JP2006081997A - Treatment apparatus of substrate - Google Patents

Treatment apparatus of substrate Download PDF

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JP2006081997A
JP2006081997A JP2004268627A JP2004268627A JP2006081997A JP 2006081997 A JP2006081997 A JP 2006081997A JP 2004268627 A JP2004268627 A JP 2004268627A JP 2004268627 A JP2004268627 A JP 2004268627A JP 2006081997 A JP2006081997 A JP 2006081997A
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substrate
processing
predetermined
processing chamber
support roller
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JP4568059B2 (en
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Yukinobu Nishibe
幸伸 西部
Akinori Iso
明典 磯
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2004268627A priority Critical patent/JP4568059B2/en
Priority to TW094130358A priority patent/TWI364069B/en
Priority to KR1020050086347A priority patent/KR101204725B1/en
Priority to CNB2005101034237A priority patent/CN100530525C/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G13/00—Roller-ways
    • B65G13/02—Roller-ways having driven rollers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

Abstract

<P>PROBLEM TO BE SOLVED: To provide a treatment apparatus in which the undersurface of a substrate can be supported surely by a supporting roller when the substrate is treated while being inclined and conveyed. <P>SOLUTION: This treatment apparatus is provided with: a plurality of treatment chambers 3-5 which are arranged side by side and each of which has the width narrower than that of the substrate and in each of which the predetermined treatment is performed on the substrate; a plurality of mounting members 11 each of which has the length shorter than the height of the substrate and some of which are arranged in each of treatment chambers parallel to one another at predetermined intervals in the vertical direction; the supporting roller 15 which is arranged to be rotated on each of mounting members and used for supporting the undersurface of the substrate to be sent into the corresponding treatment chamber while being inclined at a predetermined angle; and a driving roller 22 which is arranged to be rotary driven in each of treatment chambers for supporting the bottom end of the substrate, the undersurface of which is supported by the supporting roller, and is rotary driven to convey the substrate to the predetermined direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は基板を所定の角度で傾斜させて搬送しながら処理する基板の処理装置に関する。   The present invention relates to a substrate processing apparatus that processes a substrate while being inclined at a predetermined angle.

液晶表示装置に用いられるガラス製の基板には回路パターンが形成される。基板に回路パターンを形成するにはリソグラフィープロセスが採用される。リソグラフィープロセスは周知のように上記基板にレジストを塗布し、このレジストに回路パターンが形成されたマスクを介して光を照射する。   A circuit pattern is formed on a glass substrate used in the liquid crystal display device. A lithographic process is employed to form a circuit pattern on the substrate. In a lithography process, as is well known, a resist is applied to the substrate, and light is irradiated through a mask having a circuit pattern formed on the resist.

つぎに、レジストの光が照射されない部分或いは光が照射された部分を除去し、基板のレジストが除去された部分をエッチングし、エッチング後にレジストを除去するなどの一連の工程を複数回繰り返すことで、上記基板に回路パターンを形成する。   Next, by repeating a series of steps such as removing a portion of the resist not irradiated with light or a portion irradiated with light, etching the portion of the substrate where the resist is removed, and removing the resist after etching, a plurality of times. Then, a circuit pattern is formed on the substrate.

このようなリソグラフィープロセスにおいては、上記基板に現像液、エッチング液或いはエッチング後にレジストを除去する剥離液などによって基板を処理する工程、さらに洗浄液によって洗浄する工程があり、洗浄後には基板に付着残留した洗浄液を除去する乾燥工程が必要となる。   In such a lithography process, there are a step of treating the substrate with a developer, an etching solution or a stripping solution for removing the resist after etching, and a step of washing with a cleaning solution. After washing, the substrate remains adhered to the substrate. A drying process for removing the cleaning liquid is required.

従来、基板に対して上述した一連の処理を行う場合、上記基板は軸線を水平にして配置された搬送ローラによって水平な状態でそれぞれの処理チャンバに順次搬送し、各チャンバで上述したそれぞれの処理を行うようにしている。   Conventionally, when the above-described series of processing is performed on a substrate, the substrate is sequentially transported to each processing chamber in a horizontal state by transport rollers arranged with the axis line horizontal, and each processing described above is performed in each chamber. Like to do.

ところで、最近では液晶表示装置に用いられるガラス製の基板が大型化及び薄型化する傾向にある。そのため、基板を水平搬送すると、自重によって搬送ローラ間における基板の撓みが大きくなるため、各処理チャンバでの処理が基板の板面全体にわたって均一に行えなくなるということが生じる。   Recently, glass substrates used in liquid crystal display devices tend to be larger and thinner. For this reason, when the substrate is transported horizontally, the substrate is flexed between the transport rollers due to its own weight, so that processing in each processing chamber cannot be performed uniformly over the entire plate surface of the substrate.

しかも、基板が大型化すると、基板上に供給されて滞留する処理液の量が増大するから、基板上に滞留する処理液の量に応じて上記搬送軸に加わる荷重が大きくなり、そのことによっても搬送軸の撓みが増大する。そのため、基板は搬送軸とともに撓み、均一な処理が行えなくなるということがある。
そこで、最近では基板の撓みを少なくするために、基板を所定の角度で傾斜させて搬送しながら、処理するということが実用化されつつある。基板を傾斜させて搬送すれば、搬送ローラ間における基板の自重による撓みを除くことができるばかりか、水平に搬送する場合のように基板上に処理液が滞留し、その重さによって基板が撓むのも防止することができる。 Moreover, when the substrate is increased in size, the amount of the processing liquid that is supplied and stays on the substrate increases, so that the load applied to the transport shaft increases according to the amount of the processing liquid that stays on the substrate, thereby Also, the deflection of the transport shaft increases. For this reason, the substrate may be bent together with the transport shaft, and uniform processing may not be performed.
Therefore, recently, in order to reduce the bending of the substrate, it has been put into practical use that the substrate is processed while being inclined at a predetermined angle. If the substrate is transported at an incline, not only can the bending due to the weight of the substrate between the transport rollers be removed, but the processing liquid stays on the substrate as in the case of transporting horizontally, and the substrate is bent due to its weight. Can also be prevented.

