WO2008126497A1 - ポリウレタン発泡体の製造方法 - Google Patents

ポリウレタン発泡体の製造方法 Download PDF

Info

Publication number
WO2008126497A1
WO2008126497A1 PCT/JP2008/053602 JP2008053602W WO2008126497A1 WO 2008126497 A1 WO2008126497 A1 WO 2008126497A1 JP 2008053602 W JP2008053602 W JP 2008053602W WO 2008126497 A1 WO2008126497 A1 WO 2008126497A1
Authority
WO
WIPO (PCT)
Prior art keywords
cell
urethane composition
dispersed urethane
thickness
face member
Prior art date
Application number
PCT/JP2008/053602
Other languages
English (en)
French (fr)
Inventor
Junji Hirose
Takeshi Fukuda
Masato Doura
Akinori Sato
Kenji Nakamura
Original Assignee
Toyo Tire & Rubber Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire & Rubber Co., Ltd. filed Critical Toyo Tire & Rubber Co., Ltd.
Priority to KR1020097007882A priority Critical patent/KR101480812B1/ko
Priority to CN2008800056230A priority patent/CN101616773B/zh
Priority to US12/593,174 priority patent/US8314029B2/en
Publication of WO2008126497A1 publication Critical patent/WO2008126497A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/30—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by mixing gases into liquid compositions or plastisols, e.g. frothing with air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)

Abstract

　略球状の気泡を有し、厚み精度に優れる研磨パッドの製造方法を提供することを目的とする。本発明は、機械発泡法により気泡分散ウレタン組成物を調製する工程、面材Ａ（９）を送り出しつつ、該面材Ａの幅方向の略中央部に気泡分散ウレタン組成物（１１）を1つの吐出口から連続的に吐出する工程、該気泡分散ウレタン組成物上に面材Ｂ（１４）を積層し、その後厚さ調整手段（１５）により気泡分散ウレタン組成物の厚さを均一に調整する工程、前工程で厚さを調整した気泡分散ウレタン組成物に更なる荷重を加えずに硬化させることによりポリウレタン発泡体からなる研磨シートを形成する工程、及び研磨シートを裁断する工程を含む研磨パッドの製造方法、に関する。
PCT/JP2008/053602 2007-03-27 2008-02-29 ポリウレタン発泡体の製造方法 WO2008126497A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097007882A KR101480812B1 (ko) 2007-03-27 2008-02-29 폴리우레탄 발포체의 제조 방법
CN2008800056230A CN101616773B (zh) 2007-03-27 2008-02-29 聚氨酯发泡体的制造方法
US12/593,174 US8314029B2 (en) 2007-03-27 2008-02-29 Process for producing polyurethane foam

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-081403 2007-03-27
JP2007081403A JP4954762B2 (ja) 2007-03-27 2007-03-27 ポリウレタン発泡体の製造方法

Publications (1)

Publication Number Publication Date
WO2008126497A1 true WO2008126497A1 (ja) 2008-10-23

Family

ID=39863653

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053602 WO2008126497A1 (ja) 2007-03-27 2008-02-29 ポリウレタン発泡体の製造方法

Country Status (6)

Country Link
US (1) US8314029B2 (ja)
JP (1) JP4954762B2 (ja)
KR (1) KR101480812B1 (ja)
CN (1) CN101616773B (ja)
MY (1) MY149405A (ja)
WO (1) WO2008126497A1 (ja)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101704309B (zh) * 2005-07-15 2014-12-03 东洋橡胶工业株式会社 层叠片及其制造方法
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
MY144784A (en) * 2006-09-08 2011-11-15 Toyo Tire & Rubber Co Method for manufacturing a polishing pad
US8257153B2 (en) 2007-01-15 2012-09-04 Toyo Tire & Rubber Co., Ltd. Polishing pad and a method for manufacturing the same
JP5297096B2 (ja) * 2007-10-03 2013-09-25 富士紡ホールディングス株式会社 研磨布
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
US20100112919A1 (en) * 2008-11-03 2010-05-06 Applied Materials, Inc. Monolithic linear polishing sheet
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10144115B2 (en) 2015-06-26 2018-12-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making polishing layer for chemical mechanical polishing pad
US10105825B2 (en) 2015-06-26 2018-10-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Method of making polishing layer for chemical mechanical polishing pad
US9776300B2 (en) * 2015-06-26 2017-10-03 Rohm And Haas Electronic Materials Cmp Holdings Inc. Chemical mechanical polishing pad and method of making same
US10005172B2 (en) * 2015-06-26 2018-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-porosity method for forming polishing pad
US10011002B2 (en) 2015-06-26 2018-07-03 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
US10092998B2 (en) 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5253969A (en) * 1975-10-29 1977-04-30 Ig Gijutsu Kenkyusho Kk Process for manufacturing composite panel
JPS5271562A (en) * 1975-10-29 1977-06-15 Uniroyal Inc Method of producing laminated foam article
JPH07329086A (ja) * 1994-06-06 1995-12-19 Nippon Shokubai Co Ltd 人工大理石板の連続成形方法
JP2006253691A (ja) * 2005-03-08 2006-09-21 Rohm & Haas Electronic Materials Cmp Holdings Inc 水性研磨パッド及びその製造方法
JP2007061929A (ja) * 2005-08-30 2007-03-15 Toyo Tire & Rubber Co Ltd 積層研磨パッドの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001043920A1 (en) 1999-12-14 2001-06-21 Rodel Holdings, Inc. Method of manufacturing a polymer or polymer composite polishing pad
KR100784656B1 (ko) * 2000-12-08 2007-12-12 가부시키가이샤 구라레 열가소성 폴리우레탄 발포체, 이의 제조방법 및 이로부터제조된 연마 패드
JP2004169038A (ja) 2002-11-06 2004-06-17 Kimimasa Asano ポリウレタン・ポリウレア系均一研磨シート材
JP4313761B2 (ja) * 2002-11-18 2009-08-12 ドン ソン エイ アンド ティ カンパニー リミテッド 微細気孔が含まれたポリウレタン発泡体の製造方法及びそれから製造された研磨パッド
CN1504315A (zh) * 2002-12-05 2004-06-16 智胜科技股份有限公司 研磨垫的制造方法
US7338983B2 (en) 2004-02-10 2008-03-04 World Properties, Inc. Low density polyurethane foam, method of producing, and articles comprising the same
JP4378624B2 (ja) 2004-02-10 2009-12-09 株式会社イノアックコーポレーション シール部材の製造方法
US20070141312A1 (en) * 2005-12-21 2007-06-21 James David B Multilayered polishing pads having improved defectivity and methods of manufacture

