SG72767A1 - Electronic-parts mounting apparatus - Google Patents

Electronic-parts mounting apparatus

Info

Publication number
SG72767A1
SG72767A1 SG1997003967A SG1997003967A SG72767A1 SG 72767 A1 SG72767 A1 SG 72767A1 SG 1997003967 A SG1997003967 A SG 1997003967A SG 1997003967 A SG1997003967 A SG 1997003967A SG 72767 A1 SG72767 A1 SG 72767A1
Authority
SG
Singapore
Prior art keywords
electronic
mounting apparatus
parts mounting
parts
mounting
Prior art date
Application number
SG1997003967A
Other languages
English (en)
Inventor
Takashi Munezane
Takatoshi Mitsushima
Noboru Furuta
Kimio Iizuka
Kunio Tanaka
Tomitatsu Soga
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG72767A1 publication Critical patent/SG72767A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SG1997003967A 1997-01-17 1997-11-06 Electronic-parts mounting apparatus SG72767A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00601597A JP3339344B2 (ja) 1997-01-17 1997-01-17 電子部品装着装置

Publications (1)

Publication Number Publication Date
SG72767A1 true SG72767A1 (en) 2000-05-23

Family

ID=11626886

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997003967A SG72767A1 (en) 1997-01-17 1997-11-06 Electronic-parts mounting apparatus

Country Status (9)

Country Link
US (1) US6000123A (ko)
EP (1) EP0854670B1 (ko)
JP (1) JP3339344B2 (ko)
KR (1) KR100287437B1 (ko)
CN (1) CN1100478C (ko)
DE (1) DE69706515T2 (ko)
MY (1) MY117949A (ko)
SG (1) SG72767A1 (ko)
TW (1) TW361056B (ko)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6061894A (en) * 1997-07-22 2000-05-16 Seagate Technologies, Inc. Method and apparatus for assembling disc drive motors utilizing multiposition preload/cure fixtures
JPH11251792A (ja) * 1998-03-03 1999-09-17 Matsushita Electric Ind Co Ltd 電子部品装着機
JP3537682B2 (ja) * 1998-10-30 2004-06-14 株式会社日立ハイテクインスツルメンツ マウンタの部品認識処理装置および部品認識処理方法
JP3978910B2 (ja) * 1998-12-07 2007-09-19 松下電器産業株式会社 電子部品の実装装置
JP2001044696A (ja) * 1999-08-03 2001-02-16 Matsushita Electric Ind Co Ltd 電子部品実装方法
KR100311747B1 (ko) * 1999-08-20 2001-10-18 정문술 표면실장기의 인쇄회로기판 이송장치
KR100328345B1 (ko) * 1999-09-01 2002-03-12 정문술 표면실장장치 및 그 실장방법
KR100310706B1 (ko) * 1999-10-15 2001-10-18 윤종용 솔더볼 어탯치 시스템 및 그에 따른 솔더볼 어탯치 방법
WO2001035707A1 (fr) 1999-11-05 2001-05-17 Matsushita Electric Industrial Co., Ltd. Machine et technique pour montage de composants
US6996440B2 (en) * 2000-08-04 2006-02-07 Matsushita Electric Industrial Co., Ltd. Method for optimization of an order of component mounting, apparatus using the same, and mounter
US6862803B2 (en) 2000-08-29 2005-03-08 Matsushita Electric Industrial Co., Ltd. Method for mounting electronic component
JP4540838B2 (ja) * 2000-12-12 2010-09-08 パナソニック株式会社 回路基板固定方法
JP2004521512A (ja) * 2001-05-23 2004-07-15 シーメンス　アクチエンゲゼルシヤフト 基板に構成素子を実装するための実装システムおよび方法
JP4108298B2 (ja) * 2001-07-06 2008-06-25 松下電器産業株式会社 電子部品実装装置における生産シミュレーション装置および生産シミュレーション方法
WO2003078282A1 (de) 2002-03-15 2003-09-25 Siemens Aktiengesellschaft Breitenverstellbare fördereinrichtung zum transportieren von werkstücken
DE10235471A1 (de) * 2002-08-02 2004-02-19 Siemens Ag Verfahren und Vorrichtung zum Bestücken von Substraten
JP3817207B2 (ja) 2002-08-21 2006-09-06 Ｔｄｋ株式会社 実装処理装置及び該実装処理装置の制御装置
WO2005004575A1 (en) * 2003-07-03 2005-01-13 Assembléon N.V. Component placement device
JP2005268785A (ja) * 2004-03-16 2005-09-29 Assembleon Nv 少なくとも一つのコンポーネント載置ユニットによってコンポーネントを載置するための方法およびシステム
JP4559243B2 (ja) * 2005-01-28 2010-10-06 株式会社日立ハイテクインスツルメンツ 電子部品の装着方法及び電子部品の装着装置
KR101278010B1 (ko) * 2005-08-02 2013-06-27 파나소닉 주식회사 전자 부품 장착기 및 장착 방법
KR100771326B1 (ko) * 2006-07-25 2007-10-29 삼성전기주식회사 인쇄회로기판 이송장치
EP1971197A3 (de) 2007-03-14 2011-01-12 Siemens Electronics Assembly Systems GmbH & Co. KG Unterstützung von zwei mit einem Doppel-Transportsystem bereitgestellten zu bestückenden Substraten mit unterschiedlicher Breite
JP2009016498A (ja) * 2007-07-03 2009-01-22 Yamaha Motor Co Ltd 部品吸着方法および表面実装機
US7644618B2 (en) * 2007-10-26 2010-01-12 The Boeing Company Apparatus and method for nondestructive inspection of parts
JP4997124B2 (ja) * 2008-01-21 2012-08-08 株式会社日立ハイテクインスツルメンツ 電子部品装着ヘッド及び電子部品装着装置
KR101308467B1 (ko) * 2009-08-04 2013-09-16 엘지디스플레이 주식회사 전자 부품 실장 장치 및 방법
JP5861041B2 (ja) * 2013-03-07 2016-02-16 パナソニックＩｐマネジメント株式会社 基板搬送機構および部品実装用装置
CN104044908B (zh) 2013-03-15 2016-03-02 纬创资通(昆山)有限公司 用来自动卸载电路板的卸载系统
KR101470614B1 (ko) * 2013-05-07 2014-12-10 주식회사 큐디씨솔루션 회로기판 정렬장치
JP6193994B2 (ja) * 2013-06-27 2017-09-06 富士機械製造株式会社 部品実装機
TW201540627A (zh) * 2014-04-18 2015-11-01 Prov Technology Corp 具取放數量調整機構之電子元件移載裝置
CN107470905B (zh) * 2017-09-04 2023-08-01 广东信华电器有限公司 一体自动化装配软led灯带的灯管的设备及应用该设备生产具有软led灯带灯管的方法
JP2019075466A (ja) * 2017-10-16 2019-05-16 パナソニックＩｐマネジメント株式会社 製造作業装置
CN108463101A (zh) * 2018-05-22 2018-08-28 深圳中科工控智能科技有限公司 全自动高速按键插件机
CN113396646B (zh) * 2019-01-04 2023-06-13 捷普有限公司 提供用于拾取和放置系统的电路板载体的装置、系统和方法
CN110381722A (zh) * 2019-07-18 2019-10-25 安徽天通精电新科技有限公司 一种自定位的贴片机及其工作方法
TWI701420B (zh) * 2019-09-11 2020-08-11 英業達股份有限公司 散熱片組裝裝置及散熱片組裝方法
CN111787781B (zh) * 2020-06-22 2021-12-03 赤壁市中亮光电科技有限公司 一种贴片led灯珠基板自动焊接装置
CN111970852B (zh) * 2020-08-28 2021-12-31 湖南维胜科技电路板有限公司 一种电路板生产用电子元件自动安装装置
CN114698271B (zh) * 2022-05-16 2023-05-02 四川英创力电子科技股份有限公司 一种在印制电路板双面成型高频层的成型装置及方法
CN116437577B (zh) * 2023-06-09 2023-08-22 四川英创力电子科技股份有限公司 一种印制板盲槽加工装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
US5223528A (en) * 1986-03-17 1993-06-29 University Of Florida Anticholinergic compounds, composititons and methods of treatment
JP2503082B2 (ja) * 1989-09-05 1996-06-05 富士機械製造株式会社 電子部品装着装置
DE69116709T2 (de) * 1990-03-19 1997-02-06 Hitachi Ltd Vorrichtung und Verfahren zum Transport von Bauteilen
JP2841845B2 (ja) * 1990-11-13 1998-12-24 松下電器産業株式会社 電子部品実装装置
JP3114034B2 (ja) * 1992-06-05 2000-12-04 ヤマハ発動機株式会社 部品実装方法及び部品実装装置
JP2775550B2 (ja) * 1992-06-19 1998-07-16 日鉄鉱業株式会社 含アルミニウム廃硝酸の処理方法
JPH06275991A (ja) * 1993-03-23 1994-09-30 Japan Tobacco Inc ワーク実装機
JP3227881B2 (ja) * 1993-03-31 2001-11-12 ソニー株式会社 プリント配線基板搬送装置及び搬送方法
US5323528A (en) * 1993-06-14 1994-06-28 Amistar Corporation Surface mount placement system
JPH0878890A (ja) * 1994-09-06 1996-03-22 Japan Tobacco Inc 部品実装装置
JP3196626B2 (ja) * 1995-12-26 2001-08-06 ソニー株式会社 部品実装方法