上記基板を傾斜させて搬送する場合、基板の傾斜方向の下面を支持ローラで支持し、下端を駆動ローラで支持する。そして、駆動ローラを回転駆動することで、上記基板を駆動ローラの回転方向に搬送するようにしている。   When the substrate is conveyed while being inclined, the lower surface in the inclined direction of the substrate is supported by a support roller, and the lower end is supported by a drive roller. Then, the drive roller is driven to rotate so that the substrate is conveyed in the rotation direction of the drive roller.

上記支持ローラは、基板の搬送方向に沿って所定間隔で、しかも傾斜した基板の板面と軸線を平行、つまり基板の傾斜角度と同じ角度で傾斜して配置された複数の取り付け軸に、軸方向に所定間隔で回転可能に設けられている。   The support roller is mounted on a plurality of mounting shafts arranged at predetermined intervals along the substrate transport direction and parallel to the inclined plate surface and the axis, that is, inclined at the same angle as the substrate inclination angle. It is provided to be rotatable at a predetermined interval in the direction.

ところで、上述したように、基板を取り付け軸に設けられた支持ローラによって傾斜させて支持し、下端に係合した駆動ローラを駆動して搬送する構成によると、基板が大型化することで、上記取り付け軸が長尺化することが避けられない。つまり、取り付け軸は、傾斜した基板の上下方向の寸法（高さ寸法）よりも長くしなければならず、最近では基板の大型化に伴って取り付け軸を２ｍ以上の長さ寸法にしなければならない。   By the way, as described above, according to the configuration in which the substrate is inclined and supported by the support roller provided on the mounting shaft, and the drive roller engaged with the lower end is driven and conveyed, the size of the substrate increases. It is inevitable that the mounting shaft becomes longer. In other words, the mounting shaft must be longer than the vertical dimension (height dimension) of the inclined substrate, and recently, the mounting shaft must have a length dimension of 2 m or more as the size of the substrate increases. .

取り付け軸が長尺化、とくに２ｍ以上の長さになると、この取り付け軸が所定の角度で傾斜して設けられていることや支持ローラを介して基板の重量が加わるなどのことによって取り付け軸に撓みが生じ易くなる。取り付け軸に撓みが生じると、この取り付け軸に所定間隔で設けられた複数の支持ローラが基板の板面に対して均一な強さで当たらなくなる。   When the mounting shaft becomes longer, especially when the length is 2 m or more, the mounting shaft is inclined at a predetermined angle or the weight of the substrate is added via a support roller. Bending tends to occur. When the mounting shaft is bent, the plurality of support rollers provided at a predetermined interval on the mounting shaft do not hit the plate surface of the substrate with a uniform strength.

つまり、基板に対してほとんど当たらない支持ローラや強く当たり過ぎる支持ローラが生じる。それによって、基板を円滑に搬送することができなくなったり、強く当たった支持ローラによって基板に傷を付けるという虞がある。   That is, a support roller that hardly hits the substrate or a support roller that strikes too strongly is generated. As a result, the substrate may not be transported smoothly, or the substrate may be damaged by the support roller that is struck strongly.

この発明は、基板を所定の角度で傾斜させて搬送する場合に、基板に複数の支持ローラを均一に当てて搬送することができるようにした基板の処理装置を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus in which a plurality of support rollers can be uniformly applied to a substrate when the substrate is conveyed while being inclined at a predetermined angle.

この発明は、基板を所定の角度で傾斜させて搬送し、その搬送過程で上記基板に対して所定の処理を行う基板の処理装置であって、
上記基板の幅寸法よりも小さな幅寸法で形成されて並設されるとともに上記基板に対してそれぞれ所定の処理を行う複数の処理室と、
上記基板の高さ寸法よりも短い長さ寸法に設定され各処理室内に上下方向に所定間隔で平行に設けられた複数の取り付け部材と、
それぞれの取り付け部材に回転可能に設けられ上記処理室内に所定の角度で傾斜して送り込まれる上記基板の傾斜方向の下側の面を支持する支持ローラと、
各処理室内に回転駆動可能に設けられ上記支持ローラによって傾斜方向の下側の面が支持される上記基板の下端を支持し回転駆動されることで上記基板を所定方向に搬送する駆動ローラと
を具備したことを特徴とする基板の処理装置にある。 The present invention is a substrate processing apparatus for transporting a substrate inclined at a predetermined angle and performing a predetermined process on the substrate in the transport process,
A plurality of processing chambers that are formed in parallel with a width dimension smaller than the width dimension of the substrate and perform predetermined processing on the substrate, respectively.
A plurality of mounting members that are set to a length shorter than the height of the substrate and are provided in parallel in the vertical direction at predetermined intervals in each processing chamber;
A support roller that is rotatably provided on each attachment member and supports a lower surface of the substrate in the inclined direction that is inclined and fed into the processing chamber at a predetermined angle;
A driving roller which is rotatably provided in each processing chamber and supports the lower end of the substrate supported on the lower surface in the tilt direction by the support roller, and is driven to rotate to convey the substrate in a predetermined direction. A substrate processing apparatus is provided.

