SG161144A1 - Device for the double-sided processing of flat workpieces and method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers - Google Patents

Device for the double-sided processing of flat workpieces and method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers

Info

Publication number
SG161144A1
SG161144A1 SG200905775-3A SG2009057753A SG161144A1 SG 161144 A1 SG161144 A1 SG 161144A1 SG 2009057753 A SG2009057753 A SG 2009057753A SG 161144 A1 SG161144 A1 SG 161144A1
Authority
SG
Singapore
Prior art keywords
pin
double
sided
working
processing
Prior art date
Application number
SG200905775-3A
Other languages
English (en)
Inventor
Michael Kerstan
Dr Georg Pietsch
Frank Runkel
Dr Conrad Von Bechtolsheim
Helge Moeller
Original Assignee
Siltronic Ag
Wolters Peter Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag, Wolters Peter Gmbh filed Critical Siltronic Ag
Publication of SG161144A1 publication Critical patent/SG161144A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200905775-3A 2008-10-22 2009-08-31 Device for the double-sided processing of flat workpieces and method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers SG161144A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008052793 2008-10-22
DE102008061038 2008-12-03

Publications (1)

Publication Number Publication Date
SG161144A1 true SG161144A1 (en) 2010-05-27

Family

ID=42055253

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200905775-3A SG161144A1 (en) 2008-10-22 2009-08-31 Device for the double-sided processing of flat workpieces and method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers

Country Status (7)

Country Link
US (1) US8512099B2 (ja)
JP (2) JP5208087B2 (ja)
KR (1) KR101124034B1 (ja)
CN (2) CN102441826B (ja)
DE (1) DE102009038942B4 (ja)
SG (1) SG161144A1 (ja)
TW (2) TWI398320B (ja)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102859339B (zh) 2010-04-23 2014-12-24 柯尼卡美能达精密光学仪器株式会社 测定用光学系统、以及使用该光学系统的色彩亮度计及色彩计
DE102010026352A1 (de) * 2010-05-05 2011-11-10 Siltronic Ag Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung einer Halbleiterscheibe
DE102010032501B4 (de) * 2010-07-28 2019-03-28 Siltronic Ag Verfahren und Vorrichtung zum Abrichten der Arbeitsschichten einer Doppelseiten-Schleifvorrichtung
DE102010042040A1 (de) 2010-10-06 2012-04-12 Siltronic Ag Verfahren zum Schleifen einer Halbleiterscheibe
DE102010063179B4 (de) * 2010-12-15 2012-10-04 Siltronic Ag Verfahren zur gleichzeitigen Material abtragenden Bearbeitung beider Seiten mindestens dreier Halbleiterscheiben
DE102011003006B4 (de) * 2011-01-21 2013-02-07 Siltronic Ag Verfahren zur Bereitstellung jeweils einer ebenen Arbeitsschicht auf jeder der zwei Arbeitsscheiben einer Doppelseiten-Bearbeitungsvorrichtung
JP5479390B2 (ja) 2011-03-07 2014-04-23 信越半導体株式会社 シリコンウェーハの製造方法
DE102011080323A1 (de) 2011-08-03 2013-02-07 Siltronic Ag Verfahren zum Einebnen einer Halbleiterscheibe mit verbesserter Kantenschonung
