TW200307725A - Heat-dissipating silicone grease composition - Google Patents
Heat-dissipating silicone grease composition Download PDFInfo
- Publication number
- TW200307725A TW200307725A TW092108154A TW92108154A TW200307725A TW 200307725 A TW200307725 A TW 200307725A TW 092108154 A TW092108154 A TW 092108154A TW 92108154 A TW92108154 A TW 92108154A TW 200307725 A TW200307725 A TW 200307725A
- Authority
- TW
- Taiwan
- Prior art keywords
- polyorganosiloxane
- viscosity
- grease composition
- grease
- heat
- Prior art date
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- 239000004519 grease Substances 0.000 title claims abstract description 22
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 19
- 239000000203 mixture Substances 0.000 title abstract description 22
- -1 polysiloxane Polymers 0.000 claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 9
- 239000002245 particle Substances 0.000 claims abstract description 7
- 239000011256 inorganic filler Substances 0.000 claims abstract description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 4
- 238000011109 contamination Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 17
- 238000003786 synthesis reaction Methods 0.000 description 17
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
- 239000002199 base oil Substances 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 125000003342 alkenyl group Chemical group 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 239000003925 fat Substances 0.000 description 2
- 239000005338 frosted glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009974 thixotropic effect Effects 0.000 description 2
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- QSLPNSWXUQHVLP-UHFFFAOYSA-N $l^{1}-sulfanylmethane Chemical compound [S]C QSLPNSWXUQHVLP-UHFFFAOYSA-N 0.000 description 1
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000006039 1-hexenyl group Chemical group 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000005018 aryl alkenyl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- MXOAEAUPQDYUQM-UHFFFAOYSA-N chlorphenesin Chemical group OCC(O)COC1=CC=C(Cl)C=C1 MXOAEAUPQDYUQM-UHFFFAOYSA-N 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 150000008282 halocarbons Chemical group 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052909 inorganic silicate Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- PPDADIYYMSXQJK-UHFFFAOYSA-N trichlorosilicon Chemical compound Cl[Si](Cl)Cl PPDADIYYMSXQJK-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M169/00—Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
- C10M169/02—Mixtures of base-materials and thickeners
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M169/00—Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/04—Elements
- C10M2201/05—Metals; Alloys
- C10M2201/056—Metals; Alloys used as thickening agents
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/06—Metal compounds
- C10M2201/062—Oxides; Hydroxides; Carbonates or bicarbonates
- C10M2201/0626—Oxides; Hydroxides; Carbonates or bicarbonates used as thickening agents
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/046—Siloxanes with specific structure containing silicon-oxygen-carbon bonds
- C10M2229/0465—Siloxanes with specific structure containing silicon-oxygen-carbon bonds used as base material
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2010/00—Metal present as such or in compounds
- C10N2010/02—Groups 1 or 11
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- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2010/00—Metal present as such or in compounds
- C10N2010/04—Groups 2 or 12
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- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2010/00—Metal present as such or in compounds
- C10N2010/06—Groups 3 or 13
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- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
- C10N2020/01—Physico-chemical properties
- C10N2020/02—Viscosity; Viscosity index
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
- C10N2020/01—Physico-chemical properties
- C10N2020/055—Particles related characteristics
- C10N2020/06—Particles of special shape or size
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- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Lubricants (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
200307725 ⑴ 玫、發明說明 【發明所屬之技術領域】. 本發明係有關散熱用滑脂,特別是有關適合於長期使 用散熱用聚矽氧滑脂之組成物。 【先前技術】 目前技術 向來知悉以聚矽氧滑脂爲基礎,混合作爲塡充劑的各 種粉末,使用爲散熱用聚矽氧滑脂(特公昭5 2- 3 3 2 72號 ,特公昭5 9- 5 2 1195號,特開昭5 2- 1 25 5 06號,特開昭 5 7- 3 63 02號,特開昭62- 43 492號,特開平2- 2 1 25 5 6號 及特開平3- 16203號等各公報)。 但是這些散熱用聚矽氧滑脂組成物,長期使用時基油 會流向周邊,除降低散熱特性外,並引起電氣接點的通導 不良等。 【發明內容】 發明所欲解決之問題 本發明人對於上述應當解決之缺點,銳意檢討結果, 達成標題所示的本發明,使用特定的聚有機矽氧烷爲基油 ,可以抑制基油的亂流。 因此本發明提供信賴性高之散熱用聚矽氧滑脂組成物 ,能夠發揮長期安定的熱傳導性性能,同時不會造成周邊 油脂污染而引起接點障害。 -6- (2) (2)200307725 解決問題的方法 爲達成本發明上記的目的,使用由(A)聚有機矽氧 烷 觸變度 α 1 03〜1 50 , 黏度 (25 °C 時) 100〜l,000,000mm2/s,含重量1 00及 (B)無機塡充劑 具熱傳導性,平均粒徑0 1〜ΙΟΟμηι,含重量100〜2,000生 成之散熱用聚矽氧滑脂組成物。 發明的實施形態 本發明的散熱用聚矽氧滑脂組成物,其構成成分(Α) 聚有機矽氧烷具觸變性。油脂的觸度性以觸變度α値表示 ’數値越大顯示粘度越強。本發明的油脂觸變度需爲 1 0 3〜1 5 0之間’特別以1 0 5〜1 4 0最佳。觸變度α値小於 1 0 3時,因油脂粘性過小,導致聚有機砂氧院和熱傳導性 充塡劑之親和性弱,聚矽氧滑脂組成物中油脂容易流動。 另一方面,觸變度大於1 50時,成分 (Α)和 (Β)混合 困難。 上記觸變度α値,可按公式計算之。ρ 及2係指2 5 °C Β型回轉粘度計之測定粘度,” 1是轉子 的回轉數於冷r p m所測定之値,而π 2是以2 X /3 r p m之回 轉數所測定之値。 又該聚有機矽氧烷以B型回轉粘度計在2 5 °C所測定 的粘度,需在 1〇〇〜l,000,000mm2/s之範圍內,特別於 100 0〜1 0050 00 〇11112/5最埋想。小於100〇11112/8所得聚矽氧 (3) (3)200307725 滑脂組成物缺乏安定性,大於l,000,000mm2/s時,和成 分 (B)混合困難。 以成分 (A)聚有機砂氧院而言,例如使用鈾單體, 氯鉑酸,鈾烯錯體,鉑醇醋體等白金系觸媒,以附加反應 可容易獲得一分子中至少含有2個脂烯基 (alkenyl)的 聚有機矽氧烷,和至少有2個氫矽基的氫二烯的聚有機矽 氧烷。上述具有脂烯基的聚有機矽氧烷,一分子中至少有 兩個直結矽原子的脂烯基,直鎖狀或分歧狀均可。又兩種 以上不同粘度之混合物亦佳。例示的乙烯基 (vinyl), 芳基 (asyl) ,1-丁燒基 (1- butenyl) 及 1- 己燦基 (1- hexenyl)等脂烯基,從合成的容易度及成本面而言, 乙烯基較理想。 結合矽原子的其他有機基,除屬於烷基類的甲基,乙 基,丙基,丁基,己基,十二烷基等,苯基等的芳基類’ 2-苯乙基,2-苯丙基等的芳烷基例示外,尙舉例出氯甲 基,3,3,3-三氟代丙基等的置換碳氫基。這些有機基 中,從合成的容易度及成本面而言,90%以上是甲基較理 想。結合矽原子的脂烯基’無論存於聚有機矽氧烷分子鎖 的末端或中途均可’但從柔軟性面而言’以存於兩末端者 較ί圭。 上述至少含有2個Si_ Η基的聚氫二烯有機矽氧烷’ 其一·般式如 (1)所示。 200307725 \J/
VSL
IV 10 HIS—^ ο
Ysl^n IR1 '^/ 1— 其中Ri是指從氫,碳原子數1至20飽和或不飽和之一《貝 碳氫基群中,至少選出一種的基。這些基群例如甲基’乙 基,丙基,己基,辛基,癸基,十二基,十四基,十六基 ,十八基等之院基,環戊基,環己基等之環己基’乙燦基 ,芳基等之脂烯基,苯基,甲苯基等之芳基,2-苯乙基 ,2-甲基-2-苯乙基等之芳烷基,3,3,3-三氟代丙 基,2-(過三羥丁基)乙基,2-(過三羥辛基)乙基,P-氯苯基等之鹵化碳氫基等。從合成的容易度及成本面而言 ,R1之90%以上爲甲基者最理想。η及m則有[<n <1,〇〇〇 ,0 S m < 1,0 0 0等各種情形。 經由上述附加反應獲得成分 (A)聚有機矽氧烷時, 含有脂烯基的聚有機矽氧烷和含有矽-氫基的聚有機矽氧 烷各個2種類以上使用亦佳。又混合不含反應基的聚甲基 石夕氧院等亦可。 又以其他方法,在具一般性的線狀聚有機矽氧烷構造 單位的[R23SiOW2]單位和[R22SiO]單位中,加入[R2Si03/2] 或導入[Si04/2]單位,亦可獲得。R2與前述一般式 (1) 中之R1相同。 這些聚有機矽氧烷之製造方法並非特別限定,尙可列 舉例如①(CH3)3SiCl, (CH3)2SiCl2,(CH3)SiCl3 等加水 (5) (5)200307725 分解縮合,②這種縮合物與環狀低分子矽氧烷,選用鹼性 金屬氫氧化物,鹼性金屬矽烷鹽或者四烷基磷根羥基鹽, 四烷基銨羥基鹽等之氫氧化物,或硫酸,有機硫代酸等強 酸’作爲觸媒,在室溫下加熱反應,③或者由含有氫氧基 與(CH:〇3SiOl/2單位及Si〇2單位生成之聚有機矽氧烷及 含有矽烷醇之聚有機矽氧烷等,於胺觸媒,錫觸媒等縮合 觸媒存在下,室溫加熱反應等之形成方法。 成分(B)熱傳導性無機充塡劑是本發明爲供應熱傳 導性所需物質。該熱傳導性充塡劑之平均粒徑須於 0 1〜1 0 0 μ m範圍內,但以1〜2 0 μ m者最理想。