複数の処理室のうちの少なくとも１つは、基板に処理液を噴射して処理する処理室であって、その処理室には基板の搬送方向に沿うとともに搬送方向と交差する上下方向に所定間隔で給液管が配設され、各給液管には上記基板の傾斜方向上側の面に処理液を供給するノズルが設けられていることが好ましい。   At least one of the plurality of processing chambers is a processing chamber that injects a processing liquid onto the substrate to perform processing, and the processing chamber has a predetermined interval in the vertical direction that intersects the transport direction and intersects the transport direction. It is preferable that a liquid supply pipe is provided, and each liquid supply pipe is provided with a nozzle for supplying a processing liquid to the upper surface in the tilt direction of the substrate.

上記取り付け部材には、上記支持ローラが上記基板の搬送方向と交差する前後方向に位置決め調整可能に設けられていることが好ましい。   It is preferable that the mounting member is provided with the support roller so that the positioning can be adjusted in the front-rear direction intersecting the transport direction of the substrate.

この発明は、基板を所定の角度で傾斜させて搬送し、その搬送過程で上記基板に対して所定の処理を行う基板の処理装置であって、
上記基板の幅寸法よりも小さな幅寸法で形成されて並設されるとともに上記基板に対してそれぞれ所定の処理を行う複数の処理室と、
上記処理室内に所定の角度で傾斜して送り込まれる上記基板の傾斜方向の下側の面を支持する支持ローラと、
各処理室内に回転駆動可能に設けられ上記支持ローラによって傾斜方向の下側の面が支持される上記基板の下端を支持し回転駆動されることで上記基板を所定方向に搬送する駆動ローラと
を具備したことを特徴とする基板の処理装置にある。 The present invention is a substrate processing apparatus for transporting a substrate inclined at a predetermined angle and performing a predetermined process on the substrate in the transport process,
A plurality of processing chambers that are formed in parallel with a width dimension smaller than the width dimension of the substrate and perform predetermined processing on the substrate, respectively.
A support roller for supporting a lower surface of the substrate in the tilt direction, which is fed into the processing chamber at a predetermined angle;
A driving roller which is rotatably provided in each processing chamber and supports the lower end of the substrate supported on the lower surface in the tilt direction by the support roller, and is driven to rotate to convey the substrate in a predetermined direction. A substrate processing apparatus is provided.

この発明によれば、処理室の幅寸法を基板の幅寸法よりも小さくし、しかも支持ローラが設けられる取り付け部材の長さ寸法を基板の高さ寸法よりも短くし、この取り付け部材を処理室の幅方向に沿って設けるようにした。そのため、取り付け部材の長さ寸法を基板の幅寸法及び高さ寸法に比べて十分に短くできるから、取り付け部材に撓みが生じ難くなり、この取り付け部材に設けられた支持ローラによって基板を確実に支持することが可能となる。   According to the present invention, the width dimension of the processing chamber is made smaller than the width dimension of the substrate, and the length dimension of the mounting member on which the support roller is provided is made shorter than the height dimension of the substrate. It was made to provide along the width direction. Therefore, the length of the mounting member can be made sufficiently shorter than the width and height of the substrate, so that the mounting member is less likely to bend and the substrate is reliably supported by the support roller provided on the mounting member. It becomes possible to do.

図１はこの発明の処理装置を示す概略的構成図であって、この処理装置は筐体１を有する。この筐体１内は、長手方向に所定間隔で設けられた複数の仕切り壁２によって複数、この実施の形態では第１乃至第３の３つの処理室３〜５に隔別されている。つまり、筐体１内には第１乃至第３の処理室３〜５が横方向に並んで形成されている。   FIG. 1 is a schematic configuration diagram showing a processing apparatus of the present invention, and this processing apparatus has a housing 1. The housing 1 is divided into a plurality of partition walls 2 provided at predetermined intervals in the longitudinal direction, and in this embodiment, the housing 1 is divided into first to third three processing chambers 3 to 5. That is, the first to third processing chambers 3 to 5 are formed side by side in the housing 1.

図３は上記筐体１の横断面図であって、筐体１の長手方向一端の側壁１ａにはスリット状の搬入口６が上下方向に所定の角度、たとえば７５度の角度で傾斜して形成され、長手方向他端の側壁１ｂには同じくスリット状の搬出口７が搬入口６と同じ角度で傾斜して形成されている。筐体１内を３つの処理室３〜５に隔別した２つの仕切り壁２には上記搬入口６及び搬出口７と同じ角度で傾斜したスリット状の連通口８が形成されている。   FIG. 3 is a transverse cross-sectional view of the casing 1, and a slit-shaped entrance 6 is inclined at a predetermined angle, for example, an angle of 75 degrees, on the side wall 1a at one end in the longitudinal direction of the casing 1. Similarly, a slit-like exit 7 is formed at the same angle as the entrance 6 on the side wall 1b at the other end in the longitudinal direction. A slit-like communication port 8 inclined at the same angle as the carry-in port 6 and the carry-out port 7 is formed in the two partition walls 2 that separate the inside of the housing 1 into three processing chambers 3 to 5.

第１乃至第３の処理室３〜５内には、所定の厚さを有する帯板状の複数、この実施の形態では４つの取り付け部材１１が上下方向に所定間隔で水平に、しかも図２に示すように搬入口６、搬出口７及び連通口８の傾斜角度に対応するよう前後方向に位置をずらして設けられている。   In the first to third processing chambers 3 to 5, a plurality of strip-like plate members having a predetermined thickness, in this embodiment, four attachment members 11 are horizontally arranged at predetermined intervals in the vertical direction, and FIG. As shown in FIG. 2, the positions are shifted in the front-rear direction so as to correspond to the inclination angles of the carry-in port 6, the carry-out port 7, and the communication port 8.

