JP4820705B2 - Substrate processing equipment - Google Patents

Substrate processing equipment Download PDF

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JP4820705B2
JP4820705B2 JP2006201149A JP2006201149A JP4820705B2 JP 4820705 B2 JP4820705 B2 JP 4820705B2 JP 2006201149 A JP2006201149 A JP 2006201149A JP 2006201149 A JP2006201149 A JP 2006201149A JP 4820705 B2 JP4820705 B2 JP 4820705B2
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substrate
roller
processing
chamber
curving
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JP2008023489A (en
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治道 廣瀬
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2006201149A priority Critical patent/JP4820705B2/en
Priority to TW096125407A priority patent/TWI453848B/en
Priority to KR1020070072911A priority patent/KR101408758B1/en
Priority to CN2007101386343A priority patent/CN101114581B/en
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/54Arrangements for reducing warping-twist

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Description

この発明は基板を所定の角度で傾斜した起立状態で搬送しながら処理液などの流体によって処理する基板の処理装置に関する。   The present invention relates to a substrate processing apparatus for processing a substrate by a fluid such as a processing liquid while conveying the substrate in an upright state inclined at a predetermined angle.

液晶表示装置に用いられるガラス製の基板には回路パターンが形成される。基板に回路パターンを形成するにはリソグラフィープロセスが採用される。リソグラフィープロセスは周知のように上記基板にレジストを塗布し、このレジストに回路パターンが形成されたマスクを介して光を照射する。   A circuit pattern is formed on a glass substrate used in the liquid crystal display device. A lithographic process is employed to form a circuit pattern on the substrate. In a lithography process, as is well known, a resist is applied to the substrate, and light is irradiated through a mask having a circuit pattern formed on the resist.

つぎに、レジストの光が照射されない部分或いは光が照射された部分を除去し、基板のレジストが除去された部分をエッチングする。そして、エッチング後にレジストを除去するという一連の工程を複数回繰り返すことで、上記基板に回路パターンを形成する。   Next, the portion of the resist not irradiated with light or the portion irradiated with light is removed, and the portion of the substrate where the resist is removed is etched. A circuit pattern is formed on the substrate by repeating a series of steps of removing the resist after etching a plurality of times.

このようなリソグラフィープロセスにおいては、上記基板に現像液、エッチング液或いはエッチング後にレジストを除去する剥離液によって基板を処理する工程、さらにリンス液によって洗浄する工程、洗浄後に基板に付着残留したリンス液を除去する乾燥工程が必要となる。   In such a lithography process, the substrate is treated with a developer, an etching solution or a stripping solution that removes the resist after etching, a step of washing with a rinsing solution, and a rinsing solution remaining on the substrate after washing. A drying step to be removed is required.

従来、基板に対して上述した一連の処理を行う場合、上記基板は軸線を水平にして配置された搬送ローラによってほぼ水平な状態でそれぞれの処理を行なう処理チャンバに順次搬送し、各処理チャンバで基板を処理液によって処理したり、処理後に圧縮気体を噴射して乾燥処理するようにしている。   Conventionally, when the above-described series of processing is performed on a substrate, the substrate is sequentially transported to processing chambers in which the processing is performed in a substantially horizontal state by transport rollers arranged with the axis line horizontal, and in each processing chamber. The substrate is processed with a processing liquid, or after the processing, a compressed gas is injected to dry the substrate.

ところで、最近では液晶表示装置に用いられるガラス製の基板が大型化及び薄型化する傾向にある。そのため、基板を水平搬送すると、搬送ローラ間における基板の撓みが大きくなるため、各処理チャンバでの処理が基板の板面全体にわたって均一に行えなくなるということが生じる。   Recently, glass substrates used in liquid crystal display devices tend to be larger and thinner. For this reason, when the substrate is horizontally transported, the bending of the substrate between the transport rollers becomes large, so that processing in each processing chamber cannot be performed uniformly over the entire plate surface of the substrate.

さらに、基板が大型化すると、その基板を搬送する搬送ローラが設けられた搬送軸が長尺化する。しかも、基板が大型化することで、基板上に供給される処理液が増大し、基板上の処理液の量に応じて上記搬送軸に加わる荷重が大きくなるから、それらのことによって搬送軸の撓みが増大する。そのため、基板は搬送軸が撓むことによっても撓みが生じ、均一な処理が行えなくなるということがある。   Furthermore, when the substrate is enlarged, the transport shaft provided with the transport roller for transporting the substrate becomes longer. In addition, since the substrate is increased in size, the processing liquid supplied onto the substrate is increased, and the load applied to the transport shaft is increased according to the amount of the processing liquid on the substrate. Deflection increases. Therefore, the substrate may be bent even when the transport shaft is bent, and uniform processing may not be performed.

そこで、処理液によって基板を処理する際、上記基板が処理液の重量によって撓むのを防止するため、基板を所定の傾斜角度、たとえば垂直状態から15度傾斜させた75度の角度で搬送し、傾斜方向の上側に位置する前面に処理液を噴射することで、その基板の前面を処理するということが行なわれている。   Therefore, when the substrate is processed with the processing liquid, the substrate is transported at a predetermined inclination angle, for example, an angle of 75 degrees inclined by 15 degrees from the vertical state in order to prevent the substrate from being bent by the weight of the processing liquid. The front surface of the substrate is processed by injecting the processing liquid onto the front surface located on the upper side in the tilt direction.

