SG193709A1 - Method for detaching a semiconductor chip from a foil - Google Patents

Method for detaching a semiconductor chip from a foil Download PDF

Info

Publication number
SG193709A1
SG193709A1 SG2013014311A SG2013014311A SG193709A1 SG 193709 A1 SG193709 A1 SG 193709A1 SG 2013014311 A SG2013014311 A SG 2013014311A SG 2013014311 A SG2013014311 A SG 2013014311A SG 193709 A1 SG193709 A1 SG 193709A1
Authority
SG
Singapore
Prior art keywords
plates
lowered
lowering
carrier
semiconductor chip
Prior art date
Application number
SG2013014311A
Other languages
English (en)
Inventor
Ernst Barmettler
Fabian Hurschler
Brian Pulis
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of SG193709A1 publication Critical patent/SG193709A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y10S156/931—Peeling away backing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y10S156/931—Peeling away backing
    • Y10S156/932—Peeling away backing with poking during delaminating, e.g. jabbing release sheet backing to remove wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y10S156/943—Means for delaminating semiconductive product with poking delaminating means, e.g. jabbing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
SG2013014311A 2012-03-30 2013-02-26 Method for detaching a semiconductor chip from a foil SG193709A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH00453/12A CH706280B1 (de) 2012-03-30 2012-03-30 Verfahren zum Ablösen eines Halbleiterchips von einer Folie.

Publications (1)

Publication Number Publication Date
SG193709A1 true SG193709A1 (en) 2013-10-30

Family

ID=49154876

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2013014311A SG193709A1 (en) 2012-03-30 2013-02-26 Method for detaching a semiconductor chip from a foil

Country Status (10)

Country Link
US (1) US9039867B2 (enExample)
JP (1) JP6128459B2 (enExample)
KR (1) KR102084792B1 (enExample)
CN (1) CN103367136B (enExample)
CH (1) CH706280B1 (enExample)
DE (1) DE102013103100B4 (enExample)
FR (1) FR2988902B1 (enExample)
MY (1) MY164119A (enExample)
SG (1) SG193709A1 (enExample)
TW (1) TWI569338B (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH707236B1 (de) * 2012-11-23 2016-10-31 Besi Switzerland Ag Verfahren zum Ablösen von Halbleiterchips von einer Folie.
JP5717910B1 (ja) * 2014-02-26 2015-05-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
SG10201403372SA (en) * 2014-06-18 2016-01-28 Mfg Integration Technology Ltd System and method for peeling a semiconductor chip from a tape using a multistage ejector
JP6797569B2 (ja) * 2016-06-13 2020-12-09 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
TWI648213B (zh) * 2017-11-30 2019-01-21 景碩科技股份有限公司 撕箔機構
JP2019169516A (ja) * 2018-03-22 2019-10-03 東芝メモリ株式会社 半導体装置の突き上げ装置及び突き上げ方法
CN109192681B (zh) * 2018-09-01 2022-05-31 佛山市美特智能科技有限公司 芯片的快速柔性制造系统
JP7217605B2 (ja) * 2018-09-21 2023-02-03 ファスフォードテクノロジ株式会社 半導体製造装置、突上げ治具および半導体装置の製造方法
CH715447B1 (de) 2018-10-15 2022-01-14 Besi Switzerland Ag Chip-Auswerfer.
DE102018125682B4 (de) * 2018-10-16 2023-01-19 Asm Assembly Systems Gmbh & Co. Kg Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils
KR102656718B1 (ko) * 2018-11-05 2024-04-12 세메스 주식회사 다이 이젝팅 장치
JP7274902B2 (ja) * 2019-03-25 2023-05-17 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
KR102020034B1 (ko) * 2019-07-09 2019-09-10 (주)삼정오토메이션 적층세라믹콘덴서 취출 방법
KR102177863B1 (ko) * 2020-08-07 2020-11-11 변영기 칩 필름 단계적 박리장치
JP7039675B2 (ja) * 2020-11-18 2022-03-22 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
US11764098B2 (en) * 2021-04-16 2023-09-19 Asmpt Singapore Pte. Ltd. Detaching a die from an adhesive tape by air ejection
JP7645768B2 (ja) * 2021-10-26 2025-03-14 三菱電機株式会社 半導体製造装置および半導体装置の製造方法
US12444625B2 (en) 2021-12-08 2025-10-14 Samsung Electronics Co., Ltd. Chip peeling apparatus and chip peeling method using the same
US12557583B2 (en) 2022-05-11 2026-02-17 Samsung Electronics Co., Ltd. Chip peeling apparatus and chip peeling method
CN119176305A (zh) * 2023-06-21 2024-12-24 纬创资通(重庆)有限公司 除膜设备与揭膜机构
KR102819732B1 (ko) 2023-11-28 2025-06-16 한국생산기술연구원 반도체 제조 공정에서의 다이 이젝팅 방법 및 장치
KR20250081568A (ko) * 2023-11-29 2025-06-05 삼성전자주식회사 칩 이젝터 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3976541B2 (ja) * 2001-10-23 2007-09-19 富士通株式会社 半導体チップの剥離方法及び装置
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CH697213A5 (de) * 2004-05-19 2008-06-25 Alphasem Ag Verfahren und Vorrichtung zum Ablösen eines auf eine flexible Folie geklebten Bauteils.
JP4735829B2 (ja) * 2005-12-06 2011-07-27 澁谷工業株式会社 チップ突き上げ装置
US7665204B2 (en) * 2006-10-16 2010-02-23 Asm Assembly Automation Ltd. Die detachment apparatus comprising pre-peeling structure
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
JP4864816B2 (ja) * 2007-06-19 2012-02-01 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
TWI463580B (zh) 2007-06-19 2014-12-01 瑞薩科技股份有限公司 Manufacturing method of semiconductor integrated circuit device
MY150953A (en) * 2008-11-05 2014-03-31 Esec Ag Die-ejector
US8141612B2 (en) * 2009-04-02 2012-03-27 Asm Assembly Automation Ltd Device for thin die detachment and pick-up
US8092645B2 (en) 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
JP2011216529A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体装置の製造方法
CH707236B1 (de) * 2012-11-23 2016-10-31 Besi Switzerland Ag Verfahren zum Ablösen von Halbleiterchips von einer Folie.