図３に示すように、上記筐体１の長手方向両端の側壁１ａ，１ｂの内面及び一対の仕切り壁２の両側面にはＬ字状の受け具１２が一辺を固定して設けられている。上記取り付け部材１１の長手方向両端面には上記受け具１２に対応するＬ字状の取り付け具１３が一辺を固定して設けられている。   As shown in FIG. 3, L-shaped receivers 12 are provided with one side fixed to the inner surfaces of the side walls 1 a and 1 b at both ends in the longitudinal direction of the casing 1 and both side surfaces of the pair of partition walls 2. . L-shaped attachments 13 corresponding to the receiving members 12 are provided on both end surfaces in the longitudinal direction of the attachment member 11 with one side fixed.

そして、上記受け具１２の他辺に、上記取り付け具１３の他辺がねじ止め固定されることで、上記取り付け部材１１が各処理室３〜５内に上述したように上下方向に所定間隔で水平に、しかも下端にゆくにつれて前方に位置をずらして設けられている。   Then, the other side of the fixture 13 is screwed and fixed to the other side of the receiver 12, so that the attachment member 11 is vertically spaced at a predetermined interval as described above in each of the processing chambers 3 to 5. The position is shifted horizontally and further toward the lower end.

各取り付け部材１１の上面には、それぞれ４つの支持ローラ１５が軸線を垂直にして回転可能に設けられている。図４は上記支持ローラ１５の取付け構造を示している。すなわち、取り付け部材１１には前後方向の前端側に、前後方向に沿って細長い取り付け孔１６が形成されている。   Four support rollers 15 are provided on the upper surface of each attachment member 11 so as to be rotatable with their axes perpendicular to each other. FIG. 4 shows the mounting structure of the support roller 15. That is, the attachment member 11 is formed with an elongated attachment hole 16 along the front-rear direction on the front end side in the front-rear direction.

上記支持ローラ１５には軸受１７が設けられ、この軸受１７の内輪には取り付けボルト１８が挿通されている。取り付けボルト１８の上記取付け孔１６から突出した端部にはワッシャ１９を介してナット２０が螺合されている。それによって、上記支持ローラ１５は上記取り付け部材１１に前後方向の取り付け位置の調整可能に取り付けられている。   The support roller 15 is provided with a bearing 17, and a mounting bolt 18 is inserted into the inner ring of the bearing 17. A nut 20 is screwed to the end of the mounting bolt 18 protruding from the mounting hole 16 via a washer 19. Accordingly, the support roller 15 is attached to the attachment member 11 so that the attachment position in the front-rear direction can be adjusted.

図１と図２に示すように、各処理室３〜５の下端部には複数の駆動ローラ２２が処理室３〜５の幅方向に沿って所定間隔で配置されている。各駆動ローラ２２は駆動モータ２３によって回転駆動されるようになっている。   As shown in FIGS. 1 and 2, a plurality of driving rollers 22 are arranged at predetermined intervals along the width direction of the processing chambers 3 to 5 at the lower ends of the processing chambers 3 to 5. Each drive roller 22 is rotationally driven by a drive motor 23.

上記第１の処理室３の側壁１ａに形成された搬入口６からは液晶パネルに用いられるガラス製の基板Ｗが７５度の角度で傾斜して供給される。第１の処理室３に供給された基板Ｗは下端が駆動ローラ２２に支持され、傾斜方向の下側の面が支持ローラ１５によって支持される。したがって、上記駆動ローラ２２が駆動モータ２３によって回転駆動されれば、上記基板Ｗは駆動ローラ２２の回転方向、つまり第２の処理室４の方向に搬送される。   A glass substrate W used for the liquid crystal panel is supplied at an angle of 75 degrees from a carry-in port 6 formed in the side wall 1a of the first processing chamber 3. The lower end of the substrate W supplied to the first processing chamber 3 is supported by the drive roller 22, and the lower surface in the inclined direction is supported by the support roller 15. Therefore, when the driving roller 22 is rotationally driven by the driving motor 23, the substrate W is transported in the rotational direction of the driving roller 22, that is, in the direction of the second processing chamber 4.

上記基板Ｗは２ｍ角以上の大きさであって、たとえば高さ寸法が２２００ｍｍ、幅寸法が２６００ｍｍの大きさを有する。第１乃至第３の処理室３〜５の幅寸法は上記基板Ｗの幅寸法に比べて十分に小さく設定されている。たとえば、基板Ｗの幅寸法の２分の１〜３分の２程度に設定される。上記取り付け部材１１の長さ寸法は基板Ｗの高さ寸法に比べて短く設定されている。たとえば、基板Ｗの高さ寸法の２分の１〜３分の２程度に設定される。それによって、取り付け部材１１は自重によって撓みが生じ難い長さ寸法、たとえば２ｍよりも十分に短い寸法にすることができる。   The substrate W has a size of 2 m square or more and has a height dimension of 2200 mm and a width dimension of 2600 mm, for example. The width dimensions of the first to third processing chambers 3 to 5 are set to be sufficiently smaller than the width dimension of the substrate W. For example, it is set to about one-half to one-third of the width dimension of the substrate W. The length of the mounting member 11 is set shorter than the height of the substrate W. For example, it is set to about one-half to one-third of the height dimension of the substrate W. Thereby, the attachment member 11 can be made to have a length dimension that is difficult to be bent by its own weight, for example, a dimension sufficiently shorter than 2 m.

上記取り付け部材１１の長さ寸法を自重によって撓みが生じ難い長さ寸法にしても、各処理室３〜５の幅寸法も基板Ｗの幅寸法に比べて短く設定しているため、取り付け部材１１の長さ寸法が処理室３〜５の幅寸法に比べて大幅に短くなることがない。   Even if the length dimension of the mounting member 11 is set to a length dimension that hardly causes bending due to its own weight, the width dimension of each of the processing chambers 3 to 5 is set shorter than the width dimension of the substrate W. The length dimension is not significantly shorter than the width dimension of the processing chambers 3 to 5.

