CN1978580B - 导热膏及使用该导热膏的电子装置 - Google Patents

导热膏及使用该导热膏的电子装置 Download PDF

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CN1978580B
CN1978580B CN2005101022899A CN200510102289A CN1978580B CN 1978580 B CN1978580 B CN 1978580B CN 2005101022899 A CN2005101022899 A CN 2005101022899A CN 200510102289 A CN200510102289 A CN 200510102289A CN 1978580 B CN1978580 B CN 1978580B
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conducting cream
powder
weighting material
thermal conductance
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CN1978580A (zh
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郑景太
郑年添
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Abstract

一种电子装置，包括一发热电子元件、一用于对该发热电子元件散热的散热元件及填充于该发热电子元件与散热元件之间的导热膏，该导热膏包括占5～15％质量百分比的基体，占50～90％质量百分比的填充于基体内的热导填充物，该基体为硅油，该硅油在25℃时的粘度为50～50,000cs，该热导填充物为平均粒径均为2～20μm的球形锡粉与记忆合金粉至少其中之一种，该热导填充物于导热膏使用受压时产生形变并相互接触。

Description

导热膏及使用该导热膏的电子装置
【技术领域】
本发明关于一种导热膏及使用该导热膏的电子装置。
【背景技术】
导热膏一般由硅油及填充于硅油内的热导填充物组成。其中，硅油的功能主要在于使发热元件与散热元件间能有效接触，换言之，除了作为热导填充物的载体外，硅油尚能填充发热元件与散热元件间的空隙，降低发热元件与散热元件间的接触热阻。
热导填充物是导热膏的关键组分，在导热膏中扮演着导热介质的角色，对导热起主导作用。导热膏的热导特性主要取决于热导填充物的导热系数。因此，选用高导热系数的热导填充物以提升导热膏的导热性能已然成为制造导热膏时首要考虑的问题。
【发明内容】
本发明以具体实施例说明一种具较佳导热性能的导热膏及使用该导热膏的电子装置。
一种导热膏包括占5～15％质量百分比的基体，占50～90％质量百分比的填充于基体内的热导填充物，该基体为硅油，该硅油在25℃时的粘度为50～50,000cs，该热导填充物为平均粒径均为2～20μm的球形锡粉与记忆合金粉至少其中之一种，该热导填充物于导热膏使用受压时产生形变并相互接触。
一种电子装置，包括一发热电子元件、一用于对该发热电子元件散热的散热元件，上述导热膏填充于该发热电子元件与散热元件之间。
该导热膏利用具有高形变的球形锡粉及记忆合金粉作为热导填充物，使该导热膏在受到散热元件的压力时，该锡粉与记忆合金粉会产生一显著的形变，迫使该锡粉与记忆合金粉的粉末颗粒相接触，从而降低导热膏的热阻值，提升其导热系数，进而使该发热元件与散热元件间具较小的热阻，提升该电子装置的散热效果。
【附图说明】
下面参照附图结合实施例作进一步描述：
图1为本发明电子装置的示意图；
图2为本发明导热膏受压前的示意图；
图3为本发明导热膏受压后的示意图。
【具体实施方式】
如图1所示，该使用导热膏的电子装置10包括一设于电路板11上的发热电子元件12、一用于对该发热电子元件12散热的散热元件13及填充于发热电子元件12与散热元件13间的导热膏14。该散热元件13包括一基板131及设于基板131上的若干散热鳍片133。该散热元件13通过一固定元件15固定至电路板11上，并向下按压该导热膏14，使该导热膏14充分填充于发热电子元件12与散热元件13的基板131间的空隙内，降低该发热电子元件12与散热元件13的接触热阻，使该发热电子元件12与该散热元件13间存在良好的热传递。
如图2所示，该导热膏14具有较小的热阻，包括基体141及填充于基体141内的热导填充物143。
基体141的质量占该导热膏14总质量的至少5％且至多15％。该基体141一般为硅油，该硅油在25℃时的粘度(viscosity)为50～50,000cs，其主要成分可为有机聚硅氧烷(organopolysiloxane)，有机硅甲烷(organopolysilane)等。本实施例中，硅油的主要成分为有机聚硅氧烷，其化学式为RaSiO(4-a)/2，其中R可为碳氢群(hydrocarbon group)、氨基有机群(amino group)、聚醚有机群(polyethergroup)与环氧有机群(epoxy group)等。其中，碳氢群可为二甲基(dimethyl)、二乙基(diethyl)、甲苯基(methylphenyl)、二甲基二乙基(dimethyl-diethyl)等，这些碳氢群可分别与硅氧烷(siloxane)相聚合而形成对应的聚硅烷(organopolysilane)，如聚二甲基硅氧烷(dimethylpolysiloxane)，该聚二甲基硅氧烷为二甲基硅油的主要成分。
该热导填充物143占该导热膏14总质量的至少50％且至多90％。该热导填充物143包括球形锡粉、记忆合金粉或球形锡粉与记忆合金粉的混合物。该球形锡粉与记忆合金粉的平均粒径均为2～20μm，它们具有较低的硬度，使该热导填充物143在受到外力作用时，容易受压变形。该记忆合金粉一般为镍钛合金粉、钴锌铝合金粉等。当该热导填充物143为球形锡粉与记忆合金粉的混合物时，锡粉与记忆合金粉的质量比为1∶1～1∶10。
该热导填充物143还包括占该导热膏14总质量至多35％的氧化物粉末。该氧化物粉末为氧化锌粉末、氧化铝粉末或氧化锌粉末与氧化铝粉末的混合物，该氧化锌粉末及氧化铝粉末的平均粒径均为0.1～5μm。另，该导热膏内亦可无须填充氧化物粉末。
请一并参阅图3，本发明利用具有高形变的球形锡粉与记忆合金粉作为导热膏14的热导填充物143，使该导热膏14在受到散热元件13的压力时，该锡粉与记忆合金粉会产生一显著的形变，迫使由于受基体141之间隔而相互分离的各锡粉与记忆合金粉相接触，从而降低导热膏14的热阻值，提升其导热系数，进而使该发热元件与散热元件13间具较小的热阻。
下面用具体的实验数据说明本发明导热膏14与现有导热膏的热阻值。
表具不同热导填充物的导热膏的热阻值

