WO2012146820A1 - Electronic apparatus with a display - Google Patents

Electronic apparatus with a display Download PDF

Info

Publication number
WO2012146820A1
WO2012146820A1 PCT/FI2011/050370 FI2011050370W WO2012146820A1 WO 2012146820 A1 WO2012146820 A1 WO 2012146820A1 FI 2011050370 W FI2011050370 W FI 2011050370W WO 2012146820 A1 WO2012146820 A1 WO 2012146820A1
Authority
WO
WIPO (PCT)
Prior art keywords
display element
display
base element
film
transparent layer
Prior art date
Application number
PCT/FI2011/050370
Other languages
French (fr)
Inventor
Ilkka HYYTIÄINEN
Original Assignee
Nokia Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Corporation filed Critical Nokia Corporation
Priority to PCT/FI2011/050370 priority Critical patent/WO2012146820A1/en
Publication of WO2012146820A1 publication Critical patent/WO2012146820A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates generally to an electronic apparatus comprising a display.
  • Display is one of the most expensive components in many electronic devices, such as mobile phones, MP3 players and cameras.
  • One of the key factors in low end market is low cost structure, i.e. the aim is to reduce component costs.
  • an apparatus comprising:
  • a base element comprising wiring for one or more electronic components and a film of blocking material
  • a display element comprising a transparent layer and electrodes configured to emit light through the transparent layer
  • the display element faces the film of blocking material of the base element
  • a method comprising:
  • a base element comprising wiring for one or more electronic components and a film of blocking material
  • the film of blocking material of the base element provides an encapsulation structure for the display element.
  • Fig. 1 shows an apparatus according to an embodiment of the invention
  • Fig. 2A shows a partial cross sectional view of an apparatus according to an embodiment of the invention
  • Fig. 2B shows a partial cross sectional view of a base element according to an embodiment of the invention
  • Fig. 3 shows a top view of an apparatus according to an embodiment of the invention
  • Fig. 4A shows a rough flow diagram showing a method in accordance with an example embodiment of the invention.
  • Fig. 4B shows a rough flow diagram showing a method in accordance with another example embodiment of the invention.
  • a base element such as a printed circuit board of an electronic apparatus is configured to provide an encapsulation structure for a display element such as an organic light emitting diode (OLED) display element or more specifically a bottom emission OLED display element.
  • OLED organic light emitting diode
  • a printed circuit board usually comprises one or more metal film layers, which are etched to provide desired wiring in the board.
  • the metal film that is readily part of the circuit board is used for providing encapsulation of a display element. In the etching process the metal film is not etched away from certain area where the display element will be placed.
  • an apparatus that comprises a base element, such as a printed circuit board or a printed wiring board, that comprises wiring for one or more electronic components and a film of blocking material.
  • a display element comprising a transparent layer and electrodes configured to emit light through the transparent layer. The display element is placed on top of the film of blocking material. That is, the display element faces the film of blocking material.
  • the film of blocking material of the base element is configured to provide encapsulation structure for the transparent layer of the display element.
  • the apparatus further comprises a display driver component and the base element comprises a cavity configured to receive the display driver component.
  • the apparatus further comprises a display driver component and the base element comprises an aperture or a hole configured to receive the display driver component.
  • the display element is a bottom emission organic light emitting diode display element.
  • the transparent layer of the display element comprises a first surface and a second surface
  • the electrodes of the display element reside on a first surface of the transparent layer and are configured to emit light towards the second surface of the transparent layer.
  • the first surface may be a bottom surface of the transparent layer and the second surface may be a top surface of the transparent layer.
  • the apparatus further comprises a ring of sealing material that seals the base element and the film of blocking material to the transparent layer of the display element.
  • the transparent layer is made of glass.
  • the transparent layer is made of plastic or some suitable polymer structure.
  • the blocking film is a metal film.
  • FIG. 1 shows an apparatus according to an embodiment of the invention.
  • the apparatus comprises a base element 101 , which may be for example a printed circuit board (PCB).
  • the base element can be called a printed wiring board (PWB), an etched wiring board, or a printed circuit assembly (PCA).
  • the base element 101 comprises electronic circuits.
  • the electronic circuits can be for example baseband circuits (especially in telecommunication devices) or other circuits.
  • the apparatus comprises a display element 102, a battery 103, and a plurality of keys 104. It must be noted that this only one example configuration and for example the battery 103 and the keys 104 are not mandatory. Instead of plurality of keys there may be only one key or no keys at all.
  • Figure 2A shows a partial cross sectional view of an apparatus according to an embodiment of the invention.
  • the apparatus may be the apparatus of Figure 1 .
  • the apparatus comprises a base element 101 and a display element 102.