それによって、取り付け部材１１に設けられた支持ローラ１５は、基板Ｗの各処理室３〜５内に位置する部分を幅方向に沿って確実に支持することになる。つまり、取り付け部材１１を短くしても、それに応じて各処理室３〜５の幅寸法も短くしているため、基板Ｗの各処理室３〜５内に位置する部分の幅方向を支持ローラ１５によって確実に支持することができる。   As a result, the support roller 15 provided on the attachment member 11 reliably supports the portions of the substrate W positioned in the processing chambers 3 to 5 along the width direction. That is, even if the mounting member 11 is shortened, the width dimension of each of the processing chambers 3 to 5 is also shortened accordingly, so that the width direction of the portion located in each of the processing chambers 3 to 5 of the substrate W is supported by the support roller. 15 can be reliably supported.

上記基板Ｗは上記第１の処理室３では図示せぬ洗浄ブラシによって洗浄される。第１の処理室３でブラシ洗浄された基板Ｗは第２の処理室４ではリンス処理される。すなわち、第２の処理室４内にはリンス液の供給源に流量調整弁（ともに図示せず）を介して接続された給液管２５が上下方向に所定間隔で離間して水平に配設されている。   The substrate W is cleaned in the first processing chamber 3 by a cleaning brush (not shown). The substrate W that has been brush-cleaned in the first processing chamber 3 is rinsed in the second processing chamber 4. That is, a liquid supply pipe 25 connected to a rinse liquid supply source via a flow rate adjusting valve (both not shown) is disposed in the second processing chamber 4 horizontally at a predetermined interval in the vertical direction. Has been.

各給液管２５には複数のノズル２６が所定間隔で設けられていて、これらのノズル２６からは第２の処理室３内を搬送される基板Ｗの傾斜方向上側の面に向けてリンス液が噴射されるようになっている。   A plurality of nozzles 26 are provided at predetermined intervals in each liquid supply pipe 25, and the rinsing liquid is directed from these nozzles 26 toward the upper surface in the inclination direction of the substrate W transported in the second processing chamber 3. Is to be injected.

基板Ｗにリンス液を噴射するノズル２６が設けられた給液管２５を基板Ｗの高さ方向に所定間隔で配置したことで、この基板Ｗの高さ方向において、各給液管２５のノズル２６から基板Ｗに噴射供給されるリンス液の量を各給液管２５に設けられた流量調整弁によって調整することができる。つまり、基板Ｗの板面に供給されたリンス液は基板Ｗの高さ方向上方から下方に向かって流れる。そのため、各給液管２５に同じ量のリンス液を供給したのでは、基板Ｗの高さ方向上方よりも下方の方がリンス液から受けるリンス作用が大きくなり、基板Ｗの板面全体を均一にリンス処理することができなくなる。   Since the liquid supply pipes 25 provided with the nozzles 26 for injecting the rinsing liquid onto the substrate W are arranged at predetermined intervals in the height direction of the substrate W, the nozzles of the respective liquid supply pipes 25 are arranged in the height direction of the substrate W. The amount of the rinsing liquid sprayed and supplied from 26 to the substrate W can be adjusted by a flow rate adjusting valve provided in each liquid supply pipe 25. That is, the rinsing liquid supplied to the plate surface of the substrate W flows from the upper side to the lower side in the height direction of the substrate W. Therefore, if the same amount of the rinsing liquid is supplied to each liquid supply pipe 25, the rinsing action received from the rinsing liquid in the lower part of the substrate W is higher than the upper part in the height direction, and the entire plate surface of the substrate W is uniform. Can no longer be rinsed.

しかしながら、複数の給液管２５は基板Ｗの高さ方向に対して所定間隔で離間させて配置されているから、各給液管２５へのリンス液の供給量を調整することで、基板Ｗの板面の高さ方向の上部と下部とに供給するリンス液の量を調整することができる。   However, since the plurality of liquid supply pipes 25 are arranged at predetermined intervals with respect to the height direction of the substrate W, the substrate W can be adjusted by adjusting the amount of the rinse liquid supplied to each liquid supply pipe 25. The amount of the rinsing liquid supplied to the upper and lower portions of the plate surface in the height direction can be adjusted.

したがって、基板Ｗの上部に供給するリンス液の量を下部に供給するリンス液の量よりも多くすれば、上部に供給されたリンス液が下部に流れることで、下部が受けるリンス作用を上部とほぼ同じにすることができる。一例として、傾斜した基板Ｗの板面を流れるリンス液の流速と流量との総和が基板Ｗの高さ方向のどの位置においても等しくなるよう、各供給管２５からのリンス液の供給量を設定すれば、基板Ｗの板面全体をほぼ均一にリンス処理することが可能となる。   Therefore, if the amount of the rinsing liquid supplied to the upper portion of the substrate W is made larger than the amount of the rinsing liquid supplied to the lower portion, the rinsing action supplied to the upper portion causes the rinsing action received by the lower portion to flow upward. Can be almost the same. As an example, the supply amount of the rinsing liquid from each supply pipe 25 is set so that the sum of the flow velocity and the flow rate of the rinsing liquid flowing on the inclined substrate W is equal at any position in the height direction of the substrate W. By doing so, it becomes possible to rinse the entire surface of the substrate W almost uniformly.

この実施の形態では、基板Ｗをリンス液によって処理する場合であるが、リンス液以外の処理液、たとえばエッチング液や剥離液などの処理液によって基板Ｗを処理する場合であっても上述したように処理液の供給量を調整することで、基板Ｗの板面全体を均一に処理することが可能となる。   In this embodiment, the substrate W is treated with a rinsing liquid, but as described above even when the substrate W is treated with a processing liquid other than the rinsing liquid, for example, a processing liquid such as an etching liquid or a stripping liquid. In addition, by adjusting the supply amount of the processing liquid, the entire plate surface of the substrate W can be processed uniformly.

第２の処理室４でリンス処理された基板Ｗは第３の処理室５に搬送される。この第３の処理室５には図示しないエアーナイフが基板Ｗの搬送方向に対して交差する上下方向に沿って配置されていて、リンス処理された基板Ｗの板面に付着したリンス液を気体圧によって除去する乾燥処理が行われる。そして、第３の処理室５で乾燥処理された基板Ｗは搬出口７から搬出されて次工程に受け渡されることになる。   The substrate W that has been rinsed in the second processing chamber 4 is transferred to the third processing chamber 5. In the third processing chamber 5, an air knife (not shown) is arranged along the vertical direction intersecting the transport direction of the substrate W, and the rinse liquid adhering to the plate surface of the rinsed substrate W is gasified. The drying process removed by pressure is performed. Then, the substrate W dried in the third processing chamber 5 is unloaded from the carry-out port 7 and is transferred to the next process.

このように構成された処理装置によれば、所定の角度で傾斜して搬送される基板Ｗの傾斜方向の下側の面を、各処理室３〜５の幅方向に沿って水平に配置された取り付け部材１１に設けられた支持ローラ１５によって支持するようにした。   According to the processing apparatus configured as described above, the lower surface in the tilt direction of the substrate W to be transported tilted at a predetermined angle is horizontally arranged along the width direction of each of the processing chambers 3 to 5. Further, it is supported by a support roller 15 provided on the mounting member 11.

各処理室３〜５の幅寸法は基板Ｗの幅寸法よりも小さい、２分の１〜３分の２程度に設定され、取り付け部材１１の長さ寸法は基板Ｗの高さ寸法よりも小さい、２分の１〜３分の２程度に設定さている。   The width dimension of each of the processing chambers 3 to 5 is set to about one-half to one-third that is smaller than the width dimension of the substrate W, and the length dimension of the attachment member 11 is smaller than the height dimension of the substrate W. It is set to about 1/2 to 1/3.

取り付け部材１１の長さ寸法を上述したように短くすれば、この取り付け部材１１が自重によって撓みが生じるのを防止できる。そのため、各取り付け部材１１に設けられた複数の支持ローラ１５は水平方向の高さに差が生じることなく位置決めできる。しかも、各取り付け部材１１に設けられた支持ローラ１５は、取り付け部材１１に形成された取付け孔１６によって前後方向の取り付け位置を調整することができる。   If the length dimension of the attachment member 11 is shortened as described above, the attachment member 11 can be prevented from being bent by its own weight. Therefore, the plurality of support rollers 15 provided on each attachment member 11 can be positioned without causing a difference in height in the horizontal direction. In addition, the support roller 15 provided in each attachment member 11 can adjust the attachment position in the front-rear direction by the attachment hole 16 formed in the attachment member 11.

したがって、各取り付け部材１１に設けられた支持ローラ１５を基板Ｗの傾斜方向の下面に同じ強さで当接させることができるから、駆動ローラ２２を駆動すれば、上記基板Ｗを上記支持ローラ１５によって円滑にガイドして搬送することができる。つまり、基板Ｗを傷付けるようなことなく確実に搬送することができる。   Therefore, the support roller 15 provided on each attachment member 11 can be brought into contact with the lower surface of the substrate W in the inclined direction with the same strength. Therefore, when the driving roller 22 is driven, the substrate W is moved to the support roller 15. Can be guided and transported smoothly. That is, the substrate W can be reliably transported without damaging it.

処理室３〜５の幅寸法に対して取り付け部材１１の長さ寸法が短過ぎると、各処理室３〜５内において、基板Ｗの幅方向において支持ローラ１５によって支持されない部分が多くなり、その部分が撓む虞がある。   If the length dimension of the attachment member 11 is too short with respect to the width dimension of the processing chambers 3 to 5, there are many portions that are not supported by the support rollers 15 in the width direction of the substrate W in the processing chambers 3 to 5. There is a risk that the part will be bent.

しかしながら、この発明では、取り付け部材１１を単に自重によって撓みが生じ難い長さ寸法にしただけでなく、処理室３〜５の幅寸法も小さくしたから、取り付け部材１１の長さ寸法が各処理室３〜５の幅寸法に比べて大幅に短くなることがない。それによって、基板Ｗの各処理室３〜５内に位置する部分は、上記取り付け部材１１に設けられた複数の支持ローラ１５によって幅方向を確実に支持することができる。   However, according to the present invention, the mounting member 11 is not only made to have a length dimension that is difficult to bend due to its own weight, but also the width dimensions of the processing chambers 3 to 5 are reduced. Compared with the width dimension of 3-5, it is not significantly shortened. As a result, the portions of the substrate W located in the processing chambers 3 to 5 can be reliably supported in the width direction by the plurality of support rollers 15 provided on the mounting member 11.

つまり、取り付け部材１１を、自重によって撓みが生じないように単に短くしたのでは、処理室３〜５の幅寸法に対して取り付け部材１１の長さ寸法が短くなり過ぎ、基板Ｗの各処理室３〜５内に位置する部分の幅方向が支持ローラ１５によって確実に支持されない状態となり、基板Ｗが変形したり、搬送が円滑に行えなくなる虞がある。   That is, if the attachment member 11 is simply shortened so as not to be bent by its own weight, the length dimension of the attachment member 11 becomes too short with respect to the width dimension of the processing chambers 3 to 5, and each processing chamber of the substrate W The width direction of the portion located within 3 to 5 is not reliably supported by the support roller 15, and there is a possibility that the substrate W is deformed or cannot be transported smoothly.

しかしながら、取り付け部材１１を短くしただけでなく、処理室３〜５の幅寸法も小さくしたから、基板Ｗの各処理室３〜５の幅寸法に対して取り付け部材１１が短くなり過ぎることがない。そのため、取り付け部材１１に設けられた支持ローラ１５によって基板Ｗの各処理槽３〜５内に位置する部分を確実に支持することが可能となる。   However, since not only the mounting member 11 is shortened but also the width dimensions of the processing chambers 3 to 5 are reduced, the mounting member 11 does not become too short with respect to the width dimension of each processing chamber 3 to 5 of the substrate W. . Therefore, it becomes possible to reliably support the portion of the substrate W positioned in each of the processing tanks 3 to 5 by the support roller 15 provided on the attachment member 11.

基板Ｗのリンス処理を行う第２の処理室４には、リンス液を噴射するノズル２６が設けられた複数の給液管２５を水平に配置するようにした。各給液管２５に供給するリンス液の量は流量制御弁によって調整することができる。   In the second processing chamber 4 in which the rinsing process for the substrate W is performed, a plurality of liquid supply pipes 25 provided with nozzles 26 for injecting a rinsing liquid are arranged horizontally. The amount of rinse liquid supplied to each liquid supply pipe 25 can be adjusted by a flow control valve.

そのため、傾斜して搬送される基板Ｗの高さ方向上方に位置する給液管２５に供給するリンス液の量を、下方に位置する給液管２５に供給するリンス液の量よりも多くすることで、基板Ｗの上下方向をほぼ同じ状態でリンス処理することが可能となる。つまり、基板Ｗの板面全体をほぼ均一にリンス処理することができる。   Therefore, the amount of the rinsing liquid supplied to the liquid supply pipe 25 positioned in the upper direction of the height of the substrate W to be conveyed is increased more than the amount of the rinsing liquid supplied to the liquid supply pipe 25 positioned below. As a result, it is possible to perform the rinsing process in the substantially same state in the vertical direction of the substrate W. That is, the entire plate surface of the substrate W can be rinsed almost uniformly.

処理室３〜５の幅寸法を基板Ｗの幅寸法よりも小さくしたことで、基板Ｗは図１に鎖線で示すように複数の処理室３〜５のうち、隣り合う複数の処理室にまたがった状態で搬送される。それによって、基板Ｗは、たとえば搬送方向の先端部が第２の処理室４でリンス処理されているときに後端部が第１の処理室３でブラシ洗浄されることになる。同様に、先端部が第３の処理室５で乾燥処理されているときに、後端部が第２の処理室４でリンス処理される。   By making the width dimension of the processing chambers 3 to 5 smaller than the width dimension of the substrate W, the substrate W spans a plurality of adjacent processing chambers among the plurality of processing chambers 3 to 5 as indicated by a chain line in FIG. It is conveyed in the state. Thereby, the rear end of the substrate W is brush-cleaned in the first processing chamber 3 when, for example, the front end in the transport direction is rinsed in the second processing chamber 4. Similarly, when the tip portion is dried in the third processing chamber 5, the rear end portion is rinsed in the second processing chamber 4.

このように、基板Ｗを搬送しながら、この基板Ｗに対して複数の処理を複数の処理室３〜５で連続して行う場合、隣り合う処理室での異なる処理を同時に行うことができるため、基板Ｗの処理を能率よく行うことが可能となる。   As described above, when a plurality of processes are continuously performed on the substrate W in the plurality of process chambers 3 to 5 while the substrate W is being transferred, different processes in adjacent process chambers can be performed simultaneously. The substrate W can be processed efficiently.

この発明は上記一実施の形態に限定されず、種々変形可能である。たとえば処理装置として３つの処理室が並設されている場合を例に挙げて説明したが、処理室の数は限定されず、しかも各処理室で基板に対して行う処理の種類もなんら限定されるものでない。   The present invention is not limited to the one embodiment described above and can be variously modified. For example, the case where three processing chambers are arranged in parallel as a processing apparatus has been described as an example, but the number of processing chambers is not limited, and the types of processing performed on substrates in each processing chamber are also limited. It is not something.

この発明の一実施の形態を示す処理装置の幅方向に縦断面図。The longitudinal cross-sectional view in the width direction of the processing apparatus which shows one Embodiment of this invention. 同じく処理装置の第２の処理その部分の縦断面図。Similarly, the longitudinal cross-sectional view of the 2nd process part of a processing apparatus. 同じく処理装置の横断面図。Similarly, a cross-sectional view of the processing apparatus. 支持ローラの取り付け構造を示す断面図。Sectional drawing which shows the attachment structure of a support roller.

符号の説明Explanation of symbols

３…第１の処理室、４…第２の処理室、５…第３の処理室、１１…取り付け部材、１５…支持ローラ、２２…駆動ローラ、２３…駆動モータ、２５…給液管、２６…ノズル。   DESCRIPTION OF SYMBOLS 3 ... 1st processing chamber, 4 ... 2nd processing chamber, 5 ... 3rd processing chamber, 11 ... Mounting member, 15 ... Support roller, 22 ... Drive roller, 23 ... Drive motor, 25 ... Liquid supply pipe | tube, 26 ... Nozzle.