小於〇 1 μ m 所得組成物的粘度過高,缺乏伸展性,大於ΙΟΟμηι所得 組成物不均一。又其配合量在於含重量100〜2,000範圍內 ’但以含重量2 0 0 - 1,5 0 0者較理想。配合量在少於含重量 1 〇〇所得組成物,其熱傳導率惡劣,且不能伴存安定性, 多於含重量2,0 0 0時,缺乏伸展性。 上述充塡劑可自眾所皆知具良好熱傳導率之無機物中 適當選擇,較理想者有鋁粉、氧化鋅粉、氧化鋁粉、氮化 硼粉、氮化鋁粉、氮化矽粉、銅粉、銀粉、鑽石粉、鎳粉 、鋅粉、不銹鋼粉、碳粉等。球狀或不定形狀者均佳,兩 種以上混合亦佳。 製造本發明的滑脂時,應用多家公司製造的混合機 ( 公司名稱及產品各略)將成分(Α)及(Β)混合。按照需 要加熱至5 0〜1 5 0 °C亦洼。如上所述,使用一分子的 (Α) 成分中至少含有2個脂烯基之聚有機矽氧烷,與至少含有 -10- (6) (6)200307725 2個S iH基之聚有機氫二烯矽氧烷的附加反應物時,上述 含有脂烯基之聚有機矽氧烷及聚有機氫二烯矽氧烷,預先 與成分(B)攪拌混合,再添加鉑化合物等觸媒,進行附 加反應,如此可簡略化製造工程。 又混合後,爲達成均一加工,更於高剪斷力下進行混 練操作較佳。混練設備有三支滾筒、膠質碾磨機及硏砂機 等,其中以三支滾筒最理想。 發明效果 如上所得本發明的聚矽氧滑脂組成物,長期使用不會 造成基油流向周邊,並能發揮長期安定熱傳導性,適合作 爲散熱用滑脂。 【實施方式】 實施例 以下更詳述本發明實例,但是本發明並不是僅限定於 這些實例。 又有關抑制流動效果的試驗,如圖一所示,平放一塊 邊長1〇公分的四方形毛玻璃,在直徑1公分的圓形上塗 抹〇 2 5 g滑脂,於室溫靜置,1日,7日及1個月後測定 因油脂流動而使毛玻璃呈現半透明的幅度,以m m爲單位 。熱傳導率應用迅速熱傳導率計Q T Μ - 5 0 0 (京都電子工 業株式會社產品)於2 5 °C測定。至於粘度於2 5 Τ:的數値 ,則使用卜牛> 7夕社產品D V Μ - 1 1型粘度計測定之。 -11 - (7) 200307725 又觸變度a値則按a = ^ 々2公式算式。其中π 2是 測定7? i時轉子回轉數加倍時所測定的粘度。 [合成例一.成份 (A)聚有機矽氧烷A- 1之合成] 裝設有攪拌機、溫度計、冷卻管及氮氣導入管’內容 積1 0 0 2之燒瓶,裝入兩末端被二甲基乙烯基甲矽烷基所 封鎖的主鎖之5mol%是苯基,剩餘95m〇i%是甲基,25t: 時粘度爲700mm2/s的聚有機矽氧烷500g,和下記式2所 列之聚有機氫二烯矽氧烷3 0 g及下記式3所列之聚有機 氫二烦砂氧院5 0g。 CHs CH3S i 0 GHa CH3 CHaS i 0 CHs
ο 3 — HISIC Η r_________J
0 3 •丨Η — SIC
CH丨SilCH 1 δ —7
S 3 Η i Η CISIC ο 27
3 3 Η Η 3 π 3 __£2 Η i κ Η ·I Η CISIC CISIC ⑵ ⑶ 接著投入〇 25g聚二甲基矽氧烷(其含有1重量%鉑 原子之鉛-二乙烯四甲基二矽氧烷錯體爲二甲基乙烯甲矽 院基末端封鎖)後,於1 20 °C 1小時混合攪拌而產生聚有 機矽氧烷A- 1。測定其粘度如下所記 粘度測定結果 2 6,0 0 〇 m m 2 / s (轉子N 〇 4 / 6 r p m ) 22,500mm2/s (轉子 No 4/12rpm) 按α値=77 t / 77 2計算,觸變度α値爲I 1 6。 -12- (8) (8)200307725 (基油X的合成) 裝有攪拌機、溫度計、冷卻管及滴下裝置,內容積5 公升之燒瓶裡,注入3,000g水,接著一邊攪拌,一邊冷 卻,保持反應液溫度少於50°C條件下,花費3小時,滴 入49 0公克三甲基氯矽烷,560公克二甲基二氯矽烷及 6 5 0公克甲基三氯矽烷之混合物。更於3 0°C 2小時攪拌, 使水層(鹽酸及水)分離後,有機層加入含重量3%之碳 酸鈉水溶液1,700公克,於室溫攪拌2小時。分離除去水 層,加無水硫酸鈉70公克於有機層,於室溫攪拌3小時 後過濾,即可得粘度14mm2/s無色透明的油脂X。 (合成例2 成分 (A)之聚有機矽氧烷A- 2的合成) 裝設攪拌機、溫度計、冷卻管及氮氣導入管,內容積 5 0 0毫升的燒瓶裡,加入所得之基油X 1 0公克和粘度 1 0mm2/s ’以三甲基甲矽烷末端封鎖之聚二甲基矽氧烷22 公克,及八甲基環四矽氧烷300公克,通入氮氣,同時加 熱到120°C。接著加入〇 3公克氫氧化鈉,更昇溫到150 °C ’攪拌4小時後,冷卻到〖〇〇乞。添加2公克乙烯氯乙 醇’除去未反應之低分子矽氧烷,即可得聚有機矽氧烷 A- 2。 其粘度如下所記 粘度測疋結果 3 6,0 0 0 m m2 / s (轉子N 〇紅色6 r p m) 27,300mm2/s (轉子 No 4/rpm) 上記粘度計算結果,觸變度α値是1 3 2。 -13- 200307725 Ο) [合成例3 成分(A)之聚有機矽氧烷A- 3的合成] 使用25公克基油X及308公克八甲基環四矽氧烷外 ,與合成例2完全同樣處理’即可得聚有機矽氧烷A- 3。 其粘度如下所記,觸變度^値是1 〇 5。 粘度測定結果 2,200 mm2/s (轉子No 2/6rpm) 2, 1 00mm2/s (轉子 No 2/1 2rpm)。 [合成例4 成分 (A)之聚有機矽氧烷A- 4的合成] 除裝入原料爲兩末端均爲二甲基乙烯基甲矽烷基封鎖 ,25°C粘度爲600mm2/s之二甲基聚矽氧烷500g,及前記 式 Ο)所列聚氫二烯有機矽氧烷23公克和下記式 (4) 所列聚有機矽氧烷3 3公克外,完全與合成例1同樣處理 ,即可得聚有機矽氧烷A- 4。 CHa HSiO CHs rH -SiO ▲ 1 ?H3 -一SiH > 18 CH3 ⑷
