KR100866001B1 - 기판 처리 방법 및 기판 처리 장치 - Google Patents

기판 처리 방법 및 기판 처리 장치 Download PDF

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Publication number
KR100866001B1
KR100866001B1 KR1020070073891A KR20070073891A KR100866001B1 KR 100866001 B1 KR100866001 B1 KR 100866001B1 KR 1020070073891 A KR1020070073891 A KR 1020070073891A KR 20070073891 A KR20070073891 A KR 20070073891A KR 100866001 B1 KR100866001 B1 KR 100866001B1
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South Korea
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substrate
posture
attitude
board
processing
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Expired - Fee Related
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KR1020070073891A
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English (en)
Korean (ko)
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KR20080009661A (ko
Inventor
히데토 야마오카
다쿠야 즈시
미츠아키 요시타니
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다이니폰 스크린 세이조우 가부시키가이샤
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Publication of KR20080009661A publication Critical patent/KR20080009661A/ko
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Publication of KR100866001B1 publication Critical patent/KR100866001B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020070073891A 2006-07-24 2007-07-24 기판 처리 방법 및 기판 처리 장치 Expired - Fee Related KR100866001B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006201040A JP2008028247A (ja) 2006-07-24 2006-07-24 基板処理方法および基板処理装置
JPJP-P-2006-00201040 2006-07-24

Publications (2)

Publication Number Publication Date
KR20080009661A KR20080009661A (ko) 2008-01-29
KR100866001B1 true KR100866001B1 (ko) 2008-10-29

Family

ID=39022826

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070073891A Expired - Fee Related KR100866001B1 (ko) 2006-07-24 2007-07-24 기판 처리 방법 및 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP2008028247A (enrdf_load_stackoverflow)
KR (1) KR100866001B1 (enrdf_load_stackoverflow)
CN (1) CN101114578B (enrdf_load_stackoverflow)
TW (1) TW200818380A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108380564A (zh) * 2018-02-05 2018-08-10 武汉华星光电技术有限公司 具有自动清洗功能的显影腔室及其清洗组件、清洗方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100978852B1 (ko) * 2008-06-12 2010-08-31 세메스 주식회사 기판 반송 장치 및 그 방법 그리고 그 장치를 갖는 기판제조 설비
TWI407270B (zh) * 2009-12-30 2013-09-01 Au Optronics Corp 顯影設備
CN103324038A (zh) * 2013-06-25 2013-09-25 京东方科技集团股份有限公司 一种显影装置及显影方法
CN104347352B (zh) * 2013-07-31 2018-05-29 细美事有限公司 一种基板处理装置及基板处理方法
JP6887616B2 (ja) * 2017-05-09 2021-06-16 日本電気硝子株式会社 ガラス板の搬送装置及びガラス板の製造方法
CN108325900B (zh) * 2017-09-19 2021-02-02 福建晟哲自动化科技有限公司 一种液晶面板清洗设备
CN108000368B (zh) * 2017-12-01 2020-03-31 福建和达玻璃技术有限公司 曲边玻璃盖板防眩表面处理设备与处理方法
CN107962501B (zh) * 2017-12-01 2019-09-20 福建和达玻璃技术有限公司 带倾角的异形玻璃盖板防眩表面处理设备
KR102760512B1 (ko) * 2020-04-06 2025-02-03 니폰 덴키 가라스 가부시키가이샤 유리판의 제조 방법 및 제조 장치
JP7642005B2 (ja) 2023-03-10 2025-03-07 株式会社Ｓｃｒｅｅｎホールディングス 基板姿勢変更装置および基板処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017401A (ja) 2001-07-05 2003-01-17 Tokyo Electron Ltd 液処理装置および液処理方法
JP2003142453A (ja) 2001-11-02 2003-05-16 Alps Electric Co Ltd ウエット処理装置およびウエット処理方法
JP2005244022A (ja) 2004-02-27 2005-09-08 Sharp Corp 液処理装置および液処理方法
KR20060014457A (ko) * 2006-01-27 2006-02-15 주식회사 디엠에스 평판 처리 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017401A (ja) 2001-07-05 2003-01-17 Tokyo Electron Ltd 液処理装置および液処理方法
JP2003142453A (ja) 2001-11-02 2003-05-16 Alps Electric Co Ltd ウエット処理装置およびウエット処理方法
JP2005244022A (ja) 2004-02-27 2005-09-08 Sharp Corp 液処理装置および液処理方法
KR20060014457A (ko) * 2006-01-27 2006-02-15 주식회사 디엠에스 평판 처리 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108380564A (zh) * 2018-02-05 2018-08-10 武汉华星光电技术有限公司 具有自动清洗功能的显影腔室及其清洗组件、清洗方法

Also Published As

Publication number Publication date
CN101114578A (zh) 2008-01-30
KR20080009661A (ko) 2008-01-29
TW200818380A (en) 2008-04-16
TWI343088B (enrdf_load_stackoverflow) 2011-06-01
JP2008028247A (ja) 2008-02-07
CN101114578B (zh) 2011-08-10

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