TW496614U - IC test socket - Google Patents

IC test socket

Info

Publication number
TW496614U
TW496614U TW090214723U TW90214723U TW496614U TW 496614 U TW496614 U TW 496614U TW 090214723 U TW090214723 U TW 090214723U TW 90214723 U TW90214723 U TW 90214723U TW 496614 U TW496614 U TW 496614U
Authority
TW
Taiwan
Prior art keywords
test socket
socket
test
Prior art date
Application number
TW090214723U
Other languages
Chinese (zh)
Inventor
Kiyoshi Adachi
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of TW496614U publication Critical patent/TW496614U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/193—Means for increasing contact pressure at the end of engagement of coupling part, e.g. zero insertion force or no friction
TW090214723U 2000-08-29 2001-08-28 IC test socket TW496614U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000258586A JP2002071749A (en) 2000-08-29 2000-08-29 Socket for evaluating test of ic package

Publications (1)

Publication Number Publication Date
TW496614U true TW496614U (en) 2002-07-21

Family

ID=18746879

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090214723U TW496614U (en) 2000-08-29 2001-08-28 IC test socket

Country Status (5)

Country Link
JP (1) JP2002071749A (en)
KR (1) KR100539350B1 (en)
CN (1) CN1237663C (en)
TW (1) TW496614U (en)
WO (1) WO2002019471A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3942936B2 (en) * 2002-04-09 2007-07-11 株式会社エンプラス Socket for electrical parts
JP4054238B2 (en) * 2002-09-18 2008-02-27 山一電機株式会社 IC socket
KR101341566B1 (en) * 2007-07-10 2013-12-16 삼성전자주식회사 A socket, a test equipment, and method for manufacturing a multi-chip semiconductor device package
KR101173791B1 (en) 2009-09-07 2012-08-16 (주)케미텍 Connector For Test Device
CN102466774A (en) * 2010-11-12 2012-05-23 中国科学院微电子研究所 Auxiliary testing device for integrated circuit
KR101217205B1 (en) 2011-09-23 2012-12-31 하이콘 주식회사 Socket device for testing an ic
JP6507981B2 (en) * 2015-10-08 2019-05-08 三菱電機株式会社 Large current conducting device
CN106324480B (en) * 2016-08-23 2022-05-03 黄河科技学院 Multifunctional integrated circuit debugging instrument
CN108693458B (en) * 2017-04-12 2021-01-26 环旭电子股份有限公司 Test socket for chip
KR102122975B1 (en) * 2019-08-08 2020-06-16 주식회사 마이크로컨텍솔루션 Test socket

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3745060B2 (en) * 1996-12-09 2006-02-15 日本テキサス・インスツルメンツ株式会社 socket
JP3270716B2 (en) * 1997-07-04 2002-04-02 日本テキサス・インスツルメンツ株式会社 Socket and mounting method of semiconductor device

Also Published As

Publication number Publication date
WO2002019471A1 (en) 2002-03-07
KR100539350B1 (en) 2005-12-28
CN1237663C (en) 2006-01-18
CN1451190A (en) 2003-10-22
KR20030064390A (en) 2003-07-31
JP2002071749A (en) 2002-03-12
WO2002019471B1 (en) 2002-06-27

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees