CN110970337A - Substrate conveying device and substrate processing device - Google Patents
Substrate conveying device and substrate processing device Download PDFInfo
- Publication number
- CN110970337A CN110970337A CN201910892149.8A CN201910892149A CN110970337A CN 110970337 A CN110970337 A CN 110970337A CN 201910892149 A CN201910892149 A CN 201910892149A CN 110970337 A CN110970337 A CN 110970337A
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- CN
- China
- Prior art keywords
- substrate
- shaft
- upper loading
- roller
- conveying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Abstract
The invention provides a substrate conveying device which can carry out substrate conveying while restraining impact applied to the surface of a substrate by an upper loading roller to the minimum limit. It is characterized by comprising: a plurality of transport shafts (4); a plurality of conveying rollers (5) which support the lower surface of the substrate arranged on the conveying shaft (4); an end supporting roller (6) for supporting the lower surface of the two ends of the substrate in the width direction; an upper loading roller shaft (7) which is arranged above at least one end part and the other end part of the conveying shaft (4), is parallel to the conveying shaft (4), and is supported in a rotatable manner; and a pair of upper loading rollers (8) arranged on the upper loading roller shaft (7) at the part opposite to the end supporting roller (6), wherein the upper loading rollers (8) are installed through an elastic body so as to be capable of moving up and down relative to the upper loading roller shaft (7).
Description
Technical Field
The present invention relates to a substrate transport apparatus and a substrate processing apparatus.
Background
For example, in an apparatus for processing a glass substrate for a liquid crystal display device, a processing liquid, a processing gas, or the like (hereinafter, collectively referred to as "processing fluid") is supplied from a nozzle provided in the middle of the apparatus while the substrate is being transported.
The substrate is often conveyed by a rotating conveyance roller, but if the substrate becomes large, an upper loading roller may be provided to face the conveyance roller in order to increase the conveyance force of the substrate. By providing the upper loading roller, the frictional force between the conveying roller and the substrate is increased, and the conveying force of the substrate is increased.
Patent document
Patent document 1: japanese laid-open patent publication No. 11-10096
In the conventional apparatus, in a configuration in which the weight of the roller shaft supporting the upper loading roller is set to the pressing force of the upper loading roller to the substrate, it is necessary to provide a long roller shaft to increase the pressing force required by the upper loading roller. If the roller shaft is long, the roller shaft becomes an obstacle, and a variation occurs in the supply state of the processing fluid supplied from the supply portion to the substrate. Therefore, it is difficult to perform a high-quality substrate process.
Disclosure of Invention
The invention aims to provide a substrate conveying device and a substrate processing device which can process a substrate with good quality in the substrate processing using processing fluid.
Means for solving the problems
The substrate transport apparatus according to the present invention is characterized by comprising: a plurality of conveying shafts, both ends of which are rotatably supported, and which are disposed in parallel at predetermined intervals so that axes thereof intersect with the conveying direction of the substrate; a plurality of transport rollers provided on the transport shafts, respectively, and supporting a lower surface of a portion of the substrate except for both ends in a width direction of the substrate; a pair of end supporting rollers provided on the conveying shaft, respectively, and supporting lower surfaces of both ends in the width direction of the substrate; an upper mounting roller shaft rotatably supported above at least one end portion and the other end portion of the transport shaft so that an axis thereof can be opposed to the transport shaft in parallel; and a pair of upper loading rollers provided at portions of the upper loading roller shaft facing the pair of end supporting rollers, and configured to press the upper surfaces of the widthwise ends of the substrate supported by the end supporting rollers, the lower surfaces of the widthwise ends being supported by the end supporting rollers, the upper loading rollers being attached via an elastic body so as to be movable up and down with respect to the upper loading roller shaft.
Effects of the invention
According to the present invention, a high-quality substrate process can be performed in a substrate process using a process fluid.
Drawings
Fig. 1 is a vertical sectional view showing an overall configuration of a transport apparatus according to a first embodiment of the present invention.