DE102011089570A1 (de) 2011-12-22 2013-06-27 Siltronic Ag Führungskäfig zum beidseitigen Schleifen von mindestens einem scheibenförmigen Werkstück zwischen zwei rotierenden Arbeitsscheiben einer Schleifvorrichtung, Verfahren zur Herstellung des Führungskäfigs und Verfahren zum gleichzeitigen beidseitigen Schleifen von scheibenförmigen Werkstücken unter Verwendung des Führungskäfigs
US9184030B2 (en) 2012-07-19 2015-11-10 Lam Research Corporation Edge exclusion control with adjustable plasma exclusion zone ring
CN103065935B (zh) * 2012-12-03 2015-02-04 天津中环领先材料技术有限公司 一种采用挤压方式去除igbt用硅晶圆抛光片边缘氧化膜的方法
CN104812531B (zh) * 2012-12-28 2017-05-03 Hoya株式会社 信息记录介质用玻璃基板、信息记录介质用玻璃基板的制造方法以及制造装置
US9797064B2 (en) 2013-02-05 2017-10-24 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion
US9738991B2 (en) 2013-02-05 2017-08-22 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion
CN103182675A (zh) * 2013-03-28 2013-07-03 铜陵迈维电子科技有限公司 一种二氧化硅晶片研磨机
JP6108999B2 (ja) * 2013-07-18 2017-04-05 株式会社ディスコ 切削装置
JP6007889B2 (ja) 2013-12-03 2016-10-19 信越半導体株式会社 面取り加工装置及びノッチレスウェーハの製造方法
CN104044087B (zh) * 2014-06-18 2016-09-07 蓝思科技股份有限公司 一种蓝宝石抛光用铜盘及其修盘方法
US9279192B2 (en) 2014-07-29 2016-03-08 Dow Corning Corporation Method for manufacturing SiC wafer fit for integration with power device manufacturing technology
KR101572103B1 (ko) * 2014-09-11 2015-12-04 주식회사 엘지실트론 웨이퍼 연마 장치
WO2016142237A1 (en) * 2015-03-11 2016-09-15 Nv Bekaert Sa Carrier for temporary bonded wafers
JP6304132B2 (ja) * 2015-06-12 2018-04-04 信越半導体株式会社 ワークの加工装置
DE102015112527B4 (de) * 2015-07-30 2018-11-29 Lapmaster Wolters Gmbh Vorrichtung und Verfahren zum Eingießen eines ringförmigen Kunststoffrahmens in eine Ausnehmung einer Läuferscheibe einer Doppelseitenbearbeitungsmaschine
CN105304432B (zh) * 2015-11-16 2017-04-26 西北核技术研究所 电子束二极管石墨阴极表面碾磨装置
CN109500708B (zh) * 2017-09-12 2023-12-29 蓝思科技（长沙）有限公司 一种板材减薄装置
CN107457689B (zh) * 2017-10-03 2024-04-05 德清晶生光电科技有限公司 用于单面打磨的游星轮
CN108637889A (zh) * 2018-04-28 2018-10-12 湖南宇晶机器股份有限公司 带上下盘冷却式高精密双面研磨机
CN108561532A (zh) * 2018-04-28 2018-09-21 湖南宇晶机器股份有限公司 分体局部升降式齿圈结构
CN108481185A (zh) * 2018-06-14 2018-09-04 东莞金研精密研磨机械制造有限公司 一种双面研磨机
CN110962039A (zh) * 2018-09-29 2020-04-07 康宁股份有限公司 载体晶片和形成载体晶片的方法
CN110587470B (zh) * 2019-04-09 2023-07-04 厦门钨业股份有限公司 一种夹具
CN110802503A (zh) * 2019-11-06 2020-02-18 西安奕斯伟硅片技术有限公司 一种研磨装置
CN111136573B (zh) * 2019-11-27 2021-12-03 常州市瑞得通讯科技有限公司 一种高稳定、低损耗陶瓷滤波器制备流水线
CN110900342B (zh) * 2019-11-29 2020-12-08 上海磐盟电子材料有限公司 一种磨片机
DE102020101313B3 (de) * 2020-01-21 2021-07-01 Lapmaster Wolters Gmbh Läuferscheibe, Doppelseitenbearbeitungsmaschine und Verfahren zum Bearbeiten mindestens eines Werkstücks in einer Doppelseitenbearbeitungsmaschine
CN111673554A (zh) * 2020-07-01 2020-09-18 上海光和光学制造大丰有限公司 一种提高盘片寿命的治具
KR102374393B1 (ko) * 2021-07-09 2022-03-15 주식회사 기가레인 웨이퍼 트레이 조립 장치 및 웨이퍼 트레이 조립 방법
CN113732851B (zh) * 2021-11-05 2022-02-01 四川明泰微电子有限公司 一种用于半导体晶圆背面打磨的装置
CN115847278A (zh) * 2023-01-09 2023-03-28 江苏纳沛斯半导体有限公司 一种晶圆背面研磨装置及研磨工艺
CN116494027B (zh) * 2023-06-19 2023-10-03 新美光(苏州)半导体科技有限公司 一种硅部件的双面研磨方法

