MY129961A - Double side polishing machine and method of polishing opposite sides of a workpiece using the same - Google Patents

Double side polishing machine and method of polishing opposite sides of a workpiece using the same

Info

Publication number
MY129961A
MY129961A MYPI9700328A MY129961A MY 129961 A MY129961 A MY 129961A MY PI9700328 A MYPI9700328 A MY PI9700328A MY 129961 A MY129961 A MY 129961A
Authority
MY
Malaysia
Prior art keywords
double side
sleeves
side polishing
resin
internal
Prior art date
Application number
Inventor
Tadahiro Kato
Hisashi Masumura
Hideo Kudo
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3868196A external-priority patent/JPH09207063A/en
Priority claimed from JP9616696A external-priority patent/JPH09254026A/en
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of MY129961A publication Critical patent/MY129961A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A DOUBLE SIDE POLISHING MACHINE INCLUDES A DISK-SHAPED CARRIER (3) FOR HOLDING AN ARTICLE (W) TO BE POLISHED, AND A SUN GEAR (2) AND AN INTERNAL GEAR (1) WHICH ARE MESHED WITH EXTERNAL TEETH (3G) OF THE CARRIER. THE TOOTH PORTIONS (2G, 1G) OF THE SUN GEAR AND THE INTERNAL GEAR ARE MADE OF A HARD RESIN MATERIAL, SUCH AS POLYIMIDE SINTERED BODY OR POLYAMIDE IMIDE RESIN, WHICH HAS EXCELLENT WEAR RESISTANCE, SUFFICIENT SELF-LUBRICATING PERFORMANCE, AND HIGH SHEAR RESISTANCE. EACH TOOTH PORTION IS FORMED AS A SINGLE MEMBER, OR IS FORMED BY A PLURALITY OF SEPARABLE SEGMENTS.ALTERNATIVELY, THE INTERNAL AND SUN GEARS (1, 2) ARE MADE OF A METAL SUCH AS STEEL AND COATED WITH A HARD RESIN COATING MATERIAL. IN ANOTHER DOUBLE SIDE POLISHING MACHINE, EACH OF THE TOOTH PORTIONS OF THE INTERNAL AND SUN GEARS IS FORMED BY A PLURALITY OF PINS (15) DISPOSED AT A PREDETERMINED PITCHES AND SLEEVES (16) FIT ONTO THE PINS. THE SLEEVES (16) ARE MADE OF A RESIN. ALTERNATIVELY, RESIN-COATED METALLIC SLEEVES MAY BE USED AS THE SLEEVES. THE DOUBLE SIDE POLISHING MACHINES CAN PREVENT GENERATION OF METAL POWDER, THEREBY SUPPRESSING GENERATION OF SCRATCHES AND METAL CONTAMINATION.(FIG 2)
MYPI9700328 1996-02-01 1997-01-29 Double side polishing machine and method of polishing opposite sides of a workpiece using the same MY129961A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3868196A JPH09207063A (en) 1996-02-01 1996-02-01 Double side polisher and method for polishing both of work using the polisher
JP9616696A JPH09254026A (en) 1996-03-26 1996-03-26 Both-side polishing device

Publications (1)

Publication Number Publication Date
MY129961A true MY129961A (en) 2007-05-31

Family

ID=26377959

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9700328 MY129961A (en) 1996-02-01 1997-01-29 Double side polishing machine and method of polishing opposite sides of a workpiece using the same

Country Status (3)

Country Link
EP (1) EP0787562B1 (en)
DE (1) DE69700885T2 (en)
MY (1) MY129961A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11267966A (en) * 1998-03-24 1999-10-05 Speedfam Co Ltd Duplex polishing machine
US6379226B1 (en) 1999-12-08 2002-04-30 Memc Electronic Materials, Inc. Method for storing carrier for polishing wafer
DE19961106C2 (en) * 1999-12-17 2003-01-30 Siemens Ag Holding device for mechanical processing of a flat plate, use of the holding device and flat plate
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
DE10060697B4 (en) 2000-12-07 2005-10-06 Siltronic Ag Double-sided polishing method with reduced scratch rate and apparatus for carrying out the method
DE10159848B4 (en) * 2001-12-06 2004-07-15 Siltronic Ag Device for machining workpieces on both sides
DE10218483B4 (en) * 2002-04-25 2004-09-23 Siltronic Ag Device for simultaneously machining workpieces on both sides of material
DE102009038942B4 (en) * 2008-10-22 2022-06-23 Peter Wolters Gmbh Device for machining flat workpieces on both sides and method for machining a plurality of semiconductor wafers simultaneously by removing material from both sides
CN103158054B (en) * 2011-12-19 2016-02-03 张卫兴 Two kinds of single-sided polishing methods realized on two-sided lapping and buffing machine
DE102012214998B4 (en) 2012-08-23 2014-07-24 Siltronic Ag Method for double-sided processing of a semiconductor wafer
CN105014491A (en) * 2015-07-30 2015-11-04 苏州市智诚光学科技有限公司 Device for repairing surfaces of glass cover plates
CN113043096B (en) * 2021-03-09 2023-08-08 广东恒兆丰科技有限公司 High-end device for polishing two sides of PCB
EP4417364A1 (en) 2023-02-16 2024-08-21 Siltronic AG Method for polishing both sides of wafers of semiconductor material

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584349U (en) 1981-06-30 1983-01-12 日立金属株式会社 Carrier for double-sided sanding machine
DE3524978A1 (en) * 1985-07-12 1987-01-22 Wacker Chemitronic METHOD FOR DOUBLE-SIDED REMOVAL MACHINING OF DISK-SHAPED WORKPIECES, IN PARTICULAR SEMICONDUCTOR DISCS
JPS63221968A (en) * 1987-03-11 1988-09-14 Fujitsu Ltd Carrier
JPH0373265A (en) * 1989-05-02 1991-03-28 Sekisui Chem Co Ltd Carrier for holding body to be polished and manufacture thereof

Also Published As

Publication number Publication date
DE69700885T2 (en) 2000-05-31
EP0787562B1 (en) 1999-12-08
EP0787562A1 (en) 1997-08-06
DE69700885D1 (en) 2000-01-13

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