其粘度測定結果如下,觸變度α値爲1 5 7。 粘度測定結果 72,000mm2/s (轉子No 4/3rpm) 46,000mm2/s (轉子 No 4/6rpm) (合成例5 成分(A)之聚有機矽氧烷a- 5的合成) 除使用基油X 1 0 0公克及八甲基環四矽氧烷2 0 0公克 -14- (10) 200307725 爲原料外’以與合成例之完全相同之處理,即可得聚有機 石夕氧院A- 5。其粘度如下測定結果,觸變度α値爲i 〇2 。粘度測定結果 450mm2/g (轉子No l/6rpm) 440mm2/s (轉子 No l/12rpm) (散熱用聚矽氧滑脂組成物的製造) 應用以合成例1〜5所得之聚有機矽氧烷a 1〜5,以及 下記式(5)所列觸變度以値丨〇1之聚二甲基矽氧烷a- 6 等/、種爲原料,按表一及表二所示組成配合,於行星式混 合機(井上製作所株式會社製造)1 2 〇 °C 1小時混合,即可 得實施例1〜6 ’比較例1〜3之散熱用聚有機矽氧烷組成物 。但表中B 1〜B 3所列成分如下所示。 B- 1 氧化鋅粉末(不定形,平均粒徑 2μιη) Β* 2 銀粉末(不定形,平均粒徑5μηι) Β-3 鋁粉末(不定形,平均粒徑 7μιη) 又上記聚二甲基矽氧烷6之粘度測定結果如下 粘度測定結果9,8 0 0 m m2 / s (轉子Ν 〇 3 / 6 r p m) 9,700mm2/s (轉子 No 3/12rpm) CHsCH3S1OCH3 rCH3^ -Si ο ι
CHs S i CH3 CH3 ⑸ •15- (11) 200307725 [表i]
成分 實施例 1 2 3 4 5 配合量(g) 成分 (A) A- 1 100 A- 2 100 A- 3 100 100 100 成分 (B) B- 1 400 500 500 200 180 B- 2 1200 B- 3 720 油脂流動結果 1曰後 0 0 0 0 0 7日後 1 1 2 2 1 1個月後 2 2 2 3 2 熱傳導率 (W/m°C ) 1 1 14 13 2 0 3 4
-16- (12) 200307725 [表2] 成分 比較例 1 2 3 配合量(g) 成分 (A) A- 4 100 A- 5 1 00 A- 6 100 成分 (B) B- 1 400 400 400 B- 2 B- 3 油脂流動結果 ί曰後 不會形 3 2 7曰後 成潤滑 12 7 1個月後 油 20 10 熱傳導率 (W/m°C ) 1 1 1 1
【圖式簡單說明】 圖1係流出評價試驗之槪念圖。 -17-
Claims (1)
- (1) (1)200307725 拾、申請專利範園 1 一種散熱用聚矽氧滑脂組成物,其特徵係由 (A) 聚有機矽氧烷 觸變度α爲1 0 3〜1 5 0,2 5 °C之粘度爲 100〜l,000,0 00mm2/s之聚有機矽氧烷 100重量份及 (B) 平均粒徑0 1〜ΙΟΟμπι之熱傳導性無機塡充劑[00〜2,000重 量份所構成。-18-
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Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
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US7976941B2 (en) | 1999-08-31 | 2011-07-12 | Momentive Performance Materials Inc. | Boron nitride particles of spherical geometry and process for making thereof |
US6713088B2 (en) * | 1999-08-31 | 2004-03-30 | General Electric Company | Low viscosity filler composition of boron nitride particles of spherical geometry and process |
US20070241303A1 (en) * | 1999-08-31 | 2007-10-18 | General Electric Company | Thermally conductive composition and method for preparing the same |
ATE357476T1 (de) | 2003-11-05 | 2007-04-15 | Dow Corning | Wärmeleitfähiges schmierfett und verfahren und vorrichtungen, bei denen das schmierfett verwendet wird |
