200818373 • 5 九、發明說明： 【發明所屬之技術領域】 技術領域 本發明係有關於-種基板處理1置，係於將基板以預定角 度傾斜之立起狀態搬運時，以處理液等流體處理者。 【先前技術】 背景技術 • 液晶顯示器所使用之玻璃基板可形成電路圖案，而於 基板上形成電路目案時係採職影成㈣程。微影成像製 10 程係如眾知地於前述基板上塗佈光阻，再透過已形成電路 圖案之光罩將光線照射於光阻上者。 15 之後’去除光阻未受到光照射之部分或已受到光照射 之部分，再蝴已去除光阻之部分。接著，藉由重複餘刻 後再去除光阻此-連串之步驟，即可將電路圖案形成於前 述基板上。 • 於此種微影成像製程中，前述基板上必須經過：利用 顯影液、钱刻液或餘刻後去除光阻的剝離液處理基板之步 驟，再利用沖洗液清洗之步驟；及除去清洗後殘留於基板 上之沖洗液的乾燥步驟。 20 以往’對基板進行前述一連串處理時，前述基板係藉 由轴線成水平配置的搬運滾子，在大致水平的狀態下，依 序搬運至進行各項處理之處理室，以便於各處理室中對基 板進行以處理液處理、及處理後噴射壓縮氣體的乾燥處理。 但’近來液晶顯示器所使用之玻璃基板有逐漸大型化 5 200818373 • 及薄型化之傾向，因此，在水平地搬運基板時，搬運滾子 間之基板撓曲會增大，故會產生各處理室中之處理無法遍 布基板全體板面均勻地進行的問題。 且，一旦基板大型化後，設有搬運該基板之搬運滾子 - 5的搬運軸須增長。此外，因基板大型化，於基板上使用的 處理液量也會增加，而隨著基板上處理液量的增加，施加 於前述搬運軸上的負載將變大，搬運軸的撓曲亦會隨之增 大。因此，基板也會因搬運軸撓曲而產生撓曲，而無法進 ® 行均勻之處理。 10 因此，在以處理液處理基板時，為了防止該基板因處 理液的重量而導致撓曲，所採行的方式是將基板以預定的 角度，例如相對垂直狀態傾斜15度之75度的角度來搬運， 對位於該基板傾斜方向上側之前面噴射處理液，來處理該 基板前面。 15 將基板傾斜搬運，再於該基板前面噴射供給處理液的 話，處理液將不會殘留於板面上，而會順利的從板面上方 流向下方，因此可防止基板因處理液的重量而撓曲。 另外，將基板以預定角度傾斜地搬運並加以處理的處 理裝置，如專利文獻1所示，以支撐滾子支撐成為基板傾斜 20方向下側之背面、並以驅動滾子之外周面支撐基板下端。 ' 驅動滾子安裝於驅動軸上，且該驅動軸可藉由驅動源驅動 旋轉。 前述處理裝置中，多數前述支撐滾子及前述驅動滾子 相對於前述基板的搬運方向以預定間隔配置，藉此，前述 6 200818373 基板的背面可由前述支撐滾子支撐，且由前述驅動滾子驅 動。 專利文獻1 :特開2004-210511號公報 【發明内容】 5 發明揭示 發明所欲解決之課題[Technical Field] The present invention relates to a substrate processing method in which a substrate is handled by a fluid such as a treatment liquid when the substrate is transported in an upright state inclined at a predetermined angle. By. [Prior Art] BACKGROUND OF THE INVENTION A glass substrate used in a liquid crystal display can form a circuit pattern, and when a circuit pattern is formed on a substrate, a film is taken (four). The lithography imaging system is known to apply a photoresist to the substrate, and to illuminate the photoresist through a photomask having a circuit pattern. After 15 'removal of the portion of the photoresist that has not been exposed to light or that has been exposed to light, the portion of the photoresist that has been removed is removed. Then, by repeating the steps of removing the photoresist and then repeating the series, the circuit pattern can be formed on the substrate. • In the lithography process, the substrate must be subjected to a step of treating the substrate with a developer, a money engraving solution or a stripping solution for removing the photoresist after the etching, and then using a rinse solution; and removing the cleaning solution. A drying step of the rinse liquid remaining on the substrate. [In the past, when the substrate is subjected to the above-described series of processes, the substrate is transported to the processing chamber for performing various processes in a substantially horizontal state by the transport rollers arranged horizontally on the axis, so as to facilitate the respective processing chambers. The substrate is subjected to a drying treatment of the processing liquid and the processing of the compressed gas after the processing. However, the glass substrates used in liquid crystal displays have been gradually increasing in size and are becoming thinner. Therefore, when the substrate is transported horizontally, the deflection of the substrate between the rollers is increased, so that each processing chamber is generated. The processing in the middle cannot be performed uniformly over the entire surface of the substrate. Further, once the substrate is enlarged, the conveyance shaft to which the conveyance roller 3-5 for conveying the substrate is required to grow. Further, as the substrate is increased in size, the amount of the processing liquid used on the substrate increases, and as the amount of the processing liquid on the substrate increases, the load applied to the carrier shaft increases, and the deflection of the carrier shaft also follows. Increased. Therefore, the substrate is also deflected by the deflection of the conveying shaft, and it is impossible to perform uniform processing. 