JP5624449B2 - ワイヤソーのスラリ管理装置 - Google Patents
ワイヤソーのスラリ管理装置 Download PDFInfo
- Publication number
- JP5624449B2 JP5624449B2 JP2010280225A JP2010280225A JP5624449B2 JP 5624449 B2 JP5624449 B2 JP 5624449B2 JP 2010280225 A JP2010280225 A JP 2010280225A JP 2010280225 A JP2010280225 A JP 2010280225A JP 5624449 B2 JP5624449 B2 JP 5624449B2
- Authority
- JP
- Japan
- Prior art keywords
- slurry
- tank
- wire saw
- concentration
- waste liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
2 スラリ
2a 新スラリ
3 スラリ廃液
3a スラリ廃液
3b スラリ廃液
5A 第1槽
5B 第2槽
6 オーバーフロー壁
7 サイクロン分離機
14 遠心分離機
15 固体粒子
23,24 比重計
26 スラリ供給系路
28 循環流路
29 比重計
30 粘度計
31 廃スラリ
33 スラリ排出系路
38 新スラリ供給系路
41 制御器
S 規定濃度
Claims (3)
- 固定砥粒ワイヤソーからのスラリ廃液を受けて貯留する第1槽と、該第1槽のスラリ廃液を導入して固体粒子を分離する遠心分離機と、該遠心分離機で固体粒子が分離されたスラリを受けて貯留する第2槽と、該第2槽のスラリを前記固定砥粒ワイヤソーに供給するスラリ供給系路と、前記第2槽のスラリを取り出して循環する循環流路に備えた比重計及び粘度計と、前記比重計による比重検出値と前記粘度計による粘度検出値を取り入れて、スラリ中の固形分の比重から得られる濃度に対して固形分の粘度から得られる粒径を考慮したスラリ濃度を検出する制御器と、第2槽のスラリの一部を廃スラリとして排出するスラリ排出系路と、新スラリを前記第2槽に供給する新スラリ供給系路とを備え、前記制御器は、前記検出しているスラリ濃度が規定濃度を保持するように、前記スラリ排出系路による廃スラリの排出と新スラリ供給系路による新スラリの供給とを行うようにしたことを特徴とするワイヤソーのスラリ管理装置。
- 前記第1槽にサイクロン分離機を備え、前記固定砥粒ワイヤソーからのスラリ廃液をサイクロン分離機に導いて固体粒子の濃度を高めたスラリ廃液を前記遠心分離機に供給するようにしたことを特徴とする請求項1に記載のワイヤソーのスラリ管理装置。
- 前記第1槽と第2槽とを一体に構成し、第1槽のスラリ廃液がオーバーフロー壁を介して第2槽に供給されるようにしたことを特徴とする請求項1又は2に記載のワイヤソーのスラリ管理装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010280225A JP5624449B2 (ja) | 2010-12-16 | 2010-12-16 | ワイヤソーのスラリ管理装置 |
TW100144656A TWI533973B (zh) | 2010-12-16 | 2011-12-05 | Saw the slurry management device |
PCT/JP2011/006964 WO2012081239A1 (ja) | 2010-12-16 | 2011-12-14 | ワイヤソーのスラリ管理装置 |
MYPI2013002082A MY170481A (en) | 2010-12-16 | 2011-12-14 | Slurry management device for wire saw |
KR1020137015183A KR101860296B1 (ko) | 2010-12-16 | 2011-12-14 | 와이어 소의 슬러리 관리 장치 |
SG2013045786A SG191158A1 (en) | 2010-12-16 | 2011-12-14 | Slurry management device for wire saw |
CN201180060317.9A CN103237628B (zh) | 2010-12-16 | 2011-12-14 | 线锯的浆料管理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010280225A JP5624449B2 (ja) | 2010-12-16 | 2010-12-16 | ワイヤソーのスラリ管理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012125891A JP2012125891A (ja) | 2012-07-05 |
JP5624449B2 true JP5624449B2 (ja) | 2014-11-12 |
Family
ID=46244358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010280225A Active JP5624449B2 (ja) | 2010-12-16 | 2010-12-16 | ワイヤソーのスラリ管理装置 |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5624449B2 (ja) |
KR (1) | KR101860296B1 (ja) |
CN (1) | CN103237628B (ja) |
MY (1) | MY170481A (ja) |
SG (1) | SG191158A1 (ja) |
TW (1) | TWI533973B (ja) |
