TW200708606A - Laminate polishing pad - Google Patents
Laminate polishing padInfo
- Publication number
- TW200708606A TW200708606A TW095131745A TW95131745A TW200708606A TW 200708606 A TW200708606 A TW 200708606A TW 095131745 A TW095131745 A TW 095131745A TW 95131745 A TW95131745 A TW 95131745A TW 200708606 A TW200708606 A TW 200708606A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing pad
- laminate
- composition
- cushion layer
- layer
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 6
- 239000000203 mixture Substances 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract 1
- 241000628997 Flos Species 0.000 abstract 1
- 229920005830 Polyurethane Foam Polymers 0.000 abstract 1
- 239000011496 polyurethane foam Substances 0.000 abstract 1
- 239000002002 slurry Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/20—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles for articles of indefinite length
- B29C44/32—Incorporating or moulding on preformed parts, e.g. linings, inserts or reinforcements
- B29C44/321—Incorporating or moulding on preformed parts, e.g. linings, inserts or reinforcements the preformed part being a lining, e.g. a film or a support lining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/20—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles for articles of indefinite length
- B29C44/32—Incorporating or moulding on preformed parts, e.g. linings, inserts or reinforcements
- B29C44/326—Joining the preformed parts, e.g. to make flat or profiled sandwich laminates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/20—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles for articles of indefinite length
- B29C44/32—Incorporating or moulding on preformed parts, e.g. linings, inserts or reinforcements
- B29C44/332—Incorporating or moulding on preformed parts, e.g. linings, inserts or reinforcements the preformed parts being three-dimensional structures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/721—Two or more polyisocyanates not provided for in one single group C08G18/73 - C08G18/80
- C08G18/724—Combination of aromatic polyisocyanates with (cyclo)aliphatic polyisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/758—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing two or more cycloaliphatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
- C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0025—Foam properties rigid
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005249056A JP4884726B2 (ja) | 2005-08-30 | 2005-08-30 | 積層研磨パッドの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200708606A true TW200708606A (en) | 2007-03-01 |
| TWI293982B TWI293982B (enExample) | 2008-03-01 |
Family
ID=37808704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095131745A TW200708606A (en) | 2005-08-30 | 2006-08-29 | Laminate polishing pad |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9126303B2 (enExample) |
| JP (1) | JP4884726B2 (enExample) |
| TW (1) | TW200708606A (enExample) |
| WO (1) | WO2007026610A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9969049B2 (en) | 2015-06-29 | 2018-05-15 | Iv Technologies Co., Ltd. | Polishing layer of polishing pad and method of forming the same and polishing method |
| TWI629297B (zh) * | 2016-07-05 | 2018-07-11 | 智勝科技股份有限公司 | 研磨層及其製造方法以及研磨方法 |
| CN112059937A (zh) * | 2015-10-16 | 2020-12-11 | 应用材料公司 | 使用增材制造工艺形成先进抛光垫的方法和设备 |
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| KR101134058B1 (ko) * | 2005-05-17 | 2012-04-16 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
| SG162794A1 (en) * | 2005-07-15 | 2010-07-29 | Toyo Tire & Rubber Co | Layered sheets and processes for producing the same |
| JP4884725B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5031236B2 (ja) * | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | 研磨パッド |
| CN102672630B (zh) | 2006-04-19 | 2015-03-18 | 东洋橡胶工业株式会社 | 抛光垫的制造方法 |
| WO2007123168A1 (ja) * | 2006-04-19 | 2007-11-01 | Toyo Tire & Rubber Co., Ltd. | 研磨パッドの製造方法 |
| JP4817432B2 (ja) * | 2006-04-19 | 2011-11-16 | 東洋ゴム工業株式会社 | 長尺研磨パッドの製造方法 |
| JP4831476B2 (ja) * | 2006-04-19 | 2011-12-07 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
| JP2007283712A (ja) * | 2006-04-19 | 2007-11-01 | Toyo Tire & Rubber Co Ltd | 溝付き長尺研磨パッドの製造方法 |
| WO2008026451A1 (fr) | 2006-08-28 | 2008-03-06 | Toyo Tire & Rubber Co., Ltd. | Tampon de polissage |
| JP5008927B2 (ja) | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | 研磨パッド |
