TW200810880A - Method of recovering abrasive from abrasive slurry waste liquid and apparatus therefor - Google Patents
Method of recovering abrasive from abrasive slurry waste liquid and apparatus therefor Download PDFInfo
- Publication number
- TW200810880A TW200810880A TW096123063A TW96123063A TW200810880A TW 200810880 A TW200810880 A TW 200810880A TW 096123063 A TW096123063 A TW 096123063A TW 96123063 A TW96123063 A TW 96123063A TW 200810880 A TW200810880 A TW 200810880A
- Authority
- TW
- Taiwan
- Prior art keywords
- honing agent
- waste liquid
- dispersion
- honing
- slurry waste
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 116
- 239000002002 slurry Substances 0.000 title claims abstract description 86
- 239000002699 waste material Substances 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims description 41
- 239000006185 dispersion Substances 0.000 claims abstract description 61
- 238000011084 recovery Methods 0.000 claims abstract description 28
- 239000000706 filtrate Substances 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 163
- 238000001914 filtration Methods 0.000 claims description 44
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 27
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical group [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 22
- 238000011001 backwashing Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 230000005484 gravity Effects 0.000 claims description 6
- 238000009210 therapy by ultrasound Methods 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 abstract 2
- 238000005498 polishing Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 20
- 239000000758 substrate Substances 0.000 description 16
- 238000010298 pulverizing process Methods 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 5
- 239000007921 spray Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000010130 dispersion processing Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 239000000701 coagulant Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000005493 condensed matter Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003206 sterilizing agent Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/01—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/62—Regenerating the filter material in the filter
- B01D29/66—Regenerating the filter material in the filter by flushing, e.g. counter-current air-bumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C19/00—Other disintegrating devices or methods
- B02C19/06—Jet mills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Food Science & Technology (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Treatment Of Sludge (AREA)
- Disintegrating Or Milling (AREA)
- Separation Of Solids By Using Liquids Or Pneumatic Power (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006222000 | 2006-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200810880A true TW200810880A (en) | 2008-03-01 |
Family
ID=39082035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096123063A TW200810880A (en) | 2006-08-16 | 2007-06-26 | Method of recovering abrasive from abrasive slurry waste liquid and apparatus therefor |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2008020507A1 (fr) |
| KR (1) | KR20090009266A (fr) |
| CN (1) | CN101500754A (fr) |
| TW (1) | TW200810880A (fr) |
| WO (1) | WO2008020507A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI418441B (zh) * | 2010-02-12 | 2013-12-11 | Ihi Compressor And Machinery Co Ltd | Sawing mill grinding machine |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5399125B2 (ja) * | 2009-04-27 | 2014-01-29 | 株式会社Ｉｈｉ回転機械 | ワイヤソーのクーラント管理方法及び装置 |