WO (1) | WO2012081239A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6085500B2 (ja) * | 2013-03-08 | 2017-02-22 | 株式会社Ihi回転機械 | ワイヤソースラリのクーラント回収装置 |
JP6819619B2 (ja) * | 2018-01-22 | 2021-01-27 | 信越半導体株式会社 | ワーク切断方法及びワイヤソー |
JP7003897B2 (ja) * | 2018-11-16 | 2022-02-04 | 株式会社Sumco | ウェーハの製造方法、ワイヤーソー用再利用スラリーの品質評価方法、及びワイヤーソー用使用済みスラリーの品質評価方法 |
CN111805775B (zh) * | 2020-06-09 | 2022-08-26 | 徐州鑫晶半导体科技有限公司 | 砂浆供应方法、砂浆供应设备及晶棒切割系统 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY138664A (en) * | 1995-10-04 | 2009-07-31 | Komatsu Ntc Ltd | Slurry managing system and slurry managing for wire saws |
JP2000141362A (ja) * | 1998-11-11 | 2000-05-23 | Tokyo Seimitsu Co Ltd | ワイヤソーの加工液交換制御装置 |
JP3776675B2 (ja) * | 2000-03-30 | 2006-05-17 | 三倉物産株式会社 | 無機研磨剤廃液の再生処理装置 |
JP2002144229A (ja) * | 2000-11-02 | 2002-05-21 | Nippei Toyama Corp | ワイヤソー及びワイヤソーの切断方法 |
WO2008020507A1 (fr) * | 2006-08-16 | 2008-02-21 | Asahi Glass Company, Limited | Procédé de récupération d'un abrasif à partir d'un rejet liquide de boue d'abrasif et appareil associé |
US7690968B2 (en) * | 2006-08-30 | 2010-04-06 | Saint-Gobain Ceramics & Plastics, Inc. | Aqueous fluid compositions for abrasive slurries, methods of production, and methods of use thereof |
KR100786644B1 (ko) * | 2007-06-15 | 2007-12-21 | 주식회사 유스테크코리아 | 반도체 웨이퍼 제조공정에서 발생하는 폐슬러리의 재생방법및 그 재생시스템 |
JP2010029998A (ja) * | 2008-07-30 | 2010-02-12 | Japan Fine Steel Co Ltd | 固定砥粒ワイヤソーに使用したクーラントの処理方法及びその処理装置 |
JP5399125B2 (ja) * | 2009-04-27 | 2014-01-29 | 株式会社Ihi回転機械 | ワイヤソーのクーラント管理方法及び装置 |
JP2010253621A (ja) * | 2009-04-27 | 2010-11-11 | Ihi Compressor & Machinery Co Ltd | ワイヤソーのクーラント管理方法及び装置 |
CN201573118U (zh) * | 2010-01-11 | 2010-09-08 | 湖南湘牛环保实业有限公司 | 磨切削液集中净化回用装置 |
-
2010
- 2010-12-16 JP JP2010280225A patent/JP5624449B2/ja active Active
-
2011
- 2011-12-05 TW TW100144656A patent/TWI533973B/zh not_active IP Right Cessation
- 2011-12-14 KR KR1020137015183A patent/KR101860296B1/ko active IP Right Grant
- 2011-12-14 SG SG2013045786A patent/SG191158A1/en unknown
- 2011-12-14 CN CN201180060317.9A patent/CN103237628B/zh not_active Expired - Fee Related
- 2011-12-14 MY MYPI2013002082A patent/MY170481A/en unknown
- 2011-12-14 WO PCT/JP2011/006964 patent/WO2012081239A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2012081239A1 (ja) | 2012-06-21 |
TW201236815A (en) | 2012-09-16 |
CN103237628B (zh) | 2016-07-06 |
CN103237628A (zh) | 2013-08-07 |
JP2012125891A (ja) | 2012-07-05 |
TWI533973B (zh) | 2016-05-21 |
KR101860296B1 (ko) | 2018-05-23 |
MY170481A (en) | 2019-08-07 |
KR20130128415A (ko) | 2013-11-26 |
SG191158A1 (en) | 2013-07-31 |
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