SG81959A1 - Testing ic socket - Google Patents

Testing ic socket

Info

Publication number
SG81959A1
SG81959A1 SG9900571A SG1999000571A SG81959A1 SG 81959 A1 SG81959 A1 SG 81959A1 SG 9900571 A SG9900571 A SG 9900571A SG 1999000571 A SG1999000571 A SG 1999000571A SG 81959 A1 SG81959 A1 SG 81959A1
Authority
SG
Singapore
Prior art keywords
socket
testing
Prior art date
Application number
SG9900571A
Other languages
English (en)
Inventor
Yoichi Mori
Yoshihiro Aoki
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Publication of SG81959A1 publication Critical patent/SG81959A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/97—Holders with separate means to prevent loosening of the coupling or unauthorised removal of apparatus held

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG9900571A 1998-02-16 1999-02-12 Testing ic socket SG81959A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10032735A JPH11233216A (ja) 1998-02-16 1998-02-16 テスト用ｉｃソケット

Publications (1)

Publication Number Publication Date
SG81959A1 true SG81959A1 (en) 2001-07-24

Family

ID=12367105

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9900571A SG81959A1 (en) 1998-02-16 1999-02-12 Testing ic socket

Country Status (6)

Country Link
US (1) US6278284B1 (ko)
JP (1) JPH11233216A (ko)
KR (1) KR100295305B1 (ko)
CN (1) CN1226758A (ko)
SG (1) SG81959A1 (ko)
TW (1) TW445668B (ko)