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JP2005330426A (ja) * | 2004-05-21 | 2005-12-02 | Shin Etsu Chem Co Ltd | 放熱用シリコーングリース組成物 |
JP4687887B2 (ja) * | 2004-10-14 | 2011-05-25 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
KR100898985B1 (ko) * | 2005-05-26 | 2009-05-25 | 티티엠주식회사 | 탄소나노입자가 함유된 열전도성 그리스 |
CN1978583A (zh) * | 2005-12-09 | 2007-06-13 | 富准精密工业(深圳)有限公司 | 热介面材料 |
CN1978580B (zh) * | 2005-12-09 | 2010-09-29 | 富准精密工业(深圳)有限公司 | 导热膏及使用该导热膏的电子装置 |
KR101357514B1 (ko) * | 2006-01-26 | 2014-02-03 | 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 | 방열재와 이를 이용한 반도체 장치 |
JP2007211070A (ja) * | 2006-02-08 | 2007-08-23 | Shin Etsu Chem Co Ltd | 粘着性グリース組成物 |
CN101050356A (zh) * | 2006-04-05 | 2007-10-10 | 富准精密工业(深圳)有限公司 | 导热聚硅氧烷组合物及使用该组合物的电子元件组合 |
JP4917380B2 (ja) * | 2006-07-31 | 2012-04-18 | 信越化学工業株式会社 | 放熱用シリコーングリース組成物及びその製造方法 |
TW200833752A (en) * | 2006-10-23 | 2008-08-16 | Lord Corp | Highly filled polymer materials |
JP4987496B2 (ja) * | 2007-01-30 | 2012-07-25 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 放熱材の製造方法 |
JP2008274036A (ja) | 2007-04-26 | 2008-11-13 | Shin Etsu Chem Co Ltd | 放熱用シリコーングリース組成物 |
JP5372388B2 (ja) * | 2008-01-30 | 2013-12-18 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーングリース組成物 |
JP2009262385A (ja) | 2008-04-24 | 2009-11-12 | Seiko Instruments Inc | ラベル製造方法およびラベル製造装置 |
JP2010013563A (ja) * | 2008-07-03 | 2010-01-21 | Shin-Etsu Chemical Co Ltd | 熱伝導性シリコーングリース |
DE102009009124A1 (de) * | 2008-10-24 | 2010-04-29 | Paul Hettich Gmbh & Co. Kg | Auszugsführung für Haushaltsgeräte |
JP5388329B2 (ja) * | 2008-11-26 | 2014-01-15 | 株式会社デンソー | 放熱用シリコーングリース組成物 |
CN102348763B (zh) * | 2009-03-16 | 2013-04-10 | 道康宁公司 | 导热润滑脂以及使用所述润滑脂的方法和器件 |
JP2011140566A (ja) * | 2010-01-07 | 2011-07-21 | Dow Corning Toray Co Ltd | 熱伝導性シリコーングリース組成物 |
JP5365572B2 (ja) | 2010-04-13 | 2013-12-11 | 信越化学工業株式会社 | 室温湿気増粘型熱伝導性シリコーングリース組成物 |
JP2012077256A (ja) | 2010-10-06 | 2012-04-19 | Shin-Etsu Chemical Co Ltd | 室温湿気増粘型熱伝導性シリコーングリース組成物 |
JP5553006B2 (ja) * | 2010-11-12 | 2014-07-16 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
JPWO2012067247A1 (ja) * | 2010-11-18 | 2014-05-19 | 電気化学工業株式会社 | 高耐久性熱伝導性組成物及び低脱油性グリース |
JP5472055B2 (ja) * | 2010-11-19 | 2014-04-16 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