Claims (9)

1.一种导热膏，包括占5～15％质量百分比的基体及占50～90％质量百分比的填充于基体内的热导填充物，该基体为硅油，该硅油在25℃时的粘度为50～50,000cs，该热导填充物为平均粒径均为2～20μm的球形锡粉与记忆合金粉至少其中之一种，该热导填充物于导热膏使用受压时产生形变并相互接触。
2.如权利要求1所述的导热膏，其特征在于：该硅油为有机聚硅氧烷。
3.如权利要求2所述的导热膏，其特征在于：该有机聚硅氧烷为聚二甲基硅氧烷。
4.如权利要求1所述的导热膏，其特征在于：该热导填充物为球形锡粉与记忆合金粉的混合物，该锡粉与记忆合金粉的质量比为1∶1～1∶10。
5.如权利要求1所述的导热膏，其特征在于：该记忆合金粉为镍钛合金粉或钴锌铝合金粉。
6.如权利要求1所述的导热膏，其特征在于：该热导填充物还包括占导热膏0～35％质量百分比的氧化物粉末。
7.如权利要求6所述的导热膏，其特征在于：该氧化物粉末的平均粒径为0.1～5μm。
8.如权利要求8所述的导热膏，其特征在于：该氧化物粉末为氧化锌粉末与氧化铝粉末至少其中之一种。
9.一种使用如权利要求1至8项中任一项所述的导热膏的电子装置，包括一发热电子元件、一用于对该发热电子元件散热的散热元件，上述导热膏填充于该发热电子元件与散热元件之间。
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