Also Published As

Publication number Publication date
KR100287437B1 (ko) 2001-04-16
TW361056B (en) 1999-06-11
EP0854670A1 (en) 1998-07-22
DE69706515D1 (de) 2001-10-11
US6000123A (en) 1999-12-14
EP0854670B1 (en) 2001-09-05
JP3339344B2 (ja) 2002-10-28
DE69706515T2 (de) 2002-05-02
MY117949A (en) 2004-08-30
CN1189761A (zh) 1998-08-05
JPH10209680A (ja) 1998-08-07
KR19980070167A (ko) 1998-10-26
CN1100478C (zh) 2003-01-29

Similar Documents

Publication Publication Date Title
SG72767A1 (en) Electronic-parts mounting apparatus
SG72717A1 (en) Mounting apparatus
SG79977A1 (en) Resist-processing apparatus
EP0992863A4 (en) FIXER
SG76598A1 (en) Electronic-parts mounting apparatus
SG55456A1 (en) Charding apparatus
GB9715667D0 (en) Amusement -with-prizes apparatus
EP0928567A4 (en) FILTER MOUNTING APPARATUS
GB2330642B (en) mounting
GB9723324D0 (en) Apparatus
GB9721660D0 (en) Apparatus
GB2326981B (en) Chip mounting apparatus
GB2321274B (en) Mounting apparatus
GB2332033B (en) Positioning apparatus
GB9722897D0 (en) Cable-storage apparatus
GB2364760B (en) Positioning apparatus
GB9816608D0 (en) Securing apparatus
TW319049U (en) Tea-making apparatus
TW346754U (en) Insects-catching apparatus
GB9703914D0 (en) Mounting device
GB9620470D0 (en) Mounting apparatus
GB9615644D0 (en) Mounting apparatus
GB2337298B (en) Mounting device
ZA983274B (en) An ensoscopic apparatus
GB9716714D0 (en) Apparatus