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63300857A (ja) * 1987-05-29 1988-12-08 Hoya Corp 研摩装置
JPH0373265A (ja) * 1989-05-02 1991-03-28 Sekisui Chem Co Ltd 被研磨物保持用キャリヤ及びその製造方法
JP2945110B2 (ja) 1990-09-20 1999-09-06 古河電気工業株式会社 キャリアの定位置停止方法
JP2598753B2 (ja) 1994-02-25 1997-04-09 弘至 川島 ラッピング装置
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
DE29520741U1 (de) 1995-12-15 1996-03-21 Peter Wolters Werkzeugmaschinen GmbH, 24768 Rendsburg Vorrichtung zum flächigen Bearbeiten von Werkstücken
DE19547086C1 (de) * 1995-12-15 1997-06-19 Wolters Peter Werkzeugmasch Vorrichtung zum flächigen Bearbeiten von Werkstücken
MY129961A (en) 1996-02-01 2007-05-31 Shinetsu Handotai Kk Double side polishing machine and method of polishing opposite sides of a workpiece using the same
JPH09207063A (ja) * 1996-02-01 1997-08-12 Shin Etsu Handotai Co Ltd 両面研磨機およびこれを用いて被加工物の両面を研磨する方法
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
JPH11179649A (ja) 1997-12-16 1999-07-06 Speedfam Co Ltd ワークの取出方法及びワーク取出機構付き平面研磨装置
JPH11254308A (ja) 1998-03-06 1999-09-21 Fujikoshi Mach Corp 両面研磨装置
JPH11254303A (ja) 1998-03-11 1999-09-21 Daido Steel Co Ltd ラップ盤
JPH11267966A (ja) 1998-03-24 1999-10-05 Speedfam Co Ltd 両面研磨加工機
JPH11277420A (ja) 1998-03-31 1999-10-12 Speedfam-Ipec Co Ltd 両面研磨加工機
JP3262808B2 (ja) * 1998-08-20 2002-03-04 浜井産業株式会社 遊星歯車方式平行平面加工盤
JP4384742B2 (ja) 1998-11-02 2009-12-16 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハのラッピング装置及びラッピング方法
JP3317910B2 (ja) * 1998-12-24 2002-08-26 株式会社ノリタケスーパーアブレーシブ 研削盤における研削装置
DE10007389B4 (de) 1999-10-29 2005-06-30 Peter Wolters Werkzeugmaschinen Gmbh Vorrichtung zur Entnahme von Halbleiterscheiben aus Läuferscheiben in einer doppelseitigen Poliermaschine
DE20004223U1 (de) * 1999-10-29 2000-08-24 Peter Wolters Werkzeugmaschinen GmbH, 24768 Rendsburg Vorrichtung zur Entnahme von Halbleiterscheiben aus den Läufer-Scheiben in einer Doppelseiten-Poliermaschine
DE10060697B4 (de) * 2000-12-07 2005-10-06 Siltronic Ag Doppelseiten-Polierverfahren mit reduzierter Kratzerrate und Vorrichtung zur Durchführung des Verfahrens
US6599177B2 (en) 2001-06-25 2003-07-29 Saint-Gobain Abrasives Technology Company Coated abrasives with indicia
DE10159848B4 (de) 2001-12-06 2004-07-15 Siltronic Ag Vorrichtung zur beidseitigen Bearbeitung von Werkstücken
CN100380600C (zh) * 2002-03-28 2008-04-09 信越半导体株式会社 晶片的两面研磨装置及两面研磨方法
JP3981291B2 (ja) 2002-04-03 2007-09-26 不二越機械工業株式会社 両面研磨装置用キャリアおよび両面研磨装置
DE10218483B4 (de) 2002-04-25 2004-09-23 Siltronic Ag Vorrichtung zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Werkstücken
JP2004087521A (ja) * 2002-08-22 2004-03-18 Sumitomo Mitsubishi Silicon Corp 片面鏡面ウェーハおよびその製造方法
JP2004106173A (ja) * 2002-08-29 2004-04-08 Fujikoshi Mach Corp 両面研磨装置
DE10344602A1 (de) 2003-09-25 2005-05-19 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben
JP4343020B2 (ja) * 2003-12-22 2009-10-14 株式会社住友金属ファインテック 両面研磨方法及び装置
JP2005224892A (ja) * 2004-02-12 2005-08-25 Nippon Tokushu Kento Kk 研磨方法
DE102004011996B4 (de) * 2004-03-11 2007-12-06 Siltronic Ag Vorrichtung zum simultanen beidseitigen Schleifen von scheibenförmigen Werkstücken
JP4663270B2 (ja) * 2004-08-04 2011-04-06 不二越機械工業株式会社 研磨装置
JP2006068888A (ja) 2004-09-06 2006-03-16 Speedfam Co Ltd 定盤の製造方法及び平面研磨装置
JP4510659B2 (ja) 2005-02-04 2010-07-28 不二越機械工業株式会社 研磨装置
KR101193406B1 (ko) * 2005-02-25 2012-10-24 신에쯔 한도타이 가부시키가이샤 양면 연마 장치용 캐리어 및 이를 이용한 양면 연마 장치,양면 연마 방법
JP2008012623A (ja) * 2006-07-05 2008-01-24 Speedfam Co Ltd 平面研磨装置
DE102006032455A1 (de) 2006-07-13 2008-04-10 Siltronic Ag Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit
JP2008227393A (ja) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
DE102007013058B4 (de) 2007-03-19 2024-01-11 Lapmaster Wolters Gmbh Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben
DE102007056627B4 (de) * 2007-03-19 2023-12-21 Lapmaster Wolters Gmbh Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben

Also Published As

Publication number Publication date
CN101722447A (zh) 2010-06-09
TW201318773A (zh) 2013-05-16
US20100099337A1 (en) 2010-04-22
TW201016389A (en) 2010-05-01
JP2012254521A (ja) 2012-12-27
JP5476432B2 (ja) 2014-04-23
DE102009038942A1 (de) 2010-04-29
KR20100044701A (ko) 2010-04-30
TWI398320B (zh) 2013-06-11
CN102441826B (zh) 2015-06-17
US8512099B2 (en) 2013-08-20
JP2010099830A (ja) 2010-05-06
TWI505911B (zh) 2015-11-01
JP5208087B2 (ja) 2013-06-12
CN101722447B (zh) 2013-11-06
DE102009038942B4 (de) 2022-06-23
CN102441826A (zh) 2012-05-09
KR101124034B1 (ko) 2012-03-23

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