Claims (4)

基板を所定の角度で傾斜させて搬送し、その搬送過程で上記基板に対して所定の処理を行う基板の処理装置であって、
上記基板の幅寸法よりも小さな幅寸法で形成されて並設されるとともに上記基板に対してそれぞれ所定の処理を行う複数の処理室と、
上記基板の高さ寸法よりも短い長さ寸法に設定され各処理室内に上下方向に所定間隔で平行に設けられた複数の取り付け部材と、
それぞれの取り付け部材に回転可能に設けられ上記処理室内に所定の角度で傾斜して送り込まれる上記基板の傾斜方向の下側の面を支持する支持ローラと、
各処理室内に回転駆動可能に設けられ上記支持ローラによって傾斜方向の下側の面が支持される上記基板の下端を支持し回転駆動されることで上記基板を所定方向に搬送する駆動ローラと
を具備したことを特徴とする基板の処理装置。 A substrate processing apparatus for transporting a substrate inclined at a predetermined angle and performing a predetermined process on the substrate in the transport process,
A plurality of processing chambers that are formed in parallel with a width dimension smaller than the width dimension of the substrate and perform predetermined processing on the substrate, respectively.
A plurality of mounting members that are set to a length shorter than the height of the substrate and are provided in parallel in the vertical direction at predetermined intervals in each processing chamber;
A support roller that is rotatably provided on each attachment member and supports a lower surface of the substrate in the inclined direction that is inclined and fed into the processing chamber at a predetermined angle;
A driving roller which is rotatably provided in each processing chamber and supports the lower end of the substrate supported on the lower surface in the tilt direction by the support roller, and is driven to rotate to convey the substrate in a predetermined direction. A substrate processing apparatus comprising the substrate processing apparatus. 複数の処理室のうちの少なくとも１つは、基板に処理液を噴射して処理する処理室であって、その処理室には基板の搬送方向に沿うとともに搬送方向と交差する上下方向に所定間隔で給液管が配設され、各給液管には上記基板の傾斜方向上側の面に処理液を供給するノズルが設けられていることを特徴とする請求項１記載の基板の処理装置。   At least one of the plurality of processing chambers is a processing chamber that injects a processing liquid onto the substrate to perform processing, and the processing chamber has a predetermined interval in the vertical direction that intersects the transport direction and intersects the transport direction. The substrate processing apparatus according to claim 1, wherein a liquid supply pipe is provided, and each liquid supply pipe is provided with a nozzle for supplying a processing liquid to the upper surface in the tilt direction of the substrate. 上記取り付け部材には、上記支持ローラが上記基板の搬送方向と交差する前後方向に位置決め調整可能に設けられていることを特徴とする請求項１記載の基板の処理装置。   The substrate processing apparatus according to claim 1, wherein the mounting member is provided with the support roller so as to be positioned and adjustable in a front-rear direction intersecting a transport direction of the substrate. 基板を所定の角度で傾斜させて搬送し、その搬送過程で上記基板に対して所定の処理を行う基板の処理装置であって、
上記基板の幅寸法よりも小さな幅寸法で形成されて並設されるとともに上記基板に対してそれぞれ所定の処理を行う複数の処理室と、
上記処理室内に所定の角度で傾斜して送り込まれる上記基板の傾斜方向の下側の面を支持する支持ローラと、
各処理室内に回転駆動可能に設けられ上記支持ローラによって傾斜方向の下側の面が支持される上記基板の下端を支持し回転駆動されることで上記基板を所定方向に搬送する駆動ローラと
を具備したことを特徴とする基板の処理装置。 A substrate processing apparatus for transporting a substrate inclined at a predetermined angle and performing a predetermined process on the substrate in the transport process,
A plurality of processing chambers that are formed in parallel with a width dimension smaller than the width dimension of the substrate and perform predetermined processing on the substrate, respectively.
A support roller for supporting a lower surface of the substrate in the tilt direction, which is fed into the processing chamber at a predetermined angle;
A driving roller which is rotatably provided in each processing chamber and supports the lower end of the substrate supported on the lower surface in the tilt direction by the support roller, and is driven to rotate to convey the substrate in a predetermined direction. A substrate processing apparatus comprising the substrate processing apparatus.
JP2004268627A 2004-09-15 2004-09-15 Substrate processing equipment Expired - Fee Related JP4568059B2 (en)

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KR1020050086347A KR101204725B1 (en) 2004-09-15 2005-09-15 Apparatus for treating substrates
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007165545A (en) * 2005-12-13 2007-06-28 Shibaura Mechatronics Corp Substrate processing apparatus
WO2007129389A1 (en) * 2006-05-01 2007-11-15 Hitachi Plasma Display Limited Resist removing line

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4820705B2 (en) * 2006-07-24 2011-11-24 芝浦メカトロニクス株式会社 Substrate processing equipment
KR100854981B1 (en) * 2007-10-10 2008-08-28 홍경표 Wet processing treatment apparatus for manufacturing printed circuit board
JP7148289B2 (en) * 2018-06-20 2022-10-05 芝浦メカトロニクス株式会社 Substrate detection device and substrate processing device
CN110970337A (en) * 2018-09-28 2020-04-07 芝浦机械电子株式会社 Substrate conveying device and substrate processing device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004210511A (en) * 2003-01-07 2004-07-29 Shibaura Mechatronics Corp Device and method for processing substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2850118B2 (en) 1996-12-03 1999-01-27 東京化工機株式会社 Transport processing equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004210511A (en) * 2003-01-07 2004-07-29 Shibaura Mechatronics Corp Device and method for processing substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007165545A (en) * 2005-12-13 2007-06-28 Shibaura Mechatronics Corp Substrate processing apparatus
JP4685618B2 (en) * 2005-12-13 2011-05-18 芝浦メカトロニクス株式会社 Substrate processing equipment
WO2007129389A1 (en) * 2006-05-01 2007-11-15 Hitachi Plasma Display Limited Resist removing line

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