基板を傾斜させて搬送し、その基板の前面に処理液を噴射供給するようにすれば、処理液は基板の板面に留まらず、板面を上方から下方へ向かって円滑に流れるから、処理液の重量によって基板が撓むのを防止することができる。   If the substrate is transported at an incline and the processing liquid is sprayed and supplied to the front surface of the substrate, the processing liquid does not stay on the plate surface of the substrate, but smoothly flows from the upper side to the lower side. It is possible to prevent the substrate from being bent by the weight of the liquid.

ところで、基板を所定の角度で傾斜させて搬送しながら処理する処理装置の場合、特許文献1に示されるように、基板は傾斜方向下側となる背面が支持ローラによって支持され、下端が駆動ローラによって支持される。駆動ローラは駆動軸に取付けられ、その駆動軸は駆動源によって回転駆動される。   By the way, in the case of a processing apparatus that processes a substrate while inclining the substrate at a predetermined angle, as shown in Patent Document 1, the back surface of the substrate that is lower in the inclined direction is supported by a support roller, and the lower end is a driving roller. Supported by. The drive roller is attached to a drive shaft, and the drive shaft is rotationally driven by a drive source.

上記処理装置には、複数の上記支持ローラと上記駆動ローラが上記基板の搬送方向に対して所定間隔で配置される。それによって、上記基板は上記支持ローラによって支持されながら、上記駆動ローラによって駆動されることになる。
特開2004−210511号公報
In the processing apparatus, a plurality of the supporting rollers and the driving roller are arranged at a predetermined interval in the transport direction of the substrate. As a result, the substrate is driven by the drive roller while being supported by the support roller.
JP 2004-210511 A

ところで、処理液の種類によってその効果を高めるために、搬送される基板の前面に噴射ノズルから、たとえば0.7MPa程度の高い圧力で噴射させるということが行なわれている。基板の前面に処理液が高圧で噴射されると、基板はその処理液の圧力によって背面側に湾曲する。   By the way, in order to enhance the effect depending on the type of the processing liquid, the front surface of the substrate to be transported is sprayed from the spray nozzle at a high pressure of about 0.7 MPa, for example. When the processing liquid is sprayed to the front surface of the substrate at a high pressure, the substrate is bent to the back side by the pressure of the processing liquid.

基板が処理液の圧力によって湾曲するだけであれば、その湾曲は基板の背面を支持した支持ローラによって制限されることになる。しかしながら、基板の搬送方向後方の下端部が処理液の圧力で背面側に湾曲し、湾曲した状態で駆動ローラの外周面に接触すると、この駆動ローラの駆動力がその外周面を介して基板の下端に伝達されることになる。   If the substrate is only bent by the pressure of the processing liquid, the bending is limited by the support roller that supports the back surface of the substrate. However, when the lower end of the substrate rearward in the conveyance direction is curved to the back side due to the pressure of the processing liquid and comes into contact with the outer peripheral surface of the drive roller in a curved state, the driving force of the drive roller passes through the outer peripheral surface of the substrate. It will be transmitted to the lower end.

湾曲した基板の搬送方向の下端部に駆動ローラの駆動力が伝達されると、その駆動力によって基板の搬送方向後方の下端部はさらに湾曲する方向の力を受けるため、基板の搬送方向後方の下端部が湾曲し過ぎて損傷するということがある。   When the driving force of the driving roller is transmitted to the lower end of the curved substrate in the conveyance direction, the lower end of the substrate in the conveyance direction receives the force in the direction of further bending due to the driving force. The lower end may be too curved and damaged.

この発明は駆動ローラから受ける駆動力によって基板の搬送方向後方の下端部が背面側に湾曲するのを制限するようにした基板の処理装置を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus in which the lower end of the substrate in the rearward direction of the substrate is prevented from being bent back by the driving force received from the driving roller.

この発明は、基板を所定の角度で傾斜させて搬送しながら流体によって処理する基板の処理装置であって、
チャンバと、
このチャンバ内に設けられ上記基板の傾斜方向下側の背面を支持する支持ローラと、
背面が上記支持ローラによって支持された上記基板の下端を外周面によって支持し回転駆動されて上記基板を所定方向に搬送する駆動ローラと、
上記基板の傾斜方向上側の前面に上記流体を噴射する流体供給手段と、
上記駆動ローラの近傍の上記基板の搬送方向上流側に配置され上記基板の搬送方向後方の下端部が上記流体供給手段から噴射される流体の圧力を受けて上記下端部が上記基板の背面側に湾曲したときに上記駆動ローラの外周面との接触によってさらに大きく湾曲するのを阻止する湾曲防止ローラと
を具備したことを特徴とする基板の処理装置にある。
This invention is a substrate processing apparatus for processing with a fluid while transporting the substrate inclined at a predetermined angle,
A chamber;
A support roller that is provided in the chamber and supports a back surface on the lower side in the tilt direction of the substrate;
A driving roller that supports the lower end of the substrate supported by the supporting roller on the back surface by the outer peripheral surface and is driven to rotate to convey the substrate in a predetermined direction;
Fluid supply means for ejecting the fluid to the front surface on the upper side in the tilt direction of the substrate;
On the back side of the substrate conveying direction upstream arranged side conveying direction behind the lower end the lower end the substrate under the pressure of the fluid ejected from the fluid supply means of the substrate in the vicinity of the drive roller An apparatus for processing a substrate, comprising: a curving prevention roller that prevents further curving due to contact with the outer peripheral surface of the driving roller when curving.

