TW200613867A - Electrooptical device, mounting structure, and electronic apparatus - Google Patents

Electrooptical device, mounting structure, and electronic apparatus

Info

Publication number
TW200613867A
TW200613867A TW094122891A TW94122891A TW200613867A TW 200613867 A TW200613867 A TW 200613867A TW 094122891 A TW094122891 A TW 094122891A TW 94122891 A TW94122891 A TW 94122891A TW 200613867 A TW200613867 A TW 200613867A
Authority
TW
Taiwan
Prior art keywords
substrate
line
mounting structure
electronic apparatus
electrooptical device
Prior art date
Application number
TW094122891A
Other languages
English (en)
Inventor
Shinichi Kobayashi
Atsunari Tsuda
Fusashi Kimura
Sakiko Miyagawa
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200613867A publication Critical patent/TW200613867A/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
TW094122891A 2004-07-13 2005-07-06 Electrooptical device, mounting structure, and electronic apparatus TW200613867A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004205930A JP3979405B2 (ja) 2004-07-13 2004-07-13 電気光学装置、実装構造体及び電子機器

Publications (1)

Publication Number Publication Date
TW200613867A true TW200613867A (en) 2006-05-01

Family

ID=35599044

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094122891A TW200613867A (en) 2004-07-13 2005-07-06 Electrooptical device, mounting structure, and electronic apparatus

Country Status (5)

Country Link
US (1) US7518691B2 (zh)
JP (1) JP3979405B2 (zh)
KR (1) KR100743280B1 (zh)
CN (1) CN100410740C (zh)
TW (1) TW200613867A (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3693056B2 (ja) * 2003-04-21 2005-09-07 セイコーエプソン株式会社 半導体装置及びその製造方法、電子装置及びその製造方法並びに電子機器
TWI274949B (en) * 2005-07-08 2007-03-01 Ind Tech Res Inst Display module
WO2007075988A2 (en) * 2005-12-21 2007-07-05 Advanced Bionutrition Corporation Non-invasive detection of fish viruses by real-time pcr
JP4824397B2 (ja) * 2005-12-27 2011-11-30 イビデン株式会社 多層プリント配線板
US8512139B2 (en) * 2006-04-13 2013-08-20 Igt Multi-layer display 3D server based portals
KR100787174B1 (ko) * 2006-06-02 2007-12-21 동국대학교 산학협력단 반하, 백출, 천마, 진피, 복령, 산사, 희렴 및 황련을포함하는 한약제제 혼합물의 동맥경화 및 관련 질환의 예방및 치료용 추출물과, 이를 유효성분으로 함유하는동맥경화 및 관련 질환의 예방 및 치료용 약학 조성물
KR101304901B1 (ko) * 2007-01-26 2013-09-05 삼성디스플레이 주식회사 표시 장치
TW200924186A (en) * 2007-11-30 2009-06-01 Delta Electronics Inc Touch screen and its panel and manufacturing method thereof
TWI376628B (en) * 2008-03-12 2012-11-11 Delta Electronics Inc Touch panel and manufacturing method thereof
JP5685898B2 (ja) * 2010-01-08 2015-03-18 ソニー株式会社 半導体装置、固体撮像装置、およびカメラシステム
JP5452290B2 (ja) * 2010-03-05 2014-03-26 ラピスセミコンダクタ株式会社 表示パネル
WO2012146820A1 (en) * 2011-04-26 2012-11-01 Nokia Corporation Electronic apparatus with a display
US8711570B2 (en) 2011-06-21 2014-04-29 Apple Inc. Flexible circuit routing
CN104412315B (zh) * 2012-08-08 2016-09-07 夏普株式会社 显示装置
KR101415697B1 (ko) 2012-08-28 2014-07-04 (주)뉴메드 산사 및 진피의 복합 추출물을 유효성분으로 함유하는 비만 또는 지질 관련 대사성 질환의 치료 또는 예방용 약학 조성물
CN203311117U (zh) * 2013-05-31 2013-11-27 京东方科技集团股份有限公司 一种窄边框液晶显示装置及大屏幕液晶显示装置
CN104360779A (zh) * 2014-10-13 2015-02-18 苏州触动电子科技有限公司 一种触控膜的fpc焊盘处和甩尾处的布局方式
CN105528979B (zh) * 2014-10-20 2019-08-06 力领科技股份有限公司 高解析显示器及其驱动芯片
CN104582263A (zh) * 2015-01-23 2015-04-29 京东方科技集团股份有限公司 柔性电路板及其组装方法、显示装置
TWM510512U (zh) * 2015-03-27 2015-10-11 Uniform Ind Corp 防側錄讀卡裝置
CN108346640B (zh) * 2017-01-25 2020-02-07 华邦电子股份有限公司 半导体结构及其制作方法
JP2018128489A (ja) * 2017-02-06 2018-08-16 セイコーエプソン株式会社 電気光学装置および電子機器
US11579497B2 (en) * 2020-02-07 2023-02-14 Sharp Kabushiki Kaisha Substrate for display device and display device