  • the display element 102 is a bottom emission OLED (organic light emitting diode) display comprising a glass layer 205 and a plurality of transparent or semitransparent electrodes 206 in the bottom of the glass layer 206.
  • the electrodes 206 are configured to emit light through the glass layer 206.
  • the electrodes 206 may be for example thin film transistors (TFT) and there may a TFT for each pixel of the display element 102. It must be noted that instead of glass also some other transparent material, such as plastic or some suitable polymer structure, may be used in the display element 102.
  • the display element 102 may be an active or passive matrix display.
  • the apparatus comprises a display driver component 207 and the base element 101 comprises a hole or an aperture 208 configured to receive the display driver component 207.
  • the display driver component 207 is operatively coupled to the display element 102 through connections 209.
  • Connections 210 connect the glass layer 205 (e.g. a display interface on top of the glass layer) to the base element 101 .
  • the connections 209 and 210 may be metal bumps or anisotropic conductive film (ACF) connections or other applicable connections.
  • ACF anisotropic conductive film
  • the base element 101 comprises a metal film 21 1 under the display element 102.
  • the display element 102 is sealed to the metal film 21 1 with a sealing material 21 2.
  • the structure comprises also a desiccant 21 3 placed between the metal film 21 1 and the display element 102.
  • the desiccant 213 is configured for removal of moisture, oxygen and/or other harmful gases.
  • One purpose of the sealing 212 is to make room for the desiccant 213. It must be noted that it is not mandatory to have the desiccant 213.
  • the metal film 21 1 of the base element 101 forms an encapsulation structure for the display element 102.
  • encapsulation structure can be placed on the non-viewing side of the display, i.e. on the back or bottom side of the display.
  • a layer of some other well blocking material is used instead of the metal film 21 1 . .
  • Figure 2B shows a partial cross sectional view of a base element 101 according to an embodiment of the invention.
  • the base element 101 may be part of the apparatus of Figure 1 or Figure 2A.
  • the base element comprises a metal film 21 1 and wiring 215.
  • the metal film has been etched away from areas 216 to form the desired wiring 215.
  • Figure 3 shows a top view of an apparatus according to an embodiment of the invention.
  • the apparatus may be the apparatus of Figure 1 .
  • the apparatus comprises a base element 101 and a display element 102 on top of the base element 101 .
  • the apparatus comprises a hole or cavity 308 (shown with dashed line) in the base element 101 under the display element 102.
  • the cavity 308 is configured to receive a display driver component of the display element 102.
  • Figure 4A shows a rough flow diagram showing a method in accordance with an example embodiment of the invention.
  • phase 401 a circuit board that includes an area of metal film or some other blocking material is provided.
  • a display element such as an OLED display element is provided.
  • phase 403 the display element is placed on top of the metal film of the circuit board.
  • phase 404 the metal film is sealed to the display element to provide encapsulation structure for the display. The sealing may be done using suitable sealing material.
  • electrical connections are formed between the circuit board and the display element. In an example embodiment, the electrical connections are formed concurrently with the sealing in phase 404. In an example embodiment, the electrical connections are formed using metal bumps. In another example embodiment the connections are formed using anisotropic conductive film (ACF) connections.
  • ACF anisotropic conductive film
  • Figure 4B shows a rough flow diagram showing a method in accordance with another example embodiment of the invention.
  • a circuit board that includes an area of metal film or some other blocking material is provided. Additionally, the circuit board includes a cavity or a hole for receiving a display driver component.
  • a display element such as an OLED display element is provided.
  • the display element comprises a display driver component.
  • the display element is placed on top of the metal film so that the display driver component is fitted into the cavity/hole of the circuit board.
  • the metal film is sealed to the display element to provide encapsulation structure for the display. The sealing may be done using suitable sealing material.
  • phase 405 electrical connections are formed between the circuit board and the display element.
  • the electrical connections are formed concurrently with the sealing in phase 404.
  • the electrical connections are formed using metal bumps.
  • the connections are formed using anisotropic conductive film (ACF) connections.
  • a technical effect is low cost structure.
  • Display is one of the most expensive parts in many electronic device.
  • mechanical structures of an electronic device are used as mechanical parts needed for a display structure, whereby it is possible to save space and cost.
  • the feature that electrical connections between the display element and the circuit board are formed concurrently with attaching the display element to the circuit board provides the technical effect that no separate display flex is needed for connecting the display element to the circuits of the circuit board.
  • Another technical effect is that no separate OLED encapsulation is needed since the mechanical structures already present in the base element are used to provide the encapsulation.
  • Another technical effect is thin overall structure.
  • display element's thickness is about 0.4mm plus the thickness of a possibly needed polarizer component.
  • a polarizer component can be used for example with a Nokia Clear Black Display.

Abstract

An apparatus including a base element (101) with wiring for one or more electronic components and a film of blocking material (211), a display element (102) comprising a transparent layer (205) and electrodes (206) configured to emit light through the transparent layer. The display element (102) faces the film of blocking material (211) of the base element (101) and the film of blocking material (211) of the base element (101) is configured to provide an encapsulation structure for the display element (102).

Description

ELECTRONIC APPARATUS WITH A DISPLAY
TECHNICAL FIELD
The present application relates generally to an electronic apparatus comprising a display.
BACKGROUND
Display is one of the most expensive components in many electronic devices, such as mobile phones, MP3 players and cameras. One of the key factors in low end market is low cost structure, i.e. the aim is to reduce component costs. SUMMARY
Various aspects of examples of the invention are set out in the claims.
According to a first aspect of the invention there is provided an apparatus, comprising:
a base element comprising wiring for one or more electronic components and a film of blocking material,
a display element comprising a transparent layer and electrodes configured to emit light through the transparent layer,
wherein the display element faces the film of blocking material of the base element, and
wherein the film of blocking material of the base element is configured to provide an encapsulation structure for the display element. According to a second aspect of the invention there is provided a method , comprising:
providing a base element comprising wiring for one or more electronic components and a film of blocking material, placing a display element on top of the base element so that the display element faces the film of blocking material of the base element, the display element comprising a transparent layer and electrodes configured to emit light through the transparent layer,
wherein the film of blocking material of the base element provides an encapsulation structure for the display element.
Different non-binding example aspects and embodiments of the present invention have been illustrated in the foregoing. The above embodiments are used merely to explain selected aspects or steps that may be utilized in implementations of the present invention. Some embodiments may be presented only with reference to certain example aspects of the invention. It should be appreciated that corresponding embodiments may apply to other example aspects as well. Any appropriate combinations of the embodiments may be formed.
BRIEF DESCRIPTION OF THE DRAWINGS
For a more complete understanding of example embodiments of the present invention, reference is now made to the following descriptions taken in connection with the accompanying drawings in which:
Fig. 1 shows an apparatus according to an embodiment of the invention;
Fig. 2A shows a partial cross sectional view of an apparatus according to an embodiment of the invention;
Fig. 2B shows a partial cross sectional view of a base element according to an embodiment of the invention;
Fig. 3 shows a top view of an apparatus according to an embodiment of the invention;
Fig. 4A shows a rough flow diagram showing a method in accordance with an example embodiment of the invention; and
Fig. 4B shows a rough flow diagram showing a method in accordance with another example embodiment of the invention. DETAILED DESCRIPTION
Example embodiments of the present invention and their potential advantages are understood by referring to Figs. 1 through 4 of the drawings. In the following description, like numbers denote like elements.
In an example embodiment of the invention a base element such as a printed circuit board of an electronic apparatus is configured to provide an encapsulation structure for a display element such as an organic light emitting diode (OLED) display element or more specifically a bottom emission OLED display element. In this way no separate components are needed for encapsulation of the display element.
A printed circuit board usually comprises one or more metal film layers, which are etched to provide desired wiring in the board. In an embodiment of the invention the metal film that is readily part of the circuit board is used for providing encapsulation of a display element. In the etching process the metal film is not etched away from certain area where the display element will be placed. In an example embodiment of the invention there is provided an apparatus that comprises a base element, such as a printed circuit board or a printed wiring board, that comprises wiring for one or more electronic components and a film of blocking material. Additionally there is a display element comprising a transparent layer and electrodes configured to emit light through the transparent layer. The display element is placed on top of the film of blocking material. That is, the display element faces the film of blocking material. The film of blocking material of the base element is configured to provide encapsulation structure for the transparent layer of the display element. In an example embodiment the apparatus further comprises a display driver component and the base element comprises a cavity configured to receive the display driver component. In another example embodiment the apparatus further comprises a display driver component and the base element comprises an aperture or a hole configured to receive the display driver component. In an example embodiment the display element is a bottom emission organic light emitting diode display element.