上記湾曲防止ローラは、上記駆動ローラの上記基板の搬送方向に沿う直径の範囲内に設けられていることが好ましい。   It is preferable that the anti-curvature roller is provided within a range of a diameter along the conveyance direction of the substrate of the drive roller.

上記湾曲防止ローラは、上記基板の搬送方向上流側と下流側に設けられていることが好ましい。   The curving prevention rollers are preferably provided on the upstream side and the downstream side in the transport direction of the substrate.

上記湾曲防止ローラは、回転軸線が上記基板の搬送方向において上記駆動ローラの回転軸線に直交する位置に設けられていることが好ましい。   It is preferable that the anti-curvature roller is provided at a position where the rotation axis is orthogonal to the rotation axis of the drive roller in the transport direction of the substrate.

この発明によれば、駆動ローラの近傍に基板の搬送方向後方の下端部が湾曲するのを阻止する湾曲防止ローラを設けたから、基板の搬送方向後方の下端部が湾曲した状態で駆動ローラから駆動力を受け、湾曲が増大して損傷するのを防止することができる。   According to the present invention, the anti-curvature roller for preventing the lower end of the substrate rearward in the conveyance direction is provided in the vicinity of the drive roller, so that the lower end of the substrate rearward in the conveyance direction is curved and driven from the drive roller. It is possible to prevent an increase in curvature and damage due to force.

以下、この発明の実施の形態を図面を参照して説明する。
図1乃至図4はこの発明の第1の実施の形態を示す。図1はこの発明の処理装置の概略的構成を示す斜視図であって、この処理装置は装置本体1を有する。この装置本体1は分割された複数の処理ユニット、この実施の形態では第1乃至第5の処理ユニット1A〜1Eを分解可能に一列に連結してなる。
Embodiments of the present invention will be described below with reference to the drawings.
1 to 4 show a first embodiment of the present invention. FIG. 1 is a perspective view showing a schematic configuration of a processing apparatus according to the present invention. The processing apparatus has an apparatus body 1. The apparatus main body 1 is formed by connecting a plurality of divided processing units, in this embodiment, first to fifth processing units 1A to 1E in a row so as to be disassembled.

各処理ユニット1A〜1Eは架台2を有する。この架台2の前面には箱型状のチャンバ3が所定の角度で傾斜して保持されている。上記架台2とチャンバ3の上面には上部搬送部4が設けられている。上記架台2の下端の幅方向両端には板状の一対の脚体5(一方のみ図示)が分解可能に設けられる。この脚体5によって上記架台2の下面側に空間部6が形成される。   Each processing unit 1 </ b> A to 1 </ b> E has a gantry 2. A box-shaped chamber 3 is held on the front surface of the gantry 2 at a predetermined angle. An upper transfer unit 4 is provided on the upper surface of the gantry 2 and the chamber 3. A pair of plate-like legs 5 (only one is shown) are provided at both ends in the width direction of the lower end of the gantry 2 so as to be disassembled. The leg 5 forms a space 6 on the lower surface side of the gantry 2.

上記空間部6には、上記チャンバ3で後述するように行なわれる基板Wの処理に用いられる薬液やリンス液などの処理液を供給するタンクやポンプ或いは処理液の供給を制御するための制御装置などの機器7をフレーム8に載置した機器部9が収納されるようになっている。つまり、各処理ユニット1A〜1Eは架台2を脚体5で支持してチャンバ3の下方に空間部6を形成することで、上下方向に位置するチャンバ3、上部搬送部4及び機器部9の3つの部分に分割されている。   In the space 6, a tank or pump for supplying a processing liquid such as a chemical liquid or a rinsing liquid used for processing the substrate W performed in the chamber 3 as described later, or a control device for controlling the supply of the processing liquid. A device unit 9 in which a device 7 such as is mounted on a frame 8 is accommodated. That is, each of the processing units 1A to 1E supports the gantry 2 with the legs 5 and forms the space 6 below the chamber 3, so that the chamber 3, the upper transport unit 4 and the equipment unit 9 positioned in the vertical direction are arranged. It is divided into three parts.

上記チャンバ3は上記架台2に所定の角度である、たとえば垂直線に対して15度の角度で傾斜させた75度の角度で傾斜して保持されていて、幅方向の両側面には75度の角度で傾斜して搬送される基板Wが通過するスリット13(図1に一箇所だけ図示)が形成されている。   The chamber 3 is held at a predetermined angle with respect to the gantry 2 at an angle of 75 degrees, for example, an angle of 15 degrees with respect to a vertical line, and 75 degrees on both sides in the width direction. The slit 13 (only one place is shown in FIG. 1) through which the substrate W transported with an inclination of 1 passes is formed.

