving rollers 22 are arranged at predetermined intervals 20 in the width direction of the processing chambers 3 to 5. Each of the drive rollers 22 is rotatably driven by a drive motor 23. The glass substrate W for the liquid crystal panel is supplied obliquely at an angle of 75 degrees from the inlet 6 formed in the side wall 1a of the first processing chamber 3. The substrate W supplied to the first processing chamber 3 is supported by the driving roller 22 at its lower end, and the side surface in the oblique direction is supported by the supporting roller 15. As a result, when the drive roller 22 is rotationally driven by the drive motor 23, the substrate W is conveyed in the direction in which the drive roller 22 rotates, that is, in the direction of the second processing chamber 4. The substrate W has a size of 2 m or more, for example, has a height of 2,200 mm and a width of 2,600 mm. The width dimensions of the first to third processing chambers 3 to 5 are set to be shorter than the width dimension of the substrate w. For example, it is set to a degree of two-thirds of the width dimension of the substrate W. For example, it is set to a degree of one-half to two-thirds of the height dimension of the substrate W. Thereby, the mounting member 11 can be made into a length which is less likely to be deflected by its own weight, and can be made much smaller than 2 m, for example. The length dimension of the mounting member 11 is not long enough to be skewed by its own weight, but since the width dimension of each of the processing chambers 3 to 5 is also set shorter than the width dimension of the substrate W, the mounting member u The length dimension is not too short compared to the width dimension of the processing chamber 3~5. Thereby, the support roller 15 provided on the mounting member 11 can reliably support the portion of the substrate W located in each of the processing chambers 3 to 5 in the width direction. That is, the longitudinal direction or the mounting member 11 is made shorter, but the width of each of the processing chambers 3 to 5 is also short, so that the portion of the substrate w in each of the processing chambers 3 to 5 is in the width direction. It can be reliably supported by the support roller 15. The substrate W is washed in the first processing chamber 3 by a cleaning brush not shown. The substrate w cleaned in the first processing chamber 3 is subjected to a rinsing treatment in the second processing chamber 4. In other words, in the second processing chamber 4, the liquid supply pipe 25 connected to the rinsing liquid supply source (none of which is not shown) via the flow rate adjusting valve is disposed in the vertical direction at a predetermined interval. 1364069 Each of the liquid supply pipes 25 is provided with a plurality of heads 26 at predetermined intervals, and the heads 26 are sprayed with the flushing liquid on the upper side in the oblique direction of the substrate W conveyed in the second processing chamber 3. The liquid supply 5 tube 25 provided with the head 26 for ejecting the rinsing liquid to the substrate W is disposed at a predetermined interval in the height direction of the substrate W, and can be disposed in the height direction of the substrate W by The flow rate adjusting valve (not shown) on the liquid supply pipe 25 adjusts the amount of the flushing liquid sprayed onto the substrate W by the heads 26 of the respective liquid supply pipes 25. In other words, the rinsing liquid supplied onto the surface of the substrate w flows downward from the height direction of the substrate W. Therefore, the same amount of rinsing liquid is supplied to each of the 10 liquid supply tubes 25, compared to the substrate w. The rinsing action received by the rinsing liquid in the lower portion of the height direction becomes larger, and thus it becomes impossible to uniformly flush the entire surface of the substrate W. However, since most of the liquid supply pipes 25 are disposed at a predetermined interval in the height direction of the substrate W, the supply to the substrate W can be adjusted by adjusting the amount of the rinsing liquid supplied to each of the liquid supply pipes 25. The amount of flushing liquid on the top and bottom of the height direction. Therefore, if the amount of the rinsing liquid supplied to the upper portion of the substrate W is larger than the amount of the rinsing liquid supplied to the lower portion, the rinsing liquid supplied to the upper portion flows to the lower portion, whereby the rinsing action received by the lower portion is substantially the same as that of the upper portion. For example, if the amount of the rinsing liquid from each of the supply pipes 25 is set, the sum of the flow rate and the flow rate of the rinsing liquid flowing on the inclined plate surface of the substrate W is applied regardless of the height direction of the substrate W. When the positions are equal, the entire surface of the substrate W can be processed substantially equally. In the present embodiment, the substrate is treated with a rinsing liquid, and 12, but the processing liquid other than the rinsing liquid, for example, the substrate W is treated by a processing liquid such as a etchant or a stripping solution. By adjusting the supply amount of the treatment liquid as described above, the entire surface of the substrate w can be uniformly treated. 