In an example embodiment the transparent layer of the display element comprises a first surface and a second surface, and the electrodes of the display element reside on a first surface of the transparent layer and are configured to emit light towards the second surface of the transparent layer. The first surface may be a bottom surface of the transparent layer and the second surface may be a top surface of the transparent layer. In an example embodiment the apparatus further comprises a ring of sealing material that seals the base element and the film of blocking material to the transparent layer of the display element.
In an example embodiment the transparent layer is made of glass.
In an example embodiment the transparent layer is made of plastic or some suitable polymer structure.
In an example embodiment the blocking film is a metal film.
Figure 1 shows an apparatus according to an embodiment of the invention. The apparatus comprises a base element 101 , which may be for example a printed circuit board (PCB). The base element can be called a printed wiring board (PWB), an etched wiring board, or a printed circuit assembly (PCA). In an example embodiment the base element 101 comprises electronic circuits. The electronic circuits can be for example baseband circuits (especially in telecommunication devices) or other circuits. Additionally the apparatus comprises a display element 102, a battery 103, and a plurality of keys 104. It must be noted that this only one example configuration and for example the battery 103 and the keys 104 are not mandatory. Instead of plurality of keys there may be only one key or no keys at all. Figure 2A shows a partial cross sectional view of an apparatus according to an embodiment of the invention. The apparatus may be the apparatus of Figure 1 .
The apparatus comprises a base element 101 and a display element 102. The display element 102 is a bottom emission OLED (organic light emitting diode) display comprising a glass layer 205 and a plurality of transparent or semitransparent electrodes 206 in the bottom of the glass layer 206. The electrodes 206 are configured to emit light through the glass layer 206. The electrodes 206 may be for example thin film transistors (TFT) and there may a TFT for each pixel of the display element 102. It must be noted that instead of glass also some other transparent material, such as plastic or some suitable polymer structure, may be used in the display element 102. The display element 102 may be an active or passive matrix display.
Additionally the apparatus comprises a display driver component 207 and the base element 101 comprises a hole or an aperture 208 configured to receive the display driver component 207. The display driver component 207 is operatively coupled to the display element 102 through connections 209. Connections 210 connect the glass layer 205 (e.g. a display interface on top of the glass layer) to the base element 101 . The connections 209 and 210 may be metal bumps or anisotropic conductive film (ACF) connections or other applicable connections. In an example embodiment there is a cavity configured to receive the display driver component 207 instead of the hole 208.
Still further the base element 101 comprises a metal film 21 1 under the display element 102. The display element 102 is sealed to the metal film 21 1 with a sealing material 21 2. The structure comprises also a desiccant 21 3 placed between the metal film 21 1 and the display element 102. The desiccant 213 is configured for removal of moisture, oxygen and/or other harmful gases. One purpose of the sealing 212 is to make room for the desiccant 213. It must be noted that it is not mandatory to have the desiccant 213.
The metal film 21 1 of the base element 101 forms an encapsulation structure for the display element 102. For a bottom emission OLED display such encapsulation structure can be placed on the non-viewing side of the display, i.e. on the back or bottom side of the display.
In an example embodiment a layer of some other well blocking material is used instead of the metal film 21 1 . .
Figure 2B shows a partial cross sectional view of a base element 101 according to an embodiment of the invention. The base element 101 may be part of the apparatus of Figure 1 or Figure 2A.
The base element comprises a metal film 21 1 and wiring 215. The metal film has been etched away from areas 216 to form the desired wiring 215.
Figure 3 shows a top view of an apparatus according to an embodiment of the invention. The apparatus may be the apparatus of Figure 1 . The apparatus comprises a base element 101 and a display element 102 on top of the base element 101 . Additionally the apparatus comprises a hole or cavity 308 (shown with dashed line) in the base element 101 under the display element 102. In an example embodiment, the cavity 308 is configured to receive a display driver component of the display element 102. Figure 4A shows a rough flow diagram showing a method in accordance with an example embodiment of the invention.