Fig. 2 is a view from a-a of fig. 1.
Fig. 3 is an enlarged view showing one end portion of the conveyance shaft provided with the upper loading roller shaft in fig. 2.
Fig. 4 is an explanatory view of the operation of the upper loading roller.
Fig. 5 is a diagram illustrating a modification of the upper mounting roller.
Description of the symbols
100 substrate processing apparatus
1 treatment chamber
101 side wall
102 bearing
103 bearing
2 input port
3 outlet port
4 conveying shaft
5 conveying roller
5a O type ring
6 end supporting roller
7 on-board loading roller shaft
8 upper loading roller
9 inner ring
10 outer ring
10a O type ring
11 spring
12 nozzle
13 control device
W substrate
C conveying device
a direction of substrate conveyance
Detailed Description
(first embodiment)
Hereinafter, embodiments will be described with reference to the drawings.
As shown in fig. 1 and 2, the substrate processing apparatus 100 of the present embodiment includes a processing chamber 1. The processing chamber 1 has an inlet 2 formed at one end in the longitudinal direction and an outlet 3 formed at the other end, and a transfer device C for horizontally transferring the substrate W is provided therein. The transport device C includes a plurality of transport shafts 4 which are parallel to each other at predetermined intervals in the longitudinal direction of the processing chamber 1 and are rotatably provided. A plurality of transport rollers 5 are provided at predetermined intervals in the axial direction on each transport shaft 4, and form a transport path for the substrate W. The transfer rollers 5 are fixed to the transfer shaft 4, rotate together with the transfer shaft 4, and transfer the substrate W in the arrow a direction. An installation groove 5b is formed in the outer peripheral surface of the conveyance roller 5, and an O-ring 5a (see fig. 3) made of a chemically resistant elastic material, such as a fluororesin, is installed in the installation groove 5 b. End support rollers 6 formed of the same material as the conveyance rollers 5 and having the same shape are provided on the conveyance shaft 4 at positions facing both ends in the width direction of the substrate W to be conveyed. In addition, the term "end portion" as used herein includes not only an end portion of the substrate W in a strict sense but also a vicinity of the end portion. The respective transport rollers 5 support the lower surfaces of the portions of the substrate W other than the both ends in the width direction, and the respective end support rollers 6 support the lower surfaces of the both ends in the width direction of the substrate W.
An upper loading roller shaft 7 is provided above the conveyance shaft 4 via the conveyance path. In the present embodiment, as shown in fig. 1, the upper loading roller shafts 7 are provided so as to face the three adjacent conveying shafts 4. The axes (axes) of the corresponding transport shafts 4 and upper loading roller shafts 7 are arranged parallel to each other and extend in a direction orthogonal to the transport direction a of the substrate W.
As shown in fig. 3, the upper loading roller shaft 7 supports the upper loading roller 8. The upper mounting roller 8 is disposed so as to face the end support roller 6, and the end support roller 6 is disposed on the conveying shaft 4 corresponding to the upper mounting roller shaft 7. The upper loading roller 8 presses the upper surface of the widthwise end portion of the substrate W supported by the lower surface of the widthwise end portion of the end supporting roller 6.