上記チャンバ3の内部には、図2と図3に示すように傾斜搬送手段を構成する複数の搬送軸15がチャンバ3の幅方向に所定間隔で設けられている。この搬送軸15には複数の支持ローラ14が軸方向に所定間隔で回転可能に設けられている。上記搬送軸15は、軸線が上記スリット13と同じ角度で傾斜するよう、上端及び下端がそれぞれブラケット15aによって支持されている。   Inside the chamber 3, as shown in FIGS. 2 and 3, a plurality of conveying shafts 15 constituting the inclined conveying means are provided at predetermined intervals in the width direction of the chamber 3. A plurality of support rollers 14 are provided on the transport shaft 15 so as to be rotatable at predetermined intervals in the axial direction. The transport shaft 15 is supported at its upper and lower ends by brackets 15 a so that the axis is inclined at the same angle as the slit 13.

上記チャンバ3内には、上記スリット13から基板Wが図1に鎖線で示す第1の姿勢変換部16によって水平状態から75度の角度に変換されて搬入される。すなわち、未処理の基板Wは上記上部搬送部4によって第5の処理ユニット1E側から第1の処理ユニット1A側に搬送されて上記第1の姿勢変換部16で水平状態から75度の角度に傾斜されて上記第1の処理ユニット1Aに搬入される。   A substrate W is transferred from the slit 13 into the chamber 3 by being converted from a horizontal state to an angle of 75 degrees by a first posture changing unit 16 indicated by a chain line in FIG. That is, the unprocessed substrate W is transported from the fifth processing unit 1E side to the first processing unit 1A side by the upper transport unit 4, and is moved from the horizontal state to the 75 degree angle by the first attitude conversion unit 16. It is inclined and carried into the first processing unit 1A.

第1の処理ユニット1Aのチャンバ3内に搬入された基板Wは上記搬送軸15に設けられた支持ローラ14によって非デバイス面である背面が支持される。この基板Wの下端は駆動ローラ17(図2に示す)の外周面によって支持される。   The back surface, which is a non-device surface, is supported on the substrate W carried into the chamber 3 of the first processing unit 1 </ b> A by the support roller 14 provided on the transport shaft 15. The lower end of the substrate W is supported by the outer peripheral surface of the drive roller 17 (shown in FIG. 2).

上記駆動ローラ17は駆動ユニット18の回転軸19に設けられている。そして、この回転軸19が回転駆動さることで、駆動ローラ17に下端が支持され背面が上記支持ローラ14に支持された上記基板Wが上記駆動ローラ17の回転方向に搬送されるようになっている。   The drive roller 17 is provided on the rotary shaft 19 of the drive unit 18. When the rotary shaft 19 is rotationally driven, the substrate W, the lower end of which is supported by the drive roller 17 and the back surface of which is supported by the support roller 14, is conveyed in the rotational direction of the drive roller 17. Yes.

基板Wは搬送方向上流側の第1乃至第3の処理ユニット1A〜1Cで処理液としての剥離液でレジストの除去が行なわれた後、第4の処理ユニット1Dで処理液としての洗浄液で洗浄処理が行なわれる。そして、第5の処理ユニット1Eで熱風による乾燥処理が行なわれる。   The substrate W is cleaned with the removing liquid as the processing liquid in the first to third processing units 1A to 1C upstream in the transport direction, and then cleaned with the cleaning liquid as the processing liquid in the fourth processing unit 1D. Processing is performed. Then, a drying process using hot air is performed in the fifth processing unit 1E.

各処理ユニット1A〜1Eを順次通過して処理された基板Wは75度の角度で傾斜した状態で上記第5の処理ユニッ1Eから搬出される。第5の処理ユニット1Eから搬出された基板Wは、図1に鎖線で示す第2の姿勢変換部23で傾斜状態から水平状態に姿勢が変換されて次工程に受け渡される。 Substrate W which are sequentially passed to process each processing unit 1A~1E is unloaded from the fifth processing unit 1E in a state inclined at an angle of 75 degrees. The substrate W carried out of the fifth processing unit 1E is changed in posture from the inclined state to the horizontal state by the second posture converting unit 23 shown by a chain line in FIG.

図2に示すように、上記駆動ユニット18はチャンバ3の幅方向(基板Wの搬送方向)に沿って長い板状の下部ベース部材24を有する。この下部ベース部材24の上面には下部ベース部材24と同じ長さのチャンネル状の上部ベース部材25が両側下端を固着して設けられている。   As shown in FIG. 2, the drive unit 18 has a plate-like lower base member 24 that is long along the width direction of the chamber 3 (the transport direction of the substrate W). On the upper surface of the lower base member 24, a channel-shaped upper base member 25 having the same length as the lower base member 24 is provided with both lower ends fixed.