5 The substrate W subjected to the rinsing in the second processing chamber 4 is sent to the third processing chamber 5. In the third processing chamber 5, an air knife (not shown) is disposed in a direction that is perpendicular to the direction in which the substrate W is conveyed, and is subjected to a drying process, that is, by air pressure removal. The rinse liquid adhered to the surface of the substrate W by rinsing. Further, the 10 substrates w' which have been dried in the third processing chamber 5 are carried out by the carry-out port 7 and sent to the next program. According to the processing apparatus configured as described above, the support roller 15 provided on the mounting member disposed horizontally along the width direction of each of the processing chambers 3 to 5 can support the tilting direction of the substrate w which is obliquely conveyed at a predetermined angle. Side of the side. 15 The width dimension of each of the processing chambers 3 to 5 is set to be less than two-thirds of the width dimension of the substrate w, and the length dimension of the mounting member 11 is set to be smaller than the height dimension of the substrate W by two-thirds. One to two-thirds. If the length dimension of the mounting member 11 is set to be shorter than 20 inches as described above, it is possible to prevent the mounting member η from being deflected due to its own weight. Therefore, the plurality of support rollers 15 provided on the respective mounting members 11 can be positioned without causing a difference in the horizontal direction. Further, the support roller 15 provided on each of the attachment members η can be adjusted in the front-rear direction by the attachment hole 16 provided in the attachment member u. 13 1364069 Therefore, the support roller 15 provided on each of the mounting members can strongly touch the lower surface of the substrate w in the oblique direction. Therefore, when the drive roller 22 is driven, the support roller 15 can be smoothly guided. And transporting the aforementioned substrate slip. In other words, the substrate W can be reliably transported without causing damage to the substrate W. 5, compared with the width dimension of the processing chambers 3 to 5, if the length dimension of the mounting member U is too short, in each of the processing chambers 3 to 5, in the width direction of the substrate trade, the portion of the branch roller 15 not being branched There will be more, and this part will have a skew. However, in the present embodiment, not only is the mounting member 1A set to a length that is less than 10 due to its own weight, but also the length dimension of the mounting member 3 is reduced because the width of the processing chambers 3 to 5 is reduced. The width dimension of each of the processing chambers 3 to 5 is not significantly reduced. Thereby, the portion of the substrate w located in each of the processing chambers 3 to 5 can be surely supported in the width direction by the plurality of supporting rollers 15 provided on the mounting member u. That is, if only the mounting member 11 is set to a short size, and it is not easy to be deflected by its own weight, the length dimension of the mounting member 11 with respect to the width dimension of each of the processing chambers 3 to 5 is too short. In the case where the case of dicing, that is, the width direction of the portion of the substrate W in each of the processing chambers 3 to 5, the support roller 15 cannot be reliably supported, and the substrate w is deformed and 20 cannot be smoothly conveyed. Hey. However, the mounting member 11 is not only set to be short, but since the widths of the processing chambers 3 to 5 are also reduced, the mounting member 11 does not change with respect to the width dimension of the substrate W in each of the processing chambers 3 to 5. It’s too short. Therefore, the portion of the base W in each of the processing chambers 3 to 5 can be surely supported by the support roller 15' provided on the mounting member 11. In the second processing chamber 4 for performing the rinsing treatment of the substrate W, a plurality of liquid supply tubes 25 provided with a head 26 for ejecting the rinsing liquid are horizontally disposed. The amount of flushing liquid supplied to each of the liquid supply tubes 25 can be adjusted by the flow control of the unillustrated flow. Therefore, the amount of the flushing liquid supplied to the liquid supply pipe 25 above the height direction of the substrate W that is obliquely transported can be substantially the same as the amount of the flushing liquid supplied to the liquid supply pipe 25 below. The state is processed in the vertical direction of the substrate w. That is, the surface of the board 10 of the entire substrate W can be processed substantially uniformly. By making the width of the processing chambers 3 to 5 smaller than the width dimension of the substrate w, the substrate W is in the majority of the processing chambers 3 to 5, as shown by the broken line in FIG. And to carry it. Thereby, in the substrate W, for example, when the end portion in the conveyance direction is flushed in the second processing chamber 4, the rear end portion is brushed in the first processing chamber 3. Similarly, when the front end portion is subjected to the drying treatment in the third processing chamber 5, the rear end portion is subjected to the rinsing treatment in the second processing chamber 4. When the substrate W is continuously processed by the plurality of processing chambers 3 to 5 while the substrate W is being conveyed, the processing of the substrate W can be efficiently performed because two different processes in the adjacent processing chamber can be simultaneously performed. . The present invention is not limited to the foregoing embodiment, and various modifications can be made. For example, the example in which three processing chambers are arranged in parallel is used as the processing device. However, the number of processing chambers is not limited thereto, and the type of substrate processing for each processing chamber is of course not limited. 15 1364069 ί: BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a longitudinal cross-sectional view showing a processing apparatus according to an embodiment of the present invention in the width direction. Similarly, Fig. 2 is a longitudinal sectional view showing a second processing portion in the processing apparatus. 5 Fig. 3 is a cross-sectional view of the processing apparatus in the same manner. Fig. 4 is a cross-sectional view showing the mounting structure of the support roller.
【主要元件符號說明】 1...框體 15...支撐滾輪 la、lb...側壁 16...安裝孔 2...間隔壁 17...轴承 3...第1處理室 18...螺栓 4...第2處理室 19…墊片 5...第3處理室 20...螺帽 6·.·搬入口 22...驅動滾輪 7...搬出口 23...驅動馬達 8...連通口 25...給液管 11...安裝構件 26…噴頭 12...承接具 W...基板 13...安裝具 16[Main component symbol description] 1...frame 15...support roller la, lb...side wall 16...mounting hole 2...partition wall 17...bearing 3...first processing chamber 18...bolt 4...second processing chamber 19...shield 5...third processing chamber 20...nut 6··transport 22...drive roller 7...transport 23 ...drive motor 8...communication port 25...feeding pipe 11...mounting member 26...head 12...substrate W...substrate 13...mounting device 16