As shown in fig. 4, the upper loading roller 8 includes an inner race 9, an outer race 10, and a spring 11. The inner race 9 is fixedly supported by the upper placement roller shaft 7. The springs 11 are compression coil springs, and a plurality of the same springs 11 are interposed at equal intervals along the outer periphery of the inner race 9 in a state of being compressed between the inner race 9 and the outer race 10. Each spring 11 is disposed in a direction radially extending with respect to the central axis of the inner ring 9, and one end of each spring 11 on the inner ring side is disposed in contact with the outer peripheral surface of the inner ring 9, and the other end is disposed in contact with the inner peripheral surface of the outer ring 10. The outer ring 10 is formed of a material having chemical resistance such as fluororesin. The outer race 10 is rotatable integrally with the inner race 9 with respect to rotation, but is movable with respect to the inner race 9 via a spring 11 with respect to a radial direction (see fig. 4 (b)). This can be implemented by the respective ends of the spring 11 being fixedly supported by the inner race 9 and the outer race 10, respectively, and the rotational motion of the inner race 9 being transmitted to the outer race 10 via the spring 11. Further, a plurality of recesses (not shown) may be formed in the outer circumferential surface of the inner race 9 and the inner circumferential surface of the outer race 10 corresponding to the mounting positions of the springs 11, and the springs 11 may be fitted into the recesses in a compressed state. That is, in this case, the spring 11 is not fixedly supported by the outer peripheral surface of the inner race 9 and the inner peripheral surface of the outer race 10. Further, by providing a cover, not shown, in the recess into which the spring 11 is fitted, the spring 11 can be reliably prevented from being ejected outward. As the support structure of the spring 11, other known techniques can be used, and detailed description thereof is omitted. In short, the outer ring is configured to be movable in the radial direction relative to the inner ring (configured to be at least vertically movable).
An installation groove 10b is formed in the outer peripheral surface of the outer ring 10, and an O-ring 10a made of an elastic material having chemical resistance, for example, a fluororesin or the like is installed in the installation groove 10 b.
As shown in fig. 3, both end portions of each of the transport shafts 4 are rotatably supported by bearings 102 provided on the side walls 101 of the processing chamber 1. The upper mounting roller shaft 7 is supported rotatably by the side wall 101 in a cantilevered state by a bearing 103. Each of the transport shafts 4 is rotated in the same direction, clockwise in fig. 1, by a driving device provided outside the processing chamber 1 and using a motor, not shown, as a driving source. The upper loading roller shaft 7 and the conveying shaft 4 corresponding to the upper loading roller shaft 7 are dynamically interlocked with each other via a gear not shown, and when the conveying shaft 4 rotates, the upper loading roller shaft 7 rotates counterclockwise in fig. 1.
A nozzle 12 is provided above a conveyance path through which the substrate W is conveyed by the conveyance rollers 5. A processing fluid (cleaning liquid, drying gas, etc.) for processing the substrate W is supplied from the nozzle 12.
In the substrate processing apparatus 100, the control device 13 controls the rotation driving of the transport rollers 5, the supply operation of the processing liquid from the nozzles 12, and the like.
Next, the operation of the substrate processing apparatus 100 will be described.
A rectangular glass substrate W used in a liquid crystal display device is input from an input port 2 of the processing chamber 1. The lower surface of the substrate W loaded into the processing chamber 1 is supported by the transport rollers 5 provided on the transport shaft 4 and transported in a horizontal state. Fig. 4(a) shows a state before the upper loading roller 8 is loaded on the substrate W. At this time, the upper loading roller 8 abuts against the end supporting roller 6, and the outer ring 10 and the inner ring 9 of the upper loading roller 8 are concentric.
Fig. 4(b) shows a state in which the upper loading roller 8 abuts on the substrate W being conveyed. The inner ring 9 is fixed in the vertical direction with respect to the upper carrying roller shaft 7, and therefore the outer ring 10 moves upward with respect to the inner ring 9. At this time, the spring 11 corresponding to the vicinity of the contact portion with the substrate W in the outer race 10 contracts. On the other hand, in the case of the structure in which the end portion of the spring 11 is fixedly supported by the outer race 10, the spring 11 corresponding to the vicinity of the side of the outer race 10 opposite to the contact portion with the substrate W is expanded. Therefore, the outer ring 10 receives a downward urging force against the upper mounting roller shaft 7, and the urging force becomes a part of the pressing force against the substrate W. When the substrate W is further conveyed to a position below the nozzle 12 by further rotation of the conveyance roller 5 and the upper placing roller 8, the processing fluid is supplied from the nozzle 12 to the substrate W. When the substrate W passes through the upper loading roller 8 and the upper loading roller 8 is separated from the substrate W, the position of the outer ring 10 returns to the state shown in fig. 4 (a). Then, the processed substrate W is carried out from the output port 3.