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US6504223B1 (en) 1998-11-30 2003-01-07 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6579804B1 (en) 1998-11-30 2003-06-17 Advantest, Corp. Contact structure and production method thereof and probe contact assembly using same
US6471538B2 (en) * 1998-11-30 2002-10-29 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
KR20010054178A (ko) * 1999-12-03 2001-07-02 송재인 볼 그리드 어레이용 집적회로 소켓
US6676438B2 (en) * 2000-02-14 2004-01-13 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
KR100365477B1 (ko) * 2000-05-18 2002-12-26 메카텍스 (주) 반도체 디바이스 검사용 테스트 보드
KR100616434B1 (ko) * 2000-09-19 2006-08-29 삼성전자주식회사 파인 피치 볼 그리드 어레이용 소켓 테스터
US6476476B1 (en) * 2001-08-16 2002-11-05 Amkor Technology, Inc. Integrated circuit package including pin and barrel interconnects
JP3977621B2 (ja) * 2001-10-05 2007-09-19 モレックス インコーポレーテッド 半導体パッケージのソケット、及びコンタクト
US6655965B2 (en) * 2001-11-28 2003-12-02 Fci Americas Technology, Inc. Interconnect device for electrically coupling a test system to a circuit board adapted for use with a ball-grid array connector
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US7567089B2 (en) * 2003-02-04 2009-07-28 Microfabrica Inc. Two-part microprobes for contacting electronic components and methods for making such probes
SG124273A1 (en) * 2004-03-08 2006-08-30 Tan Yin Leong Non-abrasive electrical test contact
US20050083071A1 (en) * 2003-10-16 2005-04-21 Fred Hartnett Electronic circuit assembly test apparatus
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7659739B2 (en) * 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US7733101B2 (en) * 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US7459795B2 (en) * 2004-08-19 2008-12-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
US7172431B2 (en) * 2004-08-27 2007-02-06 International Business Machines Corporation Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof
KR100741930B1 (ko) 2004-12-30 2007-07-23 동부일렉트로닉스 주식회사 패키지 검사용 어셈블리 및 소켓 핀
US7590909B2 (en) * 2005-08-24 2009-09-15 Hewlett-Packard Development Company, L.P. In-circuit testing system and method
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
JP2007194435A (ja) * 2006-01-19 2007-08-02 Fujitsu Ltd 実装材整列基板、実装装置、実装方法及び回路基板製造方法
JP2007194434A (ja) * 2006-01-19 2007-08-02 Fujitsu Ltd 実装材整列基板、実装装置、実装方法及び回路基板製造方法
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
JP4522975B2 (ja) 2006-06-19 2010-08-11 東京エレクトロン株式会社 プローブカード
JP4802059B2 (ja) * 2006-07-27 2011-10-26 株式会社エンプラス 電気部品用ソケット
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7786740B2 (en) 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US7602201B2 (en) * 2007-06-22 2009-10-13 Qualitau, Inc. High temperature ceramic socket configured to test packaged semiconductor devices
KR101341566B1 (ko) * 2007-07-10 2013-12-16 삼성전자주식회사 소켓, 검사 장치, 그리고 적층형 반도체 소자 제조 방법
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US7671610B2 (en) * 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
CN101241143B (zh) * 2008-02-20 2010-09-08 日月光半导体制造股份有限公司 集成电路测试座及其测试接口
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
JP5530312B2 (ja) * 2010-09-03 2014-06-25 株式会社エンプラス 電気部品用ソケット
CN103733434B (zh) * 2011-05-17 2016-06-22 怡得乐工业有限公司 带有防变形顺应挠性针脚的板间连接系统
US20130069685A1 (en) * 2011-09-16 2013-03-21 Mark A. Swart Integrated circuit test socket having test probe inserts
PL2943999T3 (pl) 2013-01-14 2018-07-31 Vishay General Semiconductor Llc Wtyk elektryczny pasowany na wcisk do półprzewodnikowego modułu
DE102013203536B4 (de) * 2013-03-01 2016-03-31 Multitest Elektronische Systeme Gmbh Vorrichtung zum Prüfen von elektronischen Bauteilen
JP6484137B2 (ja) * 2014-11-26 2019-03-13 株式会社日本マイクロニクス プローブ及び接触検査装置
DE102016105470A1 (de) * 2016-03-23 2017-09-28 Te Connectivity Germany Gmbh Leistungselektrische Kontakteinrichtung; austauschbares, leistungselektrisches Kontaktmodul sowie leistungselektrischer Verbinder
US9806443B1 (en) * 2016-05-24 2017-10-31 Te Connectivity Corporation Press-fit circuit board connector
MY193023A (en) * 2016-09-08 2022-09-22 Multitest Elektronische Systeme Gmbh Socket for testing electronic components and test site arrangement
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
KR101944693B1 (ko) * 2018-12-04 2019-02-01 황동원 반도체 소자 테스트용 bga 소켓장치
CN109687182B (zh) * 2018-12-24 2020-06-30 番禺得意精密电子工业有限公司 电连接器
CN110045160B (zh) * 2019-05-24 2021-06-08 安徽鹰龙工业设计有限公司 一种bga封装用的上方取放的测试座
KR102080832B1 (ko) 2019-10-02 2020-02-24 황동원 스프링 콘택트 및 스프링 콘택트 내장형 테스트 소켓
TWI737291B (zh) * 2020-05-08 2021-08-21 中華精測科技股份有限公司 垂直式測試裝置
CN111707929B (zh) * 2020-06-29 2024-07-30 深圳赛西信息技术有限公司 一种pga封装微波测试夹具

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WO1997003467A1 (en) * 1995-07-10 1997-01-30 Pcd Inc. Top loading socket for ball grid arrays
WO1997016849A1 (en) * 1995-11-02 1997-05-09 Minnesota Mining And Manufacturing Company Ball grid array integrated circuit socket
GB2319404A (en) * 1996-11-15 1998-05-20 Advantest Corp IC socket for a BGA package

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JPH08236233A (ja) * 1995-02-23 1996-09-13 Toshiba Chem Corp Ｂｇａ用ｉｃソケット
JPH0955273A (ja) * 1995-08-11 1997-02-25 Advantest Corp Ｂｇａパッケージｉｃ用ｉｃソケット

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997003467A1 (en) * 1995-07-10 1997-01-30 Pcd Inc. Top loading socket for ball grid arrays
WO1997016849A1 (en) * 1995-11-02 1997-05-09 Minnesota Mining And Manufacturing Company Ball grid array integrated circuit socket
GB2319404A (en) * 1996-11-15 1998-05-20 Advantest Corp IC socket for a BGA package

Also Published As

Publication number Publication date
KR19990072639A (ko) 1999-09-27
JPH11233216A (ja) 1999-08-27
US6278284B1 (en) 2001-08-21
KR100295305B1 (ko) 2001-07-12
CN1226758A (zh) 1999-08-25
TW445668B (en) 2001-07-11

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