10 Therefore, when the substrate is treated with the treatment liquid, in order to prevent the substrate from being deflected due to the weight of the treatment liquid, the method is adopted to tilt the substrate at a predetermined angle, for example, at an angle of 75 degrees to 15 degrees with respect to the vertical state. To carry, the processing liquid is sprayed on the front side of the upper side in the oblique direction of the substrate to process the front surface of the substrate. 15 When the substrate is tilted and transported, and the processing liquid is sprayed on the front side of the substrate, the processing liquid does not remain on the surface of the board, and smoothly flows downward from the upper surface of the board. This prevents the substrate from being scratched by the weight of the processing liquid. song. In addition, as shown in Patent Document 1, the processing device that conveys and processes the substrate at a predetermined angle is supported by a support roller to support the back surface of the lower side in the direction of the substrate tilt 20, and supports the lower end of the substrate by driving the outer peripheral surface of the roller. The drive roller is mounted on the drive shaft and the drive shaft can be driven to rotate by the drive source. In the above-described processing apparatus, a plurality of the support rollers and the drive roller are disposed at a predetermined interval with respect to a conveyance direction of the substrate, whereby the back surface of the 6 200818373 substrate can be supported by the support roller and driven by the drive roller . Patent Document 1: JP-A-2004-210511 SUMMARY OF THE INVENTION [Explanation] The problem to be solved by the invention
另一方面，因處理液的種類不同而為了提高該處理效 果，所採行的方式是以例如〇.7MPa左右的高壓使前述處理 液由噴嘴噴射至所搬運之基板前面。若以高壓喷射處理液 10 至基板前面，便會使基板因該處理液之壓力而往背面側彎 曲。 若基板只因處理液之壓力而彎曲，則該彎曲將會因支 撑基板背面之支撐滾子而受到限制。但，基板之搬運方向 後方之下端部因處理液之壓力而往背面側彎曲，且於彎曲 15的狀悲下接觸到驅動滾子之外周面時，該驅動滾子的驅動 力將透過該外周面傳達至基板下端。 若驅動滾子的驅動力傳達至已彎曲之基板之搬運方向 後方的下端部，則該驅動力將會使基板之搬運方向後方的 下端邛再叉到往彎曲方向之力量，故基板之搬運方向後方 20 之下端部將過度彎曲而造成損傷。 本發明提供一種基板處理裝置，其係用以限制因受驅 動滾子之驅動力而使基板之搬運方向後方之下端部往背面 侧彎曲者。 解決課題之手段 7 200818373 本發明係-種將基板以預定角度傾斜地搬運時，以流 體進行處理之基板處理裝置，該基板處理裝置包含有： 室； :支撐滾子，係裝設於該室内，用以支撐前述基板之傾 5斜方向下侧之背面者； 驅動滾子，係以其外周面支撐前述背面由前述支撐滾 子支樓的基板之下端，且被驅動旋轉將前述基板朝預定方 向搬運者； 供給流體機構，係對前述基板之傾斜方向上側的前面 10 喷射前述流體者；及 防止彎曲滾子，係鄰近前述驅動滾子配置，用以在前 述基板之搬運方向後方之下端部受前述噴射氣體機構所噴 射之流體壓力，而往其背面側彎曲時，矯正其彎曲者。 發明效果 15 依據本發明，因於驅動滾子附近設有阻止基板之搬運 方向後方之下端部彎曲之防止彎曲滾子，可防止基板之搬 運方向後方之下端部於彎曲狀態下受到驅動滾子之驅動力 後，彎曲加大而造成損傷。 【實施方式】 20 發明之實施態樣 以下，參照圖面說明本發明之實施態樣。 第1圖至第4圖係顯示本發明之第1實施態樣。第i圖係 顯示本發明之處理裝置概略構造之透視圖。該處理裳置有 一裝置本體1，真該裝置本體1可分割成複數的處理單元， 200818373 - 而在本實施態樣中係由可分解之第1至第5處理單元士1£ 呈一列連結而成。 各處理單元1A〜1£有一底架2，且該底架2的前面設有 ㈣定角度傾斜地被ϋ持之箱狀的室3。前述底架2與室3的 ~ 5上面設有上部搬運部4，且於前述底架2下端之寬度方向兩 端設有一對板狀的可拆式腳體5(僅圖示其中一者）。藉該腳 體5，於前述底架2之下面側形成一空間部6。 響 前述空間部6内收納一將機器7載置於框架8上之機器 部9，且該機器7為將用於如後述般進行之基板處理之藥劑 1〇或沖洗液等處理液供給至前述室3中的槽或泵，或是用以控 制處理液之供給的控制裝置等。換言之，藉由以腳體5支撐 底架2且於室3下方形成空間部6，各處理單元1Α〜1Ε可分為 位於上下方向上之室3、上部搬運部4及機器部9的3個部分。 前述室3以預定的角度傾斜地固持於底架2上，例如以 15相對於垂直線傾斜15度之乃度的角度傾斜，且寬度方向的 % 兩側面上形成有可供以75度角度傾斜搬運之基板W通過的 狹縫13(第1圖中僅圖示一處）。 於前述室3之内部，如第2圖與第3圖所示，於室3之寬 、度方向上以預定間隔設有構成傾斜搬運機構之複數搬運軸 2〇 15，且在該搬運軸15上，於軸方向以預定間隔設有複數可 旋轉的支撐滾子14。前述搬運軸15之軸線與前述狹縫13係 以相同角度傾斜，且其上端與下端分別由一托架15a支撐。 在前述室3内，基板W係藉第1圖中點鏈線所示之第 勢變換部16從水平狀態變換為傾斜75度後，從前述狹縫13 200818373 ^ 搬入。即，未處理之基板W經由前述上部搬運部4從第5處 理單元1E側運送至第丨處理單元丨八側，並利用前述第丨姿勢 變換部16從水平狀態傾斜至75度後，被搬入第1處理單s1A 中。 . 5 被搬入第1處理單元1A之室3内之基板w藉由裝設於前 述搬運軸15上之支撐滾子14支撐其非裝置面，即其背面， 並以驅動滾子17之外周面支撐該基板下端。 前述驅動滾子17裝設於驅動單元18之旋轉轴19上，而 • 且，藉驅動旋轉该旋轉軸19，可向前述驅動滾子17之旋轉 10方向搬運下端由驅動滾子17支撐而背面由前述支撐滾子14 支撐之前述基板W。 基板W在位於搬運方向上游側之第1至第3處理單元 1A 1C中利用作為處理液之剝離液去除光阻後，再於第4 處理單元1D中，利用作為處理液之清洗液進行清洗處理。 15之後，再於第5處理單元1E中以熱風進行乾燥處理。 依序經過各處理單元1A〜1E處理之基板w，以75度傾斜 之狀態下從前述第5處理單元1E搬出。從第5處理單元1E搬 出之基板W，藉第1圖中點鏈線所示之第2姿勢變換部23從 傾斜狀態變換姿勢為水平狀態後，再進行下一個步驟。 20 如第2圖所示，前述驅動單元18中沿室3之寬度方向（基 ' 板W之搬運方向）具有一長板狀之下部底座構件24，且該下 部底座構件24上設有與該下部底座構件24等長之槽狀上部 底座構件25，而該上部底座構件25之兩側下端固定連接於 該下部底座構件24上。 10 200818373 於珂述上部底座構件25上，與前述下部底座構件24約 等大之平板狀安裝構件26之寬度方向上之一端部與另一端 部連結設置成可調整相對於上部底座構件Μ之傾斜角度。 換言之，使前述安裝構件26可調整室3朝前後方向之傾斜角 5 度。 於前述安裝構件26之寬度方向之一端與另一端，複數 托架31分別相對於前述安裝構件26之縱向以預定間隔設置 於對應寬度方向之位置處。前述旋轉軸19軸向之中間部透 過未圖示之軸承被支撐於寬度方向上相對應之一對托架31 10 上且可自由旋轉。前述驅動滾子17安裝於該旋轉軸19前 端，且第1齒輪33嵌接於其後端。 又’若要將室3設置於前述底架2上的話，則可藉螺絲 42將4根桿狀基準構件35之下端面安裝固定於設置在該底 架2之支撐部41上面。前述驅動單元18中，利用螺絲42將下 15 部底座構件24之四角部下面安裝固定於前述基準構件35之 上端面，且4根基準構件35之上端面係位於同一平面上。因 此，驅動單元18可以不會朝其下部底座構件24之寬度方向 及縱向產生歪斜之方式被安裝固定。 以基準構件35之上端面為基準將前述驅動單元18插入 2〇 室3内時，受驅動單元18支撐之複數旋轉軸19之後端部從室 3之前板12b開口形成之導出孔44突出至驅動室45。而且， 驅動單元18插入室3内後，前述第1齒輪33嵌接於前述旋轉 轴19之後端。 前述驅動室45中設有一驅動源51，且該驅動源51之輸 11 200818373 出軸上欣接有一驅動滑輪53。該驅動滑輪53與從動滑輪54 間張設有一皮帶55，且前述從動滑輪54與未圖示之第2齒輪 係同轴設置，並且該第2齒輪咬合於前述第丨齒輪33。因此， 若驅動源51開始運作，則前述旋轉軸19會受驅動旋轉，故 5設於該旋轉軸19前端之前述驅動滾子π也將受驅動旋轉。 若驅動滾子17受驅動旋轉，則下端藉由該等驅動滾子 17支撐之基板W便會朝前述驅動滾子17之旋轉方向搬運。 如第2圖與第4圖所示，於基板|前面喷射剝離液以去 除光阻之第1至第3處理單元1Α〜1(：*，沿基板貨之搬運方 10向以預定間隔配設有複數供液管61，且供液管61與傾斜搬 運之基板W之傾斜方向上側之面，亦即形成有電路圖案之 前面相平行地對向分開。 各供液官61上，相對於與基㈣之搬運方向交又之軸 線方向以預定間隔設有複數喷嘴體62 ,且前述供液管㈠與 15喷嘴62形成本發明之供給處理液設備。 剝離液係以〇.7MPa左右之高壓供給至前述供液管6丄 中，藉此，可從設於供液管61之噴嘴體62以高壓將 前述處 理液喷射至前述基板W前面。 鄰近支撐基板w下端之驅動滾子17配置有防止彎曲滾 20子64，且防止彎曲滾子64可阻止下端由驅動滚扣之外周 面支撐之基板W下端部因喷嘴體62所噴射之處理液壓力而 往背面側f曲。該防止f曲滾子64由支軸66支#，且可自 由旋轉，且支軸66設置於從前述室3内底面立設之托架65 上。 12 200818373 也就是說，前述防止彎曲滾子64設置於驅動滾子17附 近，且於此實施態樣中，如第3圖與第4圖所示，於基板W 之搬運方向上（以箭頭X表示）位於比驅動滾子17之旋轉軸 線01更上游側，並且其直徑方向之一部份位於驅動滚子17 5 沿基板w之搬運方向X之直徑D(如第3圖所示）的範圍内之 上方。此外，防止彎曲滾子64之外周面設置於可接觸背面 由别述支撐滾子14支撐之基板W之下端部之背面之處，姐 使其旋轉軸線02與前述驅動滾子17之旋轉軸線〇1及前述 基板之搬運方向X呈垂直相交地配設。 10 藉由如此構造，於基板W之下端由驅動滾子17之外周 面支撐，且其背面由支撐滾子14支撐之狀態下，前述驅動 滾子17可受驅動旋轉。因此，基板w可藉其下端與驅動滾 子17之外周面之接觸阻力而沿前述驅動滾子17之旋轉方向 搬運。而且，由設於供液管61上之噴嘴體62將高壓處理液 15噴射至被搬運之基板w前面，可對其前面進行處理。 <當基板W受從噴嘴體62所噴射之處理液壓力時，基板 W之未叉支撐滾子14支撐之部分將會往背面側彎曲，特別 疋包含基板w之搬運方向後方之下端部E(如第3圖與第4圖 所示）之周邊部較其他部分更容易往背面侧彎曲。On the other hand, in order to improve the treatment effect depending on the type of the treatment liquid, the treatment liquid is sprayed from the nozzle to the front surface of the substrate to be conveyed at a high pressure of, for example, about 7 MPa. When the treatment liquid 10 is sprayed to the front side of the substrate at a high pressure, the substrate is bent toward the back side due to the pressure of the treatment liquid. If the substrate is bent only by the pressure of the treatment liquid, the bending will be limited by the support rollers supporting the back surface of the substrate. However, the lower end portion in the conveyance direction of the substrate is bent toward the back side due to the pressure of the treatment liquid, and when the curved surface of the drive 15 contacts the outer peripheral surface of the drive roller, the driving force of the drive roller is transmitted through the outer circumference. The surface is communicated to the lower end of the substrate. When the driving force of the driving roller is transmitted to the lower end portion behind the conveying direction of the bent substrate, the driving force will cause the lower end 后方 at the rear of the substrate to be re-forwarded to the bending direction, so the substrate conveying direction The lower end of the rear 20 will be excessively bent to cause damage. The present invention provides a substrate processing apparatus for restricting bending of a lower rear end portion of a substrate toward a back side by a driving force of a driven roller. Means for Solving the Problems 7 200818373 The present invention relates to a substrate processing apparatus that processes a substrate while being inclined at a predetermined angle, and the substrate processing apparatus includes: a chamber; a support roller is installed in the room; a back surface for supporting the lower side of the inclined direction of the substrate; the driving roller supports the lower end of the substrate by the outer peripheral surface of the substrate supporting the roller branch, and is driven to rotate the substrate in a predetermined direction a carrier fluid supply mechanism that ejects the fluid to the front surface 10 on the upper side in the oblique direction of the substrate; and a bending preventing roller disposed adjacent to the driving roller for receiving the lower end portion of the substrate in the rear direction of the substrate The fluid pressure of the jet gas mechanism is corrected, and when it is bent toward the back side, the bender is corrected. According to the present invention, since the bending preventing roller is provided in the vicinity of the driving roller to prevent the lower end portion of the substrate from being conveyed, the lower end portion of the substrate is prevented from being driven by the driving roller in the bent state. After the driving force, the bending is increased to cause damage. [Embodiment] Embodiments of the Invention Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 to Fig. 4 show a first embodiment of the present invention. Figure i is a perspective view showing a schematic configuration of a processing apparatus of the present invention. The processing body is provided with a device body 1, and the device body 1 can be divided into a plurality of processing units, 200818373 - and in this embodiment, the first to fifth processing units are decomposed into a column. to make. Each of the processing units 1A to 1 has a chassis 2, and the front surface of the chassis 2 is provided with (4) a box-shaped chamber 3 which is tilted at an angle. The upper chassis 2 and the upper portion of the chamber 3 are provided with an upper conveying portion 4, and a pair of plate-shaped detachable legs 5 are provided at both ends in the width direction of the lower end of the chassis 2 (only one of which is shown) . A space portion 6 is formed on the lower side of the chassis 2 by the leg body 5. The machine unit 9 on which the machine 7 is placed on the frame 8 is housed in the space portion 6, and the machine 7 is supplied with a treatment liquid such as a medicine or a rinse liquid for substrate processing as will be described later. A tank or a pump in the chamber 3, or a control device for controlling the supply of the treatment liquid, or the like. In other words, by supporting the chassis 2 with the leg body 5 and forming the space portion 6 below the chamber 3, each of the processing units 1Α1 to 1Ε can be divided into three chambers 3, the upper conveying portion 4, and the machine portion 9 in the vertical direction. section. The chamber 3 is obliquely held on the chassis 2 at a predetermined angle, for example, inclined at an angle of 15 degrees with respect to the vertical line, and the sides of the width direction are formed to be inclined at an angle of 75 degrees. The slit 13 through which the substrate W passes (only one place is shown in Fig. 1). In the interior of the chamber 3, as shown in Figs. 2 and 3, a plurality of transport shafts 2''''''' A plurality of rotatable support rollers 14 are provided at predetermined intervals in the axial direction. The axis of the conveyance shaft 15 is inclined at the same angle as the slit 13 described above, and the upper end and the lower end thereof are respectively supported by a bracket 15a. In the chamber 3, the substrate W is transferred from the horizontal state to the inclination of 75 degrees by the potential conversion unit 16 shown by the dotted line in Fig. 1, and then carried in from the slit 13 200818373. In other words, the unprocessed substrate W is transported from the fifth processing unit 1E side to the second processing unit 丨8 side via the upper transport unit 4, and is tilted from the horizontal state to 75 degrees by the second posture changing unit 16, and then carried in. The first processing list is in s1A. The substrate w carried into the chamber 3 of the first processing unit 1A supports the non-device surface, that is, the back surface thereof, by the support roller 14 mounted on the transport shaft 15, and drives the outer peripheral surface of the roller 17 Supporting the lower end of the substrate. The driving roller 17 is mounted on the rotating shaft 19 of the driving unit 18, and the rotating shaft 19 is driven to rotate. The lower end of the driving roller 17 is supported by the driving roller 17 and the back side. The aforementioned substrate W supported by the aforementioned support roller 14. The substrate W is removed by the stripping liquid as the processing liquid in the first to third processing units 1A to 1C on the upstream side in the transport direction, and then cleaned by the cleaning liquid as the processing liquid in the fourth processing unit 1D. . After 15, the drying treatment is performed by hot air in the fifth processing unit 1E. The substrate w which has been processed through each of the processing units 1A to 1E in this order is carried out from the fifth processing unit 1E while being inclined at 75 degrees. The substrate W carried out from the fifth processing unit 1E is switched to the horizontal state from the tilt state by the second posture converting unit 23 indicated by the dotted line in Fig. 1, and then the next step is performed. 20, as shown in FIG. 2, the drive unit 18 has a long plate-shaped lower base member 24 along the width direction of the chamber 3 (the transport direction of the base 'board W), and the lower base member 24 is provided with The lower base member 24 is equal to the groove-shaped upper base member 25, and the lower ends of the upper base member 25 are fixedly coupled to the lower base member 24. 10 200818373 In the upper base member 25, one end portion of the flat-shaped attachment member 26 that is approximately equal to the lower base member 24 is connected to the other end portion so as to be adjustable to be inclined with respect to the upper base member angle. In other words, the aforementioned mounting member 26 can adjust the inclination angle of the chamber 3 to the front-rear direction by 5 degrees. At one end and the other end in the width direction of the mounting member 26, the plurality of brackets 31 are respectively disposed at positions at a predetermined interval in the longitudinal direction with respect to the longitudinal direction of the mounting member 26. The intermediate portion of the axial direction of the rotary shaft 19 is supported by a pair of bearings (not shown) on the bracket 31 10 in the width direction and is rotatable. The drive roller 17 is attached to the front end of the rotary shaft 19, and the first gear 33 is engaged with the rear end thereof. Further, if the chamber 3 is to be placed on the chassis 2, the lower end faces of the four rod-shaped reference members 35 can be attached and fixed to the support portion 41 provided on the chassis 2 by screws 42. In the drive unit 18, the lower corners of the lower corner portions of the lower base member 24 are attached and fixed to the upper end surface of the reference member 35 by screws 42, and the upper end faces of the four reference members 35 are located on the same plane. Therefore, the drive unit 18 can be mounted and fixed without being skewed in the width direction and the longitudinal direction of the lower base member 24. When the driving unit 18 is inserted into the second chamber 3 with reference to the upper end surface of the reference member 35, the plurality of rotating shafts 19 supported by the driving unit 18 are protruded from the leading holes 44 formed by the opening of the front plate 12b of the chamber 3 to the driving. Room 45. Further, after the drive unit 18 is inserted into the chamber 3, the first gear 33 is engaged with the rear end of the rotary shaft 19. A driving source 51 is disposed in the driving chamber 45, and a driving pulley 53 is spliced to the output shaft of the driving source 51. A belt 55 is stretched between the drive pulley 53 and the driven pulley 54, and the driven pulley 54 is coaxially disposed with a second gear train (not shown), and the second gear is engaged with the second gear 33. Therefore, when the drive source 51 starts operating, the rotary shaft 19 is driven to rotate, so that the drive roller π provided at the tip end of the rotary shaft 19 is also driven to rotate. When the drive roller 