上記上部ベース部材25には、上記下部ベース部材24とほぼ同じ大きさの平板状の取付け部材26の幅方向の一端部と他端部とが上部ベース部材25に対して傾きの調整可能に連結して設けられている。つまり、上記取り付け部材26はチャンバ3の前後方向に傾き角度の調整ができるようになっている。   One end and the other end in the width direction of a flat mounting member 26 having substantially the same size as the lower base member 24 are connected to the upper base member 25 so that the inclination of the upper base member 25 can be adjusted. Is provided. That is, the attachment member 26 can adjust the tilt angle in the front-rear direction of the chamber 3.

上記取付け部材26の幅方向の一端と他端とには、それぞれ複数のブラケット31が上記取付け部材26の長手方向に対して所定間隔で、しかも幅方向に対応する位置に設けられている。幅方向において対応する一対のブラケットには図示しない軸受を介して上記回転軸19の軸方向の中途部が回転可能に支持されている。この回転軸19の先端には上記駆動ローラ17が取り付けられ、後端には第1の歯車33が嵌着される。   A plurality of brackets 31 are provided at one end and the other end in the width direction of the mounting member 26 at predetermined intervals with respect to the longitudinal direction of the mounting member 26 and at positions corresponding to the width direction. A pair of brackets corresponding to each other in the width direction supports a midway portion in the axial direction of the rotary shaft 19 via a bearing (not shown) so as to be rotatable. The driving roller 17 is attached to the tip of the rotating shaft 19, and the first gear 33 is fitted to the rear end.

そして、上記架台2にチャンバ3を設置したならば、この架台2に設けられた支持部41の上面にロッド状の4本の基準部材35の下端面がねじ42によって取付け固定される。上記駆動ユニット18は、下部ベース部材24の四隅部下面が上記基準部材35の上端面にねじ42によって取付け固定される。4本の基準部材35の上端面は同一平面に位置している。そのため、駆動ユニット18はその下部ベース部材24の幅方向及び長手方向に歪が生じることなく取付け固定される。   When the chamber 3 is installed on the gantry 2, the lower end surfaces of the four rod-shaped reference members 35 are attached and fixed to the upper surface of the support portion 41 provided on the gantry 2 with screws 42. In the drive unit 18, the lower surfaces of the four corners of the lower base member 24 are fixedly attached to the upper end surface of the reference member 35 with screws 42. The upper end surfaces of the four reference members 35 are located on the same plane. Therefore, the drive unit 18 is mounted and fixed without distortion in the width direction and the longitudinal direction of the lower base member 24.

上記駆動ユニット18を基準部材35の上端面を基準にしてチャンバ3内に組み込む際、駆動ユニット18に支持された複数の回転軸19の後端部はチャンバ3の前板12bに開口された導出孔44から駆動室45に突出する。そして、駆動ユニット18をチャンバ3内に組み込んだ後で、上記回転軸19の後端に上記第1の歯車33が嵌着される。   When the drive unit 18 is incorporated into the chamber 3 with the upper end surface of the reference member 35 as a reference, the rear end portions of the plurality of rotary shafts 19 supported by the drive unit 18 are led out to the front plate 12 b of the chamber 3. Project into the drive chamber 45 from the hole 44. Then, after the drive unit 18 is assembled in the chamber 3, the first gear 33 is fitted to the rear end of the rotary shaft 19.

上記駆動室45には駆動源51が設けられている。この駆動源51の出力軸には駆動プーリ53が嵌着されている。この駆動プーリ53と従動プーリ54とにはベルト55が張設されている。上記従動プーリ54は図示しない第2の歯車が同軸に設けられている。この第2の歯車は上記第1の歯車33に噛合している。それによって、駆動源51が作動すれば、上記回転軸19が回転駆動されることになるから、この回転軸19の先端に設けられた上記駆動ローラ17も回転駆動される。   A drive source 51 is provided in the drive chamber 45. A drive pulley 53 is fitted on the output shaft of the drive source 51. A belt 55 is stretched between the driving pulley 53 and the driven pulley 54. The driven pulley 54 is provided with a second gear (not shown) coaxially. The second gear meshes with the first gear 33. As a result, when the drive source 51 is activated, the rotary shaft 19 is rotationally driven, so that the drive roller 17 provided at the tip of the rotary shaft 19 is also rotationally driven.

駆動ローラ17が回転駆動されれば、これらの駆動ローラ17によって下端が支持された基板Wは上記駆動ローラ17の回転方向に搬送されることになる。   If the driving roller 17 is rotationally driven, the substrate W having the lower end supported by the driving roller 17 is transported in the rotational direction of the driving roller 17.

図2と図4に示すように、基板Wの前面に剥離液を噴射してレジストの除去を行なう第1乃至第3の処理ユニット1A〜1Cには、傾斜して搬送される基板Wの傾斜方向の上側の面、つまり回路パターンが形成された前面と平行に離間対向して複数の給液管61が基板Wの搬送方向に沿って所定間隔で配設されている。   As shown in FIG. 2 and FIG. 4, the tilt of the substrate W that is transported in an inclined manner to the first to third processing units 1 </ b> A to 1 </ b> C that removes the resist by spraying a stripping solution onto the front surface of the substrate W. A plurality of liquid supply pipes 61 are arranged at a predetermined interval along the transport direction of the substrate W so as to be spaced apart from and parallel to the upper surface in the direction, that is, the front surface on which the circuit pattern is formed.