| DE102009054076B8 (de) * | 2009-11-20 | 2012-07-05 | Erwin Junker Maschinenfabrik Gmbh | Verfahren zum Abtrennen von Schleiföl aus Schleifschlämmen; Trennstation zur Durchführung des Verfahrens und verfahrenstechnische Anlage |
| KR101050473B1 (ko) * | 2010-05-24 | 2011-07-20 | 주식회사 동서 | 폐슬러리내 세리아의 고효율 재생방법 |
| KR101138403B1 (ko) * | 2010-09-02 | 2012-04-26 | 씨앤지하이테크 주식회사 | 배관 막힘 방지 수단이 마련된 반도체용 슬러리 공급장치 |
| CN102059016B (zh) * | 2010-12-13 | 2011-11-16 | 天津市环欧半导体材料技术有限公司 | 磨片机循环再生砂的过滤装置及方法 |
| JP5624449B2 (ja) * | 2010-12-16 | 2014-11-12 | 株式会社Ｉｈｉ回転機械 | ワイヤソーのスラリ管理装置 |
| US8561294B2 (en) * | 2011-04-27 | 2013-10-22 | Panasonic Corporation | Method of manufacturing circuit board |
| JP5756423B2 (ja) * | 2011-09-07 | 2015-07-29 | ジー・フォースジャパン株式会社 | 分離回収装置 |
| JP2013091130A (ja) * | 2011-10-25 | 2013-05-16 | Asahi Glass Co Ltd | 研磨砥粒回収装置、研磨液の管理システム、ガラス基板の製造方法及び研磨砥粒回収方法 |
| JP5938589B2 (ja) * | 2012-03-21 | 2016-06-22 | 秋田県 | 酸化セリウム砥粒再生方法 |
| JP5943529B2 (ja) * | 2012-09-13 | 2016-07-05 | エルジー・ケム・リミテッド | セリア含有廃研磨材の再生方法 |
| JP6265974B2 (ja) * | 2013-04-04 | 2018-01-24 | 株式会社クラレ | スラリー再生装置、スラリー再生方法及び再生スラリー |
| CN103264352A (zh) * | 2013-04-26 | 2013-08-28 | 中国科学院上海光学精密机械研究所 | 大型环抛机的抛光液循环过滤注液装置 |
| JP6454599B2 (ja) * | 2015-05-14 | 2019-01-16 | 株式会社ディスコ | 研磨装置 |
| CN105386075A (zh) * | 2015-11-30 | 2016-03-09 | 马鞍山泓宇材料科技有限公司 | 一种研磨切削油泥的处理方法 |
| CN110461544A (zh) * | 2017-03-23 | 2019-11-15 | 住友电气工业株式会社 | 磨削液的再生装置以及磨削液的再生方法 |
| CN107986283A (zh) * | 2017-11-09 | 2018-05-04 | 重庆大学 | 一种蓝宝石衬底研磨废液中碳化硼高效循环再利用装置 |
| JP7192851B2 (ja) * | 2018-03-23 | 2022-12-20 | コニカミノルタ株式会社 | 研磨剤リサイクル処理システム及び研磨剤回収・再生方法 |
| US11642754B2 (en) | 2018-08-30 | 2023-05-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Slurry recycling for chemical mechanical polishing system |
| JP7367705B2 (ja) * | 2019-01-10 | 2023-10-24 | コニカミノルタ株式会社 | 研磨剤の再生方法及び研磨剤リサイクル処理システム |
| CN109940516A (zh) * | 2019-03-12 | 2019-06-28 | 上海新昇半导体科技有限公司 | 浆料回收系统及其清洁方法 |
| CN110585772A (zh) * | 2019-10-24 | 2019-12-20 | 哈尔滨万鑫石墨谷科技有限公司 | 一种浆料过滤系统及过滤方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0741535B2 (ja) * | 1991-04-10 | 1995-05-10 | 中小企業事業団 | ラップ加工装置の砥粒液再生・循環装置 |
| JPH1157521A (ja) * | 1997-08-19 | 1999-03-02 | Jsr Corp | 無機粒子の水性分散体の製造方法 |
| JP3830619B2 (ja) * | 1997-07-02 | 2006-10-04 | 株式会社フジミインコーポレーテッド | ラップ加工装置の使用済み組成物の再生循環方法および再生循環装置 |
| KR100310234B1 (ko) * | 1999-08-20 | 2001-11-14 | 안복현 | 반도체 소자 ｃｍｐ용 금속산화물 슬러리의 제조방법 |
| JP2001070725A (ja) * | 1999-09-07 | 2001-03-21 | Susumu Kida | 燃焼ガスの減温及びばいじん除去装置 |
| JP2001300844A (ja) * | 2000-04-21 | 2001-10-30 | Nec Corp | スラリー供給装置及びその供給方法 |
| JP4541796B2 (ja) * | 2004-07-30 | 2010-09-08 | ルネサスエレクトロニクス株式会社 | 研磨スラリーの製造方法 |
-
2007
- 2007-06-14 WO PCT/JP2007/062046 patent/WO2008020507A1/fr active Application Filing
- 2007-06-14 JP JP2008529824A patent/JPWO2008020507A1/ja not_active Withdrawn
- 2007-06-14 CN CNA2007800300911A patent/CN101500754A/zh active Pending
- 2007-06-14 KR KR1020087028925A patent/KR20090009266A/ko active Search and Examination
- 2007-06-26 TW TW096123063A patent/TW200810880A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI418441B (zh) * | 2010-02-12 | 2013-12-11 | Ihi Compressor And Machinery Co Ltd | Sawing mill grinding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2008020507A1 (ja) | 2010-01-07 |
| WO2008020507A1 (fr) | 2008-02-21 |
| KR20090009266A (ko) | 2009-01-22 |
| CN101500754A (zh) | 2009-08-05 |
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