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4906071A (en) * 1987-03-31 1990-03-06 Matsushita Electric Industrial Co., Ltd. Liquid crystal display device and video projector incorporating same with particular driving circuit connection scheme
JPH04242939A (ja) 1990-12-13 1992-08-31 Citizen Watch Co Ltd 半導体装置の実装構造およびその製造方法
JPH05190600A (ja) 1992-01-13 1993-07-30 Sharp Corp 表示装置の実装構造
JPH05218130A (ja) 1992-01-31 1993-08-27 Nec Kansai Ltd Ｔａｂ式半導体装置及びその製造装置
JP3205373B2 (ja) * 1992-03-12 2001-09-04 株式会社日立製作所 液晶表示装置
DE69432460T2 (de) * 1993-11-12 2004-01-15 Seiko Epson Corp Struktur zur montage eines halbleiters- und eines fluessigkristallanzeigeapparates
JPH07321152A (ja) 1994-03-29 1995-12-08 Citizen Watch Co Ltd 半導体装置およびその製造方法
TW293093B (zh) * 1994-09-08 1996-12-11 Hitachi Ltd
TW344043B (en) * 1994-10-21 1998-11-01 Hitachi Ltd Liquid crystal display device with reduced frame portion surrounding display area
JPH0933940A (ja) 1995-07-14 1997-02-07 Citizen Watch Co Ltd 表示パネル駆動用半導体チップの実装構造
JP2798027B2 (ja) 1995-11-29 1998-09-17 日本電気株式会社 液晶表示装置およびその製造方法
JPH09305121A (ja) 1996-03-15 1997-11-28 Canon Inc 回路接続構造、この回路接続構造を有する表示装置及びｔｃｐ構造体
WO1998012597A1 (en) * 1996-09-20 1998-03-26 Hitachi, Ltd. Liquid crystal display device, production method thereof and mobile telephone
JP3955376B2 (ja) * 1997-05-13 2007-08-08 セイコーエプソン株式会社 液晶表示パネルおよび液晶表示パネルの検査方法
JPH1138434A (ja) 1997-07-22 1999-02-12 Hitachi Ltd 液晶表示装置
KR100243914B1 (ko) * 1997-07-29 2000-02-01 구본준 액정표시패널의 탭패드부 구조 및 그 제조방법
KR100269947B1 (ko) * 1997-09-13 2000-10-16 윤종용 인쇄회로기판및이를이용한엘씨디모듈
JP3730037B2 (ja) * 1998-11-20 2005-12-21 株式会社 日立ディスプレイズ 液晶表示装置
JP3808224B2 (ja) * 1998-12-02 2006-08-09 株式会社 日立ディスプレイズ 液晶表示装置
JP3377757B2 (ja) * 1999-01-04 2003-02-17 シャープ株式会社 液晶パネル駆動用集積回路パッケージおよび液晶パネルモジュール
JP3209219B2 (ja) * 1999-01-18 2001-09-17 セイコーエプソン株式会社 電気光学装置および電子機器
JP3025257B1 (ja) * 1999-02-25 2000-03-27 松下電器産業株式会社 表示パネル
JP2000259091A (ja) * 1999-03-04 2000-09-22 Casio Comput Co Ltd 表示パネル、フレキシブル配線基板及びそれらを備えた表示装置
JP4132580B2 (ja) * 1999-08-06 2008-08-13 シャープ株式会社 配線構造および基板の製造方法ならびに液晶表示装置およびその製造方法
JP3695265B2 (ja) 1999-11-30 2005-09-14 セイコーエプソン株式会社 表示装置及び電子機器
US6587177B2 (en) * 2000-02-02 2003-07-01 Casio Computer Co., Ltd. Connection structure of display device with a plurality of IC chips mounted thereon and wiring board
KR100436085B1 (ko) * 2000-10-20 2004-06-12 롬 가부시키가이샤 액정표시장치, 및 액정표시장치용 반도체 칩의 제조방법
JP3525918B2 (ja) * 2000-10-31 2004-05-10 セイコーエプソン株式会社 電気光学装置、その検査方法および電子機器
JP3781967B2 (ja) * 2000-12-25 2006-06-07 株式会社日立製作所 表示装置
JP3760282B2 (ja) 2001-09-05 2006-03-29 株式会社日立製作所 液晶表示装置
JP4634673B2 (ja) * 2001-09-26 2011-02-16 シャープ株式会社 液晶表示装置及びその製造方法
JP2003107513A (ja) * 2001-09-27 2003-04-09 Citizen Watch Co Ltd 液晶表示装置
JP3603890B2 (ja) 2002-03-06 2004-12-22 セイコーエプソン株式会社 電子デバイス及びその製造方法並びに電子機器
KR100857494B1 (ko) * 2002-04-30 2008-09-08 삼성전자주식회사 구동 집적 회로 패키지 및 이를 이용한 칩 온 글래스액정표시장치