Here, a force received by the substrate W when the substrate W enters between the upper placing roller 8 and the end supporting roller 6 will be described.
When the outer ring 10 of the upper loading roller 8 is raised relative to the inner ring 9 by the substrate W being conveyed, the weight of the outer ring 10 and the biasing force of the spring 11 described above are applied to the surface of the substrate W.
In this way, in the present embodiment, the biasing force of the spring 11 is used as the pressing force of the upper loading roller 8 against the substrate W. Therefore, it is not necessary to provide the long upper mounting roller shaft 7 as in the conventional art in order to obtain the necessary pressing force by the upper mounting roller. Since the upper mounting roller shaft 7 can be shortened, it is possible to prevent the processing fluid supplied to the substrate W from being hindered from being supplied. Therefore, the supply state of the processing fluid can be prevented from being uneven, and the substrate processing with good quality can be performed.
Further, by changing the spring constant of the spring 11, the pressing force of the upper loading roller 8 against the substrate W can be easily changed and adjusted.
Further, since the upper loading roller 8 is configured to have the inner ring 9, the outer ring 10, and the spring 11 disposed therebetween, it is possible to absorb the impact when the substrate W abuts against the outer ring 10 by the spring 11, and it is also possible to prevent the substrate W from being cracked, chipped, or the like due to the impact.
In the above embodiment, the upper carrying roller shafts 7 in a cantilever state are provided above the one end portion and the other end portion of the conveying shaft 4, respectively. In the case where the biasing force of the spring 11 is used as the pressing force of the upper loading roller 8 against the substrate W, the upper loading roller shaft 7 is disposed to face the upper side of the transport shaft 4 with the same length as the transport shaft 4, and the upper loading rollers 8 may be disposed at positions facing the end supporting rollers 6 provided on the transport shaft 4 in the vicinity of both ends of the upper loading roller shaft 7. In this case, the upper loading roller shaft 7 is in a double-supported state.
Further, although the example in which the spring 11 is fixedly supported by the inner race 9 and the outer race 10 has been described, in the case where the spring 11 is not fixedly supported by the inner race 9 and the outer race 10 only by being interposed between the inner race 9 and the outer race 10 (that is, in the case of being held by the stress of the spring 11 itself), even if the outer race 10 is raised with respect to the inner race 9 (upper mounting shaft 7), the stress of the spring 11 located on the side not in contact with the substrate W is not applied to the substrate W, and only the stress of the spring 11 in the portion in contact with the substrate W can be applied to the surface of the substrate W. In this way, when only the spring 11 is interposed between the inner ring 9 and the outer ring 10, the outer ring 10 is also lifted relative to the inner ring 9 when the upper loading roller 8 is in a state of being in contact with the substrate W being conveyed, but the upper loading roller shaft 7 and the inner ring 9 supported by the upper loading roller shaft 7 are not lifted.
According to the substrate processing apparatus 100 configured as described above, it is possible to carry the substrate W well while suppressing the impact applied to the surface of the substrate W to the minimum, and to process the substrate W with good quality.
(second embodiment)
The second embodiment is an example in which the upper mounting roller shaft 7 does not have a drive source. In embodiment 1, the conveying shaft 4 and the upper placing roller shaft 7 are linked by a gear or the like. In contrast, the second embodiment is different from the first embodiment in that gears or the like for interlocking the upper mounting roller shaft 7 with the conveying shaft 4 are not provided.
In the present embodiment, the upper mounting roller shaft 7 is rotatably supported by the side wall 101 shown in fig. 3 by a bearing 103. The inner ring 9 of the upper placing roller 8 is fixedly supported by the upper placing roller shaft 7. Therefore, when the substrate W is transported and the outer ring 10 of the upper loading roller 8 is placed on the substrate W, the outer ring 10 moves upward relative to the inner ring 9, and the upper loading roller shaft 7 and the upper loading roller 8 rotate integrally with the movement of the substrate W.
The present embodiment has the same operational effects as the first embodiment.