Also Published As

Publication number Publication date
JP6128459B2 (ja) 2017-05-17
DE102013103100A1 (de) 2013-10-02
FR2988902B1 (fr) 2016-12-30
MY164119A (en) 2017-11-30
CH706280B1 (de) 2016-03-15
TW201401384A (zh) 2014-01-01
TWI569338B (zh) 2017-02-01
CH706280A1 (de) 2013-09-30
CN103367136A (zh) 2013-10-23
DE102013103100B4 (de) 2024-02-29
JP2013214739A (ja) 2013-10-17
US9039867B2 (en) 2015-05-26
FR2988902A1 (fr) 2013-10-04
KR20130111366A (ko) 2013-10-10
CN103367136B (zh) 2017-08-25
US20130255889A1 (en) 2013-10-03
KR102084792B1 (ko) 2020-03-04

Similar Documents

Publication Publication Date Title
US9039867B2 (en) Method for detaching a semiconductor chip from a foil
US8250742B2 (en) Die ejector
US8141612B2 (en) Device for thin die detachment and pick-up
US10319614B2 (en) Wafer leveling device
CN105023862B (zh) 芯片贴装机及贴装方法
JP4816654B2 (ja) チップ剥離装置およびチップ剥離方法ならびにチップピックアップ装置
JP5941701B2 (ja) ダイボンダ
WO2013021594A1 (ja) 電子部品実装装置および電子部品実装方法ならびに下受けピンモジュールの配置変更方法
KR20180087825A (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
JP2009060014A (ja) チップ剥離装置およびチップ剥離方法ならびにチップピックアップ装置
KR101719168B1 (ko) 디테칭피커모듈을 포함하는 웨이퍼링 프레임방식용 픽앤플레이스 시스템
JP2013214683A (ja) 半導体チップのピックアップ装置
JP6019406B2 (ja) 電子部品実装装置および電子部品実装方法
US20060137828A1 (en) Die pickup apparatus
JP4816622B2 (ja) チップ剥離装置およびチップ剥離方法ならびにチップピックアップ装置
HK1185721A (zh) 将半导体芯片从箔拆下的方法
HK1185721B (en) Method for detaching a semiconductor chip from a foil
KR101199298B1 (ko) 칩 박리 방법, 반도체 장치의 제조 방법, 및 칩 박리 장치
CN221758807U (zh) 一种玻璃载具下料装置
KR20110050027A (ko) 반도체 다이의 픽업 장치
KR20220097092A (ko) 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치
JP2024155437A (ja) 半導体製造装置
KR20250161444A (ko) 자동화된 테이프 접착력 측정 도구
HK1262296A1 (zh) 半导体後工序用卡盘板、具有所述卡盘板的卡盘结构物及具有卡盘结构物的芯片分离装置
HK1142169B (en) Die ejector