| US20100009611A1 (en) * | 2006-09-08 | 2010-01-14 | Toyo Tire & Rubber Co., Ltd. | Method for manufacturing a polishing pad |
| US8257153B2 (en) | 2007-01-15 | 2012-09-04 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and a method for manufacturing the same |
| JP2008235508A (ja) * | 2007-03-20 | 2008-10-02 | Kuraray Co Ltd | 研磨パッド、それを用いた研磨方法および半導体デバイスの製造方法 |
| JP4954762B2 (ja) * | 2007-03-27 | 2012-06-20 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法 |
| JP5078000B2 (ja) | 2007-03-28 | 2012-11-21 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP4888905B2 (ja) * | 2007-03-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
| JP4968912B2 (ja) * | 2007-03-30 | 2012-07-04 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
| JP4943233B2 (ja) * | 2007-05-31 | 2012-05-30 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
| JP4499136B2 (ja) * | 2007-06-06 | 2010-07-07 | シャープ株式会社 | 研磨パッドの製造方法 |
| JP5072442B2 (ja) * | 2007-06-07 | 2012-11-14 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法および研磨パッド |
| JP5184200B2 (ja) * | 2007-07-06 | 2013-04-17 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5100241B2 (ja) * | 2007-08-01 | 2012-12-19 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
| JP2009255271A (ja) * | 2007-08-01 | 2009-11-05 | Toray Ind Inc | 研磨パッド、およびその製造方法 |
| JP5078513B2 (ja) * | 2007-09-10 | 2012-11-21 | 富士紡ホールディングス株式会社 | 研磨パッドおよび研磨パッドの製造方法 |
| JP4593643B2 (ja) * | 2008-03-12 | 2010-12-08 | 東洋ゴム工業株式会社 | 研磨パッド |
| WO2009139401A1 (ja) * | 2008-05-16 | 2009-11-19 | 東レ株式会社 | 研磨パッド |
| US20100112919A1 (en) * | 2008-11-03 | 2010-05-06 | Applied Materials, Inc. | Monolithic linear polishing sheet |
| SG10201508090WA (en) * | 2011-11-29 | 2015-10-29 | Nexplanar Corp | Polishing pad with foundation layer and polishing surface layer |
| US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
| KR102202076B1 (ko) * | 2018-12-26 | 2021-01-12 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| KR102674027B1 (ko) * | 2019-01-29 | 2024-06-12 | 삼성전자주식회사 | 재생 연마패드 |
| CN114126803B (zh) * | 2019-05-07 | 2024-07-16 | Cmc材料有限责任公司 | 具有固定沟槽体积的化学机械平坦化垫 |
| US11207757B2 (en) * | 2019-06-17 | 2021-12-28 | Skc Solmics Co., Ltd. | Composition for polishing pad, polishing pad and preparation method of semiconductor device |
| WO2021021978A1 (en) | 2019-07-31 | 2021-02-04 | L'oreal | Compositions containing copolymer of vinylpyrrolidone and acrylic acid and film forming agent |
| US20230226660A1 (en) * | 2020-07-16 | 2023-07-20 | Korea Institute Of Industrial Technology | Polishing pad, polishing device including same, and manufacturing method thereof |
| KR102538440B1 (ko) * | 2021-05-26 | 2023-05-30 | 에스케이엔펄스 주식회사 | 연마 시스템, 연마 패드 및 반도체 소자의 제조방법 |
| WO2022271270A1 (en) * | 2021-06-23 | 2022-12-29 | Smart Pad LLC | Polishing pad with protruded polishing structures, system for manufacturing the same, and method for manufacturing the same |
| US20220410339A1 (en) * | 2021-06-23 | 2022-12-29 | Smart Pad LLC | Polishing pad with protruded polishing structures, system for manufacturing the same, and method for manufacturing the same |
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-
2005
- 2005-08-30 JP JP2005249056A patent/JP4884726B2/ja not_active Expired - Fee Related
-
2006
- 2006-08-25 WO PCT/JP2006/316699 patent/WO2007026610A1/ja not_active Ceased
- 2006-08-25 US US12/065,253 patent/US9126303B2/en active Active
- 2006-08-29 TW TW095131745A patent/TW200708606A/zh not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9969049B2 (en) | 2015-06-29 | 2018-05-15 | Iv Technologies Co., Ltd. | Polishing layer of polishing pad and method of forming the same and polishing method |
| TWI647258B (zh) * | 2015-06-29 | 2019-01-11 | 智勝科技股份有限公司 | 研磨墊的研磨層及其製造方法以及研磨方法 |
| CN112059937A (zh) * | 2015-10-16 | 2020-12-11 | 应用材料公司 | 使用增材制造工艺形成先进抛光垫的方法和设备 |
| CN112059937B (zh) * | 2015-10-16 | 2022-11-01 | 应用材料公司 | 使用增材制造工艺形成先进抛光垫的方法和设备 |
| TWI629297B (zh) * | 2016-07-05 | 2018-07-11 | 智勝科技股份有限公司 | 研磨層及其製造方法以及研磨方法 |
| US10478940B2 (en) | 2016-07-05 | 2019-11-19 | Iv Technologies Co., Ltd. | Manufacturing method of polishing layer, and polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4884726B2 (ja) | 2012-02-29 |
| TWI293982B (enExample) | 2008-03-01 |
| US20080305720A1 (en) | 2008-12-11 |
| JP2007061929A (ja) | 2007-03-15 |
| WO2007026610A1 (ja) | 2007-03-08 |
| US9126303B2 (en) | 2015-09-08 |
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