(embodiment 3)
The third embodiment is different from the second embodiment in that the upper mounting roller shaft 7 is fixedly supported, and the upper mounting roller 8 is rotatably supported by the upper mounting roller shaft 7.
In fig. 3, the upper carrying roller shaft 7 is fixedly supported by the side wall 101. As shown in fig. 5, the upper mounting roller 8 is supported by the upper mounting roller shaft 7 via a rotary bearing 20. In fig. 5, a ball bearing is used as the rotation bearing.
With this configuration, the upper loading roller 8 is rotatably supported by the rotary bearing 20 with respect to the upper loading roller shaft 7. When the substrate W is transported and the outer ring 10 of the upper loading roller 8 is placed on the substrate W, the outer ring 10 moves upward relative to the inner ring 9, and the upper loading roller 8 rotates relative to the upper loading roller shaft 7 in accordance with the movement of the substrate W.
The present embodiment has the same operational effects as the first and second embodiments.
Although the embodiments have been described, in each of the above embodiments, an example is shown in which springs are radially provided between the inner ring and the outer ring of the upper loading roller as the elastic body, but the present invention is not limited to this. For example, a rubber material having elasticity may be interposed between the inner ring and the outer ring.
In the above embodiments, the respective conveying shafts 4 are disposed so as to be orthogonal to the axis line in the conveying direction a of the substrate W and to be parallel to each other at a predetermined interval. For example, the respective conveyance shafts 4 may be arranged in parallel at predetermined intervals with their axes intersecting with each other with respect to the conveyance direction a of the substrate W.
In the above embodiments, the case where the upper loading roller shaft 7 is supported by the side wall 101 has been described, but in the case where the substrate W to be conveyed is changed, for example, an adjustment mechanism capable of adjusting the interval between the conveying roller 5 and the upper loading roller 8 in accordance with the thickness of the substrate may be provided to adjust the interval between the conveying roller 5 and the upper loading roller 8. That is, when the thickness of the substrate to be conveyed is thick, the position is adjusted so as to separate the upper stage roller shaft 7 from the conveyance shaft 4, and when the thickness of the substrate is thin, the position is adjusted so as to bring the upper stage roller shaft 7 close to the conveyance shaft 4.
The substrate is not limited to a substrate for liquid crystal display, and the present invention can be applied to any substrate processing that uses a processing fluid to perform processing.
Further, although the example in which the upper loading roller shafts 7 are provided so as to face the three adjacent conveying shafts 4 has been described, the number may be any, and may be one or more.
Further, the example in which the upper loading roller 8 abuts on the end backup roller 6 until the substrate W abuts on the upper loading roller 8 has been described, but the upper loading roller 8 may be separated from the end backup roller 6.
Further, the substrate W is conveyed in a horizontal state by the conveying rollers 5, and the upper surfaces of both ends in the width direction of the substrate W are pressed by the upper loading rollers 8. That is, the substrate W may be conveyed while being tilted at a predetermined angle in a direction orthogonal to the conveyance direction of the substrate W (hereinafter, referred to as "tilted conveyance").
In the case of obliquely conveying the substrate W, the upper loading roller 8 may be used to press the upper surface of the lower end portion side of the substrate W in the oblique direction using the upper loading roller 8. In the case of obliquely conveying the substrate W, the lower end of the substrate W in the oblique direction of the substrate W is supported, and the guide roller that applies the conveying force is newly provided. In this case, the transport rollers 5 support the back surface of the substrate W and bear a part of the transport force, but the main transport force is provided by the guide rollers. When the substrate W is conveyed in a horizontal state, the upper surfaces of both ends of the substrate W in the width direction are preferably pressed by the upper loading rollers 8 so that the substrate W does not meandering. In contrast, in the case of oblique conveyance, since a part of the weight of the substrate is applied to the guide roller, the possibility of meandering is less than that of horizontal conveyance. Therefore, by pressing only the upper surface portion of the lower end portion side in the oblique direction of the substrate W using the upper loading roller 8, the substrate W can be conveyed without meandering. Of course, in the case of oblique conveyance, the upper loading roller 8 may be disposed on both the lower end side and the upper end side in the oblique direction of the substrate W.
While the embodiments of the present invention have been described above, these embodiments are provided as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in other various ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and spirit of the invention, and are included in the invention described in the claims and the equivalent scope thereof.
Claims (5)
1. A substrate transfer apparatus is characterized by comprising:
a plurality of conveying shafts, both ends of which are rotatably supported, and which are disposed in parallel at predetermined intervals so that axes thereof intersect with the conveying direction of the substrate;
a plurality of transport rollers provided on the transport shafts, respectively, and supporting a lower surface of a portion of the substrate except for both ends in a width direction of the substrate;
a pair of end supporting rollers provided on the conveying shaft, respectively, and supporting lower surfaces of both ends in the width direction of the substrate;
an upper mounting roller shaft rotatably supported above at least one end portion and the other end portion of the transport shaft so that an axis thereof can be opposed to the transport shaft in parallel; and
an upper mounting roller that is provided in a portion of the upper mounting roller shaft facing the pair of end supporting rollers and presses at least one of the widthwise end upper surfaces of the substrate whose widthwise end lower surfaces are supported by the end supporting rollers,
the upper loading roller is mounted via an elastic body so as to be movable up and down with respect to the upper loading roller shaft.
2. The substrate transport apparatus according to claim 1,
the upper loading roller includes an outer ring and an inner ring, and an elastic body is provided between the outer ring and the inner ring.
3. The substrate transport apparatus according to claim 2,
the elastic body is not fixed to either of the outer ring and the inner ring, but is held between the outer ring and the inner ring by its own stress.
4. The substrate transport apparatus according to claim 2 or 3,
the elastic body is embedded in a groove provided in the outer ring.
5. A substrate processing apparatus having a mechanism for supplying a processing fluid to and processing a substrate transported by the substrate transport apparatus according to any one of claims 1 to 4.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-185327 | 2018-09-28 | ||
| JP2018185327 | 2018-09-28 | ||
| JP2019115089 | 2019-06-21 | ||
| JP2019-115089 | 2019-06-21 | ||
| JP2019133261 | 2019-07-19 | ||
| JP2019-133261 | 2019-07-19 | ||
| JP2019-153346 | 2019-08-26 | ||
| JP2019153346A JP7332391B2 (en) | 2018-09-28 | 2019-08-26 | Substrate transfer device and substrate processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110970337A true CN110970337A (en) | 2020-04-07 |
Family
ID=70029595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910892149.8A Pending CN110970337A (en) | 2018-09-28 | 2019-09-20 | Substrate conveying device and substrate processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110970337A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114204288A (en) * | 2020-09-17 | 2022-03-18 | 株式会社斯库林集团 | Conductive device and roller conveying device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6381075U (en) * | 1986-11-15 | 1988-05-28 | ||
| CN1750232A (en) * | 2004-09-15 | 2006-03-22 | 芝浦机械电子株式会社 | Base plate processing device |
| CN1868839A (en) * | 2005-04-28 | 2006-11-29 | 芝浦机械电子株式会社 | Substrate conveying device |
| JP2007062869A (en) * | 2005-08-29 | 2007-03-15 | Murata Mach Ltd | Delivery roller device |
-
2019
- 2019-09-20 CN CN201910892149.8A patent/CN110970337A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6381075U (en) * | 1986-11-15 | 1988-05-28 | ||
| CN1750232A (en) * | 2004-09-15 | 2006-03-22 | 芝浦机械电子株式会社 | Base plate processing device |
| CN1868839A (en) * | 2005-04-28 | 2006-11-29 | 芝浦机械电子株式会社 | Substrate conveying device |
| JP2007062869A (en) * | 2005-08-29 | 2007-03-15 | Murata Mach Ltd | Delivery roller device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114204288A (en) * | 2020-09-17 | 2022-03-18 | 株式会社斯库林集团 | Conductive device and roller conveying device |
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