JP5733087B2 (ja) | 2011-07-29 | 2015-06-10 | 信越化学工業株式会社 | 室温湿気増粘型熱伝導性シリコーングリース組成物 |
JP5783128B2 (ja) | 2012-04-24 | 2015-09-24 | 信越化学工業株式会社 | 加熱硬化型熱伝導性シリコーングリース組成物 |
JP6079792B2 (ja) | 2013-01-22 | 2017-02-15 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、熱伝導性層及び半導体装置 |
JP5898139B2 (ja) | 2013-05-24 | 2016-04-06 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
JP6383993B2 (ja) * | 2014-02-18 | 2018-09-05 | 協同油脂株式会社 | シリコーングリース組成物 |
ES2796925T3 (es) | 2014-09-25 | 2020-11-30 | Shinetsu Chemical Co | Composición de grasa de silicona térmicamente conductora de espesamiento por UV |
KR102544343B1 (ko) | 2015-05-22 | 2023-06-19 | 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 | 열전도성 조성물 |
JP6524879B2 (ja) | 2015-10-13 | 2019-06-05 | 信越化学工業株式会社 | 付加一液硬化型熱伝導性シリコーングリース組成物 |
JP6465037B2 (ja) | 2016-01-07 | 2019-02-06 | 信越化学工業株式会社 | 縮合硬化反応と有機過酸化物硬化反応を併用したシリコーン組成物 |
JP6642145B2 (ja) | 2016-03-14 | 2020-02-05 | 信越化学工業株式会社 | 付加一液加熱硬化型熱伝導性シリコーングリース組成物の硬化物の製造方法 |
US9920231B2 (en) | 2016-04-06 | 2018-03-20 | Youngyiel Precision Co., Ltd. | Thermal compound composition containing Cu—CuO composite filler |
JP6879690B2 (ja) | 2016-08-05 | 2021-06-02 | スリーエム イノベイティブ プロパティズ カンパニー | 放熱用樹脂組成物、その硬化物、及びこれらの使用方法 |
JP6845343B2 (ja) | 2017-02-08 | 2021-03-17 | エルケム・シリコーンズ・ユーエスエイ・コーポレーションElkem Silicones Usa Corp. | 温度管理の改善された二次電池パック |
US20210253927A1 (en) | 2018-06-08 | 2021-08-19 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone composition and method for producing same |
CN109486192B (zh) * | 2018-09-20 | 2021-06-29 | 广州机械科学研究院有限公司 | 一种自流平高导热耐高温导热硅脂及其制备方法 |
CN109438987A (zh) * | 2018-10-31 | 2019-03-08 | 深圳联腾达科技有限公司 | 高导热硅脂及其制备方法 |
JP7001071B2 (ja) | 2019-01-10 | 2022-01-19 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
KR20220089701A (ko) | 2019-10-24 | 2022-06-28 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 열전도성 실리콘 조성물 및 그 제조 방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58219259A (ja) * | 1982-06-14 | 1983-12-20 | Toray Silicone Co Ltd | 熱伝導性シリコ−ンゴム組成物 |
JP2718956B2 (ja) * | 1988-10-03 | 1998-02-25 | 東芝シリコーン株式会社 | シリコーンゴム組成物 |
JPH0297559A (ja) * | 1988-10-03 | 1990-04-10 | Toshiba Silicone Co Ltd | 熱伝導性シリコーン組成物 |
JPH03142800A (ja) * | 1989-10-27 | 1991-06-18 | Nec Corp | 電気的消去・書き込み可能なプログラマブル・リード・オンリー・メモリ |