17 is driven to rotate, the substrate W supported by the drive rollers 17 at the lower end is conveyed in the rotational direction of the drive roller 17. As shown in FIGS. 2 and 4, the first to third processing units 1 to 1 (:*) are sprayed on the substrate|front to remove the photoresist, and are arranged at predetermined intervals along the carrier 10 of the substrate. A plurality of liquid supply pipes 61 are provided, and the liquid supply pipe 61 is opposed to the upper side in the oblique direction of the substrate W which is obliquely conveyed, that is, the front surface of the substrate W is formed in parallel with each other. (4) The conveying direction is further provided with a plurality of nozzle bodies 62 at predetermined intervals in the axial direction, and the liquid supply pipe (1) and the 15 nozzles 62 form the supply processing liquid device of the present invention. The stripping liquid is supplied to a high pressure of about 7 MPa. The liquid supply tube 6 is configured to eject the processing liquid from the nozzle body 62 provided in the liquid supply tube 61 to the front surface of the substrate W at a high pressure. The driving roller 17 adjacent to the lower end of the supporting substrate w is disposed to prevent bending. The roller 20 is prevented from being bent, and the lower end of the substrate W supported by the outer peripheral surface of the driving roller is prevented from being bent toward the back side by the pressure of the processing liquid sprayed from the nozzle body 62. 64 is supported by the support shaft 66, and is free to rotate, and supports 66 is disposed on the bracket 65 which is erected from the bottom surface of the chamber 3. 12 200818373 In other words, the aforementioned anti-bending roller 64 is disposed near the driving roller 17, and in this embodiment, as shown in FIG. As shown in Fig. 4, in the conveyance direction of the substrate W (indicated by an arrow X), it is located on the upstream side of the rotation axis 01 of the drive roller 17, and a part of the diameter direction thereof is located on the drive roller 17 5 along the substrate w The direction of the diameter D of the conveyance direction X (as shown in Fig. 3) is above. Further, the outer peripheral surface of the bending roller 64 is prevented from being disposed on the lower end of the substrate W which is supported by the support roller 14 by the support roller 14 On the back side, the sister has its rotation axis 02 arranged perpendicularly to the rotation axis 〇1 of the drive roller 17 and the conveyance direction X of the substrate. 10 By this configuration, the drive roller is driven at the lower end of the substrate W. The outer peripheral surface of the sub-section 17 is supported, and the back surface of the sub-stage 17 is supported by the support roller 14. The drive roller 17 can be driven to rotate. Therefore, the substrate w can be contacted with the outer peripheral surface of the drive roller 17 by the lower end thereof. Along the direction of rotation of the aforementioned drive roller 17 Further, the high pressure processing liquid 15 is ejected from the nozzle body 62 provided on the liquid supply pipe 61 to the front side of the substrate w to be transported, and the front surface thereof can be processed. <When the substrate W is ejected from the nozzle body 62, When the liquid pressure is applied, the portion of the substrate W that is supported by the unsupported roller 14 is bent toward the back side, and particularly includes the lower end portion E (as shown in FIGS. 3 and 4) of the substrate w in the conveyance direction. The peripheral portion is more easily bent toward the back side than other portions.