In phase 401 , a circuit board that includes an area of metal film or some other blocking material is provided. In phase 402, a display element such as an OLED display element is provided. In phase 403, the display element is placed on top of the metal film of the circuit board. In phase 404, the metal film is sealed to the display element to provide encapsulation structure for the display. The sealing may be done using suitable sealing material. In phase 405, electrical connections are formed between the circuit board and the display element. In an example embodiment, the electrical connections are formed concurrently with the sealing in phase 404. In an example embodiment, the electrical connections are formed using metal bumps. In another example embodiment the connections are formed using anisotropic conductive film (ACF) connections.
Figure 4B shows a rough flow diagram showing a method in accordance with another example embodiment of the invention.
In phase 401 , a circuit board that includes an area of metal film or some other blocking material is provided. Additionally, the circuit board includes a cavity or a hole for receiving a display driver component. In phase 402, a display element such as an OLED display element is provided. The display element comprises a display driver component. In phase 403, the display element is placed on top of the metal film so that the display driver component is fitted into the cavity/hole of the circuit board. In phase 404, the metal film is sealed to the display element to provide encapsulation structure for the display. The sealing may be done using suitable sealing material.
In phase 405, electrical connections are formed between the circuit board and the display element. In an example embodiment, the electrical connections are formed concurrently with the sealing in phase 404. In an example embodiment, the electrical connections are formed using metal bumps. In another example embodiment the connections are formed using anisotropic conductive film (ACF) connections.
Herein it must be noted that it is not mandatory to perform all phases shown in Figures 4A and 4B.
In this way, one may produce for example the apparatuses of Figures 1 -3. It must be noted that the method shown in Figures 4A and 4B may include further steps that are not currently shown for the sake of clarity and conciseness.
Without in any way limiting the scope, interpretation, or application of the claims appearing below, certain technical effects of one or more of the example embodiments disclosed herein are listed in the following: A technical effect is low cost structure. Display is one of the most expensive parts in many electronic device. In various embodiment of the invention mechanical structures of an electronic device are used as mechanical parts needed for a display structure, whereby it is possible to save space and cost.
The feature that electrical connections between the display element and the circuit board are formed concurrently with attaching the display element to the circuit board provides the technical effect that no separate display flex is needed for connecting the display element to the circuits of the circuit board. Another technical effect is that no separate OLED encapsulation is needed since the mechanical structures already present in the base element are used to provide the encapsulation. Another technical effect is thin overall structure. In an example embodiment display element's thickness is about 0.4mm plus the thickness of a possibly needed polarizer component. A polarizer component can be used for example with a Nokia Clear Black Display.
Various embodiments have been presented. It should be appreciated that in this document, words comprise, include and contain are each used as open-ended expressions with no intended exclusivity.
The foregoing description has provided by way of non-limiting examples of particular implementations and embodiments of the invention a full and informative description of the best mode presently contemplated by the inventors for carrying out the invention. It is however clear to a person skilled in the art that the invention is not restricted to details of the embodiments presented above, but that it can be implemented in other embodiments using equivalent means or in different combinations of embodiments without deviating from the characteristics of the invention. If desired, the different functions discussed herein may be performed in a different order and/or concurrently with each other. Furthermore, if desired, one or more of the above-described functions may be optional.
Furthermore, some of the features of the above-disclosed embodiments of this invention may be used to advantage without the corresponding use of other features. As such, the foregoing description shall be considered as merely illustrative of the principles of the present invention, and not in limitation thereof. Hence, the scope of the invention is only restricted by the appended patent claims.