JP2580348B2 (ja) * | 1989-11-20 | 1997-02-12 | 信越化学工業 株式会社 | 放熱用グリ―ス組成物 |
JPH03280683A (ja) * | 1990-03-28 | 1991-12-11 | Matsushita Electric Ind Co Ltd | Catv用端末装置 |
JP3142800B2 (ja) * | 1996-08-09 | 2001-03-07 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、熱伝導性材料及び熱伝導性シリコーングリース |
US5929138A (en) * | 1996-11-05 | 1999-07-27 | Raychem Corporation | Highly thermally conductive yet highly comformable alumina filled composition and method of making the same |
AU7116798A (en) * | 1997-04-16 | 1998-11-24 | University Of Connecticut, The | Silicon greases and methods for their production |
US6114429A (en) * | 1997-08-06 | 2000-09-05 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone composition |
JP3195277B2 (ja) * | 1997-08-06 | 2001-08-06 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
US6635605B1 (en) * | 1998-06-12 | 2003-10-21 | Dow Corning Corporation | Dielectric lubricant and spark plug boot including the same |
US6136758A (en) * | 1998-08-17 | 2000-10-24 | Shin-Etsu Chemical Co., Ltd. | Aluminum nitride powder and thermally conductive grease composition using the same |
JP3948642B2 (ja) * | 1998-08-21 | 2007-07-25 | 信越化学工業株式会社 | 熱伝導性グリース組成物及びそれを使用した半導体装置 |
JP2000109373A (ja) * | 1998-10-02 | 2000-04-18 | Shin Etsu Chem Co Ltd | 放熱用シリコーングリース組成物及びそれを使用した半導体装置 |
JP2000169873A (ja) * | 1998-12-02 | 2000-06-20 | Shin Etsu Chem Co Ltd | シリコーングリース組成物 |
JP3580358B2 (ja) * | 2000-06-23 | 2004-10-20 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
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2002
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- 2003-04-09 KR KR1020030022182A patent/KR100603490B1/ko active IP Right Grant
- 2003-04-09 TW TW092108154A patent/TWI276665B/zh not_active IP Right Cessation
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI691550B (zh) * | 2015-06-10 | 2020-04-21 | 日商信越化學工業股份有限公司 | 熱傳導性聚矽氧油灰組成物 |
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US20030195124A1 (en) | 2003-10-16 |
KR20030081091A (ko) | 2003-10-17 |
EP1352947A1 (en) | 2003-10-15 |
TWI276665B (en) | 2007-03-21 |
US6818600B2 (en) | 2004-11-16 |
JP4130091B2 (ja) | 2008-08-06 |
KR100603490B1 (ko) | 2006-07-24 |
JP2003301189A (ja) | 2003-10-21 |
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