2〇 又，基板W之周邊部中，位於搬運方向後方之下端部E 如第4圖中點鏈線所示，於彎曲狀態下被搬運至接觸驅動滚 子π之外周面之位置時，來自驅動滾子17之外周面之驅動 力將如第4圖中箭頭B所示般作用於使已彎曲之基板％之搬 運方向後方之下端部E更為彎曲之方向上。因此，基板1之 13 200818373 ，而有使該下端部 搬運方向後方之下端部E之彎曲將會變大 E產生裂痕專損傷之虞。 因此， 之外周 但’驅動滾子17附近配設有防止彎曲滾子64 如第4圖中實線所示，可阻止基板w因與驅動滾子u 彎 面接觸而使前述下端部E如箭頭B所示往背面側之方向 曲0In the peripheral portion of the substrate W, the lower end portion E located in the rear direction of the conveyance direction is conveyed to a position contacting the outer peripheral surface of the drive roller π in a curved state as indicated by the dotted chain line in Fig. 4, and The driving force of the outer peripheral surface of the driving roller 17 acts as shown by an arrow B in Fig. 4 in a direction in which the lower end portion E of the rear side in the conveying direction of the bent substrate % is more curved. Therefore, the substrate 1 of 13 200818373 has a tendency to increase the curvature of the lower end portion E at the lower end in the conveying direction of the lower end portion. Therefore, the outer circumference is provided with the anti-bending roller 64 in the vicinity of the driving roller 17, as shown by the solid line in FIG. 4, which prevents the substrate w from being in contact with the curved surface of the driving roller u, so that the lower end portion E is as an arrow. B shows the direction to the back side of the curve 0
總之，當基板W受到處理液壓力，而於搬運方向後方 之下端部E已彎曲之狀態下，被搬運至接觸驅動滾子17之外 周面之位置附近時，該下端部E可藉由防止彎曲滾子64矯正 10其彎曲狀態，而與驅動滾子17之外周面接觸。 因此，即使基板W之搬運方向後方之下端部£受處理液 壓力而往背面側彎曲，也可確實地防止該下端部£因驅動滾 子17產生更大彎曲進而造成損傷。 前述防止彎曲滾子64設置在與設於搬運軸15上之前述 15支撐滾子14不同的支軸66上，因此，前述防止彎曲滾子64 可於驅動滾子17附近，不受支撐滾子14之設置狀態所限， 自由地設定其設置位置。 第5A圖、第5B圖係顯示本發明之第2實施態樣。在該 實施態樣中，在防止彎曲滾子64所設置之位置即驅動滾子 20 17附近，且於驅動滾子17沿基板W之搬運方向上之直徑D的 範圍内之上流側與下游側兩側，設置有一對防止彎曲滾子 64，且使其直徑方向之一部份位於前述直徑D的範圍内。 第6A圖、第6B圖係顯示本發明之第3實施態樣。在該 實施態樣中，前述防止彎曲滾子64係鄰近驅動滾子17，且 14 200818373 - 防止彎曲滾子64之旋轉軸線02設於基板W之搬運方向上， 與前述驅動滾子17之旋轉軸線垂直相交之位置。 換言之，前述防止彎曲滾子64設置成使旋轉軸線〇2與 驅動滾子17沿基板W之搬運方向上之直徑D的中心，即驅動 5 滾子17之旋轉軸線01—致。 於前述第2、第3實施態樣中，即使基板W之搬運方向 後方之下端部E受處理液壓力而彎曲，亦可在被搬運至接觸 驅動滚子17之位置時，藉前述防止彎曲滾子64矯正該彎曲 参 狀態。In short, when the substrate W is subjected to the pressure of the processing liquid and is conveyed to a position near the outer peripheral surface of the contact driving roller 17 in a state where the lower end portion E is bent in the conveying direction, the lower end portion E can be prevented from being bent. The roller 64 corrects 10 its curved state and comes into contact with the outer peripheral surface of the drive roller 17. Therefore, even if the lower end portion of the substrate W in the conveyance direction is bent toward the back side by the pressure of the treatment liquid, it is possible to surely prevent the lower end portion from being damaged by the larger bending of the drive roller 17. The aforementioned anti-bending roller 64 is disposed on a different support shaft 66 than the aforementioned 15 support rollers 14 provided on the conveyance shaft 15, so that the aforementioned anti-bending roller 64 can be adjacent to the drive roller 17, without being supported by the roller. The setting state of 14 is limited, and the setting position is freely set. Fig. 5A and Fig. 5B show a second embodiment of the present invention. In this embodiment, the flow side and the downstream side in the vicinity of the drive roller 20 17 at the position where the bending roller 64 is disposed, and the diameter D in the conveyance direction of the drive roller 17 in the conveyance direction of the substrate W are provided. On both sides, a pair of anti-bending rollers 64 are provided, and one of the diameter directions thereof is located within the range of the aforementioned diameter D. Fig. 6A and Fig. 6B show a third embodiment of the present invention. In this embodiment, the aforementioned bending preventing roller 64 is adjacent to the driving roller 17, and 14 200818373 - prevents the rotation axis 02 of the bending roller 64 from being disposed in the conveying direction of the substrate W, and the rotation of the driving roller 17 described above. The position where the axes intersect perpendicularly. In other words, the aforementioned bending preventing roller 64 is disposed such that the rotation axis 〇2 and the center of the diameter D of the driving roller 17 in the conveying direction of the substrate W, that is, the rotation axis 01 of the driving roller 15. In the second and third embodiments, even if the end portion E of the lower side of the substrate W in the conveyance direction is bent by the pressure of the processing liquid, the bending roller can be prevented by the above when being conveyed to the position contacting the driving roller 17. Sub 64 corrects the curved parameter state.