Also Published As

Publication number Publication date
JP3979405B2 (ja) 2007-09-19
JP2006030368A (ja) 2006-02-02
KR100743280B1 (ko) 2007-07-26
US7518691B2 (en) 2009-04-14
US20060012745A1 (en) 2006-01-19
CN1721930A (zh) 2006-01-18
KR20060050066A (ko) 2006-05-19
CN100410740C (zh) 2008-08-13

Similar Documents

Publication Publication Date Title
TW200613867A (en) Electrooptical device, mounting structure, and electronic apparatus
TW200617491A (en) Electro-optical device and electronic apparatus
TW200631064A (en) Semiconductor device
SG148851A1 (en) Stacked semiconductor packages
TW200625561A (en) Semiconductor device
TW200620502A (en) Semiconductor device, circuit board, electro-optic device, electronic device
TW200802790A (en) Electronic substrate, semiconductor device, and electronic device
TW200511453A (en) Methods and apparatus for packaging integrated circuit devices
TW200605280A (en) Semiconductor device
MY189260A (en) Methods and devices for fabricating and assembling printable semiconductor elements
TW200623382A (en) Electronic package having down-set leads and method
TW200629490A (en) Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
TW200514212A (en) Method and apparatus for packaging integrated circuit devices
EP1856727A4 (en) INTERCONNECTION HOLES WITH JOINT INSULATION
TW200629618A (en) Electronic devices and processes for forming electronic devices
WO2005112113A3 (en) Mounting with auxiliary bumps
TW200644217A (en) Semiconductor package
TW200616169A (en) Wiring board and semiconductor device
TW200631150A (en) Semiconductor device, display module, and manufacturing method of semiconductor device
TW200629512A (en) Non-circular via holes for bumping pads and related structures
WO2008008581A3 (en) An electronics package with an integrated circuit device having post wafer fabrication integrated passive components
TW200603374A (en) Semiconductor device and method of manufacturing the same
WO2006016136A3 (en) Shear test device
TW200603352A (en) Semiconductor device
TW200723462A (en) Package module with alignment structure and electronic device with the same