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5253969A (en) * 1975-10-29 1977-04-30 Ig Gijutsu Kenkyusho Kk Process for manufacturing composite panel
JPS5271562A (en) * 1975-10-29 1977-06-15 Uniroyal Inc Method of producing laminated foam article
JPH07329086A (ja) * 1994-06-06 1995-12-19 Nippon Shokubai Co Ltd 人工大理石板の連続成形方法
JP2006253691A (ja) * 2005-03-08 2006-09-21 Rohm & Haas Electronic Materials Cmp Holdings Inc 水性研磨パッド及びその製造方法
JP2007061929A (ja) * 2005-08-30 2007-03-15 Toyo Tire & Rubber Co Ltd 積層研磨パッドの製造方法

Also Published As

Publication number Publication date
JP2008238323A (ja) 2008-10-09
JP4954762B2 (ja) 2012-06-20
MY149405A (en) 2013-08-30
KR20100014231A (ko) 2010-02-10
CN101616773A (zh) 2009-12-30
CN101616773B (zh) 2011-09-14
US20100120249A1 (en) 2010-05-13
US8314029B2 (en) 2012-11-20
KR101480812B1 (ko) 2015-01-09

Similar Documents

Publication Publication Date Title
WO2008126497A1 (ja) ポリウレタン発泡体の製造方法
MY153842A (en) Polishing pad and method for producing the same
TW200708606A (en) Laminate polishing pad
WO2005074627A3 (en) Process for controlling the density, conformation and composition of the hydrophilic layer of a polyurethane composite
SG160369A1 (en) Polishing pad and process for producing the same
EP1970394A4 (en) METHOD FOR THE PRODUCTION OF ALLOPHANATE GROUPS CONTAINING POLYISOCYANATE, URETHANEPREPOLYMER AND POLYURETHANE RESIN COMPOSITION
PT2125323E (pt) Processo para a produção de elementos compostos com base em espumas à base de isocianatos
WO2006020153A3 (en) Methods for producing in-situ grooves in chemical mechanical planarization (cmp) pads, and novel cmp pad designs
EP2298517B1 (en) Apparatus for preparing a panel for edgebanding
WO2008076199A3 (en) Cmp pad conditioners and associated methods
MX2007002769A (es) Método y aparato para producir pilas de láminas, y paquete de láminas.
WO2007146736A3 (en) Polarizing optical elements and method for preparing polyurethane-containing films
EP1816151A4 (en) POLYURETHANE-SOFT FOAM, MANUFACTURING METHOD AND CAR SEAT
MX2012001472A (es) Procedimiento para la produccion de un elemento compuesto de espuma.
WO2009010462A3 (de) Verfahren zum aufbringen einer aus mehreren materialien bestehenden produktschicht auf einen formkörper
TW200801057A (en) Process for producing polishing pad
HK1111319A1 (en) Method of setting stones in a support element
EP1745909A3 (en) Molded sports board
EP1820603A3 (en) Wafer and method for producing the same
MXPA05006500A (es) Prepolimeros de tdi con caracteristicas mejoradas de procesado.
WO2008024504A3 (en) Tension free wheelchair seat cover and cushion therewith
WO2011023291A3 (en) Isocyanate-terminated prepolymer, the method for preparing the same and the use thereof
EP2283968A3 (en) Polishing method for a workpiece and polishing tool used for the polishing method
MX2009001561A (es) Proceso para hacer un material laminar y material laminar formado a traves de dicho proceso.
WO2009069526A1 (ja) 研磨シートおよび研磨シートの製造方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880005623.0

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08712124

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020097007882

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: PI20093890

Country of ref document: MY

WWE Wipo information: entry into national phase

Ref document number: 12593174

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08712124

Country of ref document: EP

Kind code of ref document: A1