Claims

Claims:
1 . An apparatus, comprising:
a base element comprising wiring for one or more electronic components and a film of blocking material,
a display element comprising a transparent layer and electrodes configured to emit light through the transparent layer,
wherein the display element faces the film of blocking material of the base element, and
wherein the film of blocking material of the base element is configured to provide an encapsulation structure for the display element.
2. The apparatus of claim 1 , wherein the apparatus further comprises a display driver component and the base element comprises a cavity configured to receive the display driver component.
3. The apparatus of claim 1 , wherein the apparatus further comprises a display driver component and the base element comprises an aperture configured to receive the display driver component.
4. The apparatus of any one of claims 1 -3, wherein the base element is a printed circuit board.
5. The apparatus of any one of claims 1 -4, wherein the display element is a bottom emission organic light emitting diode display element.
6. The apparatus of any one of claims 1 -5, wherein the transparent layer comprises a first surface and a second surface, and wherein the electrodes reside on a first surface of the transparent layer and are configured to emit light towards the second surface of the transparent layer.
7. The apparatus of any one of claims 1 -6, further comprising a ring of sealing material that seals the film of blocking material of the base element to the transparent layer of the display element.
8. The apparatus of any one of claims 1 -7, wherein the film of blocking material is a metal film.
9. The apparatus of any one of claims 1 -8, wherein the transparent layer is made of glass.
10. The apparatus of any one of claims 1 -8, wherein the transparent layer is made of plastic.
1 1 .A method, comprising:
providing a base element comprising wiring for one or more electronic components and a film of blocking material,
placing a display element on top of the base element so that the display element faces the film of blocking material of the base element, the display element comprising a transparent layer and electrodes configured to emit light through the transparent layer,
wherein the film of blocking material of the base element provides an encapsulation structure for the display element.
12. The method of claim 1 1 , further comprising
sealing the transparent layer of the display element to the film of blocking material of the base element.
13. The method of claim 12, further comprising
forming electrical connections between the display element and the wiring of the base element concurrently with the sealing.
14. The method of any one of claims 1 1 -13, further comprising
fitting a display driver component of the display element into a cavity of the base element.
PCT/FI2011/050370 2011-04-26 2011-04-26 Electronic apparatus with a display WO2012146820A1 (en)

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Citations (7)

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EP0888036A1 (en) * 1997-06-27 1998-12-30 Samsung Electronics Co., Ltd. LCD assembly with reduced thickness and method for assembling the same
US20020021399A1 (en) * 1996-09-20 2002-02-21 Hitachi, Ltd. Liquid crystal display device, method for fabricating the same, and portable telephone using the same
US20020072141A1 (en) * 2000-10-20 2002-06-13 Takayuki Nakashima Liquid crystal display device and method of making semiconductor chips for liquid crystal display device
US20060012745A1 (en) * 2004-07-13 2006-01-19 Shinichi Kobayashi Electrooptical device, mounting structure, and electronic apparatus
US20090195485A1 (en) * 2008-01-14 2009-08-06 Chan-Kyoung Moon Organic light emitting diode display
US20090268147A1 (en) * 2008-04-24 2009-10-29 Pao-Yun Tang Chip having a driving integrated circuit and liquid crystal display having the same
EP2133736A1 (en) * 2007-03-06 2009-12-16 Runwen Sun Display apparatus and cellular phone,computer and television including the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020021399A1 (en) * 1996-09-20 2002-02-21 Hitachi, Ltd. Liquid crystal display device, method for fabricating the same, and portable telephone using the same
EP0888036A1 (en) * 1997-06-27 1998-12-30 Samsung Electronics Co., Ltd. LCD assembly with reduced thickness and method for assembling the same
US20020072141A1 (en) * 2000-10-20 2002-06-13 Takayuki Nakashima Liquid crystal display device and method of making semiconductor chips for liquid crystal display device
US20060012745A1 (en) * 2004-07-13 2006-01-19 Shinichi Kobayashi Electrooptical device, mounting structure, and electronic apparatus
EP2133736A1 (en) * 2007-03-06 2009-12-16 Runwen Sun Display apparatus and cellular phone,computer and television including the same
US20090195485A1 (en) * 2008-01-14 2009-08-06 Chan-Kyoung Moon Organic light emitting diode display
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