因此，與前述第1實施態樣相同，可確實地防止基板W 1〇 遽方向後方之下端部E因驅動滾子17之驅動力過度彎 曲而造成損傷。 本發明之防止彎曲滾子不僅可適用於以剝離液處理基 &情況，亦適用於以純水等其他處理液或氣體進行喷射 振 之情況，總之，只要是以高壓喷射處理液或氣體至基 15 ^ μ 板之情況皆有效。 式簡單說明】 ^ 第1圖係顯示本發明第1實施態樣之處理裝置之概略構 造么透視圖。 第2圖係顯示前述處理裝置中室之截面圖。 2〇 ^ 第3圖係顯示支撐滾子與驅動滾子之配置關係之前視 - 圖。 第4圖係顯示支撐滾子與驅動滾子之配置關係之平面 圖0 15 200818373 第5A圖係顯示本發明第2實施態樣之支撐滾子與驅動 滾子之配置關係之前視圖。 第5B圖係顯示第5A圖中支撐滾子與驅動滾子之配置 關係之平面圖。 5 第6A圖係顯示本發明第3實施態樣之支撐滾子與驅動 滾子之配置關係之前視圖。 第6B圖係顯示第6A圖中支撐滾子與驅動滾子之配置 關係之平面圖。 【主要元件符號說明】 1…裝置本體 13".狹縫 1A...第1處理單元 14…支撐滾子 1B...第2處理單元 15…搬運車由 1C…第3處理單元 15a···托架 1D...第4處理單元 16...第1姿勢變換部 1E·.·第5處理單元 17…·驅動滾子 2...底架 18···驅動單元 3...室 19…旋轉軸 4…上部搬運部 23…第2姿勢變換部 5…腳體 24...下部底座構件 6...空間部 25."上部底座構件 7...機器 26…安裝餅 8...框架 31…托架 9…機器部 33…第1齒輪 12b···前板 35…基準構件 16 200818373 41…支撐部 64.··防止彎曲滾子 42…螺絲 65...托架 44...導出孔 66···支車由 45···驅動室 01…旋轉軸線 51···驅動源 02…旋轉軸線 53…驅動滑輪 B…箭頭 54…從動滑輪 D…直徑 55…皮帶 E...下端部 61...供液管 W…鉍 62···喷嘴體 X...搬運方向 17Therefore, similarly to the first embodiment, it is possible to reliably prevent the end portion E at the lower rear side in the direction of the substrate W 1 遽 from being damaged due to excessive bending of the driving force of the driving roller 17. The anti-bending roller of the present invention can be applied not only to the case of treating the base with a peeling liquid, but also to the case of spraying with other treatment liquid or gas such as pure water. In short, as long as the treatment liquid or gas is sprayed at a high pressure to The case of the base 15 ^ μ board is valid. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a schematic configuration of a processing apparatus according to a first embodiment of the present invention. Figure 2 is a cross-sectional view showing the chamber in the aforementioned processing apparatus. 2〇 ^ Figure 3 shows the configuration relationship between the support roller and the drive roller. Fig. 4 is a plan view showing the arrangement relationship between the supporting roller and the driving roller. Fig. 0 15 200818373 Fig. 5A is a front view showing the arrangement relationship between the supporting roller and the driving roller according to the second embodiment of the present invention. Fig. 5B is a plan view showing the arrangement relationship of the supporting roller and the driving roller in Fig. 5A. Fig. 6A is a front view showing the arrangement relationship between the supporting roller and the driving roller in the third embodiment of the present invention. Fig. 6B is a plan view showing the arrangement relationship of the support roller and the drive roller in Fig. 6A. [Description of main component symbols] 1...device main body 13" slit 1A...first processing unit 14...support roller 1B...second processing unit 15...transporter 1C...third processing unit 15a·· Bracket 1D...4th processing unit 16...First posture converting unit 1E···5th processing unit 17...·Drive roller 2... Chassis 18···Drive unit 3... Room 19...rotation shaft 4...upper transport unit 23...second posture change unit 5...foot body 24...lower base member 6...space unit 25."upper base member 7...machine 26...installing cake 8...frame 31...bay 9...machine unit 33...first gear 12b···front plate 35...reference member 16 200818373 41...support portion 64.··Preventing the bending roller 42...screw 65... Bracket 44...Extraction hole 66···Car is 45···Drive chamber 01...Rotation axis 51···Drive source 02...Rotation axis 53...Drive pulley B...arrow 54...driven pulley D...diameter 55... Belt E... lower end portion 61... liquid supply tube W...铋62···nozzle body X... conveying direction 17