各給液管61には基板Wの搬送方向と交差する軸線方向に対して所定間隔で複数のノズル体62が設けられている。上記給液管61とノズル体62はこの発明の処理液供給手段を形成している。   Each liquid supply pipe 61 is provided with a plurality of nozzle bodies 62 at a predetermined interval with respect to an axial direction intersecting the transport direction of the substrate W. The liquid supply pipe 61 and the nozzle body 62 form the processing liquid supply means of the present invention.

上記給液管61には剥離液が0.7MPa程度の高い圧力で供給される。それによって、給液管61に設けられたノズル体62から上記基板Wの前面に上記処理液が高圧で噴射されるようになっている。   The stripping liquid is supplied to the liquid supply pipe 61 at a high pressure of about 0.7 MPa. As a result, the processing liquid is ejected from the nozzle body 62 provided in the liquid supply pipe 61 onto the front surface of the substrate W at a high pressure.

基板Wの下端を支持した駆動ローラ17の近傍には、下端が駆動ローラ17の外周面によって支持された基板Wの下端部がノズル体62から噴射される処理液の圧力で裏面側に湾曲するのを阻止する湾曲防止ローラ64が配置されている。この湾曲防止ローラ64は、上記チャンバ3の内底面から立設されたブラケット65に設けられた支軸66に回転可能に支持されている。   In the vicinity of the driving roller 17 that supports the lower end of the substrate W, the lower end of the substrate W, the lower end of which is supported by the outer peripheral surface of the driving roller 17, is curved to the back side by the pressure of the processing liquid ejected from the nozzle body 62. An anti-curvature roller 64 that prevents this is disposed. The curving prevention roller 64 is rotatably supported by a support shaft 66 provided on a bracket 65 erected from the inner bottom surface of the chamber 3.

すなわち、上記湾曲防止ローラ64は駆動ローラ17の近傍に設けられていて、この実施の形態では、図3と図4に示すように駆動ローラ17の回転軸線よりも基板Wの搬送方向(矢印Xで示す)の上流側であって、しかも基板Wの搬送方向Xに沿う駆動ローラ17の直径D(図3に示す)の範囲内の上方に径方向の一部が位置し、さらに外周面が上記支持ローラ14によって背面が支持された基板Wの下端部の背面に接触する位置に配設されている。   That is, the anti-curvature roller 64 is provided in the vicinity of the drive roller 17, and in this embodiment, as shown in FIGS. 3 and 4, the conveyance direction of the substrate W (arrow X) from the rotational axis of the drive roller 17 is shown. And a part of the radial direction is located above the range of the diameter D (shown in FIG. 3) of the driving roller 17 along the transport direction X of the substrate W, and the outer peripheral surface is The back surface of the substrate W supported by the support roller 14 is disposed at a position in contact with the back surface.

このような構成によると、基板Wは下端が駆動ローラ17の外周面によって支持され、背面が支持ローラ14によって支持された状態で、上記駆動ローラ17が回転駆動される。それによって、基板Wはその下端と駆動ローラ17の外周面との接触抵抗によって上記駆動ローラ17の回転方向に沿って搬送される。そして、搬送される基板Wの前面には給液管61に設けられたノズル体62から高圧の処理液が噴射され、その前面が処理されることになる。   According to such a configuration, the drive roller 17 is rotationally driven with the lower end of the substrate W supported by the outer peripheral surface of the drive roller 17 and the back surface supported by the support roller 14. Thereby, the substrate W is conveyed along the rotation direction of the driving roller 17 by the contact resistance between the lower end thereof and the outer peripheral surface of the driving roller 17. Then, a high-pressure processing liquid is ejected from the nozzle body 62 provided in the liquid supply pipe 61 to the front surface of the substrate W to be transported, and the front surface is processed.

基板Wがノズル体62から噴射される処理液の圧力を受けると、基板Wの支持ローラ14によって支持されていない部分は背面側に湾曲することになり、とくに基板Wの搬送方向後方の下端部E(図3と図4に示す)を含む周辺部は他の部分に比べて背面側に湾曲し易い。   When the pressure of the processing liquid sprayed from the nozzle body 62 is received by the substrate W, the portion of the substrate W that is not supported by the support roller 14 is curved to the back side, and in particular, the lower end portion at the rear of the substrate W in the transport direction. The peripheral portion including E (shown in FIGS. 3 and 4) is more easily curved toward the back side than the other portions.

そして、基板Wの周辺部のうち、搬送方向後方の下端部Eが図4に鎖線で示すように湾曲した状態で駆動ローラ17の外周面に接触する位置に搬送されてくると、駆動ローラ17の外周面から受ける駆動力は湾曲した基板Wの搬送方向後方の下端部Eを図4に矢印Bで示すようにさらに湾曲させる方向に作用する。そのため、基板Wの搬送方向後方の下端部Eの湾曲が大きくなり、その下端部Eに割れなどの損傷が生じる虞がある。   Then, when the lower end E of the rear side of the substrate W in the peripheral part of the substrate W is curved as shown by a chain line in FIG. 4 and is conveyed to a position in contact with the outer peripheral surface of the driving roller 17, the driving roller 17. The driving force received from the outer peripheral surface of the substrate acts in a direction in which the lower end E behind the curved substrate W in the transport direction is further curved as indicated by an arrow B in FIG. For this reason, the lower end E of the substrate W in the rearward transfer direction is greatly curved, and the lower end E may be broken or otherwise damaged.

しかしながら、駆動ローラ17の近傍には湾曲防止ローラ64が配設されている。そのため、基板Wは図4に実線で示すように駆動ローラ17の外周面との接触によって上記下端部Eが矢印Bで示す背面側の方向に湾曲するのが阻止される。   However, a curving prevention roller 64 is disposed in the vicinity of the driving roller 17. Therefore, the lower end E of the substrate W is prevented from being bent in the direction of the back side indicated by the arrow B due to the contact with the outer peripheral surface of the driving roller 17 as indicated by the solid line in FIG.

すなわち、基板Wが処理液の圧力を受け、搬送方向後方の下端部Eが湾曲した状態で駆動ローラ17の外周面に接触する位置の近傍まで搬送されてくると、その下端部Eは湾曲防止ローラ64によって湾曲状態が矯正されて駆動ローラ17の外周面に接触することになる。   In other words, when the substrate W receives the pressure of the processing liquid and is transported to the vicinity of the position in contact with the outer peripheral surface of the drive roller 17 in a state where the lower end E at the rear in the transport direction is curved, the lower end E is prevented from bending. The curved state is corrected by the roller 64 and comes into contact with the outer peripheral surface of the driving roller 17.

したがって、基板Wの搬送方向後方の下端部Eは、処理液から受ける圧力で背面側に湾曲しても、その下端部Eが駆動ローラ17によってさらに大きく湾曲させられて損傷するのを確実に防止することができる。   Therefore, even if the lower end E at the rear of the substrate W in the transport direction is curved to the back side due to the pressure received from the processing liquid, the lower end E is reliably prevented from being further bent by the driving roller 17 and being damaged. can do.

上記湾曲防止ローラ64は、上記支持ローラ14が設けられた搬送軸15とは別の支軸66に設けられている。そのため、上記湾曲防止ローラ64は、駆動ローラ17の近傍において、支持ローラ14の設置状態に制限を受けることなく、設置位置を自由に設定することができる。   The curving prevention roller 64 is provided on a support shaft 66 that is different from the conveyance shaft 15 on which the support roller 14 is provided. Therefore, the installation position of the anti-bending roller 64 can be freely set in the vicinity of the driving roller 17 without being limited by the installation state of the support roller 14.

図5(a),(b)はこの発明の第2の実施の形態を示す。この実施の形態は、湾曲防止ローラ64が設置される位置である駆動ローラ17の近傍として、基板Wの搬送方向に沿う駆動ローラ17の直径Dの範囲内の上流側と下流側との両方に、一対の湾曲防止ローラ64が、上記直径Dの範囲内に径方向の一部が位置するように設けるようにした。   FIGS. 5A and 5B show a second embodiment of the present invention. In this embodiment, as the vicinity of the driving roller 17 where the anti-curvature roller 64 is installed, both on the upstream side and the downstream side within the range of the diameter D of the driving roller 17 along the conveyance direction of the substrate W. The pair of anti-curvature rollers 64 is provided so that a part of the radial direction is located within the range of the diameter D.

図6は(a),(b)この発明の第3の実施の形態を示す。この実施の形態では上記湾曲防止ローラ64は、駆動ローラ17の近傍として、湾曲防止ローラ64の回転軸線が基板Wの搬送方向において、上記駆動ローラ17の回転軸線に直交する位置に設けるようにしている。すなわち、基板Wの搬送方向に沿う駆動ローラ17の直径Dの中心に上記湾曲防止ローラ64が回転軸線を一致させて設けるようにした。   FIGS. 6A and 6B show a third embodiment of the present invention. In this embodiment, the anti-curvature roller 64 is provided in the vicinity of the drive roller 17 at a position where the rotation axis of the anti-curvature roller 64 is orthogonal to the rotation axis of the drive roller 17 in the transport direction of the substrate W. Yes. In other words, the anti-curvature roller 64 is provided with the rotation axis aligned with the center of the diameter D of the drive roller 17 along the transport direction of the substrate W.

上記第2、第3の実施の形態においても、基板Wの搬送方向後方の下端部Eが処理液の圧力を受けて湾曲しても、駆動ローラ17の外周面に接触する位置に搬送されてくると、上記湾曲防止ローラ64によって湾曲状態が矯正される。   Also in the second and third embodiments, even if the lower end E behind the substrate W in the conveyance direction is curved by receiving the pressure of the processing liquid, the substrate W is conveyed to a position in contact with the outer peripheral surface of the drive roller 17. When it comes, the bending state is corrected by the bending prevention roller 64.

したがって、基板Wの搬送方向後方の下端部Eが駆動ローラ17から受ける駆動力によって湾曲され過ぎて損傷するのを、上記第1の実施の形態と同様、確実に防止することができる。   Therefore, it is possible to reliably prevent the lower end E of the substrate W rearward in the transport direction from being excessively curved and damaged by the driving force received from the driving roller 17, as in the first embodiment.

この発明の湾曲防止ローラは基板を剥離液によって処理する場合だけでなく、純水などの他の処理液や気体を噴射して処理する場合であっても適用することが可能であり、要は処理液や気体などの流体が高圧で基板に噴射される場合であれば有効である。   The anti-curvature roller of the present invention can be applied not only when the substrate is processed with a stripping solution, but also when processing with another processing solution such as pure water or gas. This is effective when a fluid such as a processing liquid or gas is jetted onto the substrate at a high pressure.

この発明の第1の実施の形態の処理装置の概略的構成を示す斜視図。The perspective view which shows schematic structure of the processing apparatus of 1st Embodiment of this invention. 上記処理装置のチャンバの断面図。Sectional drawing of the chamber of the said processing apparatus. 支持ローラと駆動ローラの配置関係を示す正面図。The front view which shows the arrangement | positioning relationship between a support roller and a drive roller. 支持ローラと駆動ローラの配置関係を示す平面図。The top view which shows the arrangement | positioning relationship between a support roller and a drive roller. この発明の第2の実施の形態を示し、(a)は支持ローラと駆動ローラの配置関係を示す正面図、(b)は支持ローラと駆動ローラの配置関係を示す平面図。The 2nd Embodiment of this invention is shown, (a) is a front view which shows the arrangement | positioning relationship between a support roller and a drive roller, (b) is a top view which shows the arrangement | positioning relationship between a support roller and a drive roller. この発明の第3の実施の形態を示し、(a)は支持ローラと駆動ローラの配置関係を示す正面図、(b)は支持ローラと駆動ローラの配置関係を示す平面図。The 3rd Embodiment of this invention is shown, (a) is a front view which shows the arrangement | positioning relationship between a support roller and a drive roller, (b) is a top view which shows the arrangement | positioning relationship between a support roller and a drive roller.

符号の説明Explanation of symbols

3…チャンバ、14…支持ローラ、17…駆動ローラ、19…回転軸、62…ノズル体、64…湾曲防止ローラ。   DESCRIPTION OF SYMBOLS 3 ... Chamber, 14 ... Support roller, 17 ... Drive roller, 19 ... Rotating shaft, 62 ... Nozzle body, 64 ... Curvature prevention roller

Claims (4)

基板を所定の角度で傾斜させて搬送しながら流体によって処理する基板の処理装置であって、
チャンバと、
このチャンバ内に設けられ上記基板の傾斜方向下側の背面を支持する支持ローラと、
背面が上記支持ローラによって支持された上記基板の下端を外周面によって支持し回転駆動されて上記基板を所定方向に搬送する駆動ローラと、
上記基板の傾斜方向上側の前面に上記流体を噴射する流体供給手段と、
上記駆動ローラの近傍の上記基板の搬送方向上流側に配置され上記基板の搬送方向後方の下端部が上記流体供給手段から噴射される流体の圧力を受けて上記下端部が上記基板の背面側に湾曲したときに上記駆動ローラの外周面との接触によってさらに大きく湾曲するのを阻止する湾曲防止ローラと
を具備したことを特徴とする基板の処理装置。
A substrate processing apparatus for processing with a fluid while transporting the substrate inclined at a predetermined angle,
A chamber;
A support roller that is provided in the chamber and supports a back surface on the lower side in the tilt direction of the substrate;
A driving roller that supports the lower end of the substrate supported by the supporting roller on the back surface by the outer peripheral surface and is driven to rotate to convey the substrate in a predetermined direction;
Fluid supply means for ejecting the fluid to the front surface on the upper side in the tilt direction of the substrate;
On the back side of the substrate conveying direction upstream arranged side conveying direction behind the lower end the lower end the substrate under the pressure of the fluid ejected from the fluid supply means of the substrate in the vicinity of the drive roller An apparatus for processing a substrate, comprising: a curving prevention roller that prevents further curving due to contact with the outer peripheral surface of the driving roller when curving.
上記湾曲防止ローラは、上記駆動ローラの上記基板の搬送方向に沿う直径の範囲内に設けられていることを特徴とする請求項1記載の基板の処理装置。   2. The substrate processing apparatus according to claim 1, wherein the curving prevention roller is provided within a range of a diameter of the driving roller along a conveyance direction of the substrate. 上記湾曲防止ローラは、上記基板の搬送方向上流側と下流側に設けられていることを特徴とする請求項1又は請求項2記載の基板の処理装置。   3. The substrate processing apparatus according to claim 1, wherein the curving prevention rollers are provided on an upstream side and a downstream side in the transport direction of the substrate. 上記湾曲防止ローラは、回転軸線が上記基板の搬送方向において上記駆動ローラの回転軸線に直交する位置に設けられていることを特徴とする請求項1又は請求項2記載の基板の処理装置。   3. The substrate processing apparatus according to claim 1, wherein the anti-bending roller is provided at a position where the rotation axis is orthogonal to the rotation axis of the drive roller in the transport direction of the substrate.
JP2006201149A 2006-07-24 2006-07-24 Substrate processing equipment Expired